CN114423557A - 用于电子组件的工程化材料 - Google Patents

用于电子组件的工程化材料 Download PDF

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Publication number
CN114423557A
CN114423557A CN202080066345.0A CN202080066345A CN114423557A CN 114423557 A CN114423557 A CN 114423557A CN 202080066345 A CN202080066345 A CN 202080066345A CN 114423557 A CN114423557 A CN 114423557A
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China
Prior art keywords
solder
alloys
core
layer
core material
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Pending
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CN202080066345.0A
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English (en)
Inventor
R·潘德尔
N·纳加拉扬
吉拉德·西顿
C·比尔格林
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Alpha Assembly Solutions Inc
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Alpha Metals Inc
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Publication of CN114423557A publication Critical patent/CN114423557A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Die Bonding (AREA)

Abstract

本发明公开了一种在电子组件中使用的焊料材料，该焊料材料包括：焊料层；和包括芯材料的芯层，该芯层被夹置在焊料层之间，其中：芯材料的热导率大于焊料的热导率。

Description

用于电子组件的工程化材料
本发明涉及一种在电子组件中使用的焊料材料。
存在与高功率电子装置的封装和组装相关联的两个主要挑战，该高功率电子装置诸如IGBT、MOSFET、高功率LED、高功率微处理器和在正常操作期间产生大量热量的其他大面积装置。首先，如何确保将产生的热量有效耗散以维持正常操作温度。第二，如何降低由于焊料或其他粘合剂材料附接的相邻层的材料之间的热膨胀系数(CTE)失配引起的剪切应力。
图1示出了典型的电子装置的组件1，该组件包括经由互连件3(第I级)连接到衬底4的装置2。衬底4经由互连件5(第II级)连接到印刷电路板(PCB)6。该PCB 6经由互连件7(第III级)连接到散热器8。用于高功率电子装置的最重要的互连件是将装置/管芯连接到衬底、将衬底连接到印刷电路板(PCB)和将PCB连接到散热器的那些互连件，即图1的3、5和7。此类互连件位于热耗散路径中。因此，期望互连材料的高热导率。半导体管芯材料、衬底材料和PCB材料具有不同的CTE，从而在高温操作期间在界面处产生应力。为了使该应力最小化，设计者通常增加互连件的界面厚度，但这继而增加了界面的热阻。
焊料是电子工业中使用的最常见互连材料。大部分焊料的热导率低于65W/m.K。能够使用具有较高热导率的互连材料以便帮助热耗散将是有利的。厚的焊料互连件的另一个问题在于，在回流工艺期间，当焊料呈液相时，管芯或衬底在该焊料被冷却到低于焊料的冷冻温度之前在液体材料上浮接。这导致管芯/衬底在所有方向上移动(所谓的“倾斜”)，这是装置性能和可靠性的另一个问题。控制该管芯移动是一个挑战。
本发明试图解决与现有技术相关联的至少一些问题或至少提供现有技术的商业上可接受的替代解决方案。
在第一方面，本发明提供了一种在电子组件中使用的焊料材料，该焊料材料包括：
焊料层；和
包括芯材料的芯层，该芯层被夹置在焊料层之间，
其中：
芯材料的热导率大于焊料的热导率。
如本文所定义的每个方面或实施方案可与任何其他方面或实施方案组合，除非有明确的相反指示。具体地，被指示为优选或有利的任何特征可与被指示为优选或有利的任何其他特征组合。
发明人已惊奇地发现，当用于连接在升高的温度下操作的电子装置的部件时，此类焊料材料可以能够降低由连接部件的CTE值的失配引起的应力。不受理论的束缚，认为芯材料的存在用于“增厚”连接部件之间的接头，从而降低应力。有利地，可以在不显著降低来自连接部件的热耗散的情况下提供此类应力降低。不受理论的束缚，认为这是因为芯材料的热导率大于焊料的热导率。换句话说，通过使用其热导率比焊料的热导率大的芯材料，可能使接头增厚以在不降低热耗散的情况下降低热应力。因此，其中使用焊料材料连接部件的高功率电子装置诸如IGBT、MOSFET、高功率LED、高功率微处理器或在正常操作期间产生大量热量的其他大面积装置可以表现出改善的性能和/或可靠性。此类性能和可靠性可在升高的温度和/或接通和断开期间改善。
与典型的无铅焊料诸如SnCu、SAC、SnAg和SnBi相比，使用焊料材料形成的接头或互连件可能具有更好的热机械可靠性。
本文所用的术语“电子组件”涵盖例如电子封装件和装置的组件，并且可以包括例如将装置或管芯附接到衬底、将衬底附接到印刷电路板或将印刷电路板附接到散热器的附接件。
本文所用的术语“焊料”涵盖熔点在90℃至400℃范围内的易熔金属或金属合金。
焊料材料包括焊料层和芯层。焊料材料可以基本上由焊料层和芯层组成或由焊料层和芯层组成。“基本上由……组成”意指焊料材料可以包括其他非特定部件，前提条件是它们不会实质上影响焊料材料的性质。
焊料材料通常包括两个焊料层，但可以包括多于两个焊料层。该焊料层可以由相同的焊料或不同的焊料形成。通常，焊料层由相同的焊料或至少具有类似回流温度的焊料形成，即，液相线温度以不超过20℃、典型地不超过10℃、更典型地不超过5℃不同。
焊料和芯呈层的形式。此类层将通常呈片的形式，其中两个相背对表面(主表面)具有比其他表面显著更大的表面积。焊料层可以是相同的尺寸和形状，或者可以是不同的尺寸和/或形状。芯层可以具有与一个或多个焊料层相似的尺寸和形状，或者可以具有不同的尺寸和/或形状。
芯层包括芯材料。芯层可以基本上由芯材料组成或由芯材料组成。
芯层被夹置在焊料层之间。通常，焊料层将基本上覆盖芯层的整个至少两个相背对表面、典型地主(即最大表面积)表面。芯层可以完全包封在焊料内，使得没有芯材料暴露。在这种情况下，认为第一焊料片覆盖该片的主表面，并且认为第二焊料层覆盖该片的相背对主表面，其中两个焊料层“悬挂”在主表面之上以便覆盖芯层的剩余表面。另选地，芯层可以在仅一些表面、典型地仅两个相背对表面、更典型地主表面上被焊料层覆盖。
该焊料层通常与芯层直接接触。焊料层通常是外层。
芯材料的热导率大于焊料的热导率。通常，这种热导率通过纳米闪光瞬态测量技术来测量。
芯材料的热导率优选地大于或等于65W/m.K，优选地大于65W/m.K，更优选地大于70W/m.K，甚至更优选地大于75W/m.K。此类热导率可以通过纳米闪光瞬态测量技术来测量。由于电子组件中采用的典型的焊料具有小于65w/m.K的热导率，因此具有较高热导率的芯材料的存在增加了焊料材料的整体热导率。
芯材料的熔点优选地大于焊料的回流温度。例如，芯材料的熔融温度可比焊料的回流温度高至少50℃，典型地高至少75℃，更典型地高至少100℃。术语“回流温度”在本文中用于指高于固体焊料块一定熔融(与仅软化不同)的温度。如果冷却到低于该温度，则焊料将不会流动。加热到再一次高于该温度，焊料将再次流动，即“回流”。通过使芯材料的熔融温度高于焊料的回流温度，可以增加接头/互连件的厚度，而不会显著增加管芯/封装件移动和/或倾斜，这是由于当焊料处于液态时管芯/封装件在液体焊料的顶部上浮接。这可以改善具有使用焊料材料连接的部件的电子装置的性能或可靠性。
芯层的厚度优选地为100μm至500μm、更优选地200μm至400μm、甚至更优选地150μm至300μm。此类厚度可以特别适合于降低由部件的CTE失配引起的应力而不会过度增加电子装置的尺寸。较大的厚度可以增加热阻。相对较高的厚度可能导致较高的电阻但较低的侧向应力。
每个焊料层的厚度优选地为25μm至150μm、甚至更优选地50μm至100μm。此类厚度可能特别适合于在部件之间提供足够的粘附力，而不会显著降低焊料材料的整体热导率或过度增加装置的尺寸。较低的厚度可能在温度循环的高温操作期间导致较高的侧向应力。
芯层和焊料层的厚度可以根据需要通过封装设计进行选择，并且实现互连件的期望厚度。
芯材料优选地包含金属和/或合金(或由金属和/或合金组成或基本上由金属和/或合金组成)。金属和金属合金可以提供足够的电导率以提供由焊接材料接合的部件之间的高水平电连接件。
芯材料优选地包含以下项中的一者或多者(或由以下项中的一者或多者组成或基本上由以下项中的一者或多者组成)：铜、银、镍、钼、铍、钴、铁、铜-钨合金、镍-银合金、铜-锌合金和铜-镍-锌合金、更优选地铜和银中的一者或多者。此类材料可以提供高电导率和高热导率的有利组合。
芯材料的CTE将具有对界面处的应力的影响。可以通过选择适当的芯材料来降低该应力。例如，镍的CTE是13ppm/K，而铜的CTE是17ppm/K，并且CuW合金的CTE取决于组合物，并且可以调制以满足装置设计需求。
芯材料的电导率在20℃下优选地为至少1×105S/m、更优选地至少1×106S/m、更优选地至少1×107S/m、甚至更优选地至少4×107S/m、仍甚至更优选地至少5×107S/m。此类电导率可以提供由焊接材料接合的部件之间的高水平电连接件。
焊料优选地是无铅的。这意味着不会有意添加铅。因此，铅的含量为零，或不超过意外的杂质水平。无铅焊料根据健康问题和监管要求可能是有利的。
焊料优选地包括以下项中的一者或多者：In、SnIn合金(例如，5％-58％Sn、42％-95％In)、SnBi合金(例如，42％-60％Sn、40％-58％Bi)、BiIn合金(例如，5％-67％Bi、33％-95％In)、AgIn合金(例如，1％-5％Ag、95％-99％In，例如，3％Ag、97％In)、SnAg合金(例如，90％-97.5％Sn、2.5％-10％Ag)、SnCu合金(例如，99.3％-99.6％Sn、0.4％-0.7％Cu)、InGa合金(例如，99.3％-99.5％In、0.5％-0.7％Ga)、SnBiAgCu合金(例如，50％Sn、47％Bi、1％Ag、2％Cu)、SnBiZn合金(例如，65.5％Sn、31.5％Bi、3％Zn)、SnInAg合金(例如，77.2％Sn、20％In、2.8％Ag)、SnBiAgCuIn合金(例如，82.3％Sn、2.2％Bi、3％Ag、0.5％Cu、12％In)、SnZn合金(例如，91％Sn、9％Zn)、SnCuInGa合金(例如，92.8％Sn、0.7％Cu、6％In、0.5％Ga)、SnCuAg合金(例如，95.5％Sn、3.8％Ag、0.7％Cu)、SnAgSb合金(例如，95％Sn、3.5％Ag、1.5％Sb)和SnCuSb合金(例如，4％-95％Sn、1％-2％Cu、4％Sb)。％值是指重量％。合金可以包括所引用的元素以及任何不可避免的杂质。此类合金可以特别适合于连接电气装置的部件。
在优选示例中，芯材料包括铜，并且焊料包括Sn-20In-2Ag合金。
焊料材料优选地呈箔、条状物、膜、带状物或预成型件的形式。此类形式可以特别适合于连接电子装置的部件并且/或者可以表现出有利的处理性质。
在优选实施方案中，芯完全涂覆有焊料。换句话说，芯完全被焊料包围，并且芯中没有一个部分暴露。在这种情况下，芯材料中没有任何部分暴露于空气或其他操作环境。这种设计对于在暴露于氧气和/或湿度时倾向于被氧化的芯材料(诸如例如，Cu或Ni)可能是优选的。
在替代的优选实施方案中，芯在仅两个相背对表面、典型地两个最大相背对表面(主表面)上涂覆有焊料。这种设计对于高容量制造可能相对容易，因为大尺寸的片或带状物可以涂覆有焊料，预成型件可以通过高速冲压工艺从该焊料切割。
焊料材料的有效热导率优选地大于65W/m.K，更优选地大于80W/m.K，甚至更优选地大于100W/m.K，仍甚至更优选地大于130W/m.K。“有效热导率”意指焊料材料的整体热导率，即包括焊料(具有较低热导率)和芯(具有较高热导率)两者。此类有效热导率可以改善来自焊料材料的热耗散。
本发明的第一方面涉及一种焊料材料。术语“焊料材料”可以与术语“多层结构”同义。另外，术语“焊料层”与术语“两个或更多个焊料层”同义。另外，为了避免疑义，焊料层包括焊料材料。焊料层通常是外层。
因此，本发明的第一方面另选地措词为一种在电子组件中使用的多层材料，该多层材料包括：
两个或更多个(例如，外)焊料层，每个焊料层包括焊料材料；和
包括芯材料的芯层，该芯层被夹置在两个或更多个焊料层之间，其中：
芯材料的热导率大于焊料材料的热导率。
在另一个方面，本发明提供了一种包括本文所述的焊料材料的焊接接头。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。此类接头可以表现出高热耗散和由接合部件的CTE失配引起的低应力的有利组合。因此，与常规电子装置相比，包含此类接头的电子装置可以表现出改善的性能和可靠性。焊接接头的厚度对应于芯层和焊料层的厚度的总和。通常，厚度在回流期间不改变。
在另一个方面，本发明提供了一种包括本文所述的焊料材料的互连件。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。此类互连件可以表现出高热耗散和由接合部件的CTE失配引起的低应力的有利组合。因此，与常规电子装置相比，包含此类互连件的电子装置可以表现出改善的性能和可靠性。
在另一个方面，本发明提供了一种电子装置，该电子装置包含本文所述的焊料材料、焊接接头或互连件。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。与常规电子装置相比，此类装置可以表现出改善的性能和可靠性。
在另一个方面，本发明提供了一种IGBT、MOSFET、LED或微处理器，该IGBT、MOSFET、LED或微处理器包括本文所述的焊料材料、焊接接头或互连件。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。与常规电子装置相比，此类装置可以表现出改善的性能和可靠性。
在另一个方面，本发明提供了一种本文所述的焊料材料在焊接方法中的用途，该焊接方法选自表面贴装技术(SMT)焊接、管芯附接焊接、热界面焊接、手动焊接、激光和RF感应焊接，以及热超声焊接。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。本文所述的焊料材料特别适用于此类用途。
在另一个方面，本发明提供了一种本文所述的焊料材料用于管芯附接(第I级)、衬底附接(第II级)或封装件到散热器的附接(第III级)的用途。为了避免疑义，第一方面的优点和优选特征同样适用于该方面。
本文所述的焊料材料特别适用于此类用途。
在另一个方面，本发明提供了一种形成焊接接头的方法，该方法包括：
在两个或更多个待接合的工件附近提供本文所述的焊料材料，以及
加热焊料材料以形成焊接接头。
为了避免疑义，第一方面的优点和优选特征同样适用于该方面。所得接头可以表现出高热耗散和由接合部件的CTE失配引起的低应力的有利组合。因此，与常规电子装置相比，包含此类接头的电子装置可以表现出改善的性能和可靠性。
两个或更多个待接合的工件包括：
装置或管芯和衬底，或
衬底和印刷电路板(PCB)，或
印刷电路板和散热器。
此类工件特别适合于由焊料材料接合，因为它们需要具有高热耗散，并且对于它们表现出由CTE失配引起的低应力是有益的。
在另一个方面，本发明提供了一种制造本文所述的焊料材料的方法，该方法包括：
提供两个或更多个焊料层，
提供芯材料层，以及
将焊料层层压在芯材料层的任一侧面上。
为了避免疑义，第一方面的优点和优选特征同样适用于该方面。根据焊料和芯材料以及加工条件，存在层压后的结构的厚度减小。必须考虑该减小因子以实现目标尺寸。
芯材料层优选地呈带状物的形式，并且/或者焊料层呈带状物的形式。
带状物优选地通过浇铸、挤出或拉伸提供。
层优选地在共同拉伸工艺、优选地高压共同拉伸工艺中层压。
所层压的层优选地被切割和/或冲压。
在另一个方面，本发明提供了一种制造本文所述的焊料材料的方法，该方法包括：
提供芯材料层，以及
用焊料涂覆芯材料。
芯材料层的表面优选地在涂覆有焊料之前被清洗。这可能导致芯与焊料之间的较强粘附力，从而降低分层的发生率以及包含使用焊料材料形成的接头的装置的所得可靠性损失。
用焊料涂覆芯材料优选地包括使芯材料与熔融焊料槽接触，例如通过将芯材料浸入熔融焊料槽中。
可以改变各种工艺参数诸如焊料槽温度、通过槽的带状物速度等，以控制焊料涂层厚度。
现在将结合以下非限制性附图来描述本发明，其中：
图1示出了典型的电子装置的组件的示意图。
图2示出了根据本发明的焊料材料的替代布置的横截面示意图。
图3示出了根据本发明的焊料材料的横截面的显微镜图像。
图2示出了根据本发明的两种类型的焊料材料的剖视图。焊料材料包括夹置在焊料层10之间的芯层9。顶部图片中所示的焊料材料仅在顶侧和底侧处具有焊料。在侧面上没有焊料。其他焊料材料在芯的所有侧面上具有焊料。
现在将结合以下非限制性示例来描述本发明。
实施例1
通过高压层压工艺制备焊料材料(预成型件)。图3示出了预成型件的横截面的显微镜图像。中心芯为300μm厚并且由铜形成。两个侧面上的焊料是Sn20％In2％Ag。焊料厚度从50μm变化到100μm。该样品的有效热导率为约130W/m.K，通过纳米闪光瞬态测量技术测量。
实施例2
以与实施例1类似的方式制备多个预成型件，但具有不同的芯(Keff＝400W/m.K)的厚度和焊料层(Keff＝54W/m.K)的厚度。评估预成型件的热性能。表1示出了估计热阻和等效热导率。与单独的焊料相比，厚界面的热阻低得多(等效Keff高得多)。
Figure BDA0003558706140000091
表2：具有其估计热阻和等效热导率的Cu芯预成型件的所选实施例。
现在将参考以下编号条款来进一步描述本发明：
1.一种焊料材料，包括：
芯，所述芯包括芯材料；和
焊料，所述焊料至少部分地涂覆所述芯。
2.根据条款1所述的焊料材料，所述焊料材料在电子组件中使用。
3.根据条款1或条款2所述的焊料材料，其中所述芯呈层的形式。
4.根据条款3所述的焊料材料，其中所述芯层的厚度为100μm至500μm、优选地200μm至400μm、更优选地150μm至300μm。
5.根据条款3或条款4所述的焊料材料，其中焊料呈层的形式，并且其中所述芯被夹置在两个焊料层之间。
6.根据条款6所述的焊料材料，其中所述焊料层的厚度为25μm至150μm、优选地50μm至100μm。
7.根据任一前述条款所述的焊料材料，所述焊料材料呈箔、条状物、膜、带状物或预成型件的形式。
8.根据任一前述条款所述的焊料材料，其中所述芯材料的熔点大于所述焊料的回流温度。
9.根据任一前述条款所述的焊料材料，其中所述芯材料的热导率大于所述焊料的热导率。
10.根据条款9所述的焊料材料，其中所述芯材料的热导率大于或等于65W/m.K，优选地大于65W/m.K，更优选地大于70W/m.K，甚至更优选地大于75W/m.K。
11.根据任一前述条款所述的焊料材料，其中所述芯材料包括金属和/或合金。
12.根据任一前述条款所述的焊料材料，其中所述芯材料包括以下项中的一者或多者：铜、银、镍、钼、铍、钴、铁、铜-钨合金、镍-银合金、铜-锌合金和铜-镍-锌合金。
13.根据任一前述条款所述的焊料材料，其中所述焊料是无铅的。
14.根据任一前述条款所述的焊料材料，其中所述焊料包括以下项中的一者或多者：In、SnIn合金(例如，5％-58％Sn、42％-95％In)、SnBi合金(例如，42％-60％Sn、40％-58％Bi)、BiIn合金(例如，5％-67％Bi、33％-95％In)、AgIn合金(例如，3％Ag、97％In)、SnAg合金(例如，90％-97.5％Sn、2.5％-10％Ag)、SnCu合金(例如，99.3％-99.6％Sn、0.4％-0.7％Cu)、InGa合金(例如，99.3％-99.5％In、0.5％-0.7％Ga)、SnBiAgCu合金(例如，50％Sn、47％Bi、1％Ag、2％Cu)、SnBiZn合金(例如，65.5％Sn、31.5％Bi、3％Zn)、SnInAg合金(例如，77.2％Sn、20％In、2.8％Ag)、SnBiAgCuIn合金(例如，82.3％Sn、2.2％Bi、3％Ag、0.5％Cu、12％In)、SnZn合金(例如，91％Sn、9％Zn)、SnCuInGa合金(例如，92.8％Sn、0.7％Cu、6％In、0.5％Ga)、SnCuAg合金(例如，95.5％Sn、3.8％Ag、0.7％Cu)、SnAgSb合金(例如，95％Sn、3.5％Ag、1.5％Sb)和SnCuSb合金(例如，4％-95％Sn、1％-2％Cu、4％Sb)。
15.根据任一前述条款所述的焊料材料，其中所述芯材料包括铜，并且所述焊料包括Sn-20In-2Ag合金。
16.根据任一前述条款所述的焊料材料，其中所述芯和所述焊料呈层的形式，并且其中所述焊料层涂覆在所述芯层的任一侧面上。
17.根据条款16所述的焊料材料，其中所述芯层的厚度为100μm至500μm、优选地200μm至400μm、更优选地150μm至300μm。
18.根据条款16或条款17所述的焊料材料，其中所述焊料层的厚度为25μm至150μm、优选地50μm至100μm。
19.根据任一前述条款所述的焊料材料，其中所述芯完全涂覆有所述焊料。
20.根据任一前述条款所述的焊料材料，所述焊料材料的有效热导率大于65W/m.K，优选地大于80W/m.K，更优选地大于100W/m.K，甚至更优选地大于130W/m.K。
21.一种根据任一前述条款所述的焊料材料在焊接方法中的用途，所述焊接方法选自表面贴装技术(SMT)焊接、管芯附接焊接、热界面焊接、手动焊接、激光和RF感应焊接，以及热超声焊接。
22.一种根据条款1至20中任一项所述的焊料材料用于管芯附接(第I级)、衬底附接(第II级)或封装件到散热器的附接(第III级)的用途。
23.一种互连件，包括根据条款1至20中任一项所述的焊料材料。
24.一种IGBT、MOSFET、LED或微处理器，包括根据条款1至20中任一项所述的焊料材料或根据条款23所述的互连件。
25.一种形成焊接接头的方法，所述方法包括：
在两个或更多个待接合的工件附近提供根据条款1至20中任一项所述的焊料材料，以及
加热所述焊料材料以形成焊接接头。
26.一种制造根据条款1至20中任一项所述的焊料材料的方法，所述方法包括：
提供两个或更多个焊料层，
提供芯材料层，以及
将所述焊料层层压在所述芯材料层的任一侧面上。
27.根据条款26所述的方法，其中所述芯材料层呈带状物的形式，并且/或者所述焊料层呈带状物的形式。
28.根据条款27所述的方法，其中所述带状物通过浇铸、挤出或拉伸提供。
29.根据条款26至28中任一项所述的方法，其中所述层在共同拉伸工艺、优选地高压共同拉伸工艺中层压。
30.根据条款26至29中任一项所述的方法，其中所层压的层被切割和/或冲压。
31.一种制造根据条款1至20中任一项所述的焊料材料的方法，所述方法包括：
提供芯材料层，以及
用焊料涂覆所述芯材料。
32.根据条款31所述的方法，其中所述芯材料层的表面在涂覆有所述焊料之前被清洗。
33.根据条款31或条款33所述的方法，其中用焊料涂覆所述芯材料包括使所述芯材料穿过熔融焊料槽。
上述详细描述已经通过解释和说明的方式提供，并且不旨在限制所附权利要求的范围。本文示出的本发明优选实施方案的许多变型形式对于本领域的普通技术人员而言将是显而易见的，并且仍然在所附权利要求及其等同物的范围内。

Claims (28)

1.一种在电子组件中使用的焊料材料，所述焊料材料包括：
焊料层；和
芯层，所述芯层包括芯材料，所述芯层被夹置在所述焊料层之间，
其中：
所述芯材料的热导率大于所述焊料的热导率。
2.根据权利要求1所述的焊料材料，其中所述芯材料的热导率大于或等于65W/m.K，优选地大于65W/m.K，更优选地大于70W/m.K，甚至更优选地大于75W/m.K。
3.根据权利要求1或权利要求2所述的焊料材料，其中所述芯材料的熔点大于所述焊料的回流温度，并且
4.根据任一前述权利要求所述的焊料材料，其中所述芯层的厚度为100μm至500μm、优选地200μm至400μm、更优选地150μm至300μm。
5.根据任一前述权利要求所述的焊料材料，其中每个焊料层的厚度为25μm至150μm、优选地50μm至100μm。
6.根据任一前述权利要求所述的焊料材料，其中所述芯材料包括金属和/或合金。
7.根据任一前述权利要求所述的焊料材料，其中所述芯材料包括以下项中的一者或多者：铜、银、镍、钼、铍、钴、铁、铜-钨合金、镍-银合金、铜-锌合金和铜-镍-锌合金。
8.根据任一前述权利要求所述的焊料材料，其中所述焊料是无铅的。
9.根据任一前述权利要求所述的焊料材料，其中所述焊料包括以下项中的一者或多者：In、SnIn合金(例如，5％-58％Sn、42％-95％In)、SnBi合金(例如，42％-60％Sn、40％-58％Bi)、BiIn合金(例如，5％-67％Bi、33％-95％In)、AgIn合金(例如，3％Ag、97％In)、SnAg合金(例如，90％-97.5％Sn、2.5％-10％Ag)、SnCu合金(例如，99.3％-99.6％Sn、0.4％-0.7％Cu)、InGa合金(例如，99.3％-99.5％In、0.5％-0.7％Ga)、SnBiAgCu合金(例如，50％Sn、47％Bi、1％Ag、2％Cu)、SnBiZn合金(例如，65.5％Sn、31.5％Bi、3％Zn)、SnInAg合金(例如，77.2％Sn、20％In、2.8％Ag)、SnBiAgCuIn合金(例如，82.3％Sn、2.2％Bi、3％Ag、0.5％Cu、12％In)、SnZn合金(例如，91％Sn、9％Zn)、SnCuInGa合金(例如，92.8％Sn、0.7％Cu、6％In、0.5％Ga)、SnCuAg合金(例如，95.5％Sn、3.8％Ag、0.7％Cu)、SnAgSb合金(例如，95％Sn、3.5％Ag、1.5％Sb)和SnCuSb合金(例如，4％-95％Sn、1％-2％Cu、4％Sb)。
10.根据任一前述权利要求所述的焊料材料，其中所述芯材料包括铜，并且所述焊料包括Sn-20In-2Ag合金。
11.根据任一前述权利要求所述的焊料材料，所述焊料材料呈箔、条状物、膜、带状物或预成型件的形式。
12.根据任一前述权利要求所述的焊料材料，其中所述芯完全涂覆有所述焊料。
13.根据任一前述权利要求所述的焊料材料，所述焊料材料的有效热导率大于65W/m.K，优选地大于80W/m.K，更优选地大于100W/m.K，甚至更优选地大于130W/m.K。
14.一种焊接接头，包括根据任一前述权利要求所述的焊料材料。
15.一种互连件，包括根据权利要求1至13中任一项所述的焊料材料。
16.一种IGBT、MOSFET、LED或微处理器，包括根据权利要求1至13中任一项所述的焊料材料、根据权利要求14所述的焊接接头或根据权利要求15所述的互连件。
17.一种根据权利要求1至13中任一项所述的焊料材料在焊接方法中的用途，所述焊接方法选自表面贴装技术(SMT)焊接、管芯附接焊接、热界面焊接、手动焊接、激光和RF感应焊接以及热超声焊接。
18.一种根据权利要求1至13中任一项所述的焊料材料用于管芯附接(第I级)、衬底附接(第II级)或封装件到散热器的附接(第III级)的用途。
19.一种形成焊接接头的方法，所述方法包括：
在两个或更多个待接合的工件附近提供根据权利要求1至13中任一项所述的焊料材料，以及
加热所述焊料材料以形成焊接接头。
20.根据权利要求19所述的方法，其中所述两个或更多个待接合的工件包括：
装置或管芯和衬底，或
衬底和印刷电路板(PCB)，或
印刷电路板和散热器。
21.一种制造根据权利要求1至13中任一项所述的焊料材料的方法，所述方法包括：
提供两个或更多个焊料层，
提供芯材料层，以及
将所述焊料层层压在所述芯材料层的任一侧面上。
22.根据权利要求21所述的方法，其中所述芯材料层呈带状物的形式，并且/或者所述焊料层呈带状物的形式。
23.根据权利要求22所述的方法，其中所述带状物通过浇铸、挤出或拉伸提供。
24.根据权利要求21至23中任一项所述的方法，其中所述层在共同拉伸工艺、优选地高压共同拉伸工艺中层压。
25.根据权利要求21至24中任一项所述的方法，其中所层压的层被切割和/或冲压。
26.一种制造根据权利要求1至13中任一项所述的焊料材料的方法，所述方法包括：
提供芯材料层，以及
用焊料涂覆所述芯材料。
27.根据权利要求26所述的方法，其中所述芯材料层的表面在涂覆所述焊料之前被清洗。
28.根据权利要求26或权利要求27所述的方法，其中用焊料涂覆所述芯材料包括使所述芯材料与熔融焊料槽接触。
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