CN113348226A - 树脂组合物的蚀刻液及蚀刻方法 - Google Patents

树脂组合物的蚀刻液及蚀刻方法 Download PDF

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Publication number
CN113348226A
CN113348226A CN202080010796.2A CN202080010796A CN113348226A CN 113348226 A CN113348226 A CN 113348226A CN 202080010796 A CN202080010796 A CN 202080010796A CN 113348226 A CN113348226 A CN 113348226A
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CN
China
Prior art keywords
etching
resin composition
mass
resin
etching solution
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Pending
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CN202080010796.2A
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English (en)
Chinese (zh)
Inventor
后闲宽彦
田边昌大
宫崎隆
丰田裕二
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Mitsubishi Paper Mills Ltd
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Mitsubishi Paper Mills Ltd
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Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Publication of CN113348226A publication Critical patent/CN113348226A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080010796.2A 2019-01-28 2020-01-24 树脂组合物的蚀刻液及蚀刻方法 Pending CN113348226A (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2019012382 2019-01-28
JP2019-012382 2019-01-28
JP2019154892 2019-08-27
JP2019-154892 2019-08-27
JP2019177681 2019-09-27
JP2019-177681 2019-09-27
JP2019211150 2019-11-22
JP2019-211150 2019-11-22
JP2019227548 2019-12-17
JP2019-227548 2019-12-17
PCT/JP2020/002551 WO2020158610A1 (ja) 2019-01-28 2020-01-24 樹脂組成物のエッチング液及びエッチング方法

Publications (1)

Publication Number Publication Date
CN113348226A true CN113348226A (zh) 2021-09-03

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ID=71839985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080010796.2A Pending CN113348226A (zh) 2019-01-28 2020-01-24 树脂组合物的蚀刻液及蚀刻方法

Country Status (5)

Country Link
JP (1) JP6774589B1 (ko)
KR (1) KR102376557B1 (ko)
CN (1) CN113348226A (ko)
TW (1) TW202039660A (ko)
WO (1) WO2020158610A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115011348A (zh) * 2022-06-30 2022-09-06 湖北兴福电子材料有限公司 一种氮化铝蚀刻液及其应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板

Citations (6)

* Cited by examiner, † Cited by third party
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US3481877A (en) * 1967-02-27 1969-12-02 Amchem Prod Cleaning solution concentrate and method of preparing same
TW200724650A (en) * 2005-11-28 2007-07-01 3M Innovative Properties Co Polymer etchant and method of using same
CN101878452A (zh) * 2007-10-17 2010-11-03 汉高公司 剥离液组合物、使用了该剥离液组合物的树脂层的剥离方法
CN107924145A (zh) * 2015-09-03 2018-04-17 日新制钢株式会社 从金属板上除去抗蚀剂膜的方法及经蚀刻的金属板的制造方法
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法
CN113614204A (zh) * 2019-04-03 2021-11-05 三菱制纸株式会社 液晶聚合物用蚀刻液及液晶聚合物的蚀刻方法

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JPS6330540A (ja) * 1986-07-23 1988-02-09 Canon Electronics Inc 樹脂表面の改質方法
JP2001310959A (ja) * 2000-02-23 2001-11-06 Toray Ind Inc 樹脂膜のウエットエッチング用エッチング液及びそれを用いて成るエッチング方法
JP2001358428A (ja) * 2000-06-14 2001-12-26 Toray Ind Inc エッチング方法
JP2003101244A (ja) 2001-09-27 2003-04-04 Ibiden Co Ltd 多層プリント配線板の製造方法および多層プリント配線板
JP4519548B2 (ja) 2004-07-12 2010-08-04 ポリプラスチックス株式会社 液晶性ポリマー成形品のメッキ前処理方法
JP4586628B2 (ja) * 2005-05-19 2010-11-24 和光純薬工業株式会社 半導体基板表面処理剤及び処理方法
US8049112B2 (en) * 2007-04-13 2011-11-01 3M Innovative Properties Company Flexible circuit with cover layer
JP5138277B2 (ja) 2007-05-31 2013-02-06 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
US7829794B2 (en) * 2007-09-13 2010-11-09 3M Innovative Properties Company Partially rigid flexible circuits and method of making same
WO2015002272A1 (ja) * 2013-07-05 2015-01-08 和光純薬工業株式会社 エッチング剤、エッチング方法およびエッチング剤調製液
KR102582537B1 (ko) 2015-08-31 2023-09-26 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판의 제조 방법, 반도체 장치의 제조 방법
JPWO2018088345A1 (ja) 2016-11-11 2018-11-08 住友ベークライト株式会社 金属箔付き樹脂膜、構造体、配線基板の製造方法、半導体装置の製造方法
KR102340959B1 (ko) * 2017-04-06 2021-12-17 미쓰비시 세이시 가부시키가이샤 수지 조성물용의 에칭액 및 에칭 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481877A (en) * 1967-02-27 1969-12-02 Amchem Prod Cleaning solution concentrate and method of preparing same
TW200724650A (en) * 2005-11-28 2007-07-01 3M Innovative Properties Co Polymer etchant and method of using same
CN101878452A (zh) * 2007-10-17 2010-11-03 汉高公司 剥离液组合物、使用了该剥离液组合物的树脂层的剥离方法
CN107924145A (zh) * 2015-09-03 2018-04-17 日新制钢株式会社 从金属板上除去抗蚀剂膜的方法及经蚀刻的金属板的制造方法
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法
CN113614204A (zh) * 2019-04-03 2021-11-05 三菱制纸株式会社 液晶聚合物用蚀刻液及液晶聚合物的蚀刻方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115011348A (zh) * 2022-06-30 2022-09-06 湖北兴福电子材料有限公司 一种氮化铝蚀刻液及其应用
CN115011348B (zh) * 2022-06-30 2023-12-29 湖北兴福电子材料股份有限公司 一种氮化铝蚀刻液及其应用

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JPWO2020158610A1 (ja) 2021-02-18
TW202039660A (zh) 2020-11-01
KR20210097219A (ko) 2021-08-06
WO2020158610A1 (ja) 2020-08-06
KR102376557B1 (ko) 2022-03-18
JP6774589B1 (ja) 2020-10-28

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Application publication date: 20210903