CN113658965B - 光检测器件及其驱动方法以及电子装置 - Google Patents
光检测器件及其驱动方法以及电子装置 Download PDFInfo
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- CN113658965B CN113658965B CN202110747459.8A CN202110747459A CN113658965B CN 113658965 B CN113658965 B CN 113658965B CN 202110747459 A CN202110747459 A CN 202110747459A CN 113658965 B CN113658965 B CN 113658965B
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- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
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- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
- H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
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- H10K39/32—Organic image sensors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110747459.8A CN113658965B (zh) | 2016-03-01 | 2017-03-01 | 光检测器件及其驱动方法以及电子装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-038777 | 2016-03-01 | ||
| JP2016038777 | 2016-03-01 | ||
| JP2016193919A JP6780421B2 (ja) | 2016-03-01 | 2016-09-30 | 撮像素子、積層型撮像素子及び固体撮像装置、並びに、固体撮像装置の駆動方法 |
| CN201710116479.9A CN107146850B (zh) | 2016-03-01 | 2017-03-01 | 成像元件、层叠型成像元件、固态成像装置及其驱动方法 |
| CN202110747459.8A CN113658965B (zh) | 2016-03-01 | 2017-03-01 | 光检测器件及其驱动方法以及电子装置 |
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| CN201710116479.9A Division CN107146850B (zh) | 2016-03-01 | 2017-03-01 | 成像元件、层叠型成像元件、固态成像装置及其驱动方法 |
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| CN113658965A CN113658965A (zh) | 2021-11-16 |
| CN113658965B true CN113658965B (zh) | 2024-03-19 |
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| CN202410066957.XA Pending CN118099175A (zh) | 2016-03-01 | 2017-03-01 | 光检测设备 |
| CN201710116479.9A Active CN107146850B (zh) | 2016-03-01 | 2017-03-01 | 成像元件、层叠型成像元件、固态成像装置及其驱动方法 |
| CN202110747459.8A Active CN113658965B (zh) | 2016-03-01 | 2017-03-01 | 光检测器件及其驱动方法以及电子装置 |
| CN202110367163.3A Active CN113206116B (zh) | 2016-03-01 | 2017-03-01 | 成像器件及其驱动方法以及电子装置 |
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| CN202410066957.XA Pending CN118099175A (zh) | 2016-03-01 | 2017-03-01 | 光检测设备 |
| CN201710116479.9A Active CN107146850B (zh) | 2016-03-01 | 2017-03-01 | 成像元件、层叠型成像元件、固态成像装置及其驱动方法 |
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| JP (1) | JP6780421B2 (enExample) |
| KR (2) | KR102810497B1 (enExample) |
| CN (4) | CN118099175A (enExample) |
| WO (1) | WO2017150540A1 (enExample) |
Families Citing this family (78)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011116345A1 (en) | 2010-03-19 | 2011-09-22 | Invisage Technologies, Inc. | Dark current reduction in image sensors via dynamic electrical biasing |
| US10104322B2 (en) | 2014-07-31 | 2018-10-16 | Invisage Technologies, Inc. | Image sensors with noise reduction |
| JP6780421B2 (ja) * | 2016-03-01 | 2020-11-04 | ソニー株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置、並びに、固体撮像装置の駆動方法 |
| TWI756207B (zh) * | 2016-03-01 | 2022-03-01 | 日商新力股份有限公司 | 成像元件、堆疊型成像元件、固態成像裝置及用於固態成像裝置之驅動方法 |
| JP2018060910A (ja) * | 2016-10-05 | 2018-04-12 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像装置 |
| JP6926450B2 (ja) * | 2016-11-22 | 2021-08-25 | ソニーグループ株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| JP6929643B2 (ja) * | 2016-12-27 | 2021-09-01 | キヤノン株式会社 | 撮像装置および撮像システム |
| KR102635858B1 (ko) * | 2017-01-05 | 2024-02-15 | 삼성전자주식회사 | 이미지 센서 |
| KR102831200B1 (ko) * | 2017-02-02 | 2025-07-10 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
| US10425601B1 (en) | 2017-05-05 | 2019-09-24 | Invisage Technologies, Inc. | Three-transistor active reset pixel |
| CN115332276A (zh) | 2017-06-21 | 2022-11-11 | 索尼半导体解决方案公司 | 成像元件、层叠式成像元件和固态成像装置 |
| JP7099073B2 (ja) * | 2017-06-21 | 2022-07-12 | ソニーグループ株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| JP2019036641A (ja) * | 2017-08-16 | 2019-03-07 | ソニー株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| KR102552756B1 (ko) * | 2017-08-16 | 2023-07-07 | 소니그룹주식회사 | 촬상 소자, 적층형 촬상 소자 및 고체 촬상 장치 |
| TW201911549A (zh) * | 2017-08-16 | 2019-03-16 | 日商索尼股份有限公司 | 攝像元件、積層型攝像元件及固體攝像裝置 |
| JP2019041018A (ja) | 2017-08-25 | 2019-03-14 | ソニー株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| CN111052383B (zh) * | 2017-08-31 | 2024-04-19 | 索尼半导体解决方案公司 | 成像元件、层叠型成像元件以及固态成像装置 |
| EP3723132B1 (en) * | 2017-12-05 | 2022-08-24 | Sony Group Corporation | Imaging element, laminate-type imaging element, and solid-state imaging device |
| JP2019114576A (ja) | 2017-12-20 | 2019-07-11 | ソニーセミコンダクタソリューションズ株式会社 | 光電変換素子および固体撮像装置 |
| WO2019151042A1 (ja) * | 2018-01-31 | 2019-08-08 | ソニー株式会社 | 光電変換素子、固体撮像装置及び電子装置 |
| WO2019150987A1 (ja) * | 2018-01-31 | 2019-08-08 | ソニー株式会社 | 光電変換素子および撮像装置 |
| WO2019150989A1 (ja) * | 2018-01-31 | 2019-08-08 | ソニー株式会社 | 光電変換素子および撮像装置 |
| CN111566826A (zh) * | 2018-01-31 | 2020-08-21 | 索尼公司 | 光电转换元件和成像装置 |
| WO2019151049A1 (ja) * | 2018-01-31 | 2019-08-08 | ソニー株式会社 | 光電変換素子、固体撮像装置及び電子装置 |
| WO2019150971A1 (ja) * | 2018-01-31 | 2019-08-08 | ソニー株式会社 | 光電変換素子および撮像装置 |
| JP7267940B2 (ja) * | 2018-02-01 | 2023-05-02 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
| WO2019181456A1 (ja) * | 2018-03-19 | 2019-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像装置 |
| TWI820114B (zh) * | 2018-04-20 | 2023-11-01 | 日商索尼股份有限公司 | 攝像元件、積層型攝像元件及固體攝像裝置 |
| CN111971796B (zh) * | 2018-04-20 | 2024-07-19 | 索尼公司 | 摄像器件、堆叠式摄像器件和固态摄像装置 |
| CN112119500B (zh) * | 2018-05-21 | 2025-06-17 | 索尼公司 | 固态摄像元件及其制造方法 |
| US11477404B2 (en) * | 2018-06-05 | 2022-10-18 | Sony Semiconductor Solutions Corporation | Imaging device |
| JP7248674B2 (ja) * | 2018-06-08 | 2023-03-29 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| CN118198091A (zh) * | 2018-06-15 | 2024-06-14 | 索尼半导体解决方案公司 | 光检测装置、电子设备和固态摄像装置 |
| TWI846699B (zh) * | 2018-06-15 | 2024-07-01 | 日商索尼股份有限公司 | 固體攝像元件、固體攝像裝置、電子機器及固體攝像元件之製造方法 |
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