CN113279032A - 一种金属制品的连续电镀工艺 - Google Patents
一种金属制品的连续电镀工艺 Download PDFInfo
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- CN113279032A CN113279032A CN202110477913.2A CN202110477913A CN113279032A CN 113279032 A CN113279032 A CN 113279032A CN 202110477913 A CN202110477913 A CN 202110477913A CN 113279032 A CN113279032 A CN 113279032A
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- Prior art keywords
- plating
- nickel
- drying
- washing
- metal product
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 74
- 239000002184 metal Substances 0.000 title claims abstract description 74
- 238000009713 electroplating Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 176
- 238000007747 plating Methods 0.000 claims abstract description 134
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 88
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 54
- 238000005406 washing Methods 0.000 claims abstract description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000005238 degreasing Methods 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims abstract description 36
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000010931 gold Substances 0.000 claims abstract description 21
- 229910052737 gold Inorganic materials 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003595 mist Substances 0.000 claims abstract description 5
- 230000003213 activating effect Effects 0.000 claims abstract description 4
- 230000003472 neutralizing effect Effects 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 65
- 238000001035 drying Methods 0.000 claims description 42
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 30
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 15
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 15
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 15
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 10
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 10
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 10
- 239000012670 alkaline solution Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 235000019387 fatty acid methyl ester Nutrition 0.000 claims description 10
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 10
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 10
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 10
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 10
- 238000006386 neutralization reaction Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004327 boric acid Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- ICLYJLBTOGPLMC-KVVVOXFISA-N (z)-octadec-9-enoate;tris(2-hydroxyethyl)azanium Chemical compound OCCN(CCO)CCO.CCCCCCCC\C=C/CCCCCCCC(O)=O ICLYJLBTOGPLMC-KVVVOXFISA-N 0.000 claims description 5
- CSJDJKUYRKSIDY-UHFFFAOYSA-N 1-sulfanylpropane-1-sulfonic acid Chemical compound CCC(S)S(O)(=O)=O CSJDJKUYRKSIDY-UHFFFAOYSA-N 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 5
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 5
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 claims description 5
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 5
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 5
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical group [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 claims description 5
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims description 5
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 5
- -1 methylene phosphonic acid Chemical compound 0.000 claims description 5
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 claims description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 5
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 claims description 5
- 239000001508 potassium citrate Substances 0.000 claims description 5
- 229960002635 potassium citrate Drugs 0.000 claims description 5
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 5
- 235000011082 potassium citrates Nutrition 0.000 claims description 5
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 5
- 239000001230 potassium iodate Substances 0.000 claims description 5
- 229940093930 potassium iodate Drugs 0.000 claims description 5
- 235000006666 potassium iodate Nutrition 0.000 claims description 5
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 5
- 235000011009 potassium phosphates Nutrition 0.000 claims description 5
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 5
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 5
- 235000011151 potassium sulphates Nutrition 0.000 claims description 5
- 239000001472 potassium tartrate Substances 0.000 claims description 5
- 229940111695 potassium tartrate Drugs 0.000 claims description 5
- 235000011005 potassium tartrates Nutrition 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims description 5
- 239000000344 soap Substances 0.000 claims description 5
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 5
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 5
- 239000001488 sodium phosphate Substances 0.000 claims description 5
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 5
- DGSDBJMBHCQYGN-UHFFFAOYSA-M sodium;2-ethylhexyl sulfate Chemical compound [Na+].CCCCC(CC)COS([O-])(=O)=O DGSDBJMBHCQYGN-UHFFFAOYSA-M 0.000 claims description 5
- ZWZLRIBPAZENFK-UHFFFAOYSA-J sodium;gold(3+);disulfite Chemical compound [Na+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O ZWZLRIBPAZENFK-UHFFFAOYSA-J 0.000 claims description 5
- MRGUSFYIQDLKNZ-UHFFFAOYSA-M sodium;prop-1-yne-1-sulfonate Chemical compound [Na+].CC#CS([O-])(=O)=O MRGUSFYIQDLKNZ-UHFFFAOYSA-M 0.000 claims description 5
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims description 5
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 5
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 5
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 4
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 4
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 4
- 238000007605 air drying Methods 0.000 claims description 3
- 238000000861 blow drying Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- QDGAVODICPCDMU-UHFFFAOYSA-N 2-amino-3-[3-[bis(2-chloroethyl)amino]phenyl]propanoic acid Chemical compound OC(=O)C(N)CC1=CC=CC(N(CCCl)CCCl)=C1 QDGAVODICPCDMU-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 9
- 238000000576 coating method Methods 0.000 claims 9
- 238000010924 continuous production Methods 0.000 claims 9
- 150000002739 metals Chemical class 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 description 14
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 3
- 229960005190 phenylalanine Drugs 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- OVQABVAKPIYHIG-UHFFFAOYSA-N n-(benzenesulfonyl)benzenesulfonamide Chemical compound C=1C=CC=CC=1S(=O)(=O)NS(=O)(=O)C1=CC=CC=C1 OVQABVAKPIYHIG-UHFFFAOYSA-N 0.000 description 2
- KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 229940074439 potassium sodium tartrate Drugs 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229940069328 povidone Drugs 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
本发明涉及电镀技术领域,具体涉及一种金属制品的连续电镀工艺,包括如下步骤:(1)超声波脱脂;(2)电解脱脂;(3)活化;(4)预镀镍;(5)镀修正镍;(6)镀半光镍;(7)镀高温镍;(8)镀钯;(9)镀金;(10)镀雾锡;(11)锡中和;(12)超声波热水洗;(13)水性封孔;(14)油性封孔。本发明的电镀工艺可以实现同时电镀多种金属,且通过采用多次镀镍、镀钯、镀金和镀雾锡的方法,并在每单次电镀后水洗,提高了镀层的均匀性,步骤简单,操作控制方便,质量稳定,生产效率高,生产成本低,可大规模工业化生产。
Description
技术领域
本发明涉及电镀技术领域,具体涉及一种金属制品的连续电镀工艺。
背景技术
电镀制品兼具塑料的重量轻、耐蚀性好、易成型和金属的耐有机溶剂、耐光照、金属光泽、导热性、导电性、电磁屏蔽和易焊接等优点,在五金、电子和通讯等行业广泛应用。
目前单一的电镀已经满足不了客户的要求,现在的塑料制品需要同时电镀多种金属,以满足产品的需求;但是由于各种金属的各自特性,往往同时在工件上电镀几种金属难以实现。
发明内容
为了克服现有技术中存在的缺点和不足,本发明的目的在于提供一种金属制品的连续电镀工艺。
本发明的目的通过下述技术方案实现:一种金属制品的连续电镀工艺,包括如下步骤:
(1)超声波脱脂:将金属制品进行超声波热脱脂处理,然后水洗吹干;
(2)电解脱脂:将超声波脱脂后的金属制品分三次进行电解脱脂处理,每次电解脱脂结束后水洗吹干;
(3)活化:将电解脱脂后的金属制品进行酸洗活化,然后水洗吹干;
(4)预镀镍:将活化后的金属制品进行预镀镍处理,然后水洗吹干;
(5)镀修正镍:将预镀镍后的金属制品进行电镀修正镍处理,然后水洗吹干;
(6)镀半光镍:将电镀修正镍后的金属制品分七次进行电镀半光镍处理,每次电镀半光镍结束后水洗吹干;
(7)镀高温镍:将电镀半光镍后的金属制品分两次进行电镀高温镍处理,每次电镀高温镍结束后水洗吹干;
(8)镀钯:将电镀高温镍后的金属制品采用点镀或刷镀分四次进行镀钯处理,每次镀钯结束后水洗吹干;
(9)镀金:将镀钯后的金属制品采用点镀或刷镀分两次进行镀金处理,每次镀金结束后水洗吹干;
(10)镀雾锡:将镀金后的金属制品分四次进行镀雾锡处理,每次镀雾锡结束后水洗吹干;
(11)锡中和:将电镀后的金属制品表面的锡进行中和,然后水洗吹干;
(12)超声波热水洗:将电镀后的金属制品进行超声波热水洗,然后吹干;
(13)水性封孔:将电镀后的金属制品进行水性封孔处理,吹干,然后用热水清洗,风干;
(14)油性封孔:将电镀后的金属制品进行油性封孔处理,吹干,然后烘干。
优选的,所述步骤(1)中,超声波脱脂使用碱性溶液,成分为:质量分数为2%-6%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为15%-25%的氢氧化钠,其余为水;所述步骤(2)中,电解脱脂使用碱性溶液,成分为:质量分数为1%-5%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为20%-30%的氢氧化钠,其余为水;所述步骤(3)中,酸洗活化采用质量分数为10%-20%的硫酸溶液。本发明通过采用超声波脱脂,实现待镀件表面油脂的去除;通过采用电解脱脂,可以进一步除去待镀件表面的油性物质;通过采用酸洗活化,可以活化待镀件表面,提高后续电镀的效率。
优选的,所述步骤(4)中,预镀镍的溶液成分为:氯化镍150-250g/L、酒石酸钾钠20-60g/L、二苯磺酰亚胺0.5-1.5g/L、β-萘磺酸0.1-0.5g/L和盐酸80-120mL/L。本发明的预镀镍通过采用上述原料,并严格控制各原料的重量配比,可以保证镀层与金属基材结合力,提高预镀镍镀层的均匀性,表面形成密度大、硬度高、孔隙率低且均匀性高的预镀镍镀层。
优选的,所述步骤(5)中,镀修正镍的溶液成分为:氨基磺酸镍80-160g/L、柠檬酸5-15g/L、2-乙基己基硫酸酯钠0.5-1.5g/L、苯丙氨酸0.1-0.5g/L、碘酸钾1-5mg/L和磷酸150-250mL/L。本发明的镀修正镍溶液通过采用上述原料,并严格控制各原料的重量配比,可以显著改善镍镀层晶格,使结构紧密晶格细化,降低镀层的孔隙率,从而保证半光镍外观的均一性和光泽性。
优选的,所述步骤(6)中,镀半光镍的溶液成分为:氨基磺酸镍150-250g/L、氯化镍8-16g/L、次亚磷酸钠10-20g/L、三乙醇胺20-40g/L和硫酸铵10-30g/L。本发明的镀半光镍溶液通过采用上述原料,并严格控制各原料的重量配比,可增加镀半光镍处理过程中半光镍溶液阴极的极化度和提高半光镍溶液的导电性,减小半光镍溶液的电阻率,提高半光镍溶液中导电离子的分散能力,提高半光镍镀层的均匀性。
优选的,所述步骤(7)中,镀高温镍的溶液成分为:氨基磺酸镍450-550mL/L、氯化镍8-12g/L、硼酸30-40g/L、月桂基硫酸钠5-15g/L、氯化铵1-5g/L和硫酸钾0.1-0.5g/L。本发明的镀高温镍溶液通过采用上述原料,并严格控制各原料的重量配比,使得镀层具有较好的耐高温和耐腐蚀性能。
本发明通过采用预镀镍打底,并在预镀镍的基础上镀修正镍、半光镍和高温镍,可以提高镀层的抗氧化性、耐腐蚀性和耐磨性,还可以作为金属制品和镀钯层之间的阻隔层,防止金属互相扩散而影响金属制品的可焊性和使用寿命,同时镀镍层打底也大大增加了镀钯层的机械强度,增进耐腐蚀能力及耐磨能力。
优选的,所述步骤(8)中,镀钯液的溶液成分为:硫酸四氨钯1-3g/L、氯化钯0.1-0.5g/L、磷酸钾20-40g/L、酒石酸钾8-12g/L、磷酸氢二钠2-6g、次磷酸钠4-8g/L、亚甲基膦酸4-8g/L、乙醇胺2-4g/L、十二烷基苯磺酸钠2-4g、甲基丙烯酸5-15g/L和巯基乙酸1-5g/L。本发明的镀钯液通过采用上述原料,并严格控制各原料的重量配比,使得钯镀层具有耐蚀性,耐光性,耐磨性和电气特性等优良特性,镀层无起皮、鼓泡现象,附着力好,接触电阻小。
优选的,所述步骤(9)中,镀金液的溶液成分为:亚硫酸金钠5-15g/L、柠檬酸钾20-40g/L、硫代硫酸钾30-50g/L、柠檬酸5-15g/L、乙二胺四乙酸钠1-5g/L、丙炔基磺酸钠2-6mg/L、巯基丙烷磺酸0.5-1.5g/L和N-亚硝基苯胲胺0.1-0.3g/L。本发明的镀金液通过采用上述原料,并严格控制各原料的重量配比,可在镀件基体表面形成附着性良好、厚度分布均匀的浸金镀层,镀层具有极佳的结晶结构,镀层硬度高,具有较好的导电性、耐腐蚀性和焊接性。
优选的,所述步骤(10)中,镀雾锡液的溶液成分为:甲基磺酸120-160mL/L、甲基磺酸锡30-70g/L、硫酸亚锡5-15g/L和防二价锡氧化添加剂10-20mL/L。本发明的镀雾锡液通过采用上述原料,并严格控制各原料的重量配比,可以提高焊接区的焊接性能和耐腐蚀性能。
优选的,所述步骤(11)中,中和采用质量分数为5%-10%的磷酸钠溶液;所述步骤(13)中,水性封孔采用水性封孔剂羟丙基纤维素或聚维酮;所述步骤(14)中,油性封孔采用油性封孔剂油酸三乙醇胺皂。本发明通过采用封孔处理,可以对镀层的小孔进行封孔作业,以提高镀层的防锈蚀能力。
本发明的有益效果在于:本发明的电镀工艺可以实现同时电镀多种金属,且通过采用多次镀镍、镀钯、镀金和镀雾锡的方法,并在每单次电镀后水洗,提高了镀层的均匀性,步骤简单,操作控制方便,质量稳定,生产效率高,生产成本低,可大规模工业化生产。
具体实施方式
为了便于本领域技术人员的理解,下面结合实施例对本发明作进一步的说明,实施方式提及的内容并非对本发明的限定。
下述实施例中,超声波脱脂的温度为60℃,脱脂时间为3min;电解脱脂的温度为60℃,脱脂时间为3min,以待镀件为阳极,以不锈钢板为阴极,阴极电流密度为10A/dm2;酸洗活化的温度为40℃,时间为20s;电镀采用的电流密度为10A/dm2,温度为45℃,电镀时间为5min。
实施例1
一种金属制品的连续电镀工艺,包括如下步骤:
(1)超声波脱脂:将金属制品进行超声波热脱脂处理,然后水洗吹干;
(2)电解脱脂:将超声波脱脂后的金属制品分三次进行电解脱脂处理,每次电解脱脂结束后水洗吹干;
(3)活化:将电解脱脂后的金属制品进行酸洗活化,然后水洗吹干;
(4)预镀镍:将活化后的金属制品进行预镀镍处理,然后水洗吹干;
(5)镀修正镍:将预镀镍后的金属制品进行电镀修正镍处理,然后水洗吹干;
(6)镀半光镍:将电镀修正镍后的金属制品分七次进行电镀半光镍处理,每次电镀半光镍结束后水洗吹干;
(7)镀高温镍:将电镀半光镍后的金属制品分两次进行电镀高温镍处理,每次电镀高温镍结束后水洗吹干;
(8)镀钯:将电镀高温镍后的金属制品采用点镀或刷镀分四次进行镀钯处理,每次镀钯结束后水洗吹干;
(9)镀金:将镀钯后的金属制品采用点镀或刷镀分两次进行镀金处理,每次镀金结束后水洗吹干;
(10)镀雾锡:将镀金后的金属制品分四次进行镀雾锡处理,每次镀雾锡结束后水洗吹干;
(11)锡中和:将电镀后的金属制品表面的锡进行中和,然后水洗吹干;
(12)超声波热水洗:将电镀后的金属制品进行超声波热水洗,然后吹干;
(13)水性封孔:将电镀后的金属制品进行水性封孔处理,吹干,然后用热水清洗,风干;
(14)油性封孔:将电镀后的金属制品进行油性封孔处理,吹干,然后烘干。
所述步骤(1)中,超声波脱脂使用碱性溶液,成分为:质量分数为2%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为15%的氢氧化钠,其余为水;所述步骤(2)中,电解脱脂使用碱性溶液,成分为:质量分数为1%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为20%的氢氧化钠,其余为水;所述步骤(3)中,酸洗活化采用质量分数为10%的硫酸溶液。
所述步骤(4)中,预镀镍的溶液成分为:氯化镍150-250g/L、酒石酸钾钠20g/L、二苯磺酰亚胺0.5g/L、β-萘磺酸0.1g/L和盐酸80mL/L。
所述步骤(5)中,镀修正镍的溶液成分为:氨基磺酸镍80g/L、柠檬酸5g/L、2-乙基己基硫酸酯钠0.5g/L、苯丙氨酸0.1g/L、碘酸钾1mg/L和磷酸150mL/L。
所述步骤(6)中,镀半光镍的溶液成分为:氨基磺酸镍150g/L、氯化镍8g/L、次亚磷酸钠10g/L、三乙醇胺20g/L和硫酸铵10g/L。
所述步骤(7)中,镀高温镍的溶液成分为:氨基磺酸镍450mL/L、氯化镍8g/L、硼酸30g/L、月桂基硫酸钠5g/L、氯化铵1g/L和硫酸钾0.1g/L。
所述步骤(8)中,镀钯液的溶液成分为:硫酸四氨钯1g/L、氯化钯0.1g/L、磷酸钾20g/L、酒石酸钾8g/L、磷酸氢二钠2g、次磷酸钠4g/L、亚甲基膦酸4g/L、乙醇胺2g/L、十二烷基苯磺酸钠2g、甲基丙烯酸5g/L和巯基乙酸1g/L。
所述步骤(9)中,镀金液的溶液成分为:亚硫酸金钠5g/L、柠檬酸钾20g/L、硫代硫酸钾30g/L、柠檬酸5g/L、乙二胺四乙酸钠1-5g/L、丙炔基磺酸钠2mg/L、巯基丙烷磺酸0.5g/L和N-亚硝基苯胲胺0.1g/L。
所述步骤(10)中,镀雾锡液的溶液成分为:甲基磺酸120mL/L、甲基磺酸锡30g/L、硫酸亚锡5g/L和防二价锡氧化添加剂10mL/L。
所述步骤(11)中,中和采用质量分数为5%的磷酸钠溶液;所述步骤(13)中,水性封孔采用水性封孔剂羟丙基纤维素;所述步骤(14)中,油性封孔采用油性封孔剂油酸三乙醇胺皂。
实施例2
本实施例与上述实施例1的不同之处在于:
所述步骤(1)中,超声波脱脂使用碱性溶液,成分为:质量分数为4%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为20%的氢氧化钠,其余为水;所述步骤(2)中,电解脱脂使用碱性溶液,成分为:质量分数为1%3的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为25%的氢氧化钠,其余为水;所述步骤(3)中,酸洗活化采用质量分数为15%的硫酸溶液。
所述步骤(4)中,预镀镍的溶液成分为:氯化镍200g/L、酒石酸钾钠40g/L、二苯磺酰亚胺1g/L、β-萘磺酸0.3g/L和盐酸100mL/L。
所述步骤(5)中,镀修正镍的溶液成分为:氨基磺酸镍120g/L、柠檬酸10g/L、2-乙基己基硫酸酯钠1g/L、苯丙氨酸0.3g/L、碘酸钾3mg/L和磷酸200mL/L。
所述步骤(6)中,镀半光镍的溶液成分为:氨基磺酸镍200g/L、氯化镍12g/L、次亚磷酸钠15g/L、三乙醇胺30g/L和硫酸铵20g/L。
所述步骤(7)中,镀高温镍的溶液成分为:氨基磺酸镍500mL/L、氯化镍10g/L、硼酸35g/L、月桂基硫酸钠10g/L、氯化铵3g/L和硫酸钾0.3g/L。
所述步骤(8)中,镀钯液的溶液成分为:硫酸四氨钯2g/L、氯化钯0.3g/L、磷酸钾30g/L、酒石酸钾10g/L、磷酸氢二钠4g、次磷酸钠6g/L、亚甲基膦酸6g/L、乙醇胺3g/L、十二烷基苯磺酸钠3g、甲基丙烯酸10g/L和巯基乙酸3g/L。
所述步骤(9)中,镀金液的溶液成分为:亚硫酸金钠10g/L、柠檬酸钾30g/L、硫代硫酸钾40g/L、柠檬酸10g/L、乙二胺四乙酸钠3g/L、丙炔基磺酸钠4mg/L、巯基丙烷磺酸1g/L和N-亚硝基苯胲胺0.2g/L。
所述步骤(10)中,镀雾锡液的溶液成分为:甲基磺酸140mL/L、甲基磺酸锡50g/L、硫酸亚锡10g/L和防二价锡氧化添加剂15mL/L。
所述步骤(11)中,中和采用质量分数为8%的磷酸钠溶液;所述步骤(13)中,水性封孔采用水性封孔剂聚维酮;所述步骤(14)中,油性封孔采用油性封孔剂油酸三乙醇胺皂。
实施例3
本实施例与上述实施例1的不同之处在于:
所述步骤(1)中,超声波脱脂使用碱性溶液,成分为:质量分数为6%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为25%的氢氧化钠,其余为水;所述步骤(2)中,电解脱脂使用碱性溶液,成分为:质量分数为5%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为30%的氢氧化钠,其余为水;所述步骤(3)中,酸洗活化采用质量分数为20%的硫酸溶液。
所述步骤(4)中,预镀镍的溶液成分为:氯化镍250g/L、硼酸50g/L、酒石酸钾钠60g/L、二苯磺酰亚胺1.5g/L、β-萘磺酸0.5g/L和盐酸120mL/L。
所述步骤(5)中,镀修正镍的溶液成分为:氨基磺酸镍160g/L、柠檬酸15g/L、2-乙基己基硫酸酯钠1.5g/L、苯丙氨酸0.5g/L、碘酸钾5mg/L和磷酸250mL/L。
所述步骤(6)中,镀半光镍的溶液成分为:氨基磺酸镍250g/L、氯化镍12g/L、次亚磷酸钠20g/L、三乙醇胺40g/L和硫酸铵30g/L。
所述步骤(7)中,镀高温镍的溶液成分为:氨基磺酸镍550mL/L、氯化镍12g/L、硼酸40g/L、月桂基硫酸钠15g/L、氯化铵5g/L和硫酸钾0.5g/L。
所述步骤(8)中,镀钯液的溶液成分为:硫酸四氨钯3g/L、氯化钯0.5g/L、磷酸钾40g/L、酒石酸钾12g/L、磷酸氢二钠6g、次磷酸钠8g/L、亚甲基膦酸8g/L、乙醇胺4g/L、十二烷基苯磺酸钠4g、甲基丙烯酸15g/L和巯基乙酸5g/L。
所述步骤(9)中,镀金液的溶液成分为:亚硫酸金钠15g/L、柠檬酸钾40g/L、硫代硫酸钾50g/L、柠檬酸15g/L、乙二胺四乙酸钠5g/L、丙炔基磺酸钠6mg/L、巯基丙烷磺酸1.5g/L和N-亚硝基苯胲胺0.3g/L。
所述步骤(10)中,镀雾锡液的溶液成分为:甲基磺酸160mL/L、甲基磺酸锡70g/L、硫酸亚锡15g/L和防二价锡氧化添加剂20mL/L。
所述步骤(11)中,中和采用质量分数为10%的磷酸钠溶液;所述步骤(13)中,水性封孔采用水性封孔剂羟丙基纤维素;所述步骤(14)中,油性封孔采用油性封孔剂油酸三乙醇胺皂。
本发明实施例1-3制得的电镀金属制品的检测结果如下表所示:
从上述可以看出,本发明连续电镀后的金属制品外观光滑无刮伤,密着性和焊锡性优异,可以通过高温试验,盐雾试验可通过48h。
上述实施例为本发明较佳的实现方案,除此之外,本发明还可以其它方式实现,在不脱离本发明构思的前提下任何显而易见的替换均在本发明的保护范围之内。
Claims (10)
1.一种金属制品的连续电镀工艺,其特征在于:包括如下步骤:
(1)超声波脱脂:将金属制品进行超声波热脱脂处理,然后水洗吹干;
(2)电解脱脂:将超声波脱脂后的金属制品分三次进行电解脱脂处理,每次电解脱脂结束后水洗吹干;
(3)活化:将电解脱脂后的金属制品进行酸洗活化,然后水洗吹干;
(4)预镀镍:将活化后的金属制品进行预镀镍处理,然后水洗吹干;
(5)镀修正镍:将预镀镍后的金属制品进行电镀修正镍处理,然后水洗吹干;
(6)镀半光镍:将电镀修正镍后的金属制品分七次进行电镀半光镍处理,每次电镀半光镍结束后水洗吹干;
(7)镀高温镍:将电镀半光镍后的金属制品分两次进行电镀高温镍处理,每次电镀高温镍结束后水洗吹干;
(8)镀钯:将电镀高温镍后的金属制品采用点镀或刷镀分四次进行镀钯处理,每次镀钯结束后水洗吹干;
(9)镀金:将镀钯后的金属制品采用点镀或刷镀分两次进行镀金处理,每次镀金结束后水洗吹干;
(10)镀雾锡:将镀金后的金属制品分四次进行镀雾锡处理,每次镀雾锡结束后水洗吹干;
(11)锡中和:将电镀后的金属制品表面的锡进行中和,然后水洗吹干;
(12)超声波热水洗:将电镀后的金属制品进行超声波热水洗,然后吹干;
(13)水性封孔:将电镀后的金属制品进行水性封孔处理,吹干,然后用热水清洗,风干;
(14)油性封孔:将电镀后的金属制品进行油性封孔处理,吹干,然后烘干。
2.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(1)中,超声波脱脂使用碱性溶液,成分为:质量分数为2%-6%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为15%-25%的氢氧化钠,其余为水;所述步骤(2)中,电解脱脂使用碱性溶液,成分为:质量分数为1%-5%的脂肪酸甲酯乙氧基化物磺酸盐,质量分数为20%-30%的氢氧化钠,其余为水;所述步骤(3)中,酸洗活化采用质量分数为10%-20%的硫酸溶液。
3.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(4)中,预镀镍的溶液成分为:氯化镍150-250g/L、酒石酸钾钠20-60g/L、二苯磺酰亚胺0.5-1.5g/L、β-萘磺酸0.1-0.5g/L和盐酸80-120mL/L。
4.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(5)中,镀修正镍的溶液成分为:氨基磺酸镍80-160g/L、柠檬酸5-15g/L、2-乙基己基硫酸酯钠0.5-1.5g/L、苯丙氨酸0.1-0.5g/L、碘酸钾1-5mg/L和磷酸150-250mL/L。
5.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(6)中,镀半光镍的溶液成分为:氨基磺酸镍150-250g/L、氯化镍8-16g/L、次亚磷酸钠10-20g/L、三乙醇胺20-40g/L和硫酸铵10-30g/L。
6.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(7)中,镀高温镍的溶液成分为:氨基磺酸镍450-550mL/L、氯化镍8-12g/L、硼酸30-40g/L、月桂基硫酸钠5-15g/L、氯化铵1-5g/L和硫酸钾0.1-0.5g/L。
7.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(8)中,镀钯液的溶液成分为:硫酸四氨钯1-3g/L、氯化钯0.1-0.5g/L、磷酸钾20-40g/L、酒石酸钾8-12g/L、磷酸氢二钠2-6g、次磷酸钠4-8g/L、亚甲基膦酸4-8g/L、乙醇胺2-4g/L、十二烷基苯磺酸钠2-4g、甲基丙烯酸5-15g/L和巯基乙酸1-5g/L。
8.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(9)中,镀金液的溶液成分为:亚硫酸金钠5-15g/L、柠檬酸钾20-40g/L、硫代硫酸钾30-50g/L、柠檬酸5-15g/L、乙二胺四乙酸钠1-5g/L、丙炔基磺酸钠2-6mg/L、巯基丙烷磺酸0.5-1.5g/L和N-亚硝基苯胲胺0.1-0.3g/L。
9.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(10)中,镀雾锡液的溶液成分为:甲基磺酸120-160mL/L、甲基磺酸锡30-70g/L、硫酸亚锡5-15g/L和防二价锡氧化添加剂10-20mL/L。
10.根据权利要求1所述的一种金属制品的连续电镀工艺,其特征在于:所述步骤(11)中,中和采用质量分数为5%-10%的磷酸钠溶液;所述步骤(13)中,水性封孔采用水性封孔剂羟丙基纤维素或聚维酮;所述步骤(14)中,油性封孔采用油性封孔剂油酸三乙醇胺皂。
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