CN112440029B - 一种低温复合焊料合金焊片及其制备方法和使用方法 - Google Patents
一种低温复合焊料合金焊片及其制备方法和使用方法 Download PDFInfo
- Publication number
- CN112440029B CN112440029B CN202011305032.4A CN202011305032A CN112440029B CN 112440029 B CN112440029 B CN 112440029B CN 202011305032 A CN202011305032 A CN 202011305032A CN 112440029 B CN112440029 B CN 112440029B
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- temperature
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- soldering lug
- temperature layer
- soldering
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- 238000005476 soldering Methods 0.000 title claims abstract description 135
- 239000002131 composite material Substances 0.000 title claims abstract description 92
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 70
- 239000000956 alloy Substances 0.000 title claims abstract description 70
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title description 10
- 238000003466 welding Methods 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 34
- 230000005496 eutectics Effects 0.000 claims abstract description 4
- 238000005096 rolling process Methods 0.000 claims description 32
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 230000004907 flux Effects 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 4
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 4
- 229910018956 Sn—In Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 abstract description 14
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 13
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 3
- 238000004220 aggregation Methods 0.000 abstract 1
- 230000002776 aggregation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 72
- 239000006023 eutectic alloy Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 6
- 238000001000 micrograph Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011305032.4A CN112440029B (zh) | 2020-11-20 | 2020-11-20 | 一种低温复合焊料合金焊片及其制备方法和使用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011305032.4A CN112440029B (zh) | 2020-11-20 | 2020-11-20 | 一种低温复合焊料合金焊片及其制备方法和使用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112440029A CN112440029A (zh) | 2021-03-05 |
CN112440029B true CN112440029B (zh) | 2022-06-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202011305032.4A Active CN112440029B (zh) | 2020-11-20 | 2020-11-20 | 一种低温复合焊料合金焊片及其制备方法和使用方法 |
Country Status (1)
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CN (1) | CN112440029B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112453752A (zh) * | 2020-11-30 | 2021-03-09 | 云南锡业集团(控股)有限责任公司研发中心 | 一种无铅低温锡基合金焊片 |
CN115008060A (zh) * | 2022-05-31 | 2022-09-06 | 深圳市兴鸿泰锡业有限公司 | 一种功率芯片封装用锡基复合材料预成型焊片及其制备方法 |
CN114986012A (zh) * | 2022-06-06 | 2022-09-02 | 中国科学院宁波材料技术与工程研究所 | 复合柱状软焊材料及其制备方法与应用 |
CN115302123B (zh) * | 2022-08-29 | 2024-03-22 | 大连理工大学 | 可低温焊接的高可靠性复合钎料片、制备方法及其应用 |
CN116900545B (zh) * | 2023-09-13 | 2023-12-08 | 北京理工大学 | 用于快速瞬态液相连接的微合金化叠层焊片及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006033992A1 (de) * | 2006-01-23 | 2007-08-02 | Schmidt + Clemens Gmbh + Co. Kg | Schweißverfahren |
CN101157163A (zh) * | 2007-11-19 | 2008-04-09 | 贵研铂业股份有限公司 | 一种金合金钎焊材料及其制造方法 |
CN202240181U (zh) * | 2011-09-08 | 2012-05-30 | 北京市半导体器件六厂 | 三层金属复合焊片 |
CN104985350A (zh) * | 2015-07-03 | 2015-10-21 | 北京康普锡威科技有限公司 | 一种Sn-Bi/Cu无铅复合焊接材料 |
CN107486651A (zh) * | 2017-08-02 | 2017-12-19 | 中国电器科学研究院有限公司 | 一种低温焊料片的制备方法 |
CN109175772A (zh) * | 2018-09-14 | 2019-01-11 | 中国科学院电工研究所 | 一种Cu@Ni@Sn预成型焊片及其制备方法 |
TW202015904A (zh) * | 2018-05-29 | 2020-05-01 | 美商銦業公司 | 混成高溫無鉛焊料預成形物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8348139B2 (en) * | 2010-03-09 | 2013-01-08 | Indium Corporation | Composite solder alloy preform |
US9802274B2 (en) * | 2016-03-21 | 2017-10-31 | Indium Corporation | Hybrid lead-free solder wire |
-
2020
- 2020-11-20 CN CN202011305032.4A patent/CN112440029B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006033992A1 (de) * | 2006-01-23 | 2007-08-02 | Schmidt + Clemens Gmbh + Co. Kg | Schweißverfahren |
CN101157163A (zh) * | 2007-11-19 | 2008-04-09 | 贵研铂业股份有限公司 | 一种金合金钎焊材料及其制造方法 |
CN202240181U (zh) * | 2011-09-08 | 2012-05-30 | 北京市半导体器件六厂 | 三层金属复合焊片 |
CN104985350A (zh) * | 2015-07-03 | 2015-10-21 | 北京康普锡威科技有限公司 | 一种Sn-Bi/Cu无铅复合焊接材料 |
CN107486651A (zh) * | 2017-08-02 | 2017-12-19 | 中国电器科学研究院有限公司 | 一种低温焊料片的制备方法 |
TW202015904A (zh) * | 2018-05-29 | 2020-05-01 | 美商銦業公司 | 混成高溫無鉛焊料預成形物 |
CN109175772A (zh) * | 2018-09-14 | 2019-01-11 | 中国科学院电工研究所 | 一种Cu@Ni@Sn预成型焊片及其制备方法 |
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Publication number | Publication date |
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CN112440029A (zh) | 2021-03-05 |
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Effective date of registration: 20240402 Address after: No. 2 Yunjing Road, Information Industry Base, Luoyang Street Office, Economic Development Zone, Kunming Area, China (Yunnan) Pilot Free Trade Zone, Kunming City, Yunnan Province, 650501 Patentee after: YUNNAN TIN NEW MATERIAL Co.,Ltd. Country or region after: China Address before: No. 650000, Changyuan Road, Kunming, Yunnan Province Patentee before: R & D Center of Yunnan Tin Industry Group (Holdings) Co.,Ltd. Country or region before: China |