CN113451176B - 电子零件的安装装置 - Google Patents
电子零件的安装装置 Download PDFInfo
- Publication number
- CN113451176B CN113451176B CN202110312132.8A CN202110312132A CN113451176B CN 113451176 B CN113451176 B CN 113451176B CN 202110312132 A CN202110312132 A CN 202110312132A CN 113451176 B CN113451176 B CN 113451176B
- Authority
- CN
- China
- Prior art keywords
- mounting
- electronic component
- substrate
- head
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 230000007246 mechanism Effects 0.000 claims abstract description 136
- 238000012546 transfer Methods 0.000 claims abstract description 103
- 238000003384 imaging method Methods 0.000 claims description 83
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 21
- 239000004065 semiconductor Substances 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 8
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Robotics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410335775.8A CN118213297A (zh) | 2020-03-26 | 2021-03-24 | 电子零件的安装装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-056461 | 2020-03-26 | ||
| JP2020056461A JP7451259B2 (ja) | 2020-03-26 | 2020-03-26 | 電子部品の実装装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410335775.8A Division CN118213297A (zh) | 2020-03-26 | 2021-03-24 | 电子零件的安装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113451176A CN113451176A (zh) | 2021-09-28 |
| CN113451176B true CN113451176B (zh) | 2024-04-12 |
Family
ID=77809252
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110312132.8A Active CN113451176B (zh) | 2020-03-26 | 2021-03-24 | 电子零件的安装装置 |
| CN202410335775.8A Pending CN118213297A (zh) | 2020-03-26 | 2021-03-24 | 电子零件的安装装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410335775.8A Pending CN118213297A (zh) | 2020-03-26 | 2021-03-24 | 电子零件的安装装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7451259B2 (ja) |
| KR (1) | KR102539924B1 (ja) |
| CN (2) | CN113451176B (ja) |
| TW (3) | TWI807957B (ja) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150546A (ja) * | 1998-11-16 | 2000-05-30 | Toshiba Corp | 電子部品の実装装置及び実装方法 |
| JP2003249794A (ja) * | 2002-02-26 | 2003-09-05 | Sony Corp | カメラ装置、テーブル装置、部品実装方法及びその装置 |
| JP2004128384A (ja) * | 2002-10-07 | 2004-04-22 | Sony Corp | 部品実装装置および部品実装方法 |
| JP2007019207A (ja) * | 2005-07-07 | 2007-01-25 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装方法 |
| KR20090113361A (ko) * | 2007-02-22 | 2009-10-30 | 시바우라 메카트로닉스 가부시키가이샤 | 전자 부품의 실장 장치 및 실장 방법 |
| TW201105191A (en) * | 2009-05-27 | 2011-02-01 | Hitachi High Tech Corp | Electronic component mounter |
| CN103283317A (zh) * | 2011-11-08 | 2013-09-04 | 松下电器产业株式会社 | 元件安装设备 |
| JP2017183378A (ja) * | 2016-03-29 | 2017-10-05 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| CN107371360A (zh) * | 2016-05-11 | 2017-11-21 | 松下知识产权经营株式会社 | 部件安装装置 |
| KR20190068467A (ko) * | 2017-12-08 | 2019-06-18 | 아스리트 에프에이 가부시키가이샤 | 전자 부품 실장 장치 및 전자 부품 실장 방법 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4186495B2 (ja) | 2002-04-02 | 2008-11-26 | 松下電器産業株式会社 | 電子部品装着装置 |
| JP2003318228A (ja) | 2002-04-18 | 2003-11-07 | Sony Corp | 部品吸着ノズル、部品実装装置及び部品実装方法 |
| RU2333622C1 (ru) | 2004-11-29 | 2008-09-10 | Хитроникс Корп. | Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа |
| JP5077936B2 (ja) | 2006-08-31 | 2012-11-21 | ボンドテック株式会社 | 実装装置および実装方法 |
| JP5264443B2 (ja) | 2008-11-28 | 2013-08-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| JP5922904B2 (ja) | 2011-08-26 | 2016-05-24 | Juki株式会社 | 電子部品供給装置及び電子部品実装装置 |
| JP5839170B2 (ja) | 2011-09-03 | 2016-01-06 | Tdk株式会社 | ワーク搬送装置、並びにワーク処理装置及びワーク処理方法 |
| WO2014087491A1 (ja) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | 移載装置 |
| JP5608829B1 (ja) * | 2014-03-31 | 2014-10-15 | アルファーデザイン株式会社 | 部品実装装置 |
| JP6283818B2 (ja) | 2014-04-14 | 2018-02-28 | パナソニックＩｐマネジメント株式会社 | 電子部品搭載装置 |
| JP6663939B2 (ja) * | 2017-02-13 | 2020-03-13 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と表示用部材の製造方法 |
| JP6767333B2 (ja) * | 2017-09-28 | 2020-10-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
-
2020
- 2020-03-26 JP JP2020056461A patent/JP7451259B2/ja active Active
-
2021
- 2021-03-24 CN CN202110312132.8A patent/CN113451176B/zh active Active
- 2021-03-24 CN CN202410335775.8A patent/CN118213297A/zh active Pending
- 2021-03-24 TW TW111129551A patent/TWI807957B/zh active
- 2021-03-24 TW TW110110565A patent/TWI798665B/zh active
- 2021-03-24 KR KR1020210038002A patent/KR102539924B1/ko active IP Right Grant
- 2021-03-24 TW TW111129546A patent/TWI807956B/zh active
-
2024
- 2024-03-06 JP JP2024033436A patent/JP2024055992A/ja active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150546A (ja) * | 1998-11-16 | 2000-05-30 | Toshiba Corp | 電子部品の実装装置及び実装方法 |
| JP2003249794A (ja) * | 2002-02-26 | 2003-09-05 | Sony Corp | カメラ装置、テーブル装置、部品実装方法及びその装置 |
| JP2004128384A (ja) * | 2002-10-07 | 2004-04-22 | Sony Corp | 部品実装装置および部品実装方法 |
| JP2007019207A (ja) * | 2005-07-07 | 2007-01-25 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装方法 |
| KR20090113361A (ko) * | 2007-02-22 | 2009-10-30 | 시바우라 메카트로닉스 가부시키가이샤 | 전자 부품의 실장 장치 및 실장 방법 |
| TW201105191A (en) * | 2009-05-27 | 2011-02-01 | Hitachi High Tech Corp | Electronic component mounter |
| CN103283317A (zh) * | 2011-11-08 | 2013-09-04 | 松下电器产业株式会社 | 元件安装设备 |
| JP2017183378A (ja) * | 2016-03-29 | 2017-10-05 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| CN107371360A (zh) * | 2016-05-11 | 2017-11-21 | 松下知识产权经营株式会社 | 部件安装装置 |
| KR20190068467A (ko) * | 2017-12-08 | 2019-06-18 | 아스리트 에프에이 가부시키가이샤 | 전자 부품 실장 장치 및 전자 부품 실장 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210120877A (ko) | 2021-10-07 |
| TWI798665B (zh) | 2023-04-11 |
| TW202249588A (zh) | 2022-12-16 |
| TWI807957B (zh) | 2023-07-01 |
| TW202247756A (zh) | 2022-12-01 |
| TWI807956B (zh) | 2023-07-01 |
| KR102539924B1 (ko) | 2023-06-02 |
| TW202137872A (zh) | 2021-10-01 |
| JP7451259B2 (ja) | 2024-03-18 |
| CN118213297A (zh) | 2024-06-18 |
| JP2024055992A (ja) | 2024-04-19 |
| CN113451176A (zh) | 2021-09-28 |
| JP2021158204A (ja) | 2021-10-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |