CN113892015A - 振动检测系统 - Google Patents

振动检测系统 Download PDF

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Publication number
CN113892015A
CN113892015A CN202080039076.9A CN202080039076A CN113892015A CN 113892015 A CN113892015 A CN 113892015A CN 202080039076 A CN202080039076 A CN 202080039076A CN 113892015 A CN113892015 A CN 113892015A
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CN
China
Prior art keywords
vibration
image
pixel
laser light
detection system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080039076.9A
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English (en)
Chinese (zh)
Inventor
麦可·柯比
中野晶太
宗像広志
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Shinkawa Ltd
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Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN113892015A publication Critical patent/CN113892015A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/002—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means for representing acoustic field distribution
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G06T7/246—Analysis of motion using feature-based methods, e.g. the tracking of corners or segments
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G06T7/254—Analysis of motion involving subtraction of images
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202080039076.9A 2019-09-03 2020-09-03 振动检测系统 Pending CN113892015A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-160471 2019-09-03
JP2019160471 2019-09-03
PCT/JP2020/033353 WO2021045135A1 (ja) 2019-09-03 2020-09-03 振動検出システム

Publications (1)

Publication Number Publication Date
CN113892015A true CN113892015A (zh) 2022-01-04

Family

ID=74853220

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080039076.9A Pending CN113892015A (zh) 2019-09-03 2020-09-03 振动检测系统

Country Status (7)

Country Link
US (1) US20220283020A1 (https=)
EP (1) EP4027119A4 (https=)
JP (1) JP7219990B2 (https=)
KR (1) KR20220043202A (https=)
CN (1) CN113892015A (https=)
TW (1) TWI756811B (https=)
WO (1) WO2021045135A1 (https=)

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CN101236081A (zh) * 2008-02-22 2008-08-06 济南大学 基于激光图像及对应像素距离度量的位移测量装置及方法
WO2009022245A2 (en) * 2007-08-10 2009-02-19 Koninklijke Philips Electronics N.V. Mechanical resonance detection system
EP2375227A1 (en) * 2010-04-09 2011-10-12 Siemens Aktiengesellschaft Measurement of three-dimensional motion characteristics
CN102889864A (zh) * 2011-07-19 2013-01-23 中铝上海铜业有限公司 带卷边部物体塔形检测系统及其检测方法
JP2013195287A (ja) * 2012-03-21 2013-09-30 Sharp Corp 変位量検出装置、電子機器
CN104236464A (zh) * 2014-09-04 2014-12-24 宁波舜宇智能测量仪器有限公司 一种激光振动、位移传感器及其测量方法
CN105136434A (zh) * 2015-08-12 2015-12-09 中北大学 一种平面机构二维运动规律测试装置
CN107271026A (zh) * 2017-07-07 2017-10-20 河南科技大学 一种钢丝绳横向振动测量的方法
CN206892031U (zh) * 2016-07-12 2018-01-16 纳路易爱姆斯株式会社 具备位置识别飞行单元与图像拍摄部的检查用飞行体
CN107764389A (zh) * 2017-09-08 2018-03-06 天津大学 基于条纹投影法的一种低速摄像机测量较高频振动的方法
CN108254379A (zh) * 2016-12-28 2018-07-06 上海微电子装备（集团）股份有限公司 一种缺陷检测装置及方法
JP2019045398A (ja) * 2017-09-05 2019-03-22 国立大学法人福井大学 スペックル画像を用いる欠陥検出方法およびその装置
US20190212187A1 (en) * 2016-08-29 2019-07-11 Elbit Systems Land And C4I Ltd. Optical detection of vibrations

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US4824250A (en) * 1986-11-17 1989-04-25 Newman John W Non-destructive testing by laser scanning
DE4427692A1 (de) * 1994-08-04 1996-02-08 Bayerische Motoren Werke Ag Verfahren zum Bestimmen des Schwingungsverhaltens eines Körpers
JP3388034B2 (ja) * 1994-08-31 2003-03-17 株式会社東芝 分布計測データによる機器状態の監視方法
JPH10221159A (ja) * 1997-02-12 1998-08-21 Toshiba Corp レ−ザドプラ方式振動分布測定装置
WO2000013229A1 (en) * 1998-09-01 2000-03-09 Matsushita Electric Industrial Co., Ltd. Bump joining judging device and method, and semiconductor component production device and method
US6128082A (en) * 1998-09-18 2000-10-03 Board Of Trustees Operating Michigan State University Technique and apparatus for performing electronic speckle pattern interferometry
DE19940217C5 (de) * 1999-08-25 2006-08-10 Zwick Gmbh & Co Verfahren zur berührungslosen Messung der Veränderung der räumlichen Gestalt einer Meßprobe, insbesondere zur Messung der Längenänderung der einer äußeren Kraft unterliegenden Meßprobe und Vorrichtung zur Durchführung des Verfahrens
US7436504B2 (en) * 2003-09-10 2008-10-14 Shear Graphics, Llc Non-destructive testing and imaging
DE102007023826A1 (de) 2007-05-21 2008-11-27 Polytec Gmbh Verfahren und Vorrichtung zur berührungslosen Schwingungsmessung
CN102301212B (zh) * 2009-01-30 2013-08-14 西门子公司 对象振动特性的测量
JP6106921B2 (ja) * 2011-04-26 2017-04-05 株式会社リコー 撮像装置、撮像方法および撮像プログラム
JP5974472B2 (ja) 2011-12-15 2016-08-23 日産自動車株式会社 ワイヤボンディング装置およびワイヤボンディング方法
EP2887030B1 (de) * 2013-12-20 2016-11-23 Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Messung von Schwingungen eines bewegten Objektes
WO2016094851A1 (en) * 2014-12-12 2016-06-16 Sunedison Semiconductor Limited Systems and methods for performing phase shift interferometry while a wafer is vibrating
JP6555712B2 (ja) 2015-06-09 2019-08-07 国立大学法人 新潟大学 平面振動計測装置及び平面振動計測方法
CN105258783B (zh) 2015-11-16 2019-01-18 杭州电子科技大学 一种基于激光波前编码技术的振动检测方法
WO2019239618A1 (ja) * 2018-06-11 2019-12-19 株式会社島津製作所 欠陥検出方法及び装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009022245A2 (en) * 2007-08-10 2009-02-19 Koninklijke Philips Electronics N.V. Mechanical resonance detection system
CN101236081A (zh) * 2008-02-22 2008-08-06 济南大学 基于激光图像及对应像素距离度量的位移测量装置及方法
EP2375227A1 (en) * 2010-04-09 2011-10-12 Siemens Aktiengesellschaft Measurement of three-dimensional motion characteristics
CN102889864A (zh) * 2011-07-19 2013-01-23 中铝上海铜业有限公司 带卷边部物体塔形检测系统及其检测方法
JP2013195287A (ja) * 2012-03-21 2013-09-30 Sharp Corp 変位量検出装置、電子機器
CN104236464A (zh) * 2014-09-04 2014-12-24 宁波舜宇智能测量仪器有限公司 一种激光振动、位移传感器及其测量方法
CN105136434A (zh) * 2015-08-12 2015-12-09 中北大学 一种平面机构二维运动规律测试装置
CN206892031U (zh) * 2016-07-12 2018-01-16 纳路易爱姆斯株式会社 具备位置识别飞行单元与图像拍摄部的检查用飞行体
US20190212187A1 (en) * 2016-08-29 2019-07-11 Elbit Systems Land And C4I Ltd. Optical detection of vibrations
CN108254379A (zh) * 2016-12-28 2018-07-06 上海微电子装备（集团）股份有限公司 一种缺陷检测装置及方法
CN107271026A (zh) * 2017-07-07 2017-10-20 河南科技大学 一种钢丝绳横向振动测量的方法
JP2019045398A (ja) * 2017-09-05 2019-03-22 国立大学法人福井大学 スペックル画像を用いる欠陥検出方法およびその装置
CN107764389A (zh) * 2017-09-08 2018-03-06 天津大学 基于条纹投影法的一种低速摄像机测量较高频振动的方法

Also Published As

Publication number Publication date
US20220283020A1 (en) 2022-09-08
JPWO2021045135A1 (https=) 2021-03-11
KR20220043202A (ko) 2022-04-05
TW202121551A (zh) 2021-06-01
WO2021045135A1 (ja) 2021-03-11
TWI756811B (zh) 2022-03-01
JP7219990B2 (ja) 2023-02-09
EP4027119A1 (en) 2022-07-13
EP4027119A4 (en) 2023-09-06

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