CN113016073A - 掩模板及其制作方法、有机发光装置 - Google Patents

掩模板及其制作方法、有机发光装置 Download PDF

Info

Publication number
CN113016073A
CN113016073A CN201980002060.8A CN201980002060A CN113016073A CN 113016073 A CN113016073 A CN 113016073A CN 201980002060 A CN201980002060 A CN 201980002060A CN 113016073 A CN113016073 A CN 113016073A
Authority
CN
China
Prior art keywords
opening
side edge
opening portion
edge
vertex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980002060.8A
Other languages
English (en)
Inventor
徐鹏
邓江涛
嵇凤丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN113016073A publication Critical patent/CN113016073A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

公开了一种掩模板(100)及其制作方法、有机发光装置(200)的制备方法，该掩模板(100)包括基板(1)和形成于所述基板(1)上的第一开口部(2)和第二开口部(3)，所述第一开口部(2)包括直线延伸的第一侧边(4)和第二侧边(5)，所述第一侧边(4)的延伸线和所述第二侧边(5)的延伸线相交于第一顶点(6)，以构成所述第一开口部(2)的第一顶角，所述第二开口部(3)位于所述第一顶角处且向外凸出，所述第二开口部(3)的边缘与所述第一侧边(4)和所述第二侧边(5)相交，由此与所述第一开口部(2)相通，所述第一开口部(2)和所述第二开口部(3)用于对有机发光装置(200)的显示区进行蒸镀，所述第二开口部(3)用于对所述显示区的顶角蒸镀补偿。

Description

PCT国内申请，说明书已公开。

Claims (15)

  1. PCT国内申请，权利要求书已公开。
CN201980002060.8A 2019-10-22 2019-10-22 掩模板及其制作方法、有机发光装置 Pending CN113016073A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/112545 WO2021077294A1 (zh) 2019-10-22 2019-10-22 掩模板及其制作方法、有机发光装置

Publications (1)

Publication Number Publication Date
CN113016073A true CN113016073A (zh) 2021-06-22

Family

ID=75619552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980002060.8A Pending CN113016073A (zh) 2019-10-22 2019-10-22 掩模板及其制作方法、有机发光装置

Country Status (3)

Country Link
US (1) US11917893B2 (zh)
CN (1) CN113016073A (zh)
WO (1) WO2021077294A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114481022A (zh) * 2021-12-01 2022-05-13 达运精密工业股份有限公司 精密金属遮罩及其制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113549871A (zh) * 2021-07-21 2021-10-26 合肥维信诺科技有限公司 掩膜补偿方法和蒸镀系统
TWI822510B (zh) * 2022-12-09 2023-11-11 達運精密工業股份有限公司 金屬遮罩及金屬遮罩的製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100283408B1 (ko) 1998-01-21 2001-04-02 김영환 반도체용마스크
TWI303499B (en) * 2006-05-30 2008-11-21 Au Optronics Corp Full-color organic electroluminescence panel and method of fabricating the same
CN102955353B (zh) * 2011-08-29 2015-08-19 上海天马微电子有限公司 掩模板
CN103713466B (zh) * 2013-12-30 2016-05-11 京东方科技集团股份有限公司 掩膜板及其制作方法
CN105803390A (zh) * 2016-05-20 2016-07-27 京东方科技集团股份有限公司 用于沉积膜层的掩膜板及膜层、阵列基板
CN106567052B (zh) * 2016-10-24 2018-11-23 武汉华星光电技术有限公司 掩膜板及oled器件的封装方法
CN108172505B (zh) * 2018-01-04 2019-09-24 京东方科技集团股份有限公司 掩模板及制备方法、膜层制备方法和封装结构
CN110137208A (zh) 2018-02-09 2019-08-16 京东方科技集团股份有限公司 一种像素排布结构、高精度金属掩模板及显示装置
CN207966993U (zh) * 2018-02-09 2018-10-12 京东方科技集团股份有限公司 一种像素排布结构、高精度金属掩模板及显示装置
CN108520882B (zh) * 2018-04-11 2021-03-23 Tcl华星光电技术有限公司 一种阵列基板及制造该阵列基板的掩膜板
CN208970513U (zh) * 2018-11-30 2019-06-11 京东方科技集团股份有限公司 像素结构和精细金属掩模板组
WO2021046807A1 (zh) * 2019-09-12 2021-03-18 京东方科技集团股份有限公司 掩膜装置及其制造方法、蒸镀方法、显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114481022A (zh) * 2021-12-01 2022-05-13 达运精密工业股份有限公司 精密金属遮罩及其制造方法

Also Published As

Publication number Publication date
US20220384768A1 (en) 2022-12-01
WO2021077294A1 (zh) 2021-04-29
US11917893B2 (en) 2024-02-27

Similar Documents

Publication Publication Date Title
US11578400B2 (en) Fine metal mask having protective portions having protective portion with ratio of thickness reduction equal to single pixel aperture ratio and method for manufacturing the same, mask frame assembly
CN107393939B (zh) 像素界定层及制造方法、显示面板及制造方法、显示装置
US20220216412A1 (en) Mask and manufacturing method therefor
WO2016004698A1 (zh) Oled显示器件及其制备方法、显示装置和蒸镀用掩模板
CN113016073A (zh) 掩模板及其制作方法、有机发光装置
KR102616578B1 (ko) 박막 증착용 마스크 어셈블리와, 이의 제조 방법
US20220069031A1 (en) Display panel, preparation method and display device
US20200303687A1 (en) Manufacturing method of oled display panel
US10763452B2 (en) Organic light-emitting diode display device, manufacturing method therefor, and display apparatus
CN108277454B (zh) 精细掩模板及其制备方法
CN109817694A (zh) 有机发光显示面板及制作方法、显示装置
CN109487206B (zh) 掩膜版及采用该掩膜版的掩膜装置
US11864426B2 (en) OLED with photospacers having protrusions
KR20070002553A (ko) 유기전계 발광소자 제조 용 쉐도우 마스크 제조 방법
US11502135B2 (en) Display substrate, display panel and display device
CN112909067B (zh) 显示面板及掩膜版组件
CN108878496B (zh) 有机发光二极管显示面板及其制造方法、显示装置
CN113097417A (zh) Oled显示基板及显示装置
TWI826810B (zh) 金屬遮罩的製作方法及電鑄母板
WO2021226788A1 (zh) 显示面板、掩模板、掩模板组件和制作掩模板组件的方法
EP4141949A1 (en) Display panel, display device, and method for manufacturing display panel
US11985877B2 (en) Display substrate and method of manufacturing the same, display panel, and display device
CN114335097A (zh) 一种显示基板及其制作方法、显示装置
US20190319222A1 (en) Photomask and method for manufacturing display device
CN113416923B (zh) 金属遮罩

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination