CN114585684A - 密封用树脂组合物及半导体装置 - Google Patents

密封用树脂组合物及半导体装置 Download PDF

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Publication number
CN114585684A
CN114585684A CN202080073411.7A CN202080073411A CN114585684A CN 114585684 A CN114585684 A CN 114585684A CN 202080073411 A CN202080073411 A CN 202080073411A CN 114585684 A CN114585684 A CN 114585684A
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China
Prior art keywords
silica
sealing
resin composition
less
average particle
Prior art date
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Withdrawn
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CN202080073411.7A
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English (en)
Chinese (zh)
Inventor
木佐贯敦
伊藤明日美
小西孝宪
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN114585684A publication Critical patent/CN114585684A/zh
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080073411.7A 2019-10-24 2020-09-24 密封用树脂组合物及半导体装置 Withdrawn CN114585684A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-193856 2019-10-24
JP2019193856 2019-10-24
PCT/JP2020/035983 WO2021079677A1 (ja) 2019-10-24 2020-09-24 封止用樹脂組成物、及び半導体装置

Publications (1)

Publication Number Publication Date
CN114585684A true CN114585684A (zh) 2022-06-03

Family

ID=75619295

Family Applications (1)

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CN202080073411.7A Withdrawn CN114585684A (zh) 2019-10-24 2020-09-24 密封用树脂组合物及半导体装置

Country Status (4)

Country Link
JP (1) JPWO2021079677A1 (enrdf_load_stackoverflow)
CN (1) CN114585684A (enrdf_load_stackoverflow)
TW (1) TWI862704B (enrdf_load_stackoverflow)
WO (1) WO2021079677A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240029962A (ko) * 2022-08-29 2024-03-07 주식회사 케이씨씨 에폭시 수지 조성물

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JPH06100313A (ja) * 1992-09-17 1994-04-12 Shin Etsu Chem Co Ltd 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP2003073527A (ja) * 2001-08-31 2003-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物
CN109844020A (zh) * 2016-10-14 2019-06-04 日立化成株式会社 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP2019151716A (ja) * 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI432477B (zh) * 2010-08-18 2014-04-01 Benq Materials Corp 環氧樹脂組成物
JPWO2013133015A1 (ja) * 2012-03-07 2015-07-30 東レ株式会社 半導体装置の製造方法および半導体装置の製造装置
JP6302902B2 (ja) * 2013-06-14 2018-03-28 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JPH06100313A (ja) * 1992-09-17 1994-04-12 Shin Etsu Chem Co Ltd 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP2003073527A (ja) * 2001-08-31 2003-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物
CN109844020A (zh) * 2016-10-14 2019-06-04 日立化成株式会社 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP2019151716A (ja) * 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

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TW202129863A (zh) 2021-08-01
TWI862704B (zh) 2024-11-21
WO2021079677A1 (ja) 2021-04-29

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Application publication date: 20220603