CN113302330A - 掩膜装置及其制造方法、蒸镀方法、显示装置 - Google Patents
掩膜装置及其制造方法、蒸镀方法、显示装置 Download PDFInfo
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- CN113302330A CN113302330A CN201980001689.0A CN201980001689A CN113302330A CN 113302330 A CN113302330 A CN 113302330A CN 201980001689 A CN201980001689 A CN 201980001689A CN 113302330 A CN113302330 A CN 113302330A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 230000008020 evaporation Effects 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 13
- 239000002346 layers by function Substances 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 23
- 239000000463 material Substances 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 14
- 239000002184 metal Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 229910001374 Invar Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种掩膜装置(2，3)，包括：掩膜边框(110，110')；沿第一方向(D1)延伸的至少一个第一掩膜条(120)和沿第二方向(D2)延伸的至少一个第二掩膜条(130)，固定在掩膜边框(110，110')上；以及沿第一方向(D1)延伸的第一掩膜板(140)，固定在掩膜边框(110，110')上；其中，第一方向(D1)与第二方向(D2)交叉，至少一个第一掩膜条(120)和至少一个第二掩膜条(130)彼此交叉限定至少一个掩膜开口(125)，第一掩膜板(140)包括掩膜图案区(140a)，掩膜图案区(140a)包括阵列排布的多个通孔(140v)，多个通孔(140v)包括第一部分通孔(140v)和第二部分通孔(140v)，至少一个掩膜开口(125)在第一掩膜板(140)上的正投影覆盖掩膜图案区(140a)中的第一部分通孔(140v)，至少一个第一掩膜条(120)和至少一个第二掩膜条(130)在第一掩膜板(140)上的正投影覆盖掩膜图案区(140a)中的第二部分通孔(140v)。还公开了一种掩膜装置(2，3)的制造方法、一种蒸镀方法及一种显示装置。
Description
PCT国内申请，说明书已公开。
Claims (23)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/105713 WO2021046807A1 (zh) | 2019-09-12 | 2019-09-12 | 掩膜装置及其制造方法、蒸镀方法、显示装置 |
Publications (1)
| Publication Number | Publication Date |
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| CN113302330A true CN113302330A (zh) | 2021-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201980001689.0A Pending CN113302330A (zh) | 2019-09-12 | 2019-09-12 | 掩膜装置及其制造方法、蒸镀方法、显示装置 |
| CN202080002236.2A Active CN113015821B (zh) | 2019-09-12 | 2020-09-10 | 掩膜装置及其制造方法、蒸镀方法、显示装置 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202080002236.2A Active CN113015821B (zh) | 2019-09-12 | 2020-09-10 | 掩膜装置及其制造方法、蒸镀方法、显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11800780B2 (zh) |
| CN (2) | CN113302330A (zh) |
| WO (2) | WO2021046807A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113016073A (zh) * | 2019-10-22 | 2021-06-22 | 京东方科技集团股份有限公司 | 掩模板及其制作方法、有机发光装置 |
| KR20230026586A (ko) * | 2021-08-17 | 2023-02-27 | 삼성디스플레이 주식회사 | 마스크 조립체 |
| TWI785762B (zh) * | 2021-08-26 | 2022-12-01 | 達運精密工業股份有限公司 | 形成金屬遮罩的方法與金屬遮罩 |
| CN116083842B (zh) * | 2023-01-03 | 2024-09-13 | 京东方科技集团股份有限公司 | 掩膜板组件 |
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| CN105839052A (zh) * | 2016-06-17 | 2016-08-10 | 京东方科技集团股份有限公司 | 掩膜板以及掩膜板的组装方法 |
| CN205556762U (zh) * | 2016-05-05 | 2016-09-07 | 鄂尔多斯市源盛光电有限责任公司 | 掩膜板、母板、掩膜板制造设备和显示基板蒸镀系统 |
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| CN107460436A (zh) * | 2017-07-25 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | 金属网板及蒸镀掩膜装置 |
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| JP4230258B2 (ja) | 2003-03-19 | 2009-02-25 | 東北パイオニア株式会社 | 有機ｅｌパネル、有機ｅｌパネルの製造方法 |
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2019
- 2019-09-12 WO PCT/CN2019/105713 patent/WO2021046807A1/zh active Application Filing
- 2019-09-12 CN CN201980001689.0A patent/CN113302330A/zh active Pending
- 2019-09-12 US US16/965,068 patent/US11800780B2/en active Active
-
2020
- 2020-09-10 CN CN202080002236.2A patent/CN113015821B/zh active Active
- 2020-09-10 WO PCT/CN2020/114594 patent/WO2021047610A1/zh active Application Filing
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| CN105839052A (zh) * | 2016-06-17 | 2016-08-10 | 京东方科技集团股份有限公司 | 掩膜板以及掩膜板的组装方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2021046807A1 (zh) | 2021-03-18 |
| CN113015821A (zh) | 2021-06-22 |
| WO2021047610A1 (zh) | 2021-03-18 |
| CN113015821B (zh) | 2023-01-10 |
| US20220384726A1 (en) | 2022-12-01 |
| US11800780B2 (en) | 2023-10-24 |
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