CN114736015B - 一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷及其制备方法 - Google Patents

一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷及其制备方法 Download PDF

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CN114736015B
CN114736015B CN202210446319.1A CN202210446319A CN114736015B CN 114736015 B CN114736015 B CN 114736015B CN 202210446319 A CN202210446319 A CN 202210446319A CN 114736015 B CN114736015 B CN 114736015B
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田永尚
宋望月
李水云
董俊丽
曹玲
胡雄杰
刘鹏
井强山
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Abstract

本发明公开了一种采用真空热压烧结炉制备得到了插层锆钛酸钡钙(BCZT)基无铅压电陶瓷材料及其制备方法;插层BCZT基陶瓷分为五层和七层,其制备工艺包括BCZT基陶瓷粉体制备、插层BCZT基陶瓷生坯压制和热压烧结插层BCZT基陶瓷。性能显示,在室温至400℃的温度范围内,插层BCZT基陶瓷的压电系数d 33波动范围不超过±4.5%(527.3~574.8pC/N),剩余极化强度P r的波动范围不超过±6.3%(29.2~33.0μC/cm2)。采用本发明制备的插层BCZT基无铅压电陶瓷有效解决了对组分的过度依赖、并在很宽的使用温度范围内保持了优异的压电与铁电性能,显示出本发明制备BCZT基无铅压电陶瓷在多功能电子陶瓷材料的应用领域具有广阔的前景。

Description

一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电 陶瓷及其制备方法
技术领域
本发明涉及电子陶瓷材料的制备领域,具体涉及一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷及其制备方法。
背景技术
随着科技的不断进步、AI技术的不断发展,依赖机电相互转换的电子陶瓷作为核心部件的主要材料备受关注。含铅的压电陶瓷材料以其价格低廉和电学性能优异已经实现了商业化,并一直在军工、医疗和航空航天领域占据着绝对的优势。但是,含铅的压电陶瓷材料对生物的神经系统损伤以及对大自然的破坏具有不可逆性。在寻找无铅压电陶瓷材料时,对类似于含铅材料的物相、结构和性能进行了深入的剖析,结果显示含铅材料中存在准同型相界结构(MPB)或多晶型转变结构(PPT)时,其电学性能比较优异。因此,在无铅陶瓷材料中寻找类似的结构以达到可与含铅材料匹敌的电学性能成为该领域科学家一直探寻的目标。
在2009年,我国科学家任小兵课题组在研究钛酸钡无铅压电陶瓷时,通过掺杂锆和钙离子发现了MPB结构,并且电学性能有了很大的提升,引发了全世界对锆钛酸钡钙(BCZT)基陶瓷的研究热潮。虽然BCZT基陶瓷具有了MPB结构,但是其电学性能随温度的改变稳定性较差。其主要原因是,BCZT基陶瓷材料的居里温度在80℃左右,电学性能在该温度点附近性能会有突变;另外对组分过于的依赖,造成在实际生产中难以有效控制。很多研究致力于解决BCZT基陶瓷的缺陷,从成分改良、制备方法优化和增加后处理工艺等进行了一系列的研究,然而大多没有从根本上攻克上述缺陷进而实现良好重现性的BCZT基陶瓷材料工业化生产。为了解决BCZT基陶瓷材料所面对的壁垒,选择合适的制备工艺技术制备特殊的结构、并有效利用其自身MPB产生的优异电学性能成为BCZT基陶瓷材料研究的必经之路。
热压烧结工艺能够对材料同时加热和加压,使处于热塑性状态的粉体有效传质与传热,进而在很短的时间内得到晶粒细小、成分均一且机械性能高的陶瓷。传统的固相烧结工艺制备陶瓷材料时,虽然工艺技术相对简单,但是制备的陶瓷晶粒尺寸分布较宽、组分一致性较差。因此,在采用热压烧结工艺来制备BCZT基无铅压电陶瓷材料时,相较于传统的固相烧结工艺具有非常明显的优势。
发明内容
为了解决BCZT基陶瓷材料优异电学性能的稳定性差和对组分配方过度依赖等问题,本发明提供了一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的方法。
为了达到上述目的,本发明采用如下技术方案实现的:
一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷,主要原料包括碳酸钡、碳酸钙、二氧化钛和二氧化锆纳米粉体;
所述的插层BCZT基陶瓷材料,由五层或七层BCZT基材料组成;
所述的五层BCZT基材料从上到下依次为:BaTiO3BT层,即BT层、Ba0.9Ca0.1Ti0.95Zr0.05O3层,即BCZT2层、Ba0.85Ca0.15Ti0.9Zr0.1O3层,即BCZT3层、BCZT2层和BT层;
所述的七层BCZT基材料从上到下依次为:BT层、Ba0.95Ca0.05TiO3层,即BCT层、BCZT2层、BCZT3层、BCZT2层、BCT层和BT层。
所述的插层BCZT基陶瓷材料的制备工艺步骤包括:
1)按照BT、BCT、BCZT2、BCZT3分子式中原子的摩尔比例分别准确称量主要原料粉体后,在高能球磨机内混合1~2h;
2)分别取步骤1)粉体,在4MPa的压力机下成型得到坯体后;移入高温箱式炉中,在950℃下煅烧2h;
3)步骤2)煅烧后的坯体,经过粗研磨后,再在高能球磨机内混合1h后得到BCZT基陶瓷粉体;
4)按照五层或七层的BCZT基陶瓷材料结构,分别取步骤3)BT、BCT、BCZT2、BCZT3粉体,依次逐层填充在直径为20mm的钢质磨具中,并分别在压力机下对每一层粉体施加1~2MPa的压力后初步成型,初步成型后的坯体再在25~30MPa的压力下保压10~15min制得生坯;
5)步骤4)生坯在空气中放置12h后,移入到直径为20mm的石墨磨具内,在真空热压烧结炉内烧结制得插层BCZT基陶瓷;
所述的步骤4)中五层的结构中从上到下粉体的摩尔量比例为BT:BCZT2:BCZT3:BCZT2:BT=1:3:15:3:1;七层的结构中从上到下粉体的摩尔量比例为BT:BCT:BCZT2:BCZT3:BCZT2:BCT:BT=1:2:3:15:3:2:1。
所述的步骤4)中按照摩尔量称取的粉体在置入磨具之前,添加质量分数为2%的聚乙烯醇水溶液,以便于初步成型;
所述的步骤5)中真空热压烧结炉设定的烧结程序为三段式的,其中第一段为30MPa、1200℃下烧结1~2h;第二段为40~50MPa、1300~1400℃下烧结1h;第三段为30MPa、1200℃下烧结1h;
所述的步骤5)中烧结程序完成后随着施加压力解除,真空热压烧结炉内的陶瓷随炉冷降至室温。
所述的制备的插层BCZT基陶瓷经过抛光工艺和极化工艺后,通过高温介电测量系统和铁电测试系统,分别测试了其介电与压电性能;
所述的抛光工艺是指将陶瓷表面毛刺祛除后,用砂纸粗磨,而后再在金相磨抛机上细磨;极化工艺是指将抛光后的陶瓷样品两面刷上银电极材料,再在室温、5kV/cm的直流电压下极化30min;
所述的经过极化的插层BCZT基陶瓷测试前,需要在大气环境中放置36h,使陶瓷表面富集的电荷消失。
积极有益效果:本发明采用真空热压烧结炉制备得到了插层BCZT基无铅压电陶瓷材料,有效保留了准同型相界结构带来的优异压电和铁电性能,并在设定的插层结构下使得介电居里峰合理宽化、铁电性能有效弥散;进而在室温至400℃的温度范围内,插层BCZT基陶瓷的压电系数d 33波动范围不超过±4.5%(527.3~574.8pC/N),剩余极化强度P r的波动范围不超过±6.3%(29.2~33.0μC/cm2)。采用本发明制备的插层BCZT基无铅压电陶瓷有效解决了对组分的过度依赖、并在很宽的使用温度范围内保持了优异的压电与铁电性能,显示出本发明制备的BCZT基无铅压电陶瓷在多功能电子陶瓷材料的应用领域具有广阔的前景。
具体实施方式
下面结合详细的实施例,对本发明作进一步的说明:
实施例1
制备七层插层的锆钛酸钡钙基无铅压电陶瓷:按照BT、BCT、BCZT2、BCZT3的分子式中原子的比例,称取原料粉体后在高能球磨机内均匀混合2h,煅烧得到BCZT基陶瓷粉体;粉体按照从上到下的摩尔量比例为BT:BCT:BCZT2:BCZT3:BCZT2:BCT:BT=1:2:3:15:3:2:1制成七层的生坯,期间逐层施加的压力为2MPa,初步成型坯体在30MPa的压力下保压10min制得生坯;陶瓷生坯在50MPa、1350℃的第二段烧结制度的真空热压烧结炉内烧结制得插层BCZT基陶瓷;随炉冷降温后的陶瓷经过抛光和极化后,测试了其介电与压电性能。
此七层插层BCZT基无铅压电陶瓷在室温至400℃的温度范围内,其压电系数d 33的值为538.2~544.5 pC/N;剩余极化强度P r的值为29.8~31.5μC/cm2
实施例2
制备七层插层的锆钛酸钡钙基无铅压电陶瓷:按照BT、BCT、BCZT2、BCZT3的分子式中原子的比例,称取原料粉体后在高能球磨机内均匀混合1.5h,煅烧得到BCZT基陶瓷粉体;粉体按照从上到下的摩尔量比例为BT:BCT:BCZT2:BCZT3:BCZT2:BCT:BT=1:2:3:15:3:2:1制成七层的生坯,期间逐层施加的压力为1.5MPa,初步成型坯体在28MPa的压力下保压12min制得生坯;陶瓷生坯在45MPa、1350℃的第二段烧结制度的真空热压烧结炉内烧结制得插层BCZT基陶瓷;随炉冷降温后的陶瓷经过抛光和极化后,测试了其介电与压电性能。
此七层插层BCZT基无铅压电陶瓷在室温至400℃的温度范围内,其压电系数d 33的值为546.3~566.0 pC/N;剩余极化强度P r的值为30.3~31.9μC/cm2
实施例3
制备五层插层的锆钛酸钡钙基无铅压电陶瓷:按照BT、BCZT2、BCZT3的分子式中原子的比例,称取原料粉体后在高能球磨机内均匀混合1h,煅烧得到BCZT基陶瓷粉体;粉体按照从上到下的摩尔量比例为BT:BCZT2:BCZT3:BCZT2:BT=1:3:15:3:1制成五层的生坯,期间逐层施加的压力为1MPa,初步成型坯体在25MPa的压力下保压10min制得生坯;陶瓷生坯在40MPa、1300℃的第二段烧结制度的真空热压烧结炉内烧结制得插层BCZT基陶瓷;随炉冷降温后的陶瓷经过抛光和极化后,测试了其介电与压电性能。
此五层插层BCZT基无铅压电陶瓷在室温至400℃的温度范围内,其压电系数d 33的值为527.3~544.1 pC/N;剩余极化强度P r的值为29.2~31.8μC/cm2
实施例4
制备七层插层的锆钛酸钡钙基无铅压电陶瓷:按照BT、BCT、BCZT2、BCZT3的分子式中原子的比例,称取原料粉体后在高能球磨机内均匀混合2h,煅烧得到BCZT基陶瓷粉体;粉体按照从上到下的摩尔量比例为BT:BCT:BCZT2:BCZT3:BCZT2:BCT:BT=1:2:3:15:3:2:1制成七层的生坯,期间逐层施加的压力为2MPa,初步成型坯体在30MPa的压力下保压15min制得生坯;陶瓷生坯在50MPa、1400℃的第二段烧结制度的真空热压烧结炉内烧结制得插层BCZT基陶瓷;随炉冷降温后的陶瓷经过抛光和极化后,测试了其介电与压电性能。
此七层插层BCZT基无铅压电陶瓷在室温至400℃的温度范围内,其压电系数d 33的值为551.2~574.8 pC/N;剩余极化强度P r的值为31.5~33.0μC/cm2
实施例5
制备五层插层的锆钛酸钡钙基无铅压电陶瓷:按照BT、BCZT2、BCZT3的分子式中原子的比例,称取原料粉体后在高能球磨机内均匀混合2h,煅烧得到BCZT基陶瓷粉体;粉体按照从上到下的摩尔量比例为BT:BCZT2:BCZT3:BCZT2:BT=1:3:15:3:1制成五层的生坯,期间逐层施加的压力为2MPa,初步成型坯体在30MPa的压力下保压12min制得生坯;陶瓷生坯在50MPa、1400℃的第二段烧结制度的真空热压烧结炉内烧结制得插层BCZT基陶瓷;随炉冷降温后的陶瓷经过抛光和极化后,测试了其介电与压电性能。
此五层插层BCZT基无铅压电陶瓷在室温至400℃的温度范围内,其压电系数d 33的值为551.2~574.8 pC/N;剩余极化强度P r的值为31.5~33.0μC/cm2
本发明采用真空热压烧结炉制备得到了插层BCZT基无铅压电陶瓷材料,有效保留了准同型相界结构带来的优异压电和铁电性能,并在设定的插层结构下使得介电居里峰合理宽化、铁电性能有效弥散;进而在室温至400℃的温度范围内,插层BCZT基陶瓷的压电系数d 33波动范围不超过±4.5%(527.3~574.8pC/N),剩余极化强度P r的波动范围不超过±6.3%(29.2~33.0μC/cm2)。采用本发明制备的插层BCZT基无铅压电陶瓷有效解决了对组分的过度依赖、并在很宽的使用温度范围内保持了优异的压电与铁电性能,显示出BCZT基无铅压电陶瓷材料在多功能电子陶瓷材料的应用领域具有广阔的前景。
以上描述了本发明示意性的具体实施例,不能理解为对本发明的限制,本领域的相关技术人员在不脱离本发明构思、原理和宗旨的前提下对本发明所做出的等同变化、修改或替换等,均应属于本发明保护的范围。

Claims (8)

1.一种采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷,其特征在于:主要原料包括:碳酸钡、碳酸钙、二氧化钛和二氧化锆纳米粉体,所述的锆 钛酸钡钙基无铅压电陶瓷,由五层或七层BCZT基材料组成;
所述的五层BCZT基材料从上到下依次为:BaTiO3层,即BT层、Ba0.9Ca0.1Ti0.95Zr0.05O3层,即BCZT2层、Ba0.85Ca0.15Ti0.9Zr0.1O3层,即BCZT3层、BCZT2层和BT层;
所述的七层BCZT基材料从上到下依次为:BT层、Ba0.95Ca0.05TiO3层,即BCT层、BCZT2层、BCZT3层、BCZT2层、BCT层和BT层。
2.如权利要求1所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的制备方法,其特征在于,包括以下步骤:
1)按照BT、BCT、BCZT2、BCZT3分子式中原子的摩尔比例分别准确称量主要原料粉体后,在高能球磨机内混合1~2h;
2)分别取步骤1)粉体,在4MPa的压力机下成型得到坯体后;移入高温箱式炉中,在950℃下煅烧2h;
3)步骤2)煅烧后的坯体,经过粗研磨后,再在高能球磨机内混合1h后得到BCZT基陶瓷粉体;
4)按照五层或七层的BCZT基陶瓷材料结构,分别取步骤3)BT、BCT、BCZT2、BCZT3粉体,依次逐层填充在直径为20mm的钢质模具中,并分别在压力机下对每一层粉体施加1~2MPa的压力后初步成型,初步成型后的坯体再在25~30MPa的压力下保压10~15min制得生坯;
5)步骤4)生坯在空气中放置12h后,移入到直径为20mm的石墨模具内,在真空热压烧结炉内烧结制得插层BCZT基陶瓷。
3.根据权利要求2所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的制备方法,其特征在于:所述的步骤4)中五层的结构中从上到下粉体的摩尔量比例为BT:BCZT2:BCZT3:BCZT2:BT=1:3:15:3:1;七层的结构中从上到下粉体的摩尔量比例为BT:BCT:BCZT2:BCZT3:BCZT2:BCT:BT=1:2:3:15:3:2:1。
4.根据权利要求2所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的制备方法,其特征在于:所述的步骤4)中按照摩尔量称取的粉体在置入模具之前,需要添加少量质量分数为2%的聚乙烯醇水溶液,以便于初步成型。
5.根据权利要求2所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的制备方法,其特征在于:所述的步骤5)中真空热压烧结炉设定的烧结程序为三段式的,其中第一段为30MPa、1200℃下烧结1~2h;第二段为40~50MPa、1300~1400℃下烧结1h;第三段为30MPa、1200℃下烧结1h。
6.根据权利要求2所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷的制备方法,其特征在于:所述的步骤5)中烧结程序完成后随着施加压力解除,真空热压烧结炉内的陶瓷随炉冷降至室温。
7.如权利要求1所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷,其特征在于:用如下方式进行电学性能测试,插层BCZT基陶瓷经过抛光工艺和极化工艺后,通过高温介电测量系统和铁电测试系统,分别测试其介电与压电性能;所述的抛光工艺是指将陶瓷表面毛刺祛除后,用砂纸粗磨,而后再在金相磨抛机上细磨;极化工艺是指将抛光后的陶瓷样品两面刷上银电极材料,再在室温、5kV/cm的直流电压下极化30min。
8.根据权利要求7所述的采用真空热压烧结炉制备的插层锆钛酸钡钙基无铅压电陶瓷,其特征在于:所述的经过极化的插层BCZT基陶瓷测试前,需要在大气环境下放置36h,使陶瓷表面富集的电荷消失;插层BCZT基陶瓷材料的压电系数d 33波动范围527.3~574.8pC/N,剩余极化强度P r的波动范围29.2~33.0μC/cm2
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