CN113597256A - 显示模组及其制造方法 - Google Patents
显示模组及其制造方法 Download PDFInfo
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- CN113597256A CN113597256A CN202110865626.9A CN202110865626A CN113597256A CN 113597256 A CN113597256 A CN 113597256A CN 202110865626 A CN202110865626 A CN 202110865626A CN 113597256 A CN113597256 A CN 113597256A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 76
- 239000011159 matrix material Substances 0.000 claims abstract description 43
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- 239000010410 layer Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
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- 230000007547 defect Effects 0.000 description 3
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- 238000000206 photolithography Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110865626.9A CN113597256A (zh) | 2021-07-29 | 2021-07-29 | 显示模组及其制造方法 |
TW110128986A TWI849325B (zh) | 2021-07-29 | 2021-08-05 | 顯示模組及其製造方法 |
Applications Claiming Priority (1)
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CN202110865626.9A CN113597256A (zh) | 2021-07-29 | 2021-07-29 | 显示模组及其制造方法 |
Publications (1)
Publication Number | Publication Date |
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CN113597256A true CN113597256A (zh) | 2021-11-02 |
Family
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Family Applications (1)
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CN202110865626.9A Pending CN113597256A (zh) | 2021-07-29 | 2021-07-29 | 显示模组及其制造方法 |
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CN (1) | CN113597256A (zh) |
TW (1) | TWI849325B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023159567A1 (zh) * | 2022-02-28 | 2023-08-31 | 京东方科技集团股份有限公司 | 显示基板、封装基板及显示装置 |
CN116922972A (zh) * | 2023-09-18 | 2023-10-24 | 惠科股份有限公司 | 显示模组及其制备方法 |
Citations (11)
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TW201005395A (en) * | 2008-07-18 | 2010-02-01 | Au Optronics Corp | Liquid crystal display panel and fabrication method thereof |
CN106126001A (zh) * | 2016-06-29 | 2016-11-16 | 业成光电(深圳)有限公司 | 触控面板及其制造方法 |
CN107561854A (zh) * | 2016-07-01 | 2018-01-09 | 蓝思科技(长沙)有限公司 | 一种3d玻璃的表面空白图案的加工方法 |
CN107993583A (zh) * | 2017-11-27 | 2018-05-04 | 武汉华星光电技术有限公司 | 微型发光二极管显示装置及其制作方法 |
CN210403725U (zh) * | 2019-09-18 | 2020-04-24 | 厦门三安光电有限公司 | 发光二极管封装组件 |
CN111477117A (zh) * | 2019-01-24 | 2020-07-31 | 深圳光峰科技股份有限公司 | Led显示屏及其制备方法 |
WO2021051924A1 (zh) * | 2019-09-18 | 2021-03-25 | 泉州三安半导体科技有限公司 | 发光二极管封装组件 |
WO2021051925A1 (zh) * | 2019-09-18 | 2021-03-25 | 泉州三安半导体科技有限公司 | 发光二极管封装组件 |
CN112599478A (zh) * | 2021-01-15 | 2021-04-02 | 苏州芯聚半导体有限公司 | 驱动基板及制作方法、显示面板 |
CN113013310A (zh) * | 2021-02-20 | 2021-06-22 | Tcl华星光电技术有限公司 | 显示面板和显示装置 |
CN113140556A (zh) * | 2021-04-21 | 2021-07-20 | 南方科技大学 | 一种颜色转换层及其制备方法和应用 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019146519A1 (ja) * | 2018-01-23 | 2019-08-01 | 東レ株式会社 | 赤色積層基板、カラーフィルター基板、画像表示装置およびディスプレイ用基板 |
TWI686566B (zh) * | 2019-09-09 | 2020-03-01 | 均豪精密工業股份有限公司 | 發光模組及其製造方法 |
CN112885970B (zh) * | 2019-11-14 | 2024-02-09 | 成都辰显光电有限公司 | 显示面板、电子设备及显示面板的制造方法 |
TWI710809B (zh) * | 2020-08-17 | 2020-11-21 | 友達光電股份有限公司 | 燈板裝置及其製作方法 |
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2021
- 2021-07-29 CN CN202110865626.9A patent/CN113597256A/zh active Pending
- 2021-08-05 TW TW110128986A patent/TWI849325B/zh active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201005395A (en) * | 2008-07-18 | 2010-02-01 | Au Optronics Corp | Liquid crystal display panel and fabrication method thereof |
CN106126001A (zh) * | 2016-06-29 | 2016-11-16 | 业成光电(深圳)有限公司 | 触控面板及其制造方法 |
CN107561854A (zh) * | 2016-07-01 | 2018-01-09 | 蓝思科技(长沙)有限公司 | 一种3d玻璃的表面空白图案的加工方法 |
CN107993583A (zh) * | 2017-11-27 | 2018-05-04 | 武汉华星光电技术有限公司 | 微型发光二极管显示装置及其制作方法 |
CN111477117A (zh) * | 2019-01-24 | 2020-07-31 | 深圳光峰科技股份有限公司 | Led显示屏及其制备方法 |
CN210403725U (zh) * | 2019-09-18 | 2020-04-24 | 厦门三安光电有限公司 | 发光二极管封装组件 |
WO2021051924A1 (zh) * | 2019-09-18 | 2021-03-25 | 泉州三安半导体科技有限公司 | 发光二极管封装组件 |
WO2021051925A1 (zh) * | 2019-09-18 | 2021-03-25 | 泉州三安半导体科技有限公司 | 发光二极管封装组件 |
CN112599478A (zh) * | 2021-01-15 | 2021-04-02 | 苏州芯聚半导体有限公司 | 驱动基板及制作方法、显示面板 |
CN113013310A (zh) * | 2021-02-20 | 2021-06-22 | Tcl华星光电技术有限公司 | 显示面板和显示装置 |
CN113140556A (zh) * | 2021-04-21 | 2021-07-20 | 南方科技大学 | 一种颜色转换层及其制备方法和应用 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023159567A1 (zh) * | 2022-02-28 | 2023-08-31 | 京东方科技集团股份有限公司 | 显示基板、封装基板及显示装置 |
CN116922972A (zh) * | 2023-09-18 | 2023-10-24 | 惠科股份有限公司 | 显示模组及其制备方法 |
CN116922972B (zh) * | 2023-09-18 | 2024-01-26 | 惠科股份有限公司 | 显示模组及其制备方法 |
Also Published As
Publication number | Publication date |
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TW202306146A (zh) | 2023-02-01 |
TWI849325B (zh) | 2024-07-21 |
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Effective date of registration: 20240112 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Applicant after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant after: Interface Technology (Chengdu) Co., Ltd. Applicant after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Applicant before: Interface Technology (Chengdu) Co., Ltd. Applicant before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Applicant before: GENERAL INTERFACE SOLUTION Ltd. |
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