JPWO2020230414A1 - - Google Patents
Info
- Publication number
- JPWO2020230414A1 JPWO2020230414A1 JP2021519273A JP2021519273A JPWO2020230414A1 JP WO2020230414 A1 JPWO2020230414 A1 JP WO2020230414A1 JP 2021519273 A JP2021519273 A JP 2021519273A JP 2021519273 A JP2021519273 A JP 2021519273A JP WO2020230414 A1 JPWO2020230414 A1 JP WO2020230414A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/01—Form of self-supporting electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019090617 | 2019-05-13 | ||
| JP2019090617 | 2019-05-13 | ||
| PCT/JP2020/008961 WO2020230414A1 (ja) | 2019-05-13 | 2020-03-03 | キャパシタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020230414A1 true JPWO2020230414A1 (https=) | 2020-11-19 |
| JP7197001B2 JP7197001B2 (ja) | 2022-12-27 |
Family
ID=73289559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021519273A Active JP7197001B2 (ja) | 2019-05-13 | 2020-03-03 | キャパシタ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12327689B2 (https=) |
| JP (1) | JP7197001B2 (https=) |
| CN (1) | CN113841211B (https=) |
| WO (1) | WO2020230414A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11495552B2 (en) * | 2018-06-29 | 2022-11-08 | Intel Corporation | Substrate integrated thin film capacitors using amorphous high-k dielectrics |
| WO2021166880A1 (ja) * | 2020-02-17 | 2021-08-26 | 株式会社村田製作所 | 半導体装置及びモジュール |
| JP2022144464A (ja) * | 2021-03-19 | 2022-10-03 | 住友電工デバイス・イノベーション株式会社 | キャパシタ |
| CN117321774A (zh) * | 2021-05-14 | 2023-12-29 | 京瓷Avx元器件公司 | 可嵌入的基于半导体的电容器 |
| JP7758341B2 (ja) * | 2022-03-07 | 2025-10-22 | 住友電工デバイス・イノベーション株式会社 | キャパシタおよびその製造方法 |
| JPWO2024111510A1 (https=) * | 2022-11-25 | 2024-05-30 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302466A (ja) * | 1993-04-15 | 1994-10-28 | Mitsubishi Materials Corp | チップ形シリコンコンデンサ |
| JP2007081325A (ja) * | 2005-09-16 | 2007-03-29 | Murata Mfg Co Ltd | 薄膜キャパシタ |
| JP2008252011A (ja) * | 2007-03-30 | 2008-10-16 | Taiyo Yuden Co Ltd | 誘電体キャパシタ |
| WO2008149622A1 (ja) * | 2007-05-30 | 2008-12-11 | Kyocera Corporation | キャパシタ，共振器、フィルタ装置，通信装置、並びに電気回路 |
| JP2017195322A (ja) * | 2016-04-22 | 2017-10-26 | ローム株式会社 | チップコンデンサ |
| WO2019026641A1 (ja) * | 2017-07-31 | 2019-02-07 | 株式会社村田製作所 | 薄膜コンデンサ及びその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6646323B2 (en) * | 2001-05-04 | 2003-11-11 | Texas Instruments Incorporated | Zero mask high density metal/insulator/metal capacitor |
| JP2006253631A (ja) * | 2005-02-14 | 2006-09-21 | Fujitsu Ltd | 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法 |
| US7538434B2 (en) * | 2005-03-08 | 2009-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Copper interconnection with conductive polymer layer and method of forming the same |
| JP2007227874A (ja) * | 2006-01-30 | 2007-09-06 | Fujitsu Ltd | 薄膜キャパシタ及びその製造方法 |
| JP2007294514A (ja) * | 2006-04-21 | 2007-11-08 | Renesas Technology Corp | 半導体装置 |
| KR20130051614A (ko) * | 2011-11-10 | 2013-05-21 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
| CN205959773U (zh) * | 2014-08-06 | 2017-02-15 | 株式会社村田制作所 | 复合电子部件 |
| US9871013B2 (en) * | 2014-12-29 | 2018-01-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact area design for solder bonding |
| US10607779B2 (en) | 2016-04-22 | 2020-03-31 | Rohm Co., Ltd. | Chip capacitor having capacitor region directly below external electrode |
| JPWO2018003445A1 (ja) * | 2016-06-28 | 2019-03-07 | 株式会社村田製作所 | キャパシタ |
| US10468187B2 (en) * | 2016-08-05 | 2019-11-05 | Samsung Electro-Mechanics Co., Ltd. | Thin-film ceramic capacitor having capacitance forming portions separated by separation slit |
| KR102792467B1 (ko) * | 2016-12-26 | 2025-04-08 | 엘지디스플레이 주식회사 | 표시 장치 |
| US10446325B2 (en) * | 2017-09-29 | 2019-10-15 | Advanced Semiconductor Engineering, Inc. | Capacitor structures |
| US10726996B2 (en) * | 2017-11-21 | 2020-07-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
| JP2019175968A (ja) * | 2018-03-28 | 2019-10-10 | 富士通株式会社 | 回路基板及び回路基板の製造方法 |
| US11011315B2 (en) * | 2018-06-20 | 2021-05-18 | Tdk Corporation | Thin film capacitor, manufacturing method therefor, and multilayer circuit board embedded with thin film capacitor |
| US11929212B2 (en) * | 2019-04-23 | 2024-03-12 | Intel Corporation | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages |
-
2020
- 2020-03-03 JP JP2021519273A patent/JP7197001B2/ja active Active
- 2020-03-03 CN CN202080035634.4A patent/CN113841211B/zh active Active
- 2020-03-03 WO PCT/JP2020/008961 patent/WO2020230414A1/ja not_active Ceased
-
2021
- 2021-11-02 US US17/516,774 patent/US12327689B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302466A (ja) * | 1993-04-15 | 1994-10-28 | Mitsubishi Materials Corp | チップ形シリコンコンデンサ |
| JP2007081325A (ja) * | 2005-09-16 | 2007-03-29 | Murata Mfg Co Ltd | 薄膜キャパシタ |
| JP2008252011A (ja) * | 2007-03-30 | 2008-10-16 | Taiyo Yuden Co Ltd | 誘電体キャパシタ |
| WO2008149622A1 (ja) * | 2007-05-30 | 2008-12-11 | Kyocera Corporation | キャパシタ，共振器、フィルタ装置，通信装置、並びに電気回路 |
| JP2017195322A (ja) * | 2016-04-22 | 2017-10-26 | ローム株式会社 | チップコンデンサ |
| WO2019026641A1 (ja) * | 2017-07-31 | 2019-02-07 | 株式会社村田製作所 | 薄膜コンデンサ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113841211B (zh) | 2023-04-14 |
| JP7197001B2 (ja) | 2022-12-27 |
| US12327689B2 (en) | 2025-06-10 |
| CN113841211A (zh) | 2021-12-24 |
| US20220059290A1 (en) | 2022-02-24 |
| WO2020230414A1 (ja) | 2020-11-19 |
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