JP7657543B2 - 配線回路基板およびその製造方法 - Google Patents

配線回路基板およびその製造方法 Download PDF

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Publication number
JP7657543B2
JP7657543B2 JP2019204942A JP2019204942A JP7657543B2 JP 7657543 B2 JP7657543 B2 JP 7657543B2 JP 2019204942 A JP2019204942 A JP 2019204942A JP 2019204942 A JP2019204942 A JP 2019204942A JP 7657543 B2 JP7657543 B2 JP 7657543B2
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JP
Japan
Prior art keywords
wiring
terminal
insulating layer
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019204942A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021077806A (ja
Inventor
理人 福島
隼人 高倉
直樹 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019204942A priority Critical patent/JP7657543B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to KR1020227015155A priority patent/KR102871731B1/ko
Priority to PCT/JP2020/038643 priority patent/WO2021095421A1/ja
Priority to CN202080077832.7A priority patent/CN114651534A/zh
Priority to US17/775,797 priority patent/US12279367B2/en
Priority to TW109135621A priority patent/TWI864140B/zh
Publication of JP2021077806A publication Critical patent/JP2021077806A/ja
Priority to JP2024114216A priority patent/JP2024128157A/ja
Application granted granted Critical
Publication of JP7657543B2 publication Critical patent/JP7657543B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2019204942A 2019-11-12 2019-11-12 配線回路基板およびその製造方法 Active JP7657543B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019204942A JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法
PCT/JP2020/038643 WO2021095421A1 (ja) 2019-11-12 2020-10-13 配線回路基板およびその製造方法
CN202080077832.7A CN114651534A (zh) 2019-11-12 2020-10-13 布线电路基板和其制造方法
US17/775,797 US12279367B2 (en) 2019-11-12 2020-10-13 Wiring circuit board and producing method thereof
KR1020227015155A KR102871731B1 (ko) 2019-11-12 2020-10-13 배선 회로 기판 및 그 제조 방법
TW109135621A TWI864140B (zh) 2019-11-12 2020-10-15 配線電路基板及其製造方法
JP2024114216A JP2024128157A (ja) 2019-11-12 2024-07-17 配線回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019204942A JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024114216A Division JP2024128157A (ja) 2019-11-12 2024-07-17 配線回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2021077806A JP2021077806A (ja) 2021-05-20
JP7657543B2 true JP7657543B2 (ja) 2025-04-07

Family

ID=75898316

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019204942A Active JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法
JP2024114216A Pending JP2024128157A (ja) 2019-11-12 2024-07-17 配線回路基板およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024114216A Pending JP2024128157A (ja) 2019-11-12 2024-07-17 配線回路基板およびその製造方法

Country Status (6)

Country Link
US (1) US12279367B2 (enExample)
JP (2) JP7657543B2 (enExample)
KR (1) KR102871731B1 (enExample)
CN (1) CN114651534A (enExample)
TW (1) TWI864140B (enExample)
WO (1) WO2021095421A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015158963A (ja) 2014-02-25 2015-09-03 日東電工株式会社 配線回路基板およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129490A (ja) 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5581644B2 (ja) * 2009-10-06 2014-09-03 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5699311B2 (ja) * 2009-10-06 2015-04-08 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5652115B2 (ja) 2010-10-20 2015-01-14 大日本印刷株式会社 配線付フレキシャー基板、配線付フレキシャー基板の製造方法、配線付フレキシャー、素子付配線付フレキシャーおよびハードディスクドライブ
JP5712717B2 (ja) 2011-03-18 2015-05-07 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6466680B2 (ja) * 2014-10-14 2019-02-06 日東電工株式会社 回路付サスペンション基板
WO2017122284A1 (ja) * 2016-01-12 2017-07-20 株式会社メイコー 部品内蔵基板及び部品内蔵基板の製造方法
KR102508462B1 (ko) * 2016-08-30 2023-03-09 삼성디스플레이 주식회사 표시 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015158963A (ja) 2014-02-25 2015-09-03 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
TWI864140B (zh) 2024-12-01
US20220386459A1 (en) 2022-12-01
KR102871731B1 (ko) 2025-10-15
CN114651534A (zh) 2022-06-21
TW202133284A (zh) 2021-09-01
WO2021095421A1 (ja) 2021-05-20
KR20220098735A (ko) 2022-07-12
JP2021077806A (ja) 2021-05-20
JP2024128157A (ja) 2024-09-20
US12279367B2 (en) 2025-04-15

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