CN114502685B - 连接体的制备方法、各向异性导电接合材料及连接体 - Google Patents

连接体的制备方法、各向异性导电接合材料及连接体 Download PDF

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Publication number
CN114502685B
CN114502685B CN202080071245.7A CN202080071245A CN114502685B CN 114502685 B CN114502685 B CN 114502685B CN 202080071245 A CN202080071245 A CN 202080071245A CN 114502685 B CN114502685 B CN 114502685B
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solder particles
anisotropic conductive
conductive bonding
electrode
electronic component
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Chinese (zh)
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CN114502685A (zh
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阿部智幸
石松朋之
青木正治
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
CN202080071245.7A 2019-10-25 2020-10-14 连接体的制备方法、各向异性导电接合材料及连接体 Active CN114502685B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019194428A JP7032367B2 (ja) 2019-10-25 2019-10-25 接続体の製造方法、異方性導電接合材料、及び接続体
JP2019-194428 2019-10-25
PCT/JP2020/038842 WO2021079812A1 (ja) 2019-10-25 2020-10-14 接続体の製造方法、異方性導電接合材料、及び接続体

Publications (2)

Publication Number Publication Date
CN114502685A CN114502685A (zh) 2022-05-13
CN114502685B true CN114502685B (zh) 2024-04-12

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CN202080071245.7A Active CN114502685B (zh) 2019-10-25 2020-10-14 连接体的制备方法、各向异性导电接合材料及连接体

Country Status (5)

Country Link
JP (2) JP7032367B2 (https=)
KR (1) KR102707134B1 (https=)
CN (1) CN114502685B (https=)
TW (1) TWI870491B (https=)
WO (1) WO2021079812A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023092710A (ja) * 2021-12-22 2023-07-04 デクセリアルズ株式会社 接続構造体及び接続構造体の製造方法
KR102677735B1 (ko) * 2021-12-28 2024-06-24 주식회사 노피온 이방성 도전접착제 및 이의 조성물
KR20240131377A (ko) 2022-03-31 2024-08-30 데쿠세리아루즈 가부시키가이샤 도전 필름, 접속 구조체 및 그 제조 방법
US20260109886A1 (en) 2022-09-30 2026-04-23 Nitto Denko Corporation Bonding sheet
WO2025211339A1 (ja) * 2024-04-03 2025-10-09 日東電工株式会社 導電組成物、導電シート、接続構造体、接続構造体の製造方法、積層体、及び、積層体の製造方法
WO2026018836A1 (ja) * 2024-07-16 2026-01-22 デクセリアルズ株式会社 半田接続材料、接続構造体の製造方法、及び接続構造体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1820361A (zh) * 2003-02-05 2006-08-16 千住金属工业株式会社 端子间的连接方法及半导体装置的安装方法

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Publication number Priority date Publication date Assignee Title
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP5032938B2 (ja) 2007-10-24 2012-09-26 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
JP2009147231A (ja) 2007-12-17 2009-07-02 Hitachi Chem Co Ltd 実装方法、半導体チップ、及び半導体ウエハ
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
CN104059547B (zh) 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP6114627B2 (ja) * 2012-05-18 2017-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP6114557B2 (ja) 2013-01-10 2017-04-12 積水化学工業株式会社 導電材料及び接続構造体の製造方法
JP2015098588A (ja) 2013-10-17 2015-05-28 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
JP2015193683A (ja) 2014-03-31 2015-11-05 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
KR20170102184A (ko) * 2014-12-26 2017-09-08 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
JP6557591B2 (ja) * 2014-12-26 2019-08-07 積水化学工業株式会社 導電フィルム、接続構造体及び接続構造体の製造方法
KR101820214B1 (ko) * 2015-11-27 2018-01-18 이경섭 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1820361A (zh) * 2003-02-05 2006-08-16 千住金属工业株式会社 端子间的连接方法及半导体装置的安装方法

Also Published As

Publication number Publication date
KR20220062055A (ko) 2022-05-13
JP7032367B2 (ja) 2022-03-08
TWI870491B (zh) 2025-01-21
JP2021068842A (ja) 2021-04-30
JP2022060494A (ja) 2022-04-14
CN114502685A (zh) 2022-05-13
KR102707134B1 (ko) 2024-09-13
TW202122535A (zh) 2021-06-16
WO2021079812A1 (ja) 2021-04-29
JP7432633B2 (ja) 2024-02-16

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