KR20220043202A - 진동 검출 시스템 - Google Patents

진동 검출 시스템 Download PDF

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Publication number
KR20220043202A
KR20220043202A KR1020227007729A KR20227007729A KR20220043202A KR 20220043202 A KR20220043202 A KR 20220043202A KR 1020227007729 A KR1020227007729 A KR 1020227007729A KR 20227007729 A KR20227007729 A KR 20227007729A KR 20220043202 A KR20220043202 A KR 20220043202A
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KR
South Korea
Prior art keywords
vibration
image
pixel
camera
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020227007729A
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English (en)
Korean (ko)
Inventor
마이클 커크비
쇼타 나카노
히로시 무나카타
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20220043202A publication Critical patent/KR20220043202A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/002—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means for representing acoustic field distribution
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G06T7/246—Analysis of motion using feature-based methods, e.g. the tracking of corners or segments
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/20—Analysis of motion
    • G06T7/254—Analysis of motion involving subtraction of images
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020227007729A 2019-09-03 2020-09-03 진동 검출 시스템 Ceased KR20220043202A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-160471 2019-09-03
JP2019160471 2019-09-03
PCT/JP2020/033353 WO2021045135A1 (ja) 2019-09-03 2020-09-03 振動検出システム

Publications (1)

Publication Number Publication Date
KR20220043202A true KR20220043202A (ko) 2022-04-05

Family

ID=74853220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227007729A Ceased KR20220043202A (ko) 2019-09-03 2020-09-03 진동 검출 시스템

Country Status (7)

Country Link
US (1) US20220283020A1 (https=)
EP (1) EP4027119A4 (https=)
JP (1) JP7219990B2 (https=)
KR (1) KR20220043202A (https=)
CN (1) CN113892015A (https=)
TW (1) TWI756811B (https=)
WO (1) WO2021045135A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013125875A (ja) 2011-12-15 2013-06-24 Nissan Motor Co Ltd ワイヤボンディング装置およびワイヤボンディング方法

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JPH10221159A (ja) * 1997-02-12 1998-08-21 Toshiba Corp レ−ザドプラ方式振動分布測定装置
WO2000013229A1 (en) * 1998-09-01 2000-03-09 Matsushita Electric Industrial Co., Ltd. Bump joining judging device and method, and semiconductor component production device and method
US6128082A (en) * 1998-09-18 2000-10-03 Board Of Trustees Operating Michigan State University Technique and apparatus for performing electronic speckle pattern interferometry
DE19940217C5 (de) * 1999-08-25 2006-08-10 Zwick Gmbh & Co Verfahren zur berührungslosen Messung der Veränderung der räumlichen Gestalt einer Meßprobe, insbesondere zur Messung der Längenänderung der einer äußeren Kraft unterliegenden Meßprobe und Vorrichtung zur Durchführung des Verfahrens
US7436504B2 (en) * 2003-09-10 2008-10-14 Shear Graphics, Llc Non-destructive testing and imaging
DE102007023826A1 (de) 2007-05-21 2008-11-27 Polytec Gmbh Verfahren und Vorrichtung zur berührungslosen Schwingungsmessung
WO2009022245A2 (en) * 2007-08-10 2009-02-19 Koninklijke Philips Electronics N.V. Mechanical resonance detection system
CN100585328C (zh) * 2008-02-22 2010-01-27 济南大学 基于激光图像及对应像素距离度量的位移测量装置及方法
CN102301212B (zh) * 2009-01-30 2013-08-14 西门子公司 对象振动特性的测量
EP2375227A1 (en) * 2010-04-09 2011-10-12 Siemens Aktiengesellschaft Measurement of three-dimensional motion characteristics
JP6106921B2 (ja) * 2011-04-26 2017-04-05 株式会社リコー 撮像装置、撮像方法および撮像プログラム
CN102889864A (zh) * 2011-07-19 2013-01-23 中铝上海铜业有限公司 带卷边部物体塔形检测系统及其检测方法
JP2013195287A (ja) * 2012-03-21 2013-09-30 Sharp Corp 変位量検出装置、電子機器
EP2887030B1 (de) * 2013-12-20 2016-11-23 Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Messung von Schwingungen eines bewegten Objektes
CN104236464B (zh) * 2014-09-04 2017-03-22 宁波舜宇智能科技有限公司 一种激光振动、位移传感器及其测量方法
WO2016094851A1 (en) * 2014-12-12 2016-06-16 Sunedison Semiconductor Limited Systems and methods for performing phase shift interferometry while a wafer is vibrating
JP6555712B2 (ja) 2015-06-09 2019-08-07 国立大学法人 新潟大学 平面振動計測装置及び平面振動計測方法
CN105136434B (zh) * 2015-08-12 2019-09-20 中北大学 一种平面机构二维运动规律测试装置
CN105258783B (zh) 2015-11-16 2019-01-18 杭州电子科技大学 一种基于激光波前编码技术的振动检测方法
CN206892031U (zh) * 2016-07-12 2018-01-16 纳路易爱姆斯株式会社 具备位置识别飞行单元与图像拍摄部的检查用飞行体
SG11201901644TA (en) * 2016-08-29 2019-03-28 Elbit Systems Land & C4I Ltd Optical detection of vibrations
CN108254379B (zh) * 2016-12-28 2020-10-27 上海微电子装备（集团）股份有限公司 一种缺陷检测装置及方法
CN107271026B (zh) * 2017-07-07 2020-01-03 河南科技大学 一种钢丝绳横向振动测量的方法
JP7126670B2 (ja) * 2017-09-05 2022-08-29 国立大学法人福井大学 スペックル画像を用いる欠陥検出方法およびその装置
CN107764389A (zh) * 2017-09-08 2018-03-06 天津大学 基于条纹投影法的一种低速摄像机测量较高频振动的方法
WO2019239618A1 (ja) * 2018-06-11 2019-12-19 株式会社島津製作所 欠陥検出方法及び装置

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2013125875A (ja) 2011-12-15 2013-06-24 Nissan Motor Co Ltd ワイヤボンディング装置およびワイヤボンディング方法

Also Published As

Publication number Publication date
US20220283020A1 (en) 2022-09-08
JPWO2021045135A1 (https=) 2021-03-11
TW202121551A (zh) 2021-06-01
WO2021045135A1 (ja) 2021-03-11
TWI756811B (zh) 2022-03-01
JP7219990B2 (ja) 2023-02-09
CN113892015A (zh) 2022-01-04
EP4027119A1 (en) 2022-07-13
EP4027119A4 (en) 2023-09-06

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