JP7213624B2 - 基板処理装置、基板処理システムおよび基板処理方法 - Google Patents
基板処理装置、基板処理システムおよび基板処理方法 Download PDFInfo
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Description
最初に、図1を参照しながら、実施形態に係る基板処理システム1の概略構成について説明する。図1は、実施形態に係る基板処理システム1の概略構成を示す模式図である。以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
次に、処理ユニット16の概要について、図2および図3を参照しながら説明する。図2は、実施形態に係る処理ユニット16の構成を示す上面図であり、図3は、図2におけるA-A線断面図である。なお、理解の容易のため、図3ではウェハWが搬入された状態を示すとともに、LM(Linear Motion)ガイド54の図示を省略している。
つづいて、図4A~図4Dを参照しながら、実施形態に係る液処理の詳細について説明する。図4A~図4Dは、実施形態に係る液処理の一工程を示す模式図(1)~(4)である。
つづいて、図6~図9Cを参照しながら、実施形態にかかる処理ユニット16の各種変形例について説明する。図6は、実施形態の変形例1に係る処理ユニット16の構成を示す上面図である。
つづいて、図10および図11を参照しながら、実施形態に係る液処理の詳細について説明する。図10は、実施形態に係る液処理全体の処理手順を示すフローチャートである。
L 処理液
1 基板処理システム
15 搬送部(共通搬送路の一例)
16 処理ユニット(基板処理装置の一例)
17 基板搬送装置(搬送機構の一例)
20 筐体
21 搬入出口
30 基板処理部
31 基板保持部
32 支柱部
33 液受けカップ
34 回収カップ
40 隔壁部
41 天板部
41a 貫通孔
41b 凸部
42 側壁部
43 隙間埋め部
44 ガス供給部
45 流入抑制部
50 液供給部
51 処理液ノズル
55 スキャン天板
A1 第1空間
A2 第2空間
Claims (9)
- 基板に液処理を施す基板処理部と、
前記基板が搬入される搬入出口から前記基板処理部までの第1空間と、前記第1空間以外の第2空間との間を仕切る隔壁部と、
前記第2空間に設けられ、処理液を前記基板に供給する液供給部と、
雰囲気を調整する雰囲気調整ガスを前記第1空間に供給するガス供給部と、
各部を制御する制御部と、
を備え、
前記第2空間は、大気雰囲気であり、
前記制御部は、前記基板を前記基板処理部に搬入する前に、前記第1空間に前記雰囲気調整ガスを供給し、前記第1空間内の雰囲気を前記雰囲気調整ガスで置換して、前記雰囲気調整ガスの雰囲気とするように前記ガス供給部を制御し、
前記制御部は、さらに前記基板が液処理される間、前記第2空間には大気雰囲気を供給するとともに前記第1空間には前記雰囲気調整ガスを供給し、その後、液処理された前記基板を前記基板処理部から搬出した後、前記第1空間への前記雰囲気調整ガスの供給を停止するよう前記ガス供給部を制御する
基板処理装置。 - 前記隔壁部は、前記基板の上方を覆う天板部と、前記基板の側方を囲む側壁部とを有する請求項1に記載の基板処理装置。
- 前記基板処理部と、前記隔壁部と、前記液供給部とを収容する筐体をさらに備え、
前記筐体内の前記第2空間は、大気雰囲気である請求項1または2に記載の基板処理装置。 - 前記雰囲気調整ガスは、不活性ガスである請求項1~3のいずれか一つに記載の基板処理装置。
- 請求項1~4のいずれか一つに記載の基板処理装置が複数配置され、
複数の前記基板処理装置に隣接し、それぞれの前記基板処理装置に前記基板を搬送する搬送機構が設けられる共通搬送路を備える基板処理システム。 - 雰囲気を調整する雰囲気調整ガスを前記共通搬送路に供給する第2のガス供給部をさらに備える請求項5に記載の基板処理システム。
- 基板が搬入される搬入出口から前記基板に液処理を施す基板処理部までの第1空間に雰囲気を調整する雰囲気調整ガスを供給する工程と、
前記第1空間に前記基板を搬入する工程と、
前記基板を前記基板処理部に載置する工程と、
隔壁部により前記第1空間から仕切られた第2空間に配置される液供給部を用いて前記基板を液処理する工程と、
を含み、
前記第2空間は、大気雰囲気であり、
前記基板を搬入する工程の前に、前記雰囲気調整ガスを供給する工程により前記第1空間を雰囲気調整ガスの雰囲気とし、前記基板が液処理される間、前記第2空間には大気雰囲気を供給するとともに前記第1空間には前記雰囲気調整ガスを供給し、その後、液処理された前記基板を前記基板処理部から搬出した後、前記第1空間への前記雰囲気調整ガスの供給を停止する
基板処理方法。 - 前記隔壁部のうち前記基板の上方を覆う天板部を前記基板処理部に載置された前記基板に近接させる工程をさらに含む請求項7に記載の基板処理方法。
- 前記液処理する工程は、前記天板部と前記基板との間を処理液で満たす工程を含む請求項8に記載の基板処理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2018088253A JP7213624B2 (ja) | 2018-05-01 | 2018-05-01 | 基板処理装置、基板処理システムおよび基板処理方法 |
CN201910337598.6A CN110429041B (zh) | 2018-05-01 | 2019-04-25 | 基片处理装置、基片处理系统和基片处理方法 |
TW108114607A TWI840352B (zh) | 2018-05-01 | 2019-04-26 | 基板處理裝置、基板處理系統及基板處理方法 |
US16/395,488 US20190341272A1 (en) | 2018-05-01 | 2019-04-26 | Substrate processing apparatus, substrate processing system, and substrate processing method |
KR1020190050719A KR102678998B1 (ko) | 2018-05-01 | 2019-04-30 | 기판 처리 장치, 기판 처리 시스템 및 기판 처리 방법 |
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JP2003031538A (ja) | 2001-07-16 | 2003-01-31 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2003224100A (ja) | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
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CN100367473C (zh) * | 2001-09-03 | 2008-02-06 | 东京毅力科创株式会社 | 基片处理装置及基片处理方法 |
JP4565433B2 (ja) * | 2001-11-27 | 2010-10-20 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
KR100897431B1 (ko) * | 2001-11-27 | 2009-05-14 | 도쿄엘렉트론가부시키가이샤 | 액처리장치 및 액처리방법 |
JP2004006672A (ja) * | 2002-04-19 | 2004-01-08 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
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JP5472169B2 (ja) * | 2011-03-16 | 2014-04-16 | 東京エレクトロン株式会社 | 液処理装置、液処理方法および記憶媒体 |
JP6541374B2 (ja) * | 2014-07-24 | 2019-07-10 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6425517B2 (ja) * | 2014-11-28 | 2018-11-21 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記憶媒体 |
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JP6670674B2 (ja) * | 2016-05-18 | 2020-03-25 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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JP2002134587A (ja) | 2000-10-26 | 2002-05-10 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
JP2003031538A (ja) | 2001-07-16 | 2003-01-31 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2003224100A (ja) | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2004266212A (ja) | 2003-03-04 | 2004-09-24 | Tadahiro Omi | 基板の処理システム |
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JP2019195014A (ja) | 2019-11-07 |
CN110429041A (zh) | 2019-11-08 |
KR20190126253A (ko) | 2019-11-11 |
US20190341272A1 (en) | 2019-11-07 |
TW201946110A (zh) | 2019-12-01 |
CN110429041B (zh) | 2024-04-30 |
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