JP7189827B2 - 基板処理装置および基板洗浄方法 - Google Patents

基板処理装置および基板洗浄方法 Download PDF

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Publication number
JP7189827B2
JP7189827B2 JP2019074012A JP2019074012A JP7189827B2 JP 7189827 B2 JP7189827 B2 JP 7189827B2 JP 2019074012 A JP2019074012 A JP 2019074012A JP 2019074012 A JP2019074012 A JP 2019074012A JP 7189827 B2 JP7189827 B2 JP 7189827B2
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JP
Japan
Prior art keywords
cleaning
substrate
cleaning member
cleaning liquid
skin layer
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Active
Application number
JP2019074012A
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English (en)
Japanese (ja)
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JP2020174081A (ja
JP2020174081A5 (https=
Inventor
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019074012A priority Critical patent/JP7189827B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to CN202080003844.5A priority patent/CN113614885A/zh
Priority to KR1020207037615A priority patent/KR20210147853A/ko
Priority to PCT/JP2020/015460 priority patent/WO2020209213A1/ja
Priority to US17/049,001 priority patent/US20210242015A1/en
Priority to TW109111589A priority patent/TWI869389B/zh
Publication of JP2020174081A publication Critical patent/JP2020174081A/ja
Publication of JP2020174081A5 publication Critical patent/JP2020174081A5/ja
Application granted granted Critical
Publication of JP7189827B2 publication Critical patent/JP7189827B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/40—Cleaning tools with integrated means for dispensing fluids, e.g. water, steam or detergents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/003—Cleaning involving contact with foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019074012A 2019-04-09 2019-04-09 基板処理装置および基板洗浄方法 Active JP7189827B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019074012A JP7189827B2 (ja) 2019-04-09 2019-04-09 基板処理装置および基板洗浄方法
KR1020207037615A KR20210147853A (ko) 2019-04-09 2020-04-06 기판 처리 장치 및 기판 세정 방법
PCT/JP2020/015460 WO2020209213A1 (ja) 2019-04-09 2020-04-06 基板処理装置および基板洗浄方法
US17/049,001 US20210242015A1 (en) 2019-04-09 2020-04-06 Substrate processing apparatus and substrate cleaning method
CN202080003844.5A CN113614885A (zh) 2019-04-09 2020-04-06 基板处理装置及基板清洗方法
TW109111589A TWI869389B (zh) 2019-04-09 2020-04-07 基板處理裝置及基板洗淨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019074012A JP7189827B2 (ja) 2019-04-09 2019-04-09 基板処理装置および基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2020174081A JP2020174081A (ja) 2020-10-22
JP2020174081A5 JP2020174081A5 (https=) 2022-01-06
JP7189827B2 true JP7189827B2 (ja) 2022-12-14

Family

ID=72751568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019074012A Active JP7189827B2 (ja) 2019-04-09 2019-04-09 基板処理装置および基板洗浄方法

Country Status (6)

Country Link
US (1) US20210242015A1 (https=)
JP (1) JP7189827B2 (https=)
KR (1) KR20210147853A (https=)
CN (1) CN113614885A (https=)
TW (1) TWI869389B (https=)
WO (1) WO2020209213A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250058524A1 (en) * 2021-12-28 2025-02-20 A. Raymond Et Cie Method and apparatus to clean additively manufactured components
JP7813143B2 (ja) * 2022-01-21 2026-02-12 株式会社荏原製作所 基板洗浄方法および基板洗浄装置
JP7776349B2 (ja) * 2022-02-28 2025-11-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
JP7814993B2 (ja) * 2022-03-15 2026-02-17 株式会社荏原製作所 研磨方法および研磨装置
US20230321696A1 (en) 2022-04-07 2023-10-12 Ebara Corporation Substrate processing system and substrate processing method
JP2025043597A (ja) 2023-09-19 2025-04-01 株式会社荏原製作所 基板処理モジュールおよび基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011218308A (ja) 2010-04-12 2011-11-04 Asupu:Kk 気体溶解液生成装置及び生成方法
JP2016167514A (ja) 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置
JP2017191827A (ja) 2016-04-12 2017-10-19 株式会社荏原製作所 洗浄部材及び基板洗浄装置
JP2018056385A (ja) 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043267A (ja) * 2000-07-21 2002-02-08 Ebara Corp 基板洗浄装置、基板洗浄方法及び基板処理装置
KR101579572B1 (ko) * 2008-06-30 2015-12-22 아이온 가부시키가이샤 세정용 스폰지 롤러
JP2012138498A (ja) * 2010-12-27 2012-07-19 Toshiba Corp 洗浄方法
CN105340067B (zh) * 2013-04-30 2018-07-06 奥加诺株式会社 铜露出基板的清洗方法和清洗系统
CN107078046B (zh) 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
JP6640041B2 (ja) * 2016-06-27 2020-02-05 株式会社荏原製作所 洗浄装置及び基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011218308A (ja) 2010-04-12 2011-11-04 Asupu:Kk 気体溶解液生成装置及び生成方法
JP2016167514A (ja) 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置
JP2017191827A (ja) 2016-04-12 2017-10-19 株式会社荏原製作所 洗浄部材及び基板洗浄装置
JP2018056385A (ja) 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Also Published As

Publication number Publication date
KR20210147853A (ko) 2021-12-07
US20210242015A1 (en) 2021-08-05
CN113614885A (zh) 2021-11-05
TWI869389B (zh) 2025-01-11
WO2020209213A1 (ja) 2020-10-15
JP2020174081A (ja) 2020-10-22
TW202044390A (zh) 2020-12-01

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