CN113214588A - 可雷射离型的组成物、其积层体和雷射离型方法 - Google Patents

可雷射离型的组成物、其积层体和雷射离型方法 Download PDF

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CN113214588A
CN113214588A CN202110075829.8A CN202110075829A CN113214588A CN 113214588 A CN113214588 A CN 113214588A CN 202110075829 A CN202110075829 A CN 202110075829A CN 113214588 A CN113214588 A CN 113214588A
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laser
composition
containing organic
organic group
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CN113214588B (zh
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邱士芸
李政纬
林季延
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Daxin Materials Corp
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Daxin Materials Corp
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Abstract

本发明提供一种可雷射离型的组成物，包括:压克力树脂、遮光材、添加剂和溶剂；其中前述压克力树脂包括含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、含有环醚基的有机基和含有羟基的有机基，前述添加剂至少包括一种密着促进剂。所述可雷射离型的组成物具有优异的基材密着性、可贴合性和耐溶剂性。

Description

可雷射离型的组成物、其积层体和雷射离型方法
技术领域
本发明系关于一种组成物，特别系关于一种可雷射离型的组成物、使用其所形成的积层体和利用所述组成物或所述积层体的雷射离型方法。
背景技术
近年来，为了因应市场要求效能更快速、更便宜以及尺寸更小的电子产品，扇出型晶圆级封装(Fan Out Wafer Level Package,FOWLP)、2.5维度积体电路(2.5D IC)以及三维积体电路(3D IC)等技术早已成为半导体封装的主流。为了不让薄化硅晶圆的翘曲以及易脆等特性影响后续的制程，载体(Carrier)的使用已变成不可或缺的一个步骤。然而，在产品尺寸更小的需求下，载体最终必须要移除，因此封装技术时常伴随着离型层(releasing layer)的使用，也因此创造了离型层的市场。雷射离型虽有较昂贵的设备需求，但有在低温下快速将载体脱离装置的优点，使其跃身为现今主流的离型技术。
而为了使离型层上方能进行不同制程，例如：线路重布(Redistribution Layer)、焊晶(Die bonding)、封胶(Molding)、晶圆研磨、晶片翻转等，且因应各种不同的制程需求，形成离型层的材料需要有优异的基材密着性以及耐溶剂性。然而，在现今技术中，含有遮光材的材料往往因为材料的不连续面增加，而会导致耐溶剂特性下降。
因此，针对上述问题，本发明提供一种具有优异的基材密着性、可贴合性和耐溶剂性的可雷射离型组成物。
发明内容
本发明的一目的在于提供一种可雷射离型的组成物。前述可雷射离型的组成物包括:压克力树脂、遮光材、添加剂和溶剂；其中前述压克力树脂包括含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、含有环醚基的有机基和含有羟基的有机基，前述添加剂至少包括一种密着促进剂。
在本发明的一实施方式中，前述压克力树脂的酸价为小于4mg KOH/g。
在本发明的一实施方式中，前述密着促进剂包括选自乙烯性基团、环氧基和异氰酸酯基中至少一种的硅氧烷化合物。
在本发明的一实施方式中，前述含有选自叔胺基和仲胺基的群中至少一种的含氮有机基，可为但不限于2-(烃基)胺基烃基酯基团、二烃基胺基烃基酯基团、胺基甲酸酯基团、吡啶、哌嗪和吗啉基团中的至少一种。
在本发明的一实施方式中，前述压克力树脂包括至少两种以上具有不同碳数的环的环醚基。
在本发明的一实施方式中，前述环醚基为氧杂环丁烷基、环氧丙基或其组合。
在本发明的一实施方式中，前述遮光材为可使可雷射离型的组成物吸收可见光、红外光或紫外光中至少一波段或阻挡可见光、红外光或紫外光中至少一波段通过的材料。
本发明的另一目的在于提供一种积层体。所述积层体包括一支撑材及以如上述可雷射离型的组成物在所述支撑材上所形成的膜。
本发明另一目的在于提供一种雷射离型方法，包括以下步骤:
S1:提供一支撑材；S2:以如上述可雷射离型的组成物涂布在所述支撑材上并硬化成膜；S3:可在前述膜上形成一加工元件；及S4:以雷射将所述支撑材移除。
在本发明的一实施方式中，前述加工元件为裸晶或线路重布层。
附图说明
图1为根据本发明的一实施例的雷射离型方法的流程示意图。
S1-步骤1；S2-步骤2；S3-步骤3；S4-步骤4；1-支撑材；2-膜；
3-加工元件。
具体实施方式
在详细说明本发明的至少一实施例之前，应当理解的是本发明并非必要受限于其应用在以下描述中的多个示例所举例说明的多个细节，例如，实施例的数量或采用的特定混合比例等。本发明能够为其他的实施例或者以各种方式被实施或实现。
[可雷射离型组成物]
本发明提供一种具有优异的基材密着性、可贴合性、转印性和耐溶剂性的可雷射离型组成物，其包括压克力树脂、遮光材、添加剂和溶剂。以下将就各成分进行详细说明:
[压克力树脂]
为了达成上述功效，本发明所揭露的一种实施方式，其中压克力树脂至少包括含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、含有环醚基的有机基和含有羟基的有机基。
前述含有选自叔胺基和仲胺基的群中至少一种的含氮有机基可为但不限于吡啶基团、哌嗪基团、吗啉基团、2-(烃基)胺基烃基酯基团、二烃基胺基烃基酯基团、胺基甲酸酯基团等，其中前述烃基中任一-CH2-亦可以各自独立为-NH-、-O-或-S-取代，其中各取代基彼此不相连接，具体而言，可使用含有选自叔胺基或仲胺基的群中至少一种的单体进行树脂合成，例如、丙烯酰吗啉、甲基丙烯酰吗啉、4-乙烯基吡啶、2-乙烯基吡啶、5-乙基-2-乙烯基吡啶、N-丙烯酰基哌嗪、2-(叔丁基氨基)甲基丙烯酸乙酯、丙烯酸二甲基胺基乙基酯、甲基丙烯酸二甲基胺基乙基酯、丙烯酸二乙基胺基乙基酯、甲基丙烯酸二乙基胺基乙基酯、丙烯酸二乙基胺基丙基酯、甲基丙烯酸二乙基胺基丙基酯、丙烯酸胺基甲酸酯、甲基丙烯酸胺基甲酸酯等。
前述含环醚基的有机基可为但不限于氧杂环丁烷基团、环氧丙基等，具体而言，可使用例如含环醚基的单体进行树脂合成，例如(甲基)丙烯酸缩水甘油酯、烯丙基缩水甘油基醚、α－乙基丙烯酸缩水甘油酯、巴豆酰基缩水甘油基醚、(异)巴豆酸缩水甘油基醚、甲基丙烯酸氧杂环丁烷酯、丙烯酸氧杂环丁烷酯等。
前述含有羟基的有机基，可使用含有羟基的单体进行树脂合成，包括但不限于(甲基)丙烯酸羟基烷基酯，具体可例举如:甲基丙烯酸羟基乙酯、丙烯酸羟基乙酯、甲基丙烯酸羟基丙酯、丙烯酸羟基丙酯、甲基丙烯酸羟基丁酯、丙烯酸羟基丁酯、甲基丙烯酸羟基己酯、丙烯酸羟基己酯等。前述含有羟基的有机基亦可透过接枝聚合的方式形成。例如先使树脂主链带有羧基而形成具有羧基的树脂，再使用环氧化合物接枝聚合，使羧基与环氧基反应而产生羟基；具体而言，前述具有羧基的树脂并不特别限制，一般而言系使含有羧基的聚合性单体进行聚合而得，亦可以多元酸和多元醇聚合而成的含有羧基的聚酯作为前述具有羧基的树脂。所述含有羧基的聚合性单体包括但不限于(甲基)丙烯酸，顺丁烯二酸或顺丁烯二酐，巴豆酸，亚甲基丁二酸，反丁烯二酸，2－(甲基)丙烯酰氧乙基丁二酸，2－丙烯酰氧乙基己二酸，2－(甲基)丙烯酰氧乙基酞酸，2－(甲基)丙烯酰氧乙基六氢酞酸，2－(甲基)丙烯酰氧乙基顺丁烯二酸，2－(甲基)丙烯酰氧丙基丁二酸，2－丙烯酰氧丙基己二酸，2－(甲基)丙烯酰氧丙基氢酞酸，2－(甲基)丙烯酰氧丙基酞酸，2－(甲基)丙烯酰氧丙基顺丁烯二酸，2－(甲基)丙烯酰氧丁基丁二酸，2－丙烯酰氧丁基己二酸，2－(甲基)丙烯酰氧丁基氢酞酸，2－(甲基)丙烯酰氧丁基酞酸，2－(甲基)丙烯酰氧丁基顺丁烯二酸等。所述用于接枝聚合的环氧化合物只要具有环氧基皆可，可例举如下:环氧乙烷、环氧丙烷、(甲基)丙烯酸缩水甘油酯、烯丙基缩水甘油基醚、α－乙基丙烯酸缩水甘油酯、巴豆酰基缩水甘油基醚、(异)巴豆酸缩水甘油基醚等，但不限于此；除此之外，羟基亦可由醛、酮或羧酸还原得到。
较佳地，本发明的压克力树脂包括至少两种以上具有不同碳数的环的环醚基；更佳地，所述至少两种以上具有不同碳数的环的环醚基为氧杂环丁烷基团和环氧丙基的组合。
本发明所揭露的实施方式所含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、含有环醚基的有机基和含有羟基的有机基的比例没有一定的限制，只要不影响本发明的密着性和耐溶剂性皆可。具体而言，以压克力树脂整体的固含量为100重量％，含有选自叔胺基或仲胺基的群中至少一种的含氮有机基的单体为1～50重量％，较佳为3～35重量％，更佳为5～20重量％；含有环醚基的单体为5～65重量％，较佳为10～50重量％，更佳为15～35重量％；含有羟基的单体为1～75重量％，较佳为3～60重量％，更佳为5～45重量％。
进一步地，在压克力树脂中，所述含有环醚基的有机基和所述含氮有机基的重量比为1:0.015～1:10，较佳为1:0.05～1:3.5，更佳为1:0.17～1:0.67；所述含有环醚基的有机基和所述含有羟基的有机基的重量比为1:0.015～1:25，较佳为1:0.05～1:6，更佳为1:0.17～1:2.3；所述含氮有机基和所述含有羟基的有机基的重量比为1:0.02～1:60，较佳为1:0.1～1:20，更佳为1:1～1:6。
在不影响本发明的特性下，本发明所揭露的压克力树脂可进一步包括其他官能基团，如芳香环基团、脂环基团、硅氧烷基团、羧酸基团等，但不限于此。具体而言，具有芳香环基团的单体如苯乙烯、邻苯基苯氧乙基丙烯酸酯等；具有脂环基团的单体如甲基丙烯酸三环[5.2.1.02,6]癸-8-基酯等；具有硅氧烷基团的单体如甲基丙烯酰氧基丙基三甲氧基硅烷等；具有羧酸基团的单体如甲基丙烯酸、丙烯酸等。其他官能基团的比例没有一定的限制，只要不影响本发明的密着性和耐溶剂性皆可。具体而言，以压克力树脂整体的固含量为100重量％，具有其他官能基团的单体为0～80重量％，较佳为0～60重量％，更佳为20～50重量％。
前述压克力树脂的重量平均分子量为6万以上，较佳为7～14万，更佳为8～10万，以达成优异的密着性和耐溶剂性。于本发明的可雷射离型组成物的整体固含量中，压克力树脂的比例并无特别限制，只要不影响本发明的密着性和耐溶剂性皆可。具体而言，压克力树脂占可雷射离型组成物的整体固含量为5～70重量％，较佳为7～55重量％，更佳为10～40重量％。
且较佳地，前述的压克力树脂的酸价为小于4mg KOH/g，以达成本发明优异的密着性和耐溶剂性。
[遮光材]
本发明所揭露的遮光材只要可使所述可雷射离型组成物吸收可见光、红外光或紫外光中至少一波段或阻挡可见光、红外光或紫外光中至少一波段通过的材料皆可。藉由遮光材的添加，可利用对应其特定波段的雷射将可雷射离型的组成物所形成的薄膜与支撑材分离。作为遮光材的材料可列举如下，包括但不限于:碳黑、钛黑、氧化钛、氧化铁、钛氮化物、硅灰、有机颜料、无机颜料、染料或其组合等。
较佳地，前述的遮光材不含金属离子。
遮光材的比例并无特别限制，只要不影响本发明的密着性和耐溶剂性皆可；具体而言，遮光材占可雷射离型组成物的整体固含量为20～90重量％，较佳为35～85重量％，更佳为50～70重量％。另外，本发明所揭露的树脂可使遮光材的添加比例高于50重量％，适用上可降低雷射离型所需的能量。
[添加剂]
添加剂如密着促进剂、交联剂等。密着促进剂可为硅烷类、硅氧烷类的化合物或界面活性剂；较佳地，密着促进剂为包括乙烯性基团、环氧基、胺基、酸酐、硫醇基或异氰酸酯基等的硅氧烷化合物，更佳地，密着促进剂为包括具有乙烯性基团的硅氧烷化合物。交联剂较佳为热交联剂；热交联剂可为含封端型或非封端型异氰酸酯基的化合物、如二乙烯基醚的含有烯基醚基的化合物、含烃氧基烃基的化合物、含双酸酐基的化合物、含双硫醇基的化合物、环氧树脂、三聚氰胺化合物、酚化合物等。添加剂可为一种或两种以上的组合。
较佳地，添加剂至少包括一种密着促进剂；更佳地，添加剂至少包括一种密着促进剂和一种交联剂。
具体而言，密着促进剂可例举为[3-(2,3-环氧丙氧)-丙基]三甲氧基硅烷、3-异氰酸酯基丙基三甲氧基硅烷、3-(甲基丙烯酰氧基)丙基三甲氧基硅烷等；热交联剂可例举为六羟甲基三聚氰胺、六甲氧基甲基三聚氰胺、三羟甲基酚、3,3',5,5'-四甲氧甲基联苯二酚、酚醛环氧树脂等。
添加剂的比例并无特别限制，只要不影响本发明的密着性和耐溶剂性皆可。具体而言，添加剂占可雷射离型组成物的整体固含量为5～35重量％，较佳为7～25重量％，更佳为10～15重量％。
[溶剂]
溶剂可为酰胺类、环酰胺类、酯类、醚类、醇类或是上述溶剂任意比例的混合溶剂。可列举如下，包括但不限于:N-甲基吡咯烷酮、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基己内酰胺、二甲基亚砜、四甲基尿素、六甲基磷酰胺、γ-丁内酯、吡啶、甲醇、乙醇、异丙醇、正丁醇、环己醇、乙二醇、乙二醇甲基醚、乙二醇单乙基醚、乙二醇单丁基醚、乙二醇二甲基醚、乙二醇二乙基醚、二乙基醚、丙酮、甲基乙基酮、环己酮、乙酸甲酯、乙酸乙酯、四氢呋喃、二氯甲烷、三氯甲烷、1,2-二氯乙烷、苯、甲苯、二甲苯、正己烷、正庚烷、正辛烷等。溶剂的比例并无特别限制，只要不影响本发明的密着性和耐溶剂性，且可涂布成膜皆可。
[复合膜]
本发明的可雷射离型组成物亦可用于形成具有转印功能的复合膜；前述复合膜包括可离型支撑膜及由本发明的可雷射离型组成物所形成的暂时黏着膜，其中，暂时黏着膜设置于可离型支撑膜的一表面。详细来说，将可雷射离型的组成物涂布于支撑材的表面，并加热去除部分或全部溶剂后而得，且复合膜中的暂时黏着膜可被剥离。
作为可离型支撑膜的材料可包括但不限于聚对苯二甲酸乙二酯(PET)、聚乙烯、聚丙烯、聚碳酸酯、聚氯乙烯等的膜厚15～200μm的合成树脂薄膜；暂时黏着膜远离可离型支撑膜的另一表面亦可设置保护膜覆盖。
另外，前述涂布方式可包括但不限于旋转涂布、狭缝涂布、线棒涂布、网版印刷等。
[积层体]
本发明更提供一种积层体。本发明的积层体包括支撑材及如上所述的可雷射离型的组成物在支撑材上所形成的暂时黏着膜。详细来说，将可雷射离型的组成物涂布于支撑材的表面，并加热去除部分或全部溶剂后而得；亦可将前述的复合膜以转印的方式形成于支撑材的表面。
作为本发明的支撑材并不限定，只要可被雷射穿透的材料皆可。例举如:玻璃、硅晶圆等。
利用本发明的可雷射离型组成物在支撑材上形成膜的涂布方式并不限定，只要能在支撑材上涂布成膜皆可，如:旋转涂布、刮刀式涂布等。
涂布完成后，以40℃～100℃的预烘烤温度在热板上加热5～20分钟以去除溶剂，再以200℃～300℃加热30～60分钟以固化成膜。
[雷射离型方法]
本发明更提供一种雷射离型方法。包括以下步骤:
S1:提供支撑材1；
S2:以上述的可雷射离型的组成物涂布在前述的支撑材上并硬化成膜2；
S3:在膜2上形成加工元件3；及S4:以雷射将支撑材1移除。
具体而言，步骤S1和S2即为上述积层体的提供步骤。且进一步地，步骤S2亦可用转印的方法完成，即以前述的可雷射离型的组成物所形成的暂时黏着膜转印在前述支撑材的一表面上。
具体而言，步骤S3所述的加工元件可为裸晶(KGD)或线路重布层(RDL)；且进一步地，所述加工元件若为裸晶(KGD)，则步骤S3更包括封胶(molding)；所述加工元件若为线路重布层(RDL)，则步骤S3更包括焊晶(die bonding)、封胶(molding)等步骤。
具体而言，步骤S4所使用的雷射种类并无特别限制，可包括YAG雷射、红宝石雷射、YVO4雷射、光纤雷射等的固体雷射、色素雷射等的液体雷射、CO2雷射、准分子雷射、Ar雷射、He-Ne雷射等气体雷射、半导体雷射、半导体激发固体雷射(Diode Pump Solid StateLaser，DPSSL)、自由电子雷射等。
且进一步地，步骤S4更可包括以雷射将支撑材1去除后的清洁步骤以去除本发明的可雷射离型组成物所形成的残膜，和焊锡(solder printing)等步骤。所述清洁步骤具体而言，如使用电浆的干式蚀刻、使用化学药剂的湿式蚀刻等。
因应其应用领域的不同，除了半导体领域的应用的外，只要任一基板、材料或加工元件需藉由本发明的积层体，而后进行一或多道制程，最后再利用雷射分离本发明的积层体与基板、材料或加工元件，皆为本发明的雷射离型方法的范畴。
[实施例]
压克力树脂的合成:
于1L反应釜中，架设温度计、滴定管、氮气入气孔以及搅拌棒装置。首先加入150克的丙二醇甲基醚醋酸酯(PGMEA)于釜底以转速200rpm搅拌升温至85℃，接着将不同重量比例的单体以及0.005mol的偶氮二异丁腈混于150克的PGMEA中，以滴定的方式滴入反应釜中，接着保持温度搅拌4小时，即可降至室温完成反应，可得固含量为40％的树脂。
可雷射离型组成物的配制:
首先将密着促进剂以及交联剂加入具有20％N,N-二乙基甲酰胺(DEF)及80％丙二醇甲基醚醋酸酯(PGMEA)的混和溶剂，确认混合均匀后，再将树脂加入并混合均匀后，最后加入遮光材(自达兴材料购入，PK260)并搅拌1小时，可得固含量为20％的组成物。
积层体的形成:
将表1～表3中所示比例的组成物，以可形成1.3μm膜厚的转速，旋转涂布于一玻璃支撑体上，经由50℃和90℃各5分钟的预烘烤去除溶剂后，待膜表面干燥后，再以230℃加热30分钟以固化成膜，而形成积层体。
耐溶剂性测试:于80℃浸泡光阻去除剂(AT7880P，从品化购入)，分别于不同时间点进行百格测试，测试手法遵循ASTM D3359来进行判断剥落情况。AT7880P组成为二甲基亚砜、乙醇胺和氢氧化四甲基铵。(表中:◎代表浸泡时间大于10分钟后进行百格测试为5B；O代表浸泡10分钟后进行百格测试为5B；△代表浸泡5分钟后进行百格测试为5B；X代表不论浸泡时间皆未达5B。)
密着性测试:使用拉力机进行拉力测试(Pull off test)。首先利用框胶(723K1，从AUO购入)定量点于涂布试片上，上层黏着玻璃，以355nm的UV灯照射169秒进行光固化的步骤，且热固化120度1小时，最后进行拉力测试，确认涂层与剥离所需的力，且将其除以框胶的面积，即为拉应力(tensile stress)。此处以玻璃对贴片拉应力数值作为标准品，定义为2N/mm2，将所有拉应力的样品规格化后，即可得到数值。
可雷射离型测试:使用1瓦或1瓦以上能量的355nm雷射进行连续扫描后，可利用黏着纸(protect film)撕起的材料，称的可雷射离型。
下列实施例均为可雷射离型。
树脂成分说明:
OXMA:甲基丙烯酸氧杂环丁烷酯；GMA:甲基丙烯酸缩水甘油酯；ACMO:丙烯酰吗啉；HEMA:甲基丙烯酸羟基乙酯；FA513M:甲基丙烯酸三环[5.2.1.02,6]癸-8-基酯；EM2105:邻苯基苯氧乙基丙烯酸酯；EM50:苯乙烯；A174:甲基丙烯酰氧基丙基三甲氧基硅烷；DMAEMA：丙烯酸二甲基胺基乙基酯。
添加剂成分说明:
X-12-1050:具有二个以上压克力官能基的硅氧烷聚合物(从信越购入)；
Alink:3-异氰酸酯基丙基三甲氧基硅烷；AD124:[3-(2,3-环氧丙氧)-丙基]三甲氧基硅烷；N740:酚醛环氧树脂；TMOM-BP:3,3',5,5'-四甲氧甲基联苯二酚；
HMMM:六甲氧基甲基三聚氰胺。
表1:实施例1～实施例6
Figure BDA0002907588610000101
表2:实施例7～实施例13
Figure BDA0002907588610000111
表3:实施例14～实施例16&比较例1～比较例4
Figure BDA0002907588610000121
表4:实施例17～实施例19
Figure BDA0002907588610000131
从实施例和比较例1～4可知，没有同时包括含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、环醚基和羟基的树脂，无法达成本发明优异的耐溶剂性或密着性；从实施例7和实施例8可知，树脂具有两种环醚基团的组成物，具有较佳的密着性；从实施例11、实施例17和实施例18可知，包括具有乙烯性基团的硅氧烷化合物的组成物具有较佳的密着性，包括具有环氧基的硅氧烷化合物或具有异氰酸酯基的硅氧烷化合物则次之。
[应用领域]
本发明的可雷射离型组成物、及其积层体除了半导体封装领域的应用之外，只要任一支撑材或材料需藉由一暂时载体乘载，而后进行一或多道制程，最后再利用雷射分离载体与支撑材或材料，皆为本发明可适用的范围。例如：软性支撑材或是太阳能电池制作。
虽然本发明已以实施方式揭露如上，然其并非用以限定本发明，任何熟习此技艺者，在不脱离本发明的精神和范围内，皆可作各种更动与润饰，因此本发明的保护范围，当视后附的申请专利范围所界定者为准。

Claims (13)

1.一种可雷射离型的组成物，其特征在于，包括:压克力树脂、遮光材、添加剂和溶剂；其中所述压克力树脂包括含有选自叔胺基和仲胺基的群中至少一种的含氮有机基、含有环醚基的有机基和含有羟基的有机基，所述添加剂至少包括一种密着促进剂。
2.根据权利要求1所述的可雷射离型的组成物，其中，在所述压克力树脂中，所述含有环醚基的有机基和所述含氮有机基的重量比为1:0.015～1:10，所述含有环醚基的有机基和所述含有羟基的有机基的重量比为1:0.015～1:25，所述含氮有机基和所述含有羟基的有机基的重量比为1:0.02～1:60。
3.根据权利要求1所述的可雷射离型的组成物，其中，所述压克力树脂的酸价小于4mgKOH/g。
4.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述密着促进剂为包括选自乙烯性基团、环氧基和异氰酸酯基的群中至少一种的硅氧烷化合物。
5.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述含有选自叔胺基和仲胺基的群中至少一种的含氮有机基为2-(烃基)胺基烃基酯基团、二烃基胺基烃基酯基团、胺基甲酸酯基团、吡啶、哌嗪和吗啉基团中的至少一种，其中所述烃基中任一-CH2-亦可以各自独立为-NH-、-O-或-S-取代，其中各取代基彼此不相连接。
6.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述压克力树脂包括至少两种以上具有不同碳数的环的环醚基。
7.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述环醚基为氧杂环丁烷基、环氧丙基或其组合。
8.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述遮光材为可使所述组成物吸收可见光、红外光或紫外光中至少一波段或阻挡可见光、红外光或紫外光中至少一波段通过的材料。
9.根据权利要求1～3中任一权利要求所述的可雷射离型的组成物，其中，所述添加剂进一步包括交联剂。
10.一种积层体，其特征在于，包括一支撑材及以权利要求1或2所述的可雷射离型的组成物在所述支撑材上所形成的膜。
11.一种复合膜，其特征在于，包括一可离型支撑膜及以权利要求1～3中任一权利要求所述的可雷射离型的组成物所形成的暂时黏着膜；其中，所述暂时黏着膜设置于所述可离型支撑膜的一表面。
12.一种雷射离型方法，其特征在于，包括以下步骤:
提供一支撑材；
将以权利要求1～3中任一权利要求所述的可雷射离型的组成物所形成的暂时黏着膜转印至所述支撑材的一表面；及
以雷射将所述支撑材移除的步骤。
13.一种雷射离型方法，其特征在于，包括以下步骤:
提供一支撑材；
以权利要求1～3中任一权利要求所述的可雷射离型的组成物涂布在所述支撑材上并硬化成膜；及
以雷射将所述支撑材移除的步骤。
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