CN113614885A - 基板处理装置及基板清洗方法 - Google Patents

基板处理装置及基板清洗方法 Download PDF

Info

Publication number
CN113614885A
CN113614885A CN202080003844.5A CN202080003844A CN113614885A CN 113614885 A CN113614885 A CN 113614885A CN 202080003844 A CN202080003844 A CN 202080003844A CN 113614885 A CN113614885 A CN 113614885A
Authority
CN
China
Prior art keywords
cleaning
substrate
cleaning liquid
cleaning member
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080003844.5A
Other languages
English (en)
Chinese (zh)
Inventor
石桥知淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN113614885A publication Critical patent/CN113614885A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/40—Cleaning tools with integrated means for dispensing fluids, e.g. water, steam or detergents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/003—Cleaning involving contact with foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202080003844.5A 2019-04-09 2020-04-06 基板处理装置及基板清洗方法 Pending CN113614885A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019074012A JP7189827B2 (ja) 2019-04-09 2019-04-09 基板処理装置および基板洗浄方法
JP2019-074012 2019-04-09
PCT/JP2020/015460 WO2020209213A1 (ja) 2019-04-09 2020-04-06 基板処理装置および基板洗浄方法

Publications (1)

Publication Number Publication Date
CN113614885A true CN113614885A (zh) 2021-11-05

Family

ID=72751568

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080003844.5A Pending CN113614885A (zh) 2019-04-09 2020-04-06 基板处理装置及基板清洗方法

Country Status (6)

Country Link
US (1) US20210242015A1 (https=)
JP (1) JP7189827B2 (https=)
KR (1) KR20210147853A (https=)
CN (1) CN113614885A (https=)
TW (1) TWI869389B (https=)
WO (1) WO2020209213A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250058524A1 (en) * 2021-12-28 2025-02-20 A. Raymond Et Cie Method and apparatus to clean additively manufactured components
JP7813143B2 (ja) * 2022-01-21 2026-02-12 株式会社荏原製作所 基板洗浄方法および基板洗浄装置
JP7776349B2 (ja) * 2022-02-28 2025-11-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
JP7814993B2 (ja) * 2022-03-15 2026-02-17 株式会社荏原製作所 研磨方法および研磨装置
US20230321696A1 (en) 2022-04-07 2023-10-12 Ebara Corporation Substrate processing system and substrate processing method
JP2025043597A (ja) 2023-09-19 2025-04-01 株式会社荏原製作所 基板処理モジュールおよび基板処理方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020007840A1 (en) * 2000-07-21 2002-01-24 Koji Atoh Substrate cleaning apparatus, substrate cleaning method and substrate processing apparatus
US20110265279A1 (en) * 2008-06-30 2011-11-03 Aion Co., Ltd. Cleaning sponge roller
JP2011218308A (ja) * 2010-04-12 2011-11-04 Asupu:Kk 気体溶解液生成装置及び生成方法
US20120160267A1 (en) * 2010-12-27 2012-06-28 Masako Kodera Cleaning method and cleaning apparatus
JP2016167514A (ja) * 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置
US20170372893A1 (en) * 2016-06-27 2017-12-28 Ebara Corporation Cleaning apparatus and substrate processing apparatus
JP2018056385A (ja) * 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105340067B (zh) * 2013-04-30 2018-07-06 奥加诺株式会社 铜露出基板的清洗方法和清洗系统
CN107078046B (zh) 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020007840A1 (en) * 2000-07-21 2002-01-24 Koji Atoh Substrate cleaning apparatus, substrate cleaning method and substrate processing apparatus
US20110265279A1 (en) * 2008-06-30 2011-11-03 Aion Co., Ltd. Cleaning sponge roller
JP2011218308A (ja) * 2010-04-12 2011-11-04 Asupu:Kk 気体溶解液生成装置及び生成方法
US20120160267A1 (en) * 2010-12-27 2012-06-28 Masako Kodera Cleaning method and cleaning apparatus
JP2016167514A (ja) * 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置
US20170372893A1 (en) * 2016-06-27 2017-12-28 Ebara Corporation Cleaning apparatus and substrate processing apparatus
JP2018056385A (ja) * 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Also Published As

Publication number Publication date
KR20210147853A (ko) 2021-12-07
JP7189827B2 (ja) 2022-12-14
US20210242015A1 (en) 2021-08-05
TWI869389B (zh) 2025-01-11
WO2020209213A1 (ja) 2020-10-15
JP2020174081A (ja) 2020-10-22
TW202044390A (zh) 2020-12-01

Similar Documents

Publication Publication Date Title
CN113614885A (zh) 基板处理装置及基板清洗方法
CN108780746B (zh) 基板清洗装置、基板清洗方法、基板处理装置以及基板干燥装置
CN1319130C (zh) 半导体基片处理装置及处理方法
US6711775B2 (en) System for cleaning a semiconductor wafer
CN111771260B (zh) 基板清洗装置和基板处理装置
TW200931565A (en) Substrate processing apparatus and substrate processing method
TW200841378A (en) Substrate cleaning apparatus, substrate cleaning method and storage medium
JP2005294835A (ja) 基板とメニスカスとの境界面およびその取り扱い方法
TW200800421A (en) Substrate cleaning apparatus, substrate cleaning method, substrate processing system, and recording medium
TWI782320B (zh) 基板處理裝置以及刷子收納容器
JP7482768B2 (ja) 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
JP2015002261A (ja) 基板洗浄装置、基板洗浄システムおよび基板洗浄方法
JP6860292B2 (ja) 基板洗浄装置及び基板処理装置
TWI697043B (zh) 基板液體處理裝置及基板液體處理方法與記錄有基板液體處理程式之電腦可讀取的記錄媒體
JP2003022993A (ja) 基板洗浄方法
JP2014130882A (ja) 基板洗浄装置及び基板洗浄方法
CN109075049B (zh) 清洗部件、基板清洗装置及基板处理装置
JP5173517B2 (ja) 基板処理装置および基板処理方法
JP2021163955A (ja) 洗浄部材の洗浄装置、基板洗浄装置及び洗浄部材アセンブリ
WO2022270449A1 (ja) 洗浄部材処理装置、ブレークイン方法及び洗浄部材のクリーニング方法
TW201934212A (zh) 基板洗淨裝置、基板處理裝置、超音波洗淨液供給裝置及記錄媒介
JP2007044693A (ja) 洗浄装置
JP2009238938A (ja) 基板処理装置
JP2009302385A (ja) 半導体製造装置および半導体製造方法
JP7650955B2 (ja) 基板処理方法及び基板処理システム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination