CN114213121A - 高压电、高介电、高居里压电陶瓷片 - Google Patents
高压电、高介电、高居里压电陶瓷片 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 23
- 238000000498 ball milling Methods 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 230000010287 polarization Effects 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229910052573 porcelain Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 4
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
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- C04B35/493—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT containing also other lead compounds
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- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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Abstract
本发明公开了一种高压电、高介电、高居里压电陶瓷片,属于压电陶瓷芯片;其组分式为Pb0.99Lay(Zr0.49Ti0.51)0.98‑x(Mg1/2W1/2)0.02(Ni1/ 3Nb2/3)xO3,x=0.12、y=0.01;其制备方法是按所述组分式配料,然后球磨、预烧、二次球磨、压片成型、排胶烧结、印银、极化。本发明陶瓷片Tc=280℃、d33≥600pC/N、Kp≥0.75、ε≥2500、tanδ≤1.8%,本发明具有制备工艺简单、成本低、易于批量生产等优点,是一种适用于压电换能器的压电陶瓷材料。
Description
技术领域
本发明涉及一种压电陶瓷片,尤其涉及一种高压电、高介电、高居里压电陶瓷芯片;属于压电陶瓷技术领域。
背景技术
在PZT陶瓷基础上掺杂La3+在A原子位置取代部分Pb2+,可提高PZT陶瓷的介电、压电及铁电等各方面性能。由于PLZT压电陶瓷具有高的压电常数和介电常数,大的机械耦合系数,因此在超声马达、致动器、水听器以及各种压电电声器件等领域有着极其广泛的运用前景。
随着高新技术的不断发展,为了获取较大的能量转换效率,对压电材料的压电应变常数、机电耦合系数等压电性能提出了更高的要求;因此亟待开发一种高压电应变常数、较高耦合系数、高居里温度、适用于压电换能器的压电陶瓷材料。
发明内容
针对现有技术中存在的上述缺陷,本发明旨在提供一种高压电、高介电、高居里压电陶瓷片。
为了实现上述目的,本发明采用以下技术方案:按组分式Pb0.99Lay(Zr0.49Ti0.51)0.98-x(Mg1/2W1/2)0.02(Ni1/3Nb2/3)xO3,x=0.12、y=0.01的化学计量比称取原料氧化物Pb3O4、ZrO2、TiO2、NiO、Nb2O5、La2O3、WO3、MgO进行配料;其制备步骤如下:
1)将上述原料氧化物混合,球磨、烘干,得平均粒径为2μm的一次磨料;
2)将所述一次磨料加热至850℃、保温2h,随炉冷却,得瓷粉;
3)将所述瓷粉球磨,烘干,得平均粒径为0.74μm的二次磨料;
4)所述二次磨料中加入浓度为4%的PVA,混匀、造粒、压片成型,得生坯,PVA的添加量为4wt%;
5)将所述生坯加热至600℃、排胶1h,然后升温至1220℃、保温2小时,随炉冷却,得瓷片;
6)所述瓷片表面印刷银浆,然后在750℃的条件下保温时间20min;
7)将经过烧银处理的瓷片置于90℃的二甲基硅油中极化25min,极化电场强度为2.5KV/mm。
与现有技术比较,本发明压电陶瓷芯片的Tc=280℃、d33≥600pC/N、Kp≥0.75、ε≥2500、tanδ≤1.8%,本发明具有制备工艺简单、成本低、易于批量生产等优点,是一种适用于压电换能器的压电陶瓷材料。
具体实施方式
下面结合具体的实施例对本发明作进一步说明:
实施例1
1)按组分式Pb0.99Lay(Zr0.49Ti0.51)0.98-x(Mg1/2W1/2)0.02(Ni1/3Nb2/3)xO3,x=0.12、y=0.01称取原料氧化物68.32mol%的Pb3O4、15.68mol%的ZrO2、10.57mol%的TiO2、0.9mol%的NiO、3.21mol%的Nb2O5、0.49mol%的La2O3、0.7mol%的WO3、0.12wt.%的MgO;
2)将上述原料氧化物混合,球磨、烘干,得平均粒径为2μm的一次磨料;
3)将所述一次磨料加热至850℃、保温2h,随炉冷却,得瓷粉;
4)将所述瓷粉球磨,烘干,得平均粒径为0.74μm的二次磨料;
5)所述二次磨料中加入浓度为4%的PVA,混匀、造粒、压片成型,得生坯,PVA的添加量为4wt%;
6)将所述生坯加热至600℃、排胶1h,然后升温至1220℃、保温2小时,随炉冷却,得瓷片;
7)所述瓷片表面印刷银浆,然后在750℃的条件下保温时间20min;
8)将经过烧银处理的瓷片置于90℃的二甲基硅油中极化25min,极化电场强度为2.5KV/mm。
Claims (1)
1.一种高压电、高介电、高居里压电陶瓷片,其特征在于按组分式Pb0.99Lay(Zr0.49Ti0.51)0.98-x(Mg1/2W1/2)0.02(Ni1/3Nb2/3)xO3,x=0.12、y=0.01的化学计量比称取原料氧化物Pb3O4、ZrO2、TiO2、NiO、Nb2O5、La2O3、WO3、MgO进行配料,制备步骤如下:
1)将上述原料氧化物混合,球磨、烘干,得平均粒径为2μm的一次磨料;
2)将所述一次磨料加热至850℃、保温2h,随炉冷却,得瓷粉;
3)将所述瓷粉球磨,烘干,得平均粒径为0.74μm的二次磨料;
4)所述二次磨料中加入浓度为4%的PVA,混匀、造粒、压片成型,得生坯,PVA的添加量为4wt%;
5)将所述生坯加热至600℃、排胶1h,然后升温至1220℃、保温2小时,随炉冷却,得瓷片;
6)所述瓷片表面印刷银浆,然后在750℃的条件下保温时间20min;
7)将经过烧银处理的瓷片置于90℃的二甲基硅油中极化25min,极化电场强度为2.5KV/mm。
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CN115490512A (zh) * | 2022-09-19 | 2022-12-20 | 大富科技(安徽)股份有限公司 | 5g微波介质陶瓷材料及其制备方法、微波介质陶瓷器件 |
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CN115490512B (zh) * | 2022-09-19 | 2023-10-20 | 大富科技(安徽)股份有限公司 | 5g微波介质陶瓷材料及其制备方法、微波介质陶瓷器件 |
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