CN114340138A - 印刷电路板和包括该印刷电路板的电子组件封装件 - Google Patents
印刷电路板和包括该印刷电路板的电子组件封装件 Download PDFInfo
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- CN114340138A CN114340138A CN202110842582.8A CN202110842582A CN114340138A CN 114340138 A CN114340138 A CN 114340138A CN 202110842582 A CN202110842582 A CN 202110842582A CN 114340138 A CN114340138 A CN 114340138A
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Abstract
本发明提供一种印刷电路板和包括该印刷电路板的电子组件封装件。所述印刷电路板,包括:第一绝缘层;第一布线层,所述第一布线层的至少一部分被掩埋在所述第一绝缘层的一个表面中,并且所述第一布线层的一个表面的至少一部分从所述第一绝缘层的所述一个表面暴露;金属柱,设置在所述第一布线层的暴露的所述至少一部分上;以及第二布线层,设置在所述第一绝缘层的与所述第一绝缘层的所述一个表面相对的另一表面上。所述金属柱的第一表面的宽度大于所述金属柱的与所述第一表面相对的第二表面的宽度,所述第一表面连接到所述第一布线层的暴露的所述至少一部分上。
Description
本申请要求于2020年9月28日在韩国知识产权局提交的第10-2020-0125603号韩国专利申请的优先权的权益,所述韩国专利申请的全部公开内容通过引用被包含于此。
技术领域
本公开涉及一种印刷电路板和包括该印刷电路板的电子组件封装件。
背景技术
随着5G时代的到来,要安装在主板上的电子组件的数量已增加,使得已应用了用于减小面积的各种类型的模块结构。例如,已经使用了其中电子组件安装在基板的两个表面上的双面系统级封装(SiP)结构。在这样的双面SiP的情况下,焊球可用于将主板与模块结合,但是对使用金属柱来减小节距的兴趣已增加。
发明内容
本公开的一方面在于提供一种印刷电路板和包括该印刷电路板的电子组件封装件,该印刷电路板可以通过简单的工艺制造,并且在该印刷电路板中,金属柱的高度可易于调节。
本公开的另一方面在于提供一种印刷电路板和包括该印刷电路板的电子组件封装件,在该印刷电路板中,不需要通过去污或等离子体处理的工艺在绝缘材料(诸如,阻焊剂)的表面上形成粗糙度,使得可降低质量风险。
根据本公开的一方面,印刷电路板可通过如下方式制造:在形成印刷电路板的电路之前使用芯层(诸如,覆铜层压板(CCL))预先形成呈深过孔的形式的金属柱,并且在形成电路之后通过去除芯层的材料而使金属柱暴露。
例如,根据本公开的一方面,一种印刷电路板可包括:第一绝缘层;第一布线层,所述第一布线层的至少一部分被掩埋在所述第一绝缘层的一个表面侧中,并且所述第一布线层的一个表面的至少一部分从所述第一绝缘层的所述一个表面暴露;金属柱,设置在所述第一布线层的所述一个表面上;以及第二布线层,设置在所述第一绝缘层的与所述第一绝缘层的所述一个表面相对的另一表面上。所述金属柱的第一表面的宽度大于所述金属柱的与所述第一表面相对的第二表面的宽度,所述第一表面连接到所述第一布线层的暴露的所述至少一部分。
例如,根据本公开的一方面,一种电子组件封装件可包括:印刷电路板,包括多个绝缘层、多个布线层、多个布线过孔层以及金属柱,其中,所述金属柱设置在所述多个布线层的最下面的布线层的下表面上并且具有上表面的宽度大于下表面的宽度的渐缩形状;第一电子组件,安装在所述印刷电路板的下侧上;以及第二电子组件,安装在所述印刷电路板的上侧上。所述第一电子组件和所述第二电子组件通过所述印刷电路板而彼此连接。
例如,根据本公开的一方面,一种电子组件封装件可包括:印刷电路板,包括第一绝缘层、第一布线层、金属柱、第二布线层和布线过孔,所述第一布线层的至少一部分被掩埋在所述第一绝缘层的一个表面中,并且所述第一布线层的一个表面的至少一部分从所述第一绝缘层的所述一个表面暴露,所述金属柱与所述第一布线层的至少一部分一体化并且直接从所述第一布线层的暴露的所述至少一部分延伸,所述第二布线层设置在所述第一绝缘层的与所述第一绝缘层的所述一个表面相对的另一表面上,所述布线过孔设置在所述第一绝缘层中并且使所述第一布线层的至少一部分和所述第二布线层的至少一部分彼此连接;以及第一电子组件,安装到所述印刷电路板。
附图说明
根据以下结合附图的具体实施方式,将更清楚地理解本公开的上述和其他方面、特征和优点,在附图中:
图1是示出电子装置系统的示例的框图;
图2是示出电子装置的示例的立体图;
图3是示出印刷电路板的示例的截面图;
图4至图11是示出制造图3中示出的印刷电路板的工艺的示例的示图;以及
图12是示出电子组件封装件的示例的截面图。
具体实施方式
在下文中,将参照附图描述本公开的示例实施例。在附图中,为了清楚地描述,可夸大或简略示出元件的形状、尺寸等。
图1是示出电子装置系统的示例的框图。
参照图1,电子装置1000可将主板1010容纳在其中。芯片相关组件1020、网络相关组件1030、其他组件1040等可物理连接或电连接到主板1010。这些组件可通过各种信号线1090连接到下面将要描述的其他组件。
芯片相关组件1020可包括:存储器芯片,诸如易失性存储器(例如,动态随机存取存储器(DRAM))、非易失性存储器(例如,只读存储器(ROM))、闪存等;应用处理器芯片,诸如中央处理器(例如,中央处理单元(CPU))、图形处理器(例如,图形处理单元(GPU))、数字信号处理器、密码处理器、微处理器、微控制器等;以及逻辑芯片,诸如模数转换器(ADC)、专用集成电路(ASIC)等。然而,芯片相关组件1020不限于此,而是还可包括其他类型的芯片相关组件。此外,芯片相关组件1020可彼此组合。芯片相关组件1020可具有包括上述芯片的封装件的形式。
网络相关组件1030可包括与诸如以下协议兼容或使用诸如以下协议的组件:无线保真(Wi-Fi)(电气与电子工程师协会(IEEE)802.11族等)、全球微波接入互操作性(WiMAX)(IEEE 802.16族等)、IEEE 802.20、长期演进(LTE)、演进仅数据(Ev-DO)、高速分组接入+(HSPA+)、高速下行链路分组接入+(HSDPA+)、高速上行链路分组接入+(HSUPA+)、增强型数据GSM环境(EDGE)、全球移动通信系统(GSM)、全球定位系统(GPS)、通用分组无线业务(GPRS)、码分多址(CDMA)、时分多址(TDMA)、数字增强型无绳电信(DECT)、蓝牙、3G协议、4G协议和5G协议以及在上述协议之后指定的任意其他无线协议和有线协议。然而,网络相关组件1030不限于此,而是还可包括与各种其他无线标准或协议或者有线标准或协议兼容或者使用各种其他无线标准或协议或者有线标准或协议的组件。此外,网络相关组件1030可与上述芯片相关组件1020一起彼此组合。
其他组件1040可包括高频率电感器、铁氧体电感器、功率电感器、铁氧体磁珠、低温共烧陶瓷(LTCC)、电磁干扰(EMI)滤波器、多层陶瓷电容器(MLCC)等。然而,其他组件1040不限于此,而是还可包括用于各种其他目的的无源组件等。此外,其他组件1040可与上述芯片相关组件1020和/或上述网络相关组件1030一起彼此组合。
根据电子装置1000的类型,电子装置1000可包括物理连接或电连接到主板1010或者不物理连接或不电连接到主板1010的其他组件。这些其他组件可包括例如相机1050、天线1060、显示器1070、电池1080、音频编解码器、视频编解码器、功率放大器、指南针、加速度计、陀螺仪、扬声器、大容量存储单元(例如,硬盘驱动器)、光盘(CD)驱动器、数字通用光盘(DVD)驱动器等。然而,这些其他组件不限于此,而是还可根据电子装置1000的类型等包括用于各种目的的其他组件。
电子装置1000可以是智能电话、个人数字助理(PDA)、数字摄像机、数码相机、网络系统、计算机、监视器、平板PC、膝上型PC、上网本PC、电视机、视频游戏机、智能手表、汽车组件等。然而,电子装置1000不限于此,而是可以是处理数据的任意其他电子装置。
图2是示出电子装置的示例的立体图。
参照图2,电子装置可通过智能电话1100实现。主板1010可容纳在智能电话1100中,并且各种电子组件1120可物理连接或电连接到主板1010。相机模块1130和/或扬声器1040可容纳在主板1010中。电子组件1120中的一些电子组件例如可以是芯片相关组件(诸如,组件封装件1121),但其示例实施例不限于此。在组件封装件1121中,多个电子组件可按照表面安装的形式设置在多层印刷电路板上,但其示例实施例不限于此。电子装置不必然局限于智能电话1100,并且可以是如上所述的其他电子装置。
图3是示出印刷电路板的示例的截面图。
参照图3,示例实施例中的印刷电路板100可包括:第一绝缘层111;第一布线层121,第一布线层121的至少一部分被掩埋在第一绝缘层111的下表面侧中,并且第一布线层121的下表面的至少一部分(焊盘图案121P的下表面)从第一绝缘层111的下表面暴露;第二布线层122,设置在第一绝缘层111的上表面上;以及金属柱140,设置在第一布线层121的至少一部分(焊盘图案121P的暴露的下表面)上。在这种情况下,金属柱140可具有例如上表面的宽度(第一布线层121的至少一部分的宽度)比与上表面相对的下表面的宽度大的渐缩形状,金属柱140的上表面连接到焊盘图案121P的暴露的下表面。
例如,如下方法可用作形成金属柱的方法:制造所需数量的印刷电路板,在印刷电路板上形成种子层,并且使用干膜而选择性地仅镀覆金属柱部分。当这样的金属柱形成在阻焊剂的表面上时,粘合力可能不足,使得可能增加诸如去污(desmearing)或等离子体处理的附加工艺以形成物理粗糙度。在这种情况下,诸如阻焊剂的绝缘材料的表面可能被损坏,使得在组装期间可能存在潜在的质量风险。此外,由于选择性地仅镀覆金属柱,因此镀覆区域可能是狭窄的,使得面板内可能发生厚度分布。为了解决该问题,可执行数次镀覆工艺以形成大于目标厚度的厚度,并且可执行研磨工艺以使高度平坦化。在这种情况下,可能增加数个工艺以形成金属柱,并且可能存在潜在的质量风险,诸如由使用厚的干膜引起的不可剥离性。
与上述示例不同,示例实施例中的印刷电路板100可通过如下方式制造:在形成印刷电路板100的电路之前使用芯层(诸如,CCL)预先形成呈深过孔的形式的金属柱140,并且在形成电路之后通过去除芯层的材料而使金属柱140暴露。因此,金属柱140可设置在第一布线层121(印刷电路板100的以嵌入式轨迹基板(ETS)的形式形成的嵌入式图案)的至少一部分(即,例如焊盘图案121P的暴露的下表面)上,并且金属柱140可具有渐缩形状(一种深过孔工艺形式)。在如上构造的印刷电路板100的情况下,由于形成金属柱140的方法不是使用干膜的镀覆方法,因此可省略诸如去污或等离子体处理的附加工艺,使得可解决质量风险。此外,由于金属柱140通过使用芯层(诸如,CCL)的深过孔工艺形成,因此可易于调节高度,因此可解决诸如干膜未剥离的质量风险。
第一布线层121的暴露的底表面可与第一绝缘层111的下表面具有高度差。例如,第一布线层121的暴露的底表面可凹入到第一绝缘层111中。这是因为,如在稍后描述的工艺中,当去除芯层(诸如,CCL)时,可通过蚀刻去除用作种子层的金属箔(诸如,铜箔),使得可形成凹入深度rd。类似地,第二布线层122的导体层s2和p2的数量可大于第一布线层121的导体层p1的数量。这是因为,在第一布线层121的情况下,可如上所述通过蚀刻去除用作种子层的金属箔(诸如,铜箔)。因此,第二布线层122可包括具有种子层s2的多个导体层s2和p2,而第一布线层121可包括不具有种子层的单个导体层p1。因此,第二布线层122的厚度t2可大于第一布线层121的厚度t1。
金属柱140可与第一布线层121的至少一部分一体化,而不具有边界。这是因为,如在稍后描述的工艺中,当在芯层(诸如,CCL)上形成第一布线层121时,金属柱140可在相同镀覆工艺中一起形成。因此,可改善第一布线层121与金属柱140之间的结合可靠性。因此,类似于第一布线层121,金属柱140也可包括不具有种子层的单个导体层p1。
示例实施例中的印刷电路板100还可包括第一布线过孔层131。第一布线层121的至少一部分和第二布线层122的至少一部分可通过穿过第一绝缘层111的第一布线过孔层131而彼此连接。第一布线过孔层131可通过与形成第二布线层122的镀覆工艺相同的镀覆工艺与第二布线层122一起形成。因此,第一布线过孔层131可与第二布线层122一体化,而不具有边界。此外,第一布线过孔层131也可包括具有种子层s2的多个导体层s2和p2。
示例实施例中的印刷电路板100还可包括第二绝缘层112、第三布线层123和第二布线过孔层132。第二绝缘层112可设置在第一绝缘层111的上表面上,并且第二布线层122的至少一部分可掩埋在第二绝缘层112的下表面侧中。第三布线层123可设置在第二绝缘层112的上表面上。第二布线层122的至少一部分和第三布线层123的至少一部分可通过穿过第二绝缘层112的第二布线过孔层132而彼此连接。第三布线层123可包括具有种子层s3的多个导体层s3和p3。第二布线过孔层132可通过与形成第三布线层123的镀覆工艺相同的镀覆工艺与形成第三布线层123一起形成。因此,第二布线过孔层132可与第三布线层123一体化,而不具有边界。此外,第二布线过孔层132也可包括具有种子层s3的多个导体层s3和p3。
示例实施例中的印刷电路板100还可包括钝化层150,钝化层150设置在第二绝缘层112的上表面上并且具有使第三布线层123的至少一部分分别暴露的多个开口150h。钝化层150可保护印刷电路板100的内部组件免受外部物理因素和化学因素的影响。当印刷电路板100包括更多的层时,钝化层150可设置在设置于第二绝缘层112更上方的绝缘层上,并且可具有使设置于第三布线层123更上方的布线层的至少一部分暴露的开口。
在下面的描述中,将参照图3描述印刷电路板100的元件。
绝缘材料可用作第一绝缘层111和第二绝缘层112的材料,并且热固性树脂(诸如,环氧树脂)、热塑性树脂(诸如,聚酰亚胺)或通过将无机填料(诸如,二氧化硅)和/或增强材料(诸如,玻璃纤维)浸渍在热固性树脂或热塑性树脂中而制备的材料可用绝缘材料。例如,半固化片(PPG)、味之素堆积膜(ABF,Ajinomoto build-up film)等可用作第一绝缘层111和第二绝缘层112的材料。第一绝缘层111和第二绝缘层112的厚度可基本相同,但其示例实施例不限于此。
金属材料可用作第一布线层121、第二布线层122和第三布线层123的材料,并且铜(Cu)、铝(Al)、银(Ag)、锡(Sn)、金(Au)、镍(Ni)、铅(Pb)、钛(Ti)或它们的合金可用作金属材料。第一布线层121、第二布线层122和第三布线层123中的每个可根据设计执行各种功能。例如,第一布线层121、第二布线层122和第三布线层123可包括接地图案、电力图案、信号图案等。例如,信号图案可包括除了接地图案和电力图案之外的用于传输各种信号(诸如,数据信号)的图案。这些图案中的每个可具有线形状、面形状或垫形状。第一布线层121、第二布线层122和第三布线层123中的每个可通过镀覆工艺(诸如,加成工艺(AP)、半AP(SAP)、改进的SAP(MSAP)、封孔(TT)工艺等)形成。第一布线层121可包括电镀层p1,而不具有种子层。第二布线层122和第三布线层123均可包括种子层(无电镀层)s2和s3以及分别基于种子层s2和s3形成的电镀层p2和p3。第二布线层122和第三布线层123中的至少一个还可包括底漆铜箔。
金属材料可用作第一布线过孔层131和第二布线过孔层132的材料,并且铜(Cu)、铝(Al)、银(Ag)、锡(Sn)、金(Au)、镍(Ni)、铅(Pb)、钛(Ti)或它们的合金可用作金属材料。第一布线过孔层131和第二布线过孔层132中的每者可根据设计包括信号连接过孔、接地连接过孔和电力连接过孔。第一布线过孔层131和第二布线过孔层132中的每者的布线过孔可以是其中通路孔完全被金属材料填充的填充型过孔,或者可以是其中金属材料沿着通路孔的壁表面形成的共形型过孔。第一布线过孔层131的布线过孔和第二布线过孔层132的布线过孔可在相同的方向上渐缩。例如,第一布线过孔层131和第二布线过孔层132可通过镀覆工艺(诸如,AP、SAP、MSAP、TT工艺等)形成,并因此可包括种子层(无电镀层)s2和s3以及基于种子层s2和s3形成的电镀层p2和p3。
金属材料可用作金属柱140的材料,并且铜(Cu)、铝(Al)、银(Ag)、锡(Sn)、金(Au)、镍(Ni)、铅(Pb)、钛(Ti)或它们的合金可用作金属材料。可布置多个金属柱140,并且每个金属柱140可根据设计而作为信号金属柱、接地金属柱、电力金属柱等。金属柱140可通过完全填充金属材料而形成。金属柱140可具有在与第一布线过孔层131和第二布线过孔层132的布线过孔的渐缩方向相同的方向上渐缩的渐缩形状。金属柱140也可通过镀覆工艺(例如,AP、SAP、MSAP、TT工艺等)形成。金属柱140可包括电镀层p1,而不具有种子层。
绝缘材料可用作钝化层150的材料。例如,热固性树脂(诸如,环氧树脂)、热塑性树脂(诸如,聚酰亚胺)或者其中这些树脂与无机填料混合的材料(诸如,ABF)可用作绝缘材料,但其示例性实施例不限于此。例如,钝化层150可以是包括感光绝缘材料的阻焊剂(SR)。
图4至图11是示出制造图3中所示的印刷电路板的工艺的示例的示图。
参照图4,可制备其中第一铜箔211和第二铜箔212分别层叠在绝缘材料200的上表面和下表面上的芯层(诸如,CCL)。
参照图5,此后,可使用激光钻孔或机械钻孔在芯层中加工出深通路孔140h。
参照图6,可通过镀覆工艺在第一铜箔211上形成第一布线层121,并且可同时填充深通路孔140h从而形成金属柱140。
参照图7,此后,可在第一铜箔211上形成覆盖第一布线层121的第一绝缘层111,可通过激光钻孔在第一绝缘层111中形成通路孔,并且可通过镀覆工艺形成第二布线层122和第一布线过孔层131。可在蚀刻种子层的工艺期间去除第二铜箔212的一部分。
参照图8,可在第一绝缘层111上形成覆盖第二布线层122的第二绝缘层112,可通过激光钻孔在第二绝缘层112中形成通路孔,并且可通过镀覆工艺形成第三布线层123和第二布线过孔层132。可在蚀刻种子层的工艺中去除第二铜箔212的另一部分。
参照图9,可在第二绝缘层112上形成覆盖第三布线层123的钝化层150,并且可在钝化层150中形成使第三布线层123的至少一部分分别暴露的多个开口150h。
参照图10,可以通过喷砂工艺去除绝缘材料200。在这种情况下,第一铜箔211可以用作止挡件。
参照图11,可通过蚀刻工艺去除第一铜箔211。在该情况下,可去除第一布线层121的一部分以形成凹入深度rd。
可通过一系列工艺制造前述示例实施例的印刷电路板100,并且将不再复述重复的描述。
图12是示出电子组件封装件的示例的截面图。
参照图12,在电子组件封装件500中,第一电子组件210可安装在印刷电路板100的下侧上,并且第二电子组件220和第三电子组件230可安装在印刷电路板100的上侧上。第一电子组件210可与第二电子组件220和第三电子组件230中的每个的至少一部分在平面上叠置。在一个示例中,该平面可指的是与例如电子组件封装件的在印刷电路板100的布线层的堆叠方向上的上表面或下表面平行的平面。第一电子组件210、第二电子组件220和第三电子组件230可分别具有多个第一电极焊盘210P、第二电极焊盘220P和第三电极焊盘230P,并且可分别通过多个第一连接构件215、第二连接构件225和第三连接构件235以表面安装的形式设置在印刷电路板100上。第一电子组件210、第二电子组件220和第三电子组件230可通过印刷电路板100而彼此电连接。可布置多个金属柱140,并且多个金属柱140可在印刷电路板100的下方围绕第一电子组件210设置。可在印刷电路板100的下方进一步设置覆盖金属柱140和第一电子组件210中的每个的至少一部分的第一模制材料310。第一模制材料310可使金属柱140的下表面和第一电子组件210的后表面暴露。可在印刷电路板100的上侧上进一步设置覆盖第二电子组件220和第三电子组件230中的每个的至少一部分的第二模制材料320。第二模制材料320可掩埋第二电子组件220和第三电子组件230。如果需要,可在第一模制材料310和第二模制材料320的外表面上进一步形成薄金属镀层,用于电磁屏蔽和/或散热。
第一电子组件210、第二电子组件220和第三电子组件230中的每个可以是数百至数百万个器件被集成到单个芯片中的集成电路(IC)。例如,第一电子组件210、第二电子组件220和第三电子组件230可通过诸如中央处理器(例如,CPU)、图形处理器(例如,GPU)、现场可编程门阵列(FPGA)、数字信号处理器、密码处理器、微处理器、微控制器等的处理器芯片(例如,应用处理器(AP),但其示例实施例不限于此)实现,并且可通过存储器(诸如,易失性存储器(例如,DRAM)、非易失性存储器(例如,ROM)、闪存等)或逻辑芯片(诸如,模数转换器或专用IC(ASIC))实现。多个第一电极焊盘210P、第二电极焊盘220P和第三电极焊盘230P中的每个可包括诸如铜(Cu)或铝(Al)的金属材料。例如,第一电子组件210、第二电子组件220和第三电子组件230中的至少一个可以是片状无源组件(片状电感器或片状电容器)。
多个第一连接构件215、第二连接构件225和第三连接构件235中的每个可包括低熔点金属。例如,多个第一连接构件215、第二连接构件225和第三连接构件235可利用锡(Sn)或含锡(Sn)的合金(诸如,焊料)形成。然而,其示例实施例不限于此。多个第一连接构件215、第二连接构件225和第三连接构件235中的每个可以是焊盘、焊球、引脚等,并且可具有球形,但其示例性实施例限于此。
第一模制材料310和第二模制材料320可包括绝缘材料。热固性树脂(诸如,环氧树脂)、热塑性树脂(诸如,聚酰亚胺)或通过将无机填料(诸如,二氧化硅)浸渍在热固性树脂或热塑性树脂中而制备的材料可用作绝缘材料。例如,第一模制材料310和第二模制材料320可包括ABF。然而,其示例实施例不限于此,并且第一模制材料310和第二模制材料320可以是常规的环氧塑封料(EMC)或感光包封剂(PIE)。
根据上述示例实施例,可提供一种印刷电路板和包括该印刷电路板的电子组件封装件,该印刷电路板可通过简单的工艺制造,并且在该印刷电路板中,金属柱的高度可易于调节。
此外,可提供一种印刷电路板并且可提供一种包括该印刷电路板的电子组件封装件,在该印刷电路板中,不需要通过诸如去污或等离子体处理的工艺在绝缘材料(诸如,阻焊剂)的表面上形成粗糙度,使得可降低质量风险。
在示例实施例中,为了便于描述,术语“侧部”、“侧表面”等可用于指示相对于附图中的截面在右/左方向上形成的表面,术语“上侧”、“上部”、“上表面”等可用于指示相对于附图中的截面在向上方向上形成的表面,并且术语“下侧”、“下部”、“下表面”等可用于指示相对于图中的截面在向下方向上形成的表面。元件设置在侧部区域、上侧、上部区域或下部区域上的概念可包括元件在相应方向上与被构造为基准的元件直接接触的构造以及元件不与基准元件直接接触的构造。然而,为了便于描述,这些术语可如上定义,并且示例实施例的权利范围不特别限于上述术语。
在示例实施例中,术语“连接”不仅可指“直接连接”,而且可包括借助于粘合层等的“间接连接”。此外,术语“电连接”可包括元件“物理连接”的情况和元件“不物理连接”的情况两者。此外,术语“第一”、“第二”等可用于将一个元件与另一元件区分开,并且可不限制与元件有关的顺序和/或重要性等。在一些情况下,在不脱离示例实施例的权利范围的情况下,“第一元件”可被称为“第二元件”,类似地,“第二元件”可被称为“第一元件”。
在示例实施例中,术语“示例实施例”可以不是指一个相同的示例实施例,而是可被提供以描述和强调每个示例实施例的不同的独特特征。可实现上面提出的示例实施例,但不排除与其他示例实施例的特征组合的可能性。例如,除非另有说明,否则即使在一个示例实施例中描述的特征未在另一示例实施例中描述,该描述也可被理解为与另一示例实施例有关。
虽然上面已经示出并描述了示例实施例,但对于本领域技术人员而言将易于理解的是,在不脱离由所附权利要求限定的本发明的范围的情况下,可做出修改和变形。
Claims (24)
1.一种印刷电路板,包括:
第一绝缘层;
第一布线层,所述第一布线层的至少一部分被掩埋在所述第一绝缘层的一个表面中,并且所述第一布线层的一个表面的至少一部分从所述第一绝缘层的所述一个表面暴露;
金属柱,设置在所述第一布线层的暴露的所述至少一部分上;以及
第二布线层,设置在所述第一绝缘层的与所述第一绝缘层的所述一个表面相对的另一表面上,
其中,所述金属柱的第一表面的宽度大于所述金属柱的与所述第一表面相对的第二表面的宽度,所述第一表面连接到所述第一布线层的暴露的所述至少一部分。
2.根据权利要求1所述的印刷电路板,其中,所述第一布线层的所述一个表面与所述第一绝缘层的所述一个表面具有高度差。
3.根据权利要求2所述的印刷电路板,其中,所述第一布线层的所述一个表面凹入到所述第一绝缘层中。
4.根据权利要求1所述的印刷电路板,其中,所述第二布线层的导体层的数量大于所述第一布线层的导体层的数量。
5.根据权利要求4所述的印刷电路板,其中,所述第二布线层的厚度大于所述第一布线层的厚度。
6.根据权利要求5所述的印刷电路板,
其中,所述第一布线层包括不具有种子层的单个导体层,并且
其中,所述第二布线层包括具有种子层的多个导体层。
7.根据权利要求6所述的印刷电路板,其中,所述金属柱与所述第一布线层的至少一部分一体化,而在它们之间不具有边界。
8.根据权利要求7所述的印刷电路板,其中,所述金属柱包括不具有种子层的单个导体层。
9.根据权利要求6所述的印刷电路板,所述印刷电路板还包括:
第一布线过孔层,穿过所述第一绝缘层,并且使所述第一布线层的至少一部分和所述第二布线层的至少一部分彼此连接,
其中,所述第一布线过孔层与所述第二布线层一体化,而在它们之间不具有边界,并且
其中,所述第一布线过孔层包括具有种子层的多个导体层。
10.根据权利要求1所述的印刷电路板,所述印刷电路板还包括:
第二绝缘层,设置在所述第一绝缘层的所述另一表面上,所述第二布线层的至少一部分被掩埋在所述第二绝缘层的一个表面中;以及
第三布线层,设置在所述第二绝缘层的与所述第二绝缘层的所述一个表面相对的另一表面上。
11.根据权利要求10所述的印刷电路板,所述印刷电路板还包括:
第二布线过孔层,穿过所述第二绝缘层,并且使所述第二布线层的至少一部分和所述第三布线层的至少一部分彼此连接,
其中,所述第三布线层与所述第二布线过孔层一体化,而在它们之间不具有边界,并且
其中,所述第三布线层和所述第二布线过孔层中的每者包括具有种子层的多个导体层。
12.根据权利要求10所述的印刷电路板,所述印刷电路板还包括:
钝化层,设置在所述第二绝缘层的所述另一表面上,并且具有使所述第三布线层的至少一部分分别暴露的多个开口。
13.根据权利要求1所述的印刷电路板,所述印刷电路板还包括布线过孔,所述布线过孔设置在所述第一绝缘层中并且使所述第一布线层和所述第二布线层彼此连接,
其中,所述布线过孔和所述金属柱在相同的方向上渐缩。
14.一种电子组件封装件,包括:
印刷电路板,包括多个绝缘层、多个布线层、多个布线过孔层以及金属柱,其中,所述金属柱设置在所述多个布线层的最下面的布线层的下表面上并且具有上表面的宽度大于下表面的宽度的渐缩形状;
第一电子组件,安装在所述印刷电路板的下侧上;以及
第二电子组件,安装在所述印刷电路板的上侧上,
其中,所述第一电子组件和所述第二电子组件通过所述印刷电路板而彼此连接。
15.根据权利要求14所述的电子组件封装件,其中,所述第一电子组件的至少一部分和所述第二电子组件的至少一部分在平面上彼此叠置。
16.根据权利要求14所述的电子组件封装件,
其中,所述印刷电路板包括多个所述金属柱,并且
其中,所述多个金属柱围绕所述第一电子组件设置。
17.根据权利要求14所述的电子组件封装件,所述电子组件封装件还包括:
第一模制材料,设置在所述印刷电路板的所述下侧上,并且覆盖所述金属柱和所述第一电子组件中的每个的至少一部分;以及
第二模制材料,设置在所述印刷电路板的所述上侧上,并且覆盖所述第二电子组件的至少一部分。
18.根据权利要求14所述的电子组件封装件,其中,所述多个布线过孔层的布线过孔和所述金属柱在相同的方向上渐缩。
19.一种电子组件封装件,包括:
印刷电路板,包括第一绝缘层、第一布线层、金属柱、第二布线层和布线过孔,所述第一布线层的至少一部分被掩埋在所述第一绝缘层的一个表面中,并且所述第一布线层的一个表面的至少一部分从所述第一绝缘层的所述一个表面暴露,所述金属柱与所述第一布线层的至少一部分一体化并且直接从所述第一布线层的暴露的所述至少一部分延伸,所述第二布线层设置在所述第一绝缘层的与所述第一绝缘层的所述一个表面相对的另一表面上,所述布线过孔设置在所述第一绝缘层中并且使所述第一布线层的至少一部分和所述第二布线层的至少一部分彼此连接;以及
第一电子组件,安装到所述印刷电路板。
20.根据权利要求19所述的电子组件封装件,其中,所述第一布线层的所述一个表面凹入到所述第一绝缘层中。
21.根据权利要求19所述的电子组件封装件,其中,所述布线过孔包括与所述第一布线层接触的种子层。
22.根据权利要求19所述的电子组件封装件,其中,在所述第一布线层的连接到所述金属柱的所述一个表面和所述第一布线层的连接到所述布线过孔的另一表面之中,仅所述第一布线层的连接到所述布线过孔的所述另一表面与种子层接触。
23.根据权利要求19所述的电子组件封装件,其中,所述第一电子组件连接到所述第一布线层,并相对于所述金属柱设置在所述印刷电路板的同一侧上,并且
所述电子组件封装件还包括第二电子组件,所述第二电子组件相对于所述金属柱设置在所述印刷电路板的相对侧上,并连接到所述第一电子组件。
24.根据权利要求23所述的电子组件封装件,所述电子组件封装件还包括设置为覆盖所述金属柱和所述第一电子组件中的每个的至少一部分的模制材料,
其中,所述金属柱和所述第一电子组件中的每个包括从所述模制材料暴露的部分。
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