CN113875000A - 电子元件安装用基板、电子装置以及电子模块 - Google Patents

电子元件安装用基板、电子装置以及电子模块 Download PDF

Info

Publication number
CN113875000A
CN113875000A CN202080037938.4A CN202080037938A CN113875000A CN 113875000 A CN113875000 A CN 113875000A CN 202080037938 A CN202080037938 A CN 202080037938A CN 113875000 A CN113875000 A CN 113875000A
Authority
CN
China
Prior art keywords
electronic component
layer
substrate
view
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080037938.4A
Other languages
English (en)
Chinese (zh)
Inventor
堀内加奈江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN113875000A publication Critical patent/CN113875000A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202080037938.4A 2019-05-29 2020-05-28 电子元件安装用基板、电子装置以及电子模块 Pending CN113875000A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019100404 2019-05-29
JP2019-100404 2019-05-29
PCT/JP2020/021181 WO2020241775A1 (ja) 2019-05-29 2020-05-28 電子素子実装用基板、電子装置、および電子モジュール

Publications (1)

Publication Number Publication Date
CN113875000A true CN113875000A (zh) 2021-12-31

Family

ID=73552185

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080037938.4A Pending CN113875000A (zh) 2019-05-29 2020-05-28 电子元件安装用基板、电子装置以及电子模块

Country Status (4)

Country Link
US (1) US12144114B2 (https=)
JP (2) JP7307161B2 (https=)
CN (1) CN113875000A (https=)
WO (1) WO2020241775A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202539314A (zh) * 2024-01-31 2025-10-01 日商京瓷股份有限公司 配線基板及半導體裝置
WO2025183114A1 (ja) * 2024-02-29 2025-09-04 京セラ株式会社 配線基板および半導体デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273455A (ja) * 1994-03-30 1995-10-20 Oki Electric Ind Co Ltd 多層セラミック基板及びその製造方法
JP2009206495A (ja) * 2008-01-28 2009-09-10 Kyocera Corp 積層基板
JP2019079987A (ja) * 2017-10-26 2019-05-23 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140621B1 (https=) * 1971-02-10 1976-11-05
JPS5122060A (ja) * 1974-08-19 1976-02-21 Fujitsu Ltd Tasopurintoban
JPH0717166Y2 (ja) * 1988-06-28 1995-04-19 株式会社フジクラ 多層フレキシブルプリント配線板
JP2958492B2 (ja) 1990-03-30 1999-10-06 京セラ株式会社 多層配線回路基板の製造方法
JPH0685457A (ja) 1992-08-31 1994-03-25 Kyocera Corp セラミック多層回路基板及びその製造方法
JP3441318B2 (ja) 1996-11-25 2003-09-02 京セラ株式会社 半導体装置
US7371974B2 (en) * 2001-03-14 2008-05-13 Ibiden Co., Ltd. Multilayer printed wiring board
JP3911466B2 (ja) * 2002-09-20 2007-05-09 京セラ株式会社 電子部品搭載基板および電子部品搭載構造体
JP2005072503A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 配線基板およびそれを用いた電子装置
JP2005150552A (ja) * 2003-11-18 2005-06-09 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP4683269B2 (ja) * 2005-03-23 2011-05-18 Ｔｄｋ株式会社 多層セラミック基板の製造方法
WO2008108172A1 (ja) * 2007-03-01 2008-09-12 Murata Manufacturing Co., Ltd. 多層配線基板
WO2012121141A1 (ja) * 2011-03-07 2012-09-13 株式会社村田製作所 セラミック多層基板およびその製造方法
JP5835282B2 (ja) * 2013-07-04 2015-12-24 株式会社村田製作所 多層配線基板の製造方法およびプローブカードの製造方法並びに多層配線基板およびプローブカード
JP2017050391A (ja) * 2015-09-01 2017-03-09 株式会社デンソー 多層基板およびその製造方法
JP2017123377A (ja) * 2016-01-05 2017-07-13 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP6832630B2 (ja) * 2016-03-28 2021-02-24 富士通インターコネクトテクノロジーズ株式会社 配線基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273455A (ja) * 1994-03-30 1995-10-20 Oki Electric Ind Co Ltd 多層セラミック基板及びその製造方法
JP2009206495A (ja) * 2008-01-28 2009-09-10 Kyocera Corp 積層基板
JP2019079987A (ja) * 2017-10-26 2019-05-23 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール

Also Published As

Publication number Publication date
JP2023126865A (ja) 2023-09-12
JP7610654B2 (ja) 2025-01-08
WO2020241775A1 (ja) 2020-12-03
US12144114B2 (en) 2024-11-12
US20220361333A1 (en) 2022-11-10
JP7307161B2 (ja) 2023-07-11
JPWO2020241775A1 (https=) 2020-12-03

Similar Documents

Publication Publication Date Title
JP5823043B2 (ja) 電子素子搭載用基板、電子装置および撮像モジュール
JP6732932B2 (ja) 撮像素子実装用基体、撮像装置および撮像モジュール
CN112020771B (zh) 电子元件安装用基板、电子装置以及电子模块
WO2014115766A1 (ja) 電子素子搭載用パッケージ、電子装置および撮像モジュール
US10468316B2 (en) Electronic component mounting board, electronic device, and electronic module
JP7610654B2 (ja) 電子素子実装用基板、電子装置、および電子モジュール
CN110875258B (zh) 电子元件安装用基板、电子装置以及电子模块
JP7062569B2 (ja) 電子素子実装用基板、電子装置、および電子モジュール
JP7163409B2 (ja) 電子素子実装用基板、および電子装置
US10681831B2 (en) Electronic component mounting board, electronic device, and electronic module
CN108735706B (zh) 电子元件安装用基板、电子装置以及电子模块
JP7242870B2 (ja) 実装基板および電子装置
US20250233059A1 (en) Electronic element mounting substrate, electronic device, electronic module, and method for manufacturing electronic element mounting substrate
US12087874B2 (en) Mounting board, electronic device, and electronic module
JP2021158322A (ja) 実装基板、電子装置、および電子モジュール
JP2014063892A (ja) 多数個取り配線基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination