CN114026785B - 电子部件收纳用封装件、电子装置以及电子模块 - Google Patents

电子部件收纳用封装件、电子装置以及电子模块

Info

Publication number
CN114026785B
CN114026785B CN202080044803.0A CN202080044803A CN114026785B CN 114026785 B CN114026785 B CN 114026785B CN 202080044803 A CN202080044803 A CN 202080044803A CN 114026785 B CN114026785 B CN 114026785B
Authority
CN
China
Prior art keywords
conductor
insulating substrate
electronic component
external connection
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080044803.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114026785A (zh
Inventor
佐佐木贵浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN114026785A publication Critical patent/CN114026785A/zh
Application granted granted Critical
Publication of CN114026785B publication Critical patent/CN114026785B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN202080044803.0A 2019-06-27 2020-06-24 电子部件收纳用封装件、电子装置以及电子模块 Active CN114026785B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019120065 2019-06-27
JP2019-120065 2019-06-27
PCT/JP2020/024858 WO2020262472A1 (ja) 2019-06-27 2020-06-24 電子部品収納用パッケージ、電子装置、および電子モジュール

Publications (2)

Publication Number Publication Date
CN114026785A CN114026785A (zh) 2022-02-08
CN114026785B true CN114026785B (zh) 2025-07-22

Family

ID=74060142

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080044803.0A Active CN114026785B (zh) 2019-06-27 2020-06-24 电子部件收纳用封装件、电子装置以及电子模块

Country Status (5)

Country Link
US (1) US12470200B2 (https=)
EP (1) EP3993024A4 (https=)
JP (1) JP7182712B2 (https=)
CN (1) CN114026785B (https=)
WO (1) WO2020262472A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022163502A1 (ja) * 2021-01-27 2022-08-04 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107534022A (zh) * 2015-11-25 2018-01-02 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789278A (en) * 1996-07-30 1998-08-04 Micron Technology, Inc. Method for fabricating chip modules
US6740960B1 (en) * 1997-10-31 2004-05-25 Micron Technology, Inc. Semiconductor package including flex circuit, interconnects and dense array external contacts
JP2002164451A (ja) 2000-11-28 2002-06-07 Kyocera Corp 電子部品収納用パッケージ
JP4111222B2 (ja) * 2003-07-22 2008-07-02 株式会社村田製作所 表面実装型部品
WO2008053956A1 (fr) * 2006-11-02 2008-05-08 Murata Manufacturing Co., Ltd. Substrat en céramique, dispositif électronique et procédé de production d'un substrat en céramique
CN106458761B (zh) 2014-03-19 2019-08-06 日本碍子株式会社 陶瓷基体及其制造方法
JP6556004B2 (ja) * 2015-09-26 2019-08-07 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
WO2017126596A1 (ja) * 2016-01-22 2017-07-27 京セラ株式会社 電子部品収納用パッケージ、多数個取り配線基板、電子装置および電子モジュール
JP6677547B2 (ja) * 2016-03-23 2020-04-08 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP6767772B2 (ja) * 2016-04-28 2020-10-14 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージおよびそれを用いた電子装置
JP6767204B2 (ja) * 2016-08-25 2020-10-14 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール
US11515242B2 (en) * 2017-12-28 2022-11-29 Kyocera Corporation Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107534022A (zh) * 2015-11-25 2018-01-02 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块

Also Published As

Publication number Publication date
CN114026785A (zh) 2022-02-08
US12470200B2 (en) 2025-11-11
JP7182712B2 (ja) 2022-12-02
US20220385266A1 (en) 2022-12-01
WO2020262472A1 (ja) 2020-12-30
EP3993024A4 (en) 2023-08-09
JPWO2020262472A1 (https=) 2020-12-30
EP3993024A1 (en) 2022-05-04

Similar Documents

Publication Publication Date Title
JP6671441B2 (ja) 電子部品収納用パッケージ、多数個取り配線基板、電子装置および電子モジュール
CN105359632A (zh) 布线基板以及电子装置
JP2019192825A (ja) 電子部品収納用パッケージ、電子装置、および電子モジュール
JP7062688B2 (ja) 配線基板、電子装置及び電子モジュール
CN114026785B (zh) 电子部件收纳用封装件、电子装置以及电子模块
CN113692644B (zh) 电子部件收纳用封装件、电子装置以及电子模块
JP6813682B2 (ja) 電子部品収納用パッケージ、電子装置および電子モジュール
US11116077B2 (en) Wiring board, electronic device, and electronic module
CN114762098A (zh) 电子部件收纳用封装件、电子装置及电子模块
CN207765431U (zh) 盖体、电子部件收纳用封装件以及电子装置
JP2007095956A (ja) 電子部品収納用パッケージ
JP7499601B2 (ja) 電子部品収納用パッケージ、電子装置および電子モジュール
JP2005244146A (ja) 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造
JP2010056506A (ja) 電子装置の実装構造
JP4511335B2 (ja) 多数個取り配線基板および電子装置
CN116802793A (zh) 电子部件收纳用封装件、电子装置以及电子模块
JP2003283067A (ja) 多数個取り配線基板
JP2011171696A (ja) 電子装置およびその製造方法
JP2007294636A (ja) 電子部品収納用パッケージおよび電子装置
JP2005210027A (ja) 電子部品収納用パッケージおよび電子装置
JP2006237298A (ja) 配線基板
JP2003249589A (ja) 多数個取り配線基板
JP2004229254A (ja) 圧電振動子収納用パッケージ
JP2012134301A (ja) 配線基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant