CN113035845A - 具有天线的封装结构及其制作方法 - Google Patents

具有天线的封装结构及其制作方法 Download PDF

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Publication number
CN113035845A
CN113035845A CN202110158558.2A CN202110158558A CN113035845A CN 113035845 A CN113035845 A CN 113035845A CN 202110158558 A CN202110158558 A CN 202110158558A CN 113035845 A CN113035845 A CN 113035845A
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China
Prior art keywords
layer
antenna
package
processing
metal
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CN202110158558.2A
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CN113035845B (zh
Inventor
陈先明
冯磊
王闻师
黄本霞
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Zhuhai Yueya Semiconductor Co ltd
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Zhuhai Yueya Semiconductor Co ltd
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Priority to CN202110158558.2A priority Critical patent/CN113035845B/zh
Publication of CN113035845A publication Critical patent/CN113035845A/zh
Priority to TW111101526A priority patent/TWI788191B/zh
Priority to US17/584,722 priority patent/US11984414B2/en
Priority to JP2022010949A priority patent/JP7316399B2/ja
Priority to KR1020220013300A priority patent/KR20220113274A/ko
Application granted granted Critical
Publication of CN113035845B publication Critical patent/CN113035845B/zh
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    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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Abstract

本发明公开了一种具有天线的封装结构，包括封装体、天线线路、互连线路、外层线路和芯片，封装体的内部封装有第一导通通孔柱和第二导通通孔柱，天线线路设置在封装体的第一表面和侧壁，互连线路封装在封装体内，且通过第一导通通孔柱与天线线路连接，外层线路设置在封装体的第二表面，且通过第二导通通孔柱与互连线路连接，外层线路还连接有导电引脚，芯片封装在封装体内，且与互连线路或外层线路连接。本发明还公开一种具有天线的封装结构的制作方法。本发明在封装体的表面和侧壁布置天线线路，可以充分利用封装体的布线空间，有利于布置更多天线线路，以及延长天线的长度，使提升天线线路的信号传输质量。

Description

具有天线的封装结构及其制作方法
技术领域
本发明涉及半导体封装技术领域，特别涉及一种具有天线的封装结构及其制作方法。
背景技术
随着技术的进步，无线通信设备通常将包含发送和接收射频信号的天线设置在电路板的不同部分上，并通过电路的走线进行互连，然而，天线和电路板这两个部件都可能产生单独的制造成本，并且分立式的天线安装方式已无法满足电子设备的高集成化和小型化的要求，因此天线封装技术逐步成为先进封装行业的焦点。
目前的天线封装技术，大都是在芯片(包括被动元件和裸晶片)完成塑封后，在塑封体的第一表面或下表面使用重新布线层的制作方法形成天线层，或者使天线层分别位于塑封体或封装基板的上下表面。在该类封装技术中，天线层结构要额外占用塑封体表面原本用于布置重新布线层走线的面积，或者占用封装基板表面的面积，故而对整体封装走线的设计和制造工艺产生了一定的限制。天线的长度和信号的收发有直接关系，5G通讯下频谱众多，为了满足更多的天线配置，需要设置不同的天线长度，天线长度决定了封装介质层的厚度，使天线封装体无法达到微型化的要求。
另外，因信号品质与传输速度的要求，需要配置更多的天线，而现有无线通讯模组中，天线结构为平面型，且基板的长宽尺寸均为固定，致使线路布线空间(层数)有限，因而限制天线结构的功能，无法满足信号的空间覆盖，使信号的收发收到影响，从而使天线结构难以达到通讯系统运作的需求。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明提出一种具有天线的封装结构及其制作方法，在嵌埋基板的表面及侧壁布置天线，能够布置更多、更长的天线线路。
第一方面，根据本发明实施例的具有天线的封装结构，包括封装体，内部封装有第一导通通孔柱和第二导通通孔柱；天线线路，设置在所述封装体的第一表面和侧壁；互连线路，封装在所述封装体内，且通过所述第一导通通孔柱与所述天线线路连接；外层线路，设置在所述封装体的第二表面，且通过所述第二导通通孔柱与所述互连线路连接，所述外层线路还连接有导电引脚；芯片，封装在所述封装体内，且与所述互连线路或所述外层线路连接。
根据本发明实施例的具有天线的封装结构，至少具有如下有益效果：
本发明在封装体的表面和侧壁布置天线线路，可以充分利用封装体的布线空间，有利于布置更多天线线路，以及延长天线的长度，使提升天线线路的信号传输质量。
根据本发明的一些实施例，位于所述封装体侧壁的天线线路为阶梯结构。
根据本发明的一些实施例，所述第一导通通孔柱包括多段纵向连接的层间通孔柱，相邻两段所述层间通孔柱之间设置有垫盘。
根据本发明的一些实施例，所述封装体内且位于所述垫盘的同一层内设置有内层天线线路，所述内层天线线路与相应的所述垫盘连接。
第二方面，根据本发明实施例的具有天线的封装结构的制作方法，包括：
提供具有第一金属层的承载板，并在所述第一金属层上加工至少一层天线层，所述天线层内封装有第一牺牲金属柱以及与所述第一金属层连接的第一导通通孔柱；
在最后一层所述天线层的基础上加工器件封装层，所述器件封装层包括互连线路、第二导通通孔柱和封装腔体，所述第二导通通孔柱与所述互连线路连接；
在所述封装腔体内封装芯片后，在所述器件封装层的基础上加工第二金属层；
分板并将所述第一金属层加工成表面天线线路以及将所述第二金属层加工成外层线路；
去除所述第一牺牲金属柱，以获得凹槽；
在所述凹槽的内壁加工侧壁天线线路，所述侧壁天线线路与所述表面天线线路连接；
在所述外层线路上加工导电引脚；
沿所述凹槽进行切割，以获得封装体。
根据本发明实施例的具有天线的封装结构的制作方法，至少具有如下有益效果：本发明在封装体的表面和侧壁布置天线线路，可以充分利用封装体的布线空间，有利于布置更多天线线路，以及延长天线的长度，使提升天线线路的信号传输质量。
根据本发明的一些实施例，在所述第一金属层上加工至少一层天线层，包括以下步骤：
根据生产资料，在所述第一金属层上通过图形转移和图形电镀的方式加工第一段的层间通孔柱和第一段的第一牺牲金属柱，以获得第一层天线层半成品；
对第一层所述天线层半成品进行叠层压合，以获得第一层天线层。
根据本发明的一些实施例，在所述第一金属层上加工至少一层天线层，还包括以下步骤：
减薄处理，对压合后的所述天线层进行减薄处理，以暴露前一段的所述层间通孔柱和前一段的所述第一牺牲金属柱；
图形制作，在前一段的所述层间通孔柱和前一段的所述第一牺牲金属柱上通过图形转移的方式加垫盘，或者，在前一段的所述层间通孔柱和前一段的所述第一牺牲金属柱上通过图形转移的方式加垫盘和内层天线线路，所述内层天线线路与相应的所述垫盘连接；
半成品加工，根据生产资料，通过图形转移和图形电镀的方式在垫盘的基础上加工后一段的所述层间通孔柱和后一段的所述第一牺牲金属柱，以获得次一层的天线层半成品；
叠层压合，对次一层的所述天线层半成品进行叠层压合；
根据生产资料，重复磨板、图形制作、半成品加工和叠层压合，直至完成多层所述天线层的加工。
根据本发明的一些实施例，在最后一层所述天线层的基础上加工器件封装层，包括以下步骤：
对最后一层所述天线层进行减薄处理；
在减薄后的所述天线层上通过图形转移、图形电镀和叠层压合的方式加工至少一层互连线路层，所述互连线路位于所述互连线路层上。
根据本发明的一些实施例，在最后一层所述天线层的基础上加工器件封装层，还包括以下步骤：
在最后一层所述互连线路层上且位于所述封装腔体内的互连线路上加工保护金属；
在所述最后一层所述互连线路层上加工所述第二导通通孔柱以及在所述保护金属上加工第二牺牲金属柱，以获得器件封装层半成品；
对所述器件封装层半成品进行叠层压合以及减薄处理；
通过蚀刻的方式去除所述第二牺牲金属柱和所述保护金属，以形成所述封装腔体。
根据本发明的一些实施例，在所述封装腔体内封装芯片，包括以下步骤：
将所述芯片贴装在所述封装腔体内，并使所述芯片的引脚与位于所述封装腔体内的所述互连线路连接；
对所述封装腔体进行塑封。
根据本发明的一些实施例，在所述封装腔体内封装芯片，包括以下步骤：
将所述芯片贴装在所述封装腔体内，并使所述芯片的引脚朝向远离所述互连线路层的一侧；
对所述封装腔体进行塑封。
根据本发明的一些实施例，在所述器件封装层的基础上加工第二金属层，包括以下步骤：
通过激光钻孔的方式暴露所述芯片的引脚；
通过图形转移和图形电镀的方式在所述器件封装层的基础上加工所述第二金属层，并使所述第二金属层与所述芯片的引脚连接。
根据本发明的一些实施例，在所述凹槽的内壁加工侧壁天线线路，包括以下步骤：
在所述凹槽的内壁加工金属种子层；
在所述第一金属层和所述第二金属层上加工感光遮蔽膜，并在所述感光遮蔽膜对应于所述凹槽的位置开窗；
在所述凹槽内沉积金属，以形成所述侧壁天线线路；
去除所述感光遮蔽膜和所述金属种子层。
根据本发明的一些实施例，所述凹槽的内壁为阶梯结构。
根据本发明的一些实施例，在所述外层线路上加工导电引脚之前，还包括以下步骤：
在所述外层线路上加工阻焊层，并在所述阻焊层对应于所述导电引脚的位置开窗。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1至图15为本发明实施例的具有天线的封装结构的制作方法的中间过程的基板剖面结构示意图；
图16为本发明实施例的具有天线的封装结构的结构示意图之一；
图17为本发明实施例的具有天线的封装结构的结构示意图之二。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，若干的含义是一个或者多个，多个的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本发明的描述中，除非另有明确的限定，设置、安装、连接等词语应做广义理解，所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。
请参照图16和图17，本实施例公开了一种具有天线的封装结构，包括封装体700、天线线路、互连线路310、外层线路510和芯片400，封装体700的内部封装有第一导通通孔柱220和第二导通通孔柱320，天线线路包括表面天线线路120和侧壁天线线路130，表面天线线路120设置在封装体700的第一表面上，侧壁天线线路130设置在封装体700的侧壁上，互连线路310封装在封装体700内，且通过第一导通通孔柱220与天线线路连接，外层线路510设置在封装体700的第二表面，且通过第二导通通孔柱320与互连线路310连接，外层线路510还连接有导电引脚600，芯片400封装在封装体700内，且与互连线路310或外层线路510连接。需要说明的是，互连线路310设置在互连线路层上，互连线路层的层数为一层或多层，相邻的互连线路层之间通过第三导通通孔柱连接。
本实施例在封装体700的第一表面和侧壁布置天线线路，可以充分利用封装体700的布线空间，有利于布置更多天线线路，以及延长天线的长度，使天线线路从单一平面转变为立体多面，提升天线线路的信号传输质量，而且本实施例将天线线路和芯片400进行集成化封装，使封装体700更加轻薄。
在应用过程中，为了充分利用封装体700侧壁的布线空间，将封装体700的侧壁分为多个呈阶梯状纵向分布的区域，相应的，位于封装体700侧壁的天线线路为阶梯结构，有利于进一步延长天线线路的长度，从而提升天线线路的信号传输质量。
请继续参照图16或图17，第一导通通孔柱220包括多段纵向连接的层间通孔柱221，相邻两段层间通孔柱221之间设置有垫盘240，其中垫盘240用于连接相邻的两段层间通孔柱221，以便于层间通孔柱221的加工。
为了能够更加充分利用封装体700的布线空间，封装体700内且位于垫盘240的同一层内设置有内层天线线路，内层天线线路与相应的垫盘240连接，可以实现天线线路的多层布线和立体布线，有利于延长天线线路的长度，从而提升天线线路的信号传输质量。
为了进一步理解本实施例的具有天线的封装结构的技术方案，本发明实施例还公开该嵌埋基板的制作方法。
一种具有天线的封装结构的制作方法，包括：
S100、请参照图1、图2和图3，提供具有第一金属层110的承载板100，并在第一金属层110上加工至少一层天线层200，天线层200内封装有第一牺牲金属柱210以及与第一金属层连接的第一导通通孔柱220。
在本实施例中，承载板100可采用表面附有可拆卸铜箔的覆铜板，其中覆铜板表面的铜箔为第一金属层110。需要说明的是，覆铜板可以为单面覆铜板或双面覆铜板，为了便于对本实施例的制作方法进行表述，本实施例以双面覆铜板的其中一面为例进行描述，但值得理解的是，在实际生产时可在双面覆铜板的两面铜箔上进行对称式制作。在本实施例中，第一金属层110用于加工后续的表面天线线路120，天线线路位于天线层200上，根据实际应用需求，天线层200的层数可以是一层或多层，天线层200内的第一牺牲金属柱210便于后续去除以形成凹槽230，以及便于加工后续的侧壁天线线路130，需要说明的是，本实施例的天线线路包括表面天线线路120和侧壁天线线路130，可以使天线线路从传统的单一表面布线转变为立体多面布线，有利于充分利用有限的布线空间，布置更多的天线线路，以及延长天线的长度，提升天线线路的信号传输质量。第一导通通孔柱220用于实现天线线路与其它线路之间的互连，值得理解的是，第一导通通孔柱220的长度可根据天线层200的数量进行适应性调整。
在上述步骤S100中，在第一金属层110上加工至少一层天线层200，包括以下步骤：
S110、请参照图2，根据生产资料，在第一金属层110上通过图形转移和图形电镀的方式加工第一段的层间通孔柱221和第一段的第一牺牲金属柱210，以获得第一层天线层半成品。
值得理解的是，图形转移和图形电镀的加工方式在本技术领域中均为公知常识，在本实施例中不再进行累述。
S120、请参照图2和图3，对第一层天线层半成品进行叠层压合，以获得第一层天线层200，叠层压合的材料采用低介电常数、低损耗的介质材料，介质材料覆盖于层间通孔柱221和第一牺牲金属柱210，经过叠层压合后，介质材料将层间通孔柱221和第一牺牲金属柱210包裹在内侧，实现层间通孔柱221和第一牺牲金属柱210的封装、固定和保护。
根据实际应用需求，天线层200的层数为一层或多层，当天线层200的层数是一层时，单段的层间通孔柱221即为第一导通通孔柱220，可以用于连接后续的天线线路和互连线路。当需要加工多层天线层200时，在上述步骤S100中，在第一金属层110上加工至少一层天线层200，还包括以下步骤：
S130、减薄处理，对压合后的天线层200进行减薄处理，以暴露前一段的层间通孔柱221和前一段的第一牺牲金属柱210，以便于实现层间互连。减薄处理的加工方式采用机械磨板。
S140、图形制作，请参照图4，在前一段的层间通孔柱221和前一段的第一牺牲金属柱210上通过图形转移的方式加垫盘240，或者，在前一段的层间通孔柱221和前一段的第一牺牲金属柱210上通过图形转移的方式加垫盘240和内层天线线路，内层天线线路与相应的垫盘240连接。需要说明的是，垫盘240的位置可根据生产资料需要进行设置，垫盘240可以仅设置在层间通孔柱221上，或者，垫盘240设置在层间通孔柱221以及部分第一牺牲金属柱210上。垫盘240可以增大相邻两段层间通孔柱221或第一牺牲金属柱210之间的接触面积，以便于加工相邻的两段层间通孔柱221或第一牺牲金属柱210。
S150、半成品加工，请参照图5，根据生产资料，通过图形转移和图形电镀的方式在垫盘240的基础上加工后一段的层间通孔柱221和后一段的第一牺牲金属柱210，以获得次一层的天线层半成品。需要说明的是，在此步骤中第一导通通孔柱220包括多段层间通孔柱221以及连接在相邻两端层间通孔柱221之间的垫盘240，第一牺牲金属柱210的段数可以少于层间通孔柱221的段数，即可以在部分或全部天线层200加工第一牺牲金属柱210。
S160、叠层压合，对次一层的天线层半成品进行叠层压合；
S170、请参照图4、图5和图6，根据生产资料，重复磨板、图形制作、半成品加工和叠层压合，直至完成多层天线层200的加工。
S200、请参照图6至图10，在最后一层天线层200的基础上加工器件封装层300，器件封装层300包括互连线路310、第二导通通孔柱320和封装腔体330，第二导通通孔柱320与互连线路310连接。
封装腔体330用于在后续步骤中对芯片400进行贴装和封装，第二导通通孔柱320用于实现互连线路310与后续的外层线路510之间层间连接，互连线路310与芯片400之间直接或间接连接，从而实现信号的传输。
在步骤S200中，在最后一层天线层200的基础上加工器件封装层300，包括以下步骤：
S210、请参照图6，对最后一层天线层200进行减薄处理，以暴露天线层200内的金属，例如层间通孔柱221或第一牺牲金属柱210，减薄的加工方式采用磨板处理。
S220、请参照图7，在减薄后的天线层200上通过图形转移、图形电镀和叠层压合的方式加工至少一层互连线路层，互连线路310位于互连线路层上，相邻两层互连线路层的互连线路310之间通过第三导通通孔柱进行连接。
根据不同的设计需求，芯片400可以与互连线路310直接连接，或者与外层线路510连接，并通过外层线路510与互连线路310间接连接。
请参照图8，对于芯片400与互连线路310直接连接的方式，在步骤S200中，在最后一层天线层200的基础上加工器件封装层300，还包括以下步骤：
S230、在最后一层互连线路层上且位于封装腔体330内的互连线路310上加工保护金属340。其中，位于封装腔体330内的互连线路310用作与芯片400连接的焊盘，为了在形成封装腔体330时对焊盘进行保护，在焊盘上沉积保护金属340，并通过保护金属340覆盖焊盘区域，以实现焊盘的保护，保护金属340可以是镍、钛等。
S240、请参照图9，在最后一层互连线路层上加工第二导通通孔柱320以及在保护金属340上加工第二牺牲金属柱350，以获得器件封装层半成品。根据生产资料，通过图形转移和图形电镀的方式加工，以获得第二导通通孔柱320和第二牺牲金属柱350，可以实现互连线路310与后续的外层线路510之间的连接。
S250、对器件封装层半成品进行叠层压合以及减薄处理，以便于露出器件封装层300表面的金属。
S260、请参照图10，通过蚀刻的方式去除第二牺牲金属柱350和保护金属340，以形成封装腔体330。其中，位于封装腔体330内的互连线路310在去除保护金属340后，可用作连接芯片400的焊盘。
S300、请参照图11和图12，在封装腔体330内封装芯片400后，在器件封装层300的基础上加工第二金属层500。
在步骤S200加工得到的器件封装层300中设置有封装腔体330，在封装腔体330内封装芯片400后，为了便于制作外层线路510，在器件封装层300的基础上加工第二金属层500。
对于芯片400与互连线路310直接连接的方式，在上述步骤S300中，在封装腔体330内封装芯片400，包括以下步骤：
S310a、请参照图11，将芯片400贴装在封装腔体330内，并使芯片400的引脚与位于封装腔体330内的互连线路310连接；
S320a、对封装腔体330进行塑封，使封装材料填充封装腔体330，以便于将芯片400进行包封和固定。
S400、请参照图12和图13，分板并将第一金属层110加工成表面天线线路120以及将第二金属层500加工成外层线路510。
当完成第二金属层500的加工后，将去除承载板100以便于露出第一金属层110，从而便于表面天线线路120的制作，在本实施例中，表面天线线路120和外层线路510的制作均可根据生产资料通过图形转移和图形电镀的方式进行加工，而图形转移和图形电镀的加工方式在本技术领域中均为公知常识，在本实施例中不再进行累述。
S500、请参照图13和图14，去除第一牺牲金属柱210，以获得凹槽230。
为了能够加工侧壁天线线路130，可以通过蚀刻的方式去除第一牺牲金属柱210，以获得凹槽230，凹槽230的内壁为侧壁天线线路130提供支撑。
S600、请参照图14，在凹槽230的内壁加工侧壁天线线路130，侧壁天线线路130与表面天线线路120连接。
在上述步骤S600中，在凹槽230的内壁加工侧壁天线线路130，包括以下步骤：
S610、在凹槽230的内壁加工金属种子层，以便于提高凹槽230内壁与后续的侧壁天线线路130之间的结合力，金属种子层可以通过溅射的方式进行加工。
S620、在第一金属层110和第二金属层500上加工感光遮蔽膜，并在感光遮蔽膜对应于凹槽230的位置开窗，以便于露出凹槽230。
S630、在凹槽230内沉积金属，以形成侧壁天线线路130；
S640、去除感光遮蔽膜和金属种子层。
根据实际应用的需求，凹槽230的内壁为平整结构或阶梯结构，相应的，位于封装体700侧壁的天线线路为阶梯结构，有利于进一步延长天线线路的长度，从而提升天线线路的信号传输质量。
S700、在外层线路510上加工导电引脚600。
请参照图15，上述步骤S700、在外层线路510上加工导电引脚600之前，还包括以下步骤：S701、在外层线路510上加工阻焊层800，并在阻焊层800对应于导电引脚600的位置开窗，在外层线路510上加工阻焊层800，可以对外层线路510进行保护，在阻焊层800上开窗，可以露出导电引脚600的焊盘，以便于导电引脚600的加工。
S800、请参照图15和图16，沿凹槽230进行切割，以获得封装体700。
本实施例的制作方法在封装体700的表面和侧壁布置天线线路，可以充分利用封装体700的布线空间，有利于布置更多天线线路，以及延长天线的长度，使天线线路从单一平面转变为立体多面，提升天线线路的信号传输质量，而且本实施例将天线线路和芯片400进行集成化封装，使封装体700更加轻薄。
请参照图17，对于芯片400与外层线路510连接的方式，在上述步骤S300中，在封装腔体330内封装芯片400，包括以下步骤：
S310b、将芯片400贴装在封装腔体330内，并使芯片400的引脚朝向远离互连线路层的一侧，需要说明的是，在芯片400贴装时，可以通过粘结剂材料331将芯片400固定在封装腔体330内，其中粘结剂材料331可以采用导电银浆或DAF(die attach film，晶片贴膜)材料等。
S320b、对封装腔体330进行塑封。
对于芯片400与外层线路510连接的方式，在上述步骤S300中，在器件封装层300的基础上加工第二金属层500，包括以下步骤：
S330、通过激光钻孔的方式暴露芯片400的引脚；
S340、通过图形转移和图形电镀的方式在器件封装层300的基础上加工第二金属层500，并使第二金属层500与芯片400的引脚连接。当第二金属层500被加工成外层线路510后，可以实现芯片400与外层线路510连接，需要说明的是，芯片400的引脚可通过铜柱与外层线路510连接，铜柱的加工可在外层线路510加工时通过图形电镀的方式获得。
上面结合附图对本发明实施例作了详细说明，但是本发明不限于上述实施例，在所属技术领域普通技术人员所具备的知识范围内，还可以在不脱离本发明宗旨的前提下作出各种变化。

Claims (15)

1.一种具有天线的封装结构，其特征在于，包括：
封装体(700)，内部封装有第一导通通孔柱(220)和第二导通通孔柱(320)；
天线线路，设置在所述封装体(700)的第一表面和侧壁；
互连线路(310)，封装在所述封装体(700)内，且通过所述第一导通通孔柱(220)与所述天线线路连接；
外层线路(510)，设置在所述封装体(700)的第二表面，且通过所述第二导通通孔柱(320)与所述互连线路(310)连接，所述外层线路(510)还连接有导电引脚(600)；
芯片(400)，封装在所述封装体(700)内，且与所述互连线路(310)或所述外层线路(510)连接。
2.根据权利要求1所述的具有天线的封装结构，其特征在于，位于所述封装体(700)侧壁的天线线路为阶梯结构。
3.根据权利要求2所述的具有天线的封装结构，其特征在于，所述第一导通通孔柱(220)包括多段纵向连接的层间通孔柱(221)，相邻两段所述层间通孔柱(221)之间设置有垫盘(240)。
4.根据权利要求3所述的具有天线的封装结构，其特征在于，所述封装体(700)内且位于所述垫盘(240)的同一层内设置有内层天线线路，所述内层天线线路与相应的所述垫盘(240)连接。
5.一种具有天线的封装结构的制作方法，其特征在于，包括：
提供具有第一金属层(110)的承载板(100)，并在所述第一金属层(110)上加工至少一层天线层(200)，所述天线层(200)内封装有第一牺牲金属柱(210)以及与所述第一金属层(110)连接的第一导通通孔柱(220)；
在最后一层所述天线层(200)的基础上加工器件封装层(300)，所述器件封装层(300)包括互连线路(310)、第二导通通孔柱(320)和封装腔体(330)，所述第二导通通孔柱(320)与所述互连线路(310)连接；
在所述封装腔体(330)内封装芯片(400)后，在所述器件封装层(300)的基础上加工第二金属层(500)；
分板并将所述第一金属层(110)加工成表面天线线路(120)以及将所述第二金属层(500)加工成外层线路(510)；
去除所述第一牺牲金属柱(210)，以获得凹槽(230)；
在所述凹槽(230)的内壁加工侧壁天线线路(130)，所述侧壁天线线路(130)与所述表面天线线路(120)连接；
在所述外层线路(510)上加工导电引脚(600)；
沿所述凹槽(230)进行切割，以获得封装体(700)。
6.根据权利要求5所述的具有天线的封装结构的制作方法，其特征在于，在所述第一金属层(110)上加工至少一层天线层(200)，包括以下步骤：
根据生产资料，在所述第一金属层(110)上通过图形转移和图形电镀的方式加工第一段的层间通孔柱(221)和第一段的第一牺牲金属柱(210)，以获得第一层天线层半成品；
对第一层所述天线层半成品进行叠层压合，以获得第一层天线层(200)。
7.根据权利要求6所述的具有天线的封装结构的制作方法，其特征在于，在所述第一金属层(110)上加工至少一层天线层(200)，还包括以下步骤：
减薄处理，对压合后的所述天线层(200)进行减薄处理，以暴露前一段的所述层间通孔柱(221)和前一段的所述第一牺牲金属柱(210)；
图形制作，在前一段的所述层间通孔柱(221)和前一段的所述第一牺牲金属柱(210)上通过图形转移的方式加垫盘(240)，或者，在前一段的所述层间通孔柱(221)和前一段的所述第一牺牲金属柱(210)上通过图形转移的方式加垫盘(240)和内层天线线路，所述内层天线线路与相应的所述垫盘(240)连接；
半成品加工，根据生产资料，通过图形转移和图形电镀的方式在垫盘(240)的基础上加工后一段的所述层间通孔柱(221)和后一段的所述第一牺牲金属柱(210)，以获得次一层的天线层半成品；
叠层压合，对次一层的所述天线层半成品进行叠层压合；
根据生产资料，重复磨板、图形制作、半成品加工和叠层压合，直至完成多层所述天线层(200)的加工。
8.根据权利要求5所述的具有天线的封装结构的制作方法，其特征在于，在最后一层所述天线层(200)的基础上加工器件封装层(300)，包括以下步骤：
对最后一层所述天线层(200)进行减薄处理；
在减薄后的所述天线层(200)上通过图形转移、图形电镀和叠层压合的方式加工至少一层互连线路层，所述互连线路(310)位于所述互连线路层上。
9.根据权利要求8所述的具有天线的封装结构的制作方法，其特征在于，在最后一层所述天线层(200)的基础上加工器件封装层(300)，还包括以下步骤：
在最后一层所述互连线路层上且位于所述封装腔体(330)内的互连线路(310)上加工保护金属(340)；
在所述最后一层所述互连线路层上加工所述第二导通通孔柱(320)以及在所述保护金属(340)上加工第二牺牲金属柱(350)，以获得器件封装层半成品；
对所述器件封装层半成品进行叠层压合以及减薄处理；
通过蚀刻的方式去除所述第二牺牲金属柱(350)和所述保护金属(340)，以形成所述封装腔体(330)。
10.根据权利要求9所述的具有天线的封装结构的制作方法，其特征在于，在所述封装腔体(330)内封装芯片(400)，包括以下步骤：
将所述芯片(400)贴装在所述封装腔体(330)内，并使所述芯片(400)的引脚与位于所述封装腔体(330)内的所述互连线路(310)连接；
对所述封装腔体(330)进行塑封。
11.根据权利要求9所述的具有天线的封装结构的制作方法，其特征在于，在所述封装腔体(330)内封装芯片(400)，包括以下步骤：
将所述芯片(400)贴装在所述封装腔体(330)内，并使所述芯片(400)的引脚朝向远离所述互连线路层的一侧；
对所述封装腔体(330)进行塑封。
12.根据权利要求11所述的具有天线的封装结构的制作方法，其特征在于，在所述器件封装层(300)的基础上加工第二金属层(500)，包括以下步骤：
通过激光钻孔的方式暴露所述芯片(400)的引脚；
通过图形转移和图形电镀的方式在所述器件封装层(300)的基础上加工所述第二金属层(500)，并使所述第二金属层(500)与所述芯片(400)的引脚连接。
13.根据权利要求5所述的具有天线的封装结构的制作方法，其特征在于，在所述凹槽(230)的内壁加工侧壁天线线路(130)，包括以下步骤：
在所述凹槽(230)的内壁加工金属种子层；
在所述第一金属层(110)和所述第二金属层(500)上加工感光遮蔽膜，并在所述感光遮蔽膜对应于所述凹槽(230)的位置开窗；
在所述凹槽(230)内沉积金属，以形成所述侧壁天线线路(130)；
去除所述感光遮蔽膜和所述金属种子层。
14.根据权利要求5或13所述的具有天线的封装结构的制作方法，其特征在于，所述凹槽(230)的内壁为阶梯结构。
15.根据权利要求5所述的具有天线的封装结构的制作方法，其特征在于，在所述外层线路(510)上加工导电引脚(600)之前，还包括以下步骤：
在所述外层线路(510)上加工阻焊层(800)，并在所述阻焊层(800)对应于所述导电引脚(600)的位置开窗。
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