JPWO2020262472A1 - - Google Patents

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Publication number
JPWO2020262472A1
JPWO2020262472A1 JP2021527698A JP2021527698A JPWO2020262472A1 JP WO2020262472 A1 JPWO2020262472 A1 JP WO2020262472A1 JP 2021527698 A JP2021527698 A JP 2021527698A JP 2021527698 A JP2021527698 A JP 2021527698A JP WO2020262472 A1 JPWO2020262472 A1 JP WO2020262472A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021527698A
Other languages
Japanese (ja)
Other versions
JP7182712B2 (ja
JPWO2020262472A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020262472A1 publication Critical patent/JPWO2020262472A1/ja
Publication of JPWO2020262472A5 publication Critical patent/JPWO2020262472A5/ja
Application granted granted Critical
Publication of JP7182712B2 publication Critical patent/JP7182712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021527698A 2019-06-27 2020-06-24 電子部品収納用パッケージ、電子装置、および電子モジュール Active JP7182712B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019120065 2019-06-27
JP2019120065 2019-06-27
PCT/JP2020/024858 WO2020262472A1 (ja) 2019-06-27 2020-06-24 電子部品収納用パッケージ、電子装置、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2020262472A1 true JPWO2020262472A1 (https=) 2020-12-30
JPWO2020262472A5 JPWO2020262472A5 (https=) 2022-03-17
JP7182712B2 JP7182712B2 (ja) 2022-12-02

Family

ID=74060142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021527698A Active JP7182712B2 (ja) 2019-06-27 2020-06-24 電子部品収納用パッケージ、電子装置、および電子モジュール

Country Status (5)

Country Link
US (1) US12470200B2 (https=)
EP (1) EP3993024A4 (https=)
JP (1) JP7182712B2 (https=)
CN (1) CN114026785B (https=)
WO (1) WO2020262472A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022163502A1 (ja) * 2021-01-27 2022-08-04 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063165A (ja) * 2015-09-26 2017-03-30 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
WO2017090508A1 (ja) * 2015-11-25 2017-06-01 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2018032773A (ja) * 2016-08-25 2018-03-01 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789278A (en) * 1996-07-30 1998-08-04 Micron Technology, Inc. Method for fabricating chip modules
US6740960B1 (en) * 1997-10-31 2004-05-25 Micron Technology, Inc. Semiconductor package including flex circuit, interconnects and dense array external contacts
JP2002164451A (ja) 2000-11-28 2002-06-07 Kyocera Corp 電子部品収納用パッケージ
JP4111222B2 (ja) * 2003-07-22 2008-07-02 株式会社村田製作所 表面実装型部品
WO2008053956A1 (fr) * 2006-11-02 2008-05-08 Murata Manufacturing Co., Ltd. Substrat en céramique, dispositif électronique et procédé de production d'un substrat en céramique
CN106458761B (zh) 2014-03-19 2019-08-06 日本碍子株式会社 陶瓷基体及其制造方法
WO2017126596A1 (ja) * 2016-01-22 2017-07-27 京セラ株式会社 電子部品収納用パッケージ、多数個取り配線基板、電子装置および電子モジュール
JP6677547B2 (ja) * 2016-03-23 2020-04-08 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP6767772B2 (ja) * 2016-04-28 2020-10-14 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージおよびそれを用いた電子装置
US11515242B2 (en) * 2017-12-28 2022-11-29 Kyocera Corporation Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063165A (ja) * 2015-09-26 2017-03-30 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
WO2017090508A1 (ja) * 2015-11-25 2017-06-01 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2018032773A (ja) * 2016-08-25 2018-03-01 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール

Also Published As

Publication number Publication date
CN114026785A (zh) 2022-02-08
US12470200B2 (en) 2025-11-11
JP7182712B2 (ja) 2022-12-02
US20220385266A1 (en) 2022-12-01
WO2020262472A1 (ja) 2020-12-30
EP3993024A4 (en) 2023-08-09
EP3993024A1 (en) 2022-05-04
CN114026785B (zh) 2025-07-22

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