CN113841211B - 电容器 - Google Patents

电容器 Download PDF

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Publication number
CN113841211B
CN113841211B CN202080035634.4A CN202080035634A CN113841211B CN 113841211 B CN113841211 B CN 113841211B CN 202080035634 A CN202080035634 A CN 202080035634A CN 113841211 B CN113841211 B CN 113841211B
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CN
China
Prior art keywords
capacitor
convex portion
convex
electrode
lower electrode
Prior art date
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Active
Application number
CN202080035634.4A
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English (en)
Chinese (zh)
Other versions
CN113841211A (zh
Inventor
松原弘
原田真臣
香川武史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN113841211A publication Critical patent/CN113841211A/zh
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Publication of CN113841211B publication Critical patent/CN113841211B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/01—Form of self-supporting electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Ceramic Capacitors (AREA)
CN202080035634.4A 2019-05-13 2020-03-03 电容器 Active CN113841211B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019090617 2019-05-13
JP2019-090617 2019-05-13
PCT/JP2020/008961 WO2020230414A1 (ja) 2019-05-13 2020-03-03 キャパシタ

Publications (2)

Publication Number Publication Date
CN113841211A CN113841211A (zh) 2021-12-24
CN113841211B true CN113841211B (zh) 2023-04-14

Family

ID=73289559

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080035634.4A Active CN113841211B (zh) 2019-05-13 2020-03-03 电容器

Country Status (4)

Country Link
US (1) US12327689B2 (https=)
JP (1) JP7197001B2 (https=)
CN (1) CN113841211B (https=)
WO (1) WO2020230414A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11495552B2 (en) * 2018-06-29 2022-11-08 Intel Corporation Substrate integrated thin film capacitors using amorphous high-k dielectrics
WO2021166880A1 (ja) * 2020-02-17 2021-08-26 株式会社村田製作所 半導体装置及びモジュール
JP2022144464A (ja) * 2021-03-19 2022-10-03 住友電工デバイス・イノベーション株式会社 キャパシタ
CN117321774A (zh) * 2021-05-14 2023-12-29 京瓷Avx元器件公司 可嵌入的基于半导体的电容器
JP7758341B2 (ja) * 2022-03-07 2025-10-22 住友電工デバイス・イノベーション株式会社 キャパシタおよびその製造方法
JPWO2024111510A1 (https=) * 2022-11-25 2024-05-30

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081325A (ja) * 2005-09-16 2007-03-29 Murata Mfg Co Ltd 薄膜キャパシタ
JP2008252011A (ja) * 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
JP2017195322A (ja) * 2016-04-22 2017-10-26 ローム株式会社 チップコンデンサ
WO2018003445A1 (ja) * 2016-06-28 2018-01-04 株式会社村田製作所 キャパシタ
WO2019026641A1 (ja) * 2017-07-31 2019-02-07 株式会社村田製作所 薄膜コンデンサ及びその製造方法

Family Cites Families (18)

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JPH06302466A (ja) * 1993-04-15 1994-10-28 Mitsubishi Materials Corp チップ形シリコンコンデンサ
US6646323B2 (en) * 2001-05-04 2003-11-11 Texas Instruments Incorporated Zero mask high density metal/insulator/metal capacitor
JP2006253631A (ja) * 2005-02-14 2006-09-21 Fujitsu Ltd 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法
US7538434B2 (en) * 2005-03-08 2009-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Copper interconnection with conductive polymer layer and method of forming the same
JP2007227874A (ja) * 2006-01-30 2007-09-06 Fujitsu Ltd 薄膜キャパシタ及びその製造方法
JP2007294514A (ja) * 2006-04-21 2007-11-08 Renesas Technology Corp 半導体装置
EP2166549B1 (en) 2007-05-30 2017-07-05 Kyocera Corporation Capacitor, resonator, filter device, communication device and electric circuit
KR20130051614A (ko) * 2011-11-10 2013-05-21 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
CN205959773U (zh) * 2014-08-06 2017-02-15 株式会社村田制作所 复合电子部件
US9871013B2 (en) * 2014-12-29 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Contact area design for solder bonding
US10607779B2 (en) 2016-04-22 2020-03-31 Rohm Co., Ltd. Chip capacitor having capacitor region directly below external electrode
US10468187B2 (en) * 2016-08-05 2019-11-05 Samsung Electro-Mechanics Co., Ltd. Thin-film ceramic capacitor having capacitance forming portions separated by separation slit
KR102792467B1 (ko) * 2016-12-26 2025-04-08 엘지디스플레이 주식회사 표시 장치
US10446325B2 (en) * 2017-09-29 2019-10-15 Advanced Semiconductor Engineering, Inc. Capacitor structures
US10726996B2 (en) * 2017-11-21 2020-07-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
JP2019175968A (ja) * 2018-03-28 2019-10-10 富士通株式会社 回路基板及び回路基板の製造方法
US11011315B2 (en) * 2018-06-20 2021-05-18 Tdk Corporation Thin film capacitor, manufacturing method therefor, and multilayer circuit board embedded with thin film capacitor
US11929212B2 (en) * 2019-04-23 2024-03-12 Intel Corporation Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081325A (ja) * 2005-09-16 2007-03-29 Murata Mfg Co Ltd 薄膜キャパシタ
JP2008252011A (ja) * 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
JP2017195322A (ja) * 2016-04-22 2017-10-26 ローム株式会社 チップコンデンサ
WO2018003445A1 (ja) * 2016-06-28 2018-01-04 株式会社村田製作所 キャパシタ
WO2019026641A1 (ja) * 2017-07-31 2019-02-07 株式会社村田製作所 薄膜コンデンサ及びその製造方法

Also Published As

Publication number Publication date
JPWO2020230414A1 (https=) 2020-11-19
JP7197001B2 (ja) 2022-12-27
US12327689B2 (en) 2025-06-10
CN113841211A (zh) 2021-12-24
US20220059290A1 (en) 2022-02-24
WO2020230414A1 (ja) 2020-11-19

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