CN114651534A - 布线电路基板和其制造方法 - Google Patents

布线电路基板和其制造方法 Download PDF

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Publication number
CN114651534A
CN114651534A CN202080077832.7A CN202080077832A CN114651534A CN 114651534 A CN114651534 A CN 114651534A CN 202080077832 A CN202080077832 A CN 202080077832A CN 114651534 A CN114651534 A CN 114651534A
Authority
CN
China
Prior art keywords
wiring
terminal
layer
thickness direction
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080077832.7A
Other languages
English (en)
Chinese (zh)
Inventor
福岛理人
高仓隼人
柴田直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN114651534A publication Critical patent/CN114651534A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202080077832.7A 2019-11-12 2020-10-13 布线电路基板和其制造方法 Pending CN114651534A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-204942 2019-11-12
JP2019204942A JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法
PCT/JP2020/038643 WO2021095421A1 (ja) 2019-11-12 2020-10-13 配線回路基板およびその製造方法

Publications (1)

Publication Number Publication Date
CN114651534A true CN114651534A (zh) 2022-06-21

Family

ID=75898316

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080077832.7A Pending CN114651534A (zh) 2019-11-12 2020-10-13 布线电路基板和其制造方法

Country Status (6)

Country Link
US (1) US12279367B2 (enExample)
JP (2) JP7657543B2 (enExample)
KR (1) KR102871731B1 (enExample)
CN (1) CN114651534A (enExample)
TW (1) TWI864140B (enExample)
WO (1) WO2021095421A1 (enExample)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011081861A (ja) * 2009-10-06 2011-04-21 Dainippon Printing Co Ltd 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP2012198957A (ja) * 2011-03-18 2012-10-18 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
CN104869746A (zh) * 2014-02-25 2015-08-26 日东电工株式会社 配线电路基板和其制造方法
CN105513616A (zh) * 2014-10-14 2016-04-20 日东电工株式会社 带电路的悬挂基板
CN107799561A (zh) * 2016-08-30 2018-03-13 三星显示有限公司 显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129490A (ja) 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5699311B2 (ja) * 2009-10-06 2015-04-08 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5652115B2 (ja) 2010-10-20 2015-01-14 大日本印刷株式会社 配線付フレキシャー基板、配線付フレキシャー基板の製造方法、配線付フレキシャー、素子付配線付フレキシャーおよびハードディスクドライブ
KR20180103859A (ko) * 2016-01-12 2018-09-19 메이코 일렉트로닉스 컴파니 리미티드 부품 내장 기판 및 부품 내장 기판의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011081861A (ja) * 2009-10-06 2011-04-21 Dainippon Printing Co Ltd 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP2012198957A (ja) * 2011-03-18 2012-10-18 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
CN104869746A (zh) * 2014-02-25 2015-08-26 日东电工株式会社 配线电路基板和其制造方法
CN105513616A (zh) * 2014-10-14 2016-04-20 日东电工株式会社 带电路的悬挂基板
CN107799561A (zh) * 2016-08-30 2018-03-13 三星显示有限公司 显示装置

Also Published As

Publication number Publication date
US20220386459A1 (en) 2022-12-01
US12279367B2 (en) 2025-04-15
KR102871731B1 (ko) 2025-10-15
KR20220098735A (ko) 2022-07-12
JP2024128157A (ja) 2024-09-20
WO2021095421A1 (ja) 2021-05-20
TW202133284A (zh) 2021-09-01
JP2021077806A (ja) 2021-05-20
JP7657543B2 (ja) 2025-04-07
TWI864140B (zh) 2024-12-01

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