CN113968732B - 一种高稳定低损耗的微波介质陶瓷材料的制备方法及应用其制得的微波介质陶瓷材料 - Google Patents

一种高稳定低损耗的微波介质陶瓷材料的制备方法及应用其制得的微波介质陶瓷材料 Download PDF

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CN113968732B
CN113968732B CN202111430742.4A CN202111430742A CN113968732B CN 113968732 B CN113968732 B CN 113968732B CN 202111430742 A CN202111430742 A CN 202111430742A CN 113968732 B CN113968732 B CN 113968732B
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dielectric ceramic
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林华
戴雨兰
邹翔
刘周杨
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Hunan Najin New Material Technology Co ltd
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Abstract

本发明提供一种高稳定低损耗的微波介质陶瓷材料的制备方法,包括以下步骤:按照微波介质陶瓷材料的化学组成称取原料;混合并破碎原料,得到混合粉末;使混合粉末在1000~1350℃下煅烧1.5~4小时,得到预烧物;破碎预烧物,并向其中添加粘接剂,制备陶瓷生坯;在高温炉中煅烧生坯,至煅烧温度达到1300~1500℃,保温3~10分钟,然后,使煅烧温度在5分钟内降低150~250℃,继续保温8~13小时;自然冷却,制得成品。应用上述方法可以制得介电常数εr为20左右的微波介质陶瓷材料,该陶瓷材料晶粒均匀,同时兼具高品质因数QF和近零的温度频率系数τf。

Description

一种高稳定低损耗的微波介质陶瓷材料的制备方法及应用其制得的微波介质陶瓷材料
技术领域
本发明属于陶瓷材料领域,具体地,涉及一种高稳定低损耗的微波介质陶瓷材料的制备方法及应用其制得的微波介质陶瓷材料。
背景技术
微波介质陶瓷材料是近年来迅速发展的一类新型电子陶瓷材料。它是各种介质谐振器、滤波器、振动器、双工器、天线等器件的基础材料,在微波通信、卫星导航、军用雷达设备中有大量应用。随着国家5G通信基站的建设,其用量更加广泛。
介电常数εr为20左右的微波介质陶瓷是目前在卫星通信和5G基站中用量很大的一类陶瓷材料。为克服不同微波频段应用带来的众多问题,需要这类材料满足高品质因数QF,近零的温度频率系数τf,并且价格要便宜。
微波介质陶瓷的制备包括粉体制备和成型阶段。在粉体制备的阶段,通常采用氧化物粉末混合球磨、预烧、破碎、干压成型这一传统方法。在该传统方法的处理过程中,粉体的粒度控制不到位,粒度分布宽,需要的烧结温度较高,晶粒容易出现异常长大,从而影响介电性能和一致性,此外,粒度不均匀也会导致产品在烧结后的收缩不均匀,影响尺寸精度,增加了后续调试的难度。除了上述传统方法之外,为了保证粉体的粒度均匀度,也可以通过各种水热法制备纳米粉体,用于后续的成型阶段。但是,纳米粉体的生产过程繁琐,生产成本高。微波介质陶瓷材料的成型通常在隧道窑中进行烧结,这种加热烧结方式的烧结时间较长,很容易导致晶粒的异常长大。SPS、微波烧结炉等加热设备可以替代传统的隧道窑进行粉体的烧结成型,但是这些新设备价格昂贵,单次处理量偏低,不利于常规生产。
发明内容
本发明的目的在于提供一种高稳定低损耗的微波介质陶瓷材料的制备方法及应用其制得的微波介质陶瓷材料,以优化微波介质陶瓷材料的微波性能。
根据本发明的一个方面,提供一种高稳定低损耗的微波介质陶瓷材料的制备方法,包括以下步骤:步骤一,按照微波介质陶瓷材料的化学组成称取原料,原料包括镁源物质、钙源物质、钛源物质、锶源物质、钐源物质、钕源物质、铝源物质中的至少两种;步骤二,混合并破碎原料,得到混合粉末;步骤三,使混合粉末在1000~1350℃下煅烧1.5~4小时,得到预烧物;步骤四,破碎预烧物,并向其中添加粘接剂,制备陶瓷生坯;步骤五,在高温炉中煅烧生坯,至煅烧温度达到1300~1500℃,保温3~10分钟,然后,使煅烧温度在5分钟内降低150~250℃,继续保温8~13小时;步骤六,自然冷却,制得成品。
可选地,所述镁源物质选自氧化镁、镁盐、氢氧化镁中的至少一种,钙源物质选自氧化钙、钙盐、氢氧化钙中的至少一种,钛源物质选自二氧化钛、钛酸盐中的至少一种,锶源物质选自氧化锶、锶盐中的至少一种,所述钐源物质选自氧化钐、钐盐中的至少一种,钕源物质选自氧化钕、钕盐中的至少一种,铝源物质选自氧化铝、铝盐、氢氧化铝中的至少一种。
优选地,在步骤四中还包括喷雾造粒的操作:使经过破碎后的预烧物与粘接剂进行喷雾造粒得到团粒,干压团粒,制得陶瓷生坯。
优选地,在步骤四中的破碎工艺为:对预烧物进行球磨处理18~22小时,然后对由此得到的粉末进行砂磨处理15~40分钟。
优选地,在步骤五中,在升温过程中,升温速率为5~12℃/min。
根据本发明的另一个方面,提供一种应用上述制备方法制得的微波介质陶瓷材料。
优选地,微波介质陶瓷材料为(Mg,Ca)TiO3系陶瓷材料;在制备微波介质陶瓷材料的原料中,Mg元素、Ca元素和Ti元素摩尔比为0.8~1.2 : 0.1~0.9 : 1~1.5。
优选地,微波介质陶瓷材料为MRAlO4系陶瓷材料,其中,M的元素种类包括Sr元素、Ca元素中的至少一种,R的元素种类包括La元素、Nd元素、Sm元素、Y元素中的至少一种;在制备微波介质陶瓷材料的原料中,以M为代表的元素、以R为代表的元素和Al元素摩尔比为6~8:5~6:5~7。
优选地,M的元素种类为Sr元素和Ca元素,R的元素种类为Sm元素。
优选地,在制备微波介质陶瓷材料的原料中,Sr元素和Ca元素的摩尔比为0.09~0.15:1。
优选地,MRAlO4系陶瓷材料为钛掺杂的陶瓷材料;在制备微波介质陶瓷材料的原料中,Ti元素和Al元素的摩尔比为0.12~0.2:1。
本发明通过设计微波介质陶瓷材料的煅烧工艺,能够缩减坯体在高温下的煅烧时间,使坯体在较低的煅烧温度下实现密致化,避免晶粒在煅烧过程中异常长大而导致粒度分布范围过宽。进一步地,在制粉的过程中采用砂磨工艺,使粉体颗粒细度更高、粒度分度更集中。而且,上述制备方法操作简单,使用常规的设备即可提供所需的煅烧工艺,适合大生产。应用上述方法可以制得介电常数εr为20左右的微波介质陶瓷材料,该陶瓷材料晶粒均匀,同时兼具高品质因数QF和近零的温度频率系数τf
附图说明
图1为实施例1中处理ⅠA组制备的(Mg,Ca)TiO3微波介质陶瓷材料的SEM图;
图2为实施例1中处理ⅠC组制备的(Mg,Ca)TiO3微波介质陶瓷材料的SEM图。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案,下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。
实施例1
1.(Mg,Ca)TiO3微波介质陶瓷的制备
本实施例用于制备微波介质陶瓷材料的原料为电子级的氧化镁、碳酸钙和二氧化钛。
(1)处理ⅠA组
处理ⅠA组制备(Mg,Ca)TiO3微波介质陶瓷材料的步骤如下:
步骤一,利用分析天平准确称量氧化镁397.41g、碳酸钙78.47g、二氧化钛967.74g;
步骤二,使上述原料混合得到的混合物经过球磨混合20小时,烘干后破碎;
步骤三,使混合粉末在1150℃煅烧2小时,得到预烧物;
步骤四,使预烧物经过球磨混合20小时,然后再将物料引入到砂磨机中处理30分钟,向由此得到的细颗粒中加入粘结剂,使所得物料经过喷雾造粒得到团粒,在成型模具中以60 Mpa的压力将团粒干压成型,制成φ15mm、高7.5mm的圆柱得到陶瓷生坯;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1350℃,保温5分钟,然后在5分钟内使煅烧温度降至1150℃,在此温度下保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料(Mg,Ca)TiO3
(2)处理ⅠB组
处理ⅠB组制备(Mg,Ca)TiO3微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅠA组保持一致;
步骤二,与处理ⅠA组保持一致;
步骤三,与处理ⅠA组保持一致;
步骤四,与处理ⅠA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1150℃,保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料(Mg,Ca)TiO3
(3)处理ⅠC组
处理ⅠC组制备(Mg,Ca)TiO3微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅠA组保持一致;
步骤二,与处理ⅠA组保持一致;
步骤三,与处理ⅠA组保持一致;
步骤四,与处理ⅠA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1350℃,保温5分钟,然后以20℃/h的速率使煅烧温度降至1150℃;
步骤六,自然冷却,制得微波介质陶瓷材料(Mg,Ca)TiO3
2.微波性能测试
在本实施例提供的三组处理组制备
以分别按照处理ⅠA组、处理ⅠB组、处理ⅠC组提供的方法制备的微波介质陶瓷材料参与微波性能测试,每个处理组取5个重复,每片微波介质陶瓷材料为1个重复。采用安捷伦网络分析仪,在4-9GHz频率下进行微波性能。微波性能测试的结果分别如表1~3所示。处理ⅠA组制作的(Mg,Ca)TiO3微波陶瓷的介电常数和不同温度下的温度频率系数都十分稳定,分别分布在集中的数值范围内,另外,QF值可以达到65000以上,属于较高的水平。然而,处理ⅠB组采用较低的温度煅烧坯体,煅烧的过程中没有明显幅度的变温,其制备的陶瓷材料的QF值最高不超过50000。如图1所示,处理ⅠA组所制得的陶瓷材料的颗粒粒度较为均匀,无严重的烧结或团聚。相对而言,如图2所示,处理ⅠC组所制得的陶瓷材料出现明显的团聚,颗粒大小不一,处理ⅠC组的坯体煅烧过程中,温度下降的速度慢,颗粒处于高温下的时间长,容易出现异常长大和团聚。而处理ⅠC组制得的陶瓷材料的不同温度下的温度频率系数差值达到15以上,显著高于处理ⅠA组和处理ⅠB组的陶瓷粉体的相应数值,另外,其介电常数也偏高,数值分布较为不稳定。由此可见,采用处理ⅠA组可以获得介电常数约为20的(Mg,Ca)TiO3微波介质陶瓷,相较于其他方法制得的产品,处理ⅠA组制得的(Mg,Ca)TiO3陶瓷材料的品质因素QF以及温度频率系数τf都得到较大改善。
表1处理ⅠA组制备的微波介质陶瓷材料的微波性能
表2处理ⅠB组制备的微波介质陶瓷材料的微波性能
表3处理ⅠC组制备的微波介质陶瓷材料的微波性能
实施例2
1.CaSmAlO4微波介质陶瓷的制备
本实施例用于制备微波介质陶瓷材料的原料为电子级的碳酸钙、氧化钐、三氧化二铝和二氧化钛。
(1)处理ⅡA组
处理ⅡA组制备CaSmAlO4微波介质陶瓷材料的步骤如下:
步骤一,利用分析天平准确称量碳酸钙740.32g、氧化钐905.03g、三氧化二铝328.55g、二氧化钛74.11g;
步骤二,使上述原料混合得到的混合物经过球磨混合20小时,烘干后破碎;
步骤三,使混合粉末在1250℃煅烧2小时,得到预烧物;
步骤四,使预烧物经过球磨混合20小时,然后再将物料引入到砂磨机中处理25分钟,向由此得到的细颗粒中加入粘结剂,使所得物料经过喷雾造粒得到团粒,在成型模具中以60 Mpa的压力将团粒干压成型,制成φ15mm、高7.5mm的圆柱得到陶瓷生坯;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1450℃,保温5分钟,然后在5分钟内使煅烧温度降至1250℃,在此温度下保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料CaSmAlO4
(2)处理ⅡB组
处理ⅡB组制备CaSmAlO4微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅡA组保持一致;
步骤二,与处理ⅡA组保持一致;
步骤三,与处理ⅡA组保持一致;
步骤四,与处理ⅡA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1250℃,保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料CaSmAlO4
(3)处理ⅡC组
处理ⅡC组制备CaSmAlO4微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅡA组保持一致;
步骤二,与处理ⅡA组保持一致;
步骤三,与处理ⅡA组保持一致;
步骤四,与处理ⅡA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1450℃,保温5分钟,然后以20℃/h的速率使煅烧温度降至1250℃;
步骤六,自然冷却,制得微波介质陶瓷材料CaSmAlO4
2.微波性能测试
在本实施例提供的三组处理组制备
以分别按照处理ⅡA组、处理ⅡB组、处理ⅡC组提供的方法制备的微波介质陶瓷材料参与微波性能测试,每个处理组取5个重复,每片微波介质陶瓷材料为1个重复。采用安捷伦网络分析仪,在4-9GHz频率下进行微波性能。微波性能测试的结果分别如表4~6所示。处理ⅡA组制作的CaSmAlO4微波介质陶瓷的介电常数和不同温度下的温度频率系数都十分稳定,分别分布在集中的数值范围内,另外,QF值可以达到85000以上,属于较高的水平。然而,处理ⅡB组采用较低的温度煅烧坯体,煅烧的过程中没有明显幅度的变温,其制备的陶瓷材料的QF值只能到50000~70000。处理ⅡC组的坯体煅烧过程中,温度下降的速度慢,颗粒处于高温下的时间长,由此制得的陶瓷材料的不同温度下的温度频率系数差值达到5以上,显著高于处理ⅡA组和处理ⅡB组的陶瓷粉体的相应数值,另外,其介电常数也偏高,数值分布较为不稳定。由此可见,采用处理ⅡA组可以获得介电常数约为20的CaSmAlO4微波介质陶瓷,相较于其他方法制得的产品,处理ⅡA组制得的CaSmAlO4陶瓷材料的品质因素QF以及温度频率系数τf都得到较大改善。
表4处理ⅡA组制备的微波介质陶瓷材料的微波性能
表5处理ⅡB组制备的微波介质陶瓷材料的微波性能
表6处理ⅡC组制备的微波介质陶瓷材料的微波性能
实施例3
1.(Sr,Ca)SmAlO4微波介质陶瓷的制备
本实施例用于制备微波介质陶瓷材料的原料为电子级的碳酸锶、碳酸钙、氧化钐、三氧化二铝和二氧化钛。
(1)处理ⅢA组
处理ⅢA组制备(Sr,Ca)SmAlO4微波介质陶瓷材料的步骤如下:
步骤一,利用分析天平准确称量碳酸锶108.20g、碳酸钙648.93g、氧化钐950.98g、三氧化二铝261.55g和二氧化钛72.18g;
步骤二,使上述原料混合得到的混合物经过球磨混合20小时,烘干后破碎;
步骤三,使混合粉末在1000℃煅烧2小时,得到预烧物;
步骤四,使预烧物经过球磨混合20小时,然后再将物料引入到砂磨机中处理35分钟,向由此得到的细颗粒中加入粘结剂,使所得物料经过喷雾造粒得到团粒,在成型模具中以60 Mpa的压力将团粒干压成型,制成φ15mm、高7.5mm的圆柱得到陶瓷生坯;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1485℃,保温5分钟,然后在5分钟内使煅烧温度降至1300℃,在此温度下保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料(Sr,Ca)SmAlO4
(2)处理ⅢB组
处理ⅢB组制备(Sr,Ca)SmAlO4微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅢA组保持一致;
步骤二,与处理ⅢA组保持一致;
步骤三,与处理ⅢA组保持一致;
步骤四,与处理ⅢA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1300℃,保温10小时;
步骤六,自然冷却,制得微波介质陶瓷材料(Sr,Ca)SmAlO4
(3)处理ⅢC组
处理ⅢC组制备(Sr,Ca)SmAlO4微波介质陶瓷材料的步骤如下:
步骤一,与处理ⅢA组保持一致;
步骤二,与处理ⅢA组保持一致;
步骤三,与处理ⅢA组保持一致;
步骤四,与处理ⅢA组保持一致;
步骤五,将生坯在隧道窑中先排胶,然后以10℃/min的速度升温到1485℃,保温5分钟,然后以18.5℃/h的速率使煅烧温度降至1300℃;
步骤六,自然冷却,制得微波介质陶瓷材料(Sr,Ca)SmAlO4
2.微波性能测试
在本实施例提供的三组处理组制备
以分别按照处理ⅢA组、处理ⅢB组、处理ⅢC组提供的方法制备的微波介质陶瓷材料参与微波性能测试,每个处理组取5个重复,每片微波介质陶瓷材料为1个重复。采用安捷伦网络分析仪,在4-9GHz频率下进行微波性能。微波性能测试的结果分别如表7~9所示。处理ⅢA组制作的(Sr,Ca)SmAlO4微波介质陶瓷的介电常数和不同温度下的温度频率系数都十分稳定,分别分布在集中的数值范围内,另外,QF值可以达到95000以上,属于较高的水平。然而,处理ⅢB组采用较低的温度煅烧坯体,煅烧的过程中没有明显幅度的变温,其制备的陶瓷材料的QF值只能到70000~90000。处理ⅢC组的坯体煅烧过程中,温度下降的速度慢,颗粒处于高温下的时间长,由此制得的陶瓷材料的不同温度下的温度频率系数差值达到5以上,显著高于处理ⅢA组和处理ⅢB组的陶瓷粉体的相应数值,另外,其介电常数也偏高,数值分布较为不稳定。由此可见,采用处理ⅢA组可以获得介电常数约为20的(Sr,Ca)SmAlO4微波介质陶瓷,相较于其他方法制得的产品,处理ⅢA组制得的(Sr,Ca)SmAlO4陶瓷材料的品质因素QF以及温度频率系数τf都得到较大改善。
表7处理ⅢA组制备的微波介质陶瓷材料的微波性能
表8处理ⅢB组制备的微波介质陶瓷材料的微波性能
表9处理ⅢC组制备的微波介质陶瓷材料的微波性能
以上实施例仅用以说明本发明的技术方案而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。

Claims (7)

1.一种高稳定低损耗的微波介质陶瓷材料的制备方法,其特征在于,包括以下步骤:
步骤一,按照所述微波介质陶瓷材料的化学组成称取原料,所述微波介质陶瓷材料的化学组成为(Mg,Ca)TiO3,所述原料包括镁源物质、钙源物质和钛源物质,在所述原料中,Mg元素、Ca元素和Ti元素摩尔比为0.8~1.2: 0.1~0.9 : 1~1.5;
步骤二,混合并破碎所述原料,得到混合粉末;
步骤三,使所述混合粉末在1000~1350℃下煅烧1.5~4小时,得到预烧物;
步骤四,对所述预烧物进行球磨处理18~22小时,然后对由此得到的粉末进行砂磨处理15~40分钟,并向其中添加粘接剂,制备陶瓷生坯;
步骤五,在高温炉中煅烧所述生坯,至煅烧温度达到1300~1500℃,保温3~10分钟,然后,使煅烧温度在5分钟内降低150~250℃,继续保温8~13小时;
步骤六,自然冷却,制得成品。
2.一种高稳定低损耗的微波介质陶瓷材料的制备方法,其特征在于,包括以下步骤:
步骤一,按照所述微波介质陶瓷材料的化学组成称取原料,所述微波介质陶瓷材料的化学组成为为钛掺杂的MSmAlO4,其中,所述M的元素种类包括Ca元素,所述原料包括钙源物质、钛源物质、钐源物质、铝源物质,在所述原料中,以所述M为代表的元素、Sm元素和Al元素摩尔比为6~8:5~6:5~7,且,Ti元素和Al元素的摩尔比为0.12~0.2:1;
步骤二,混合并破碎所述原料,得到混合粉末;
步骤三,使所述混合粉末在1000~1350℃下煅烧1.5~4小时,得到预烧物;
步骤四,对所述预烧物进行球磨处理18~22小时,然后对由此得到的粉末进行砂磨处理15~40分钟,并向其中添加粘接剂,制备陶瓷生坯;
步骤五,在高温炉中煅烧所述生坯,至煅烧温度达到1300~1500℃,保温3~10分钟,然后,使煅烧温度在5分钟内降低150~250℃,继续保温8~13小时;
步骤六,自然冷却,制得成品。
3.如权利要求1或2所述高稳定低损耗的微波介质陶瓷材料的制备方法,其特征在于,在所述步骤四中还包括喷雾造粒的操作:使经过破碎后的所述预烧物与粘接剂进行喷雾造粒得到团粒,干压所述团粒,制得所述陶瓷生坯。
4.如权利要求1或2所述高稳定低损耗的微波介质陶瓷材料的制备方法,其特征在于:在所述步骤五中,在升温过程中,升温速率为5~12℃/min。
5.一种应用如权利要求1~4任一项所述制备方法制得的微波介质陶瓷材料。
6.一种应用如权利要求2所述制备方法制得的微波介质陶瓷材料,其特征在于:所述M的元素种类为Sr元素和Ca元素。
7.如权利要求6所述微波介质陶瓷材料,其特征在于:在制备所述微波介质陶瓷材料的原料中,Sr元素和Ca元素的摩尔比为0.09~0.15:1。
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