CN112930241A - 加工系统以及加工方法 - Google Patents
加工系统以及加工方法 Download PDFInfo
- Publication number
- CN112930241A CN112930241A CN201980070423.1A CN201980070423A CN112930241A CN 112930241 A CN112930241 A CN 112930241A CN 201980070423 A CN201980070423 A CN 201980070423A CN 112930241 A CN112930241 A CN 112930241A
- Authority
- CN
- China
- Prior art keywords
- processing
- measurement
- machining
- workpiece
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410540060.6A CN118237728A (zh) | 2018-10-31 | 2019-10-31 | 加工装置以及加工系统 |
| CN202410540065.9A CN118237729A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202610306907.3A CN121988868A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/040625 WO2020090074A1 (ja) | 2018-10-31 | 2018-10-31 | 加工システム、及び、加工方法 |
| JPPCT/JP2018/040625 | 2018-10-31 | ||
| PCT/JP2019/042734 WO2020090961A1 (ja) | 2018-10-31 | 2019-10-31 | 加工システム、及び、加工方法 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202610306907.3A Division CN121988868A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202410540060.6A Division CN118237728A (zh) | 2018-10-31 | 2019-10-31 | 加工装置以及加工系统 |
| CN202410540065.9A Division CN118237729A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112930241A true CN112930241A (zh) | 2021-06-08 |
Family
ID=70461831
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980070423.1A Pending CN112930241A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202610306907.3A Pending CN121988868A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202410540065.9A Pending CN118237729A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202410540060.6A Pending CN118237728A (zh) | 2018-10-31 | 2019-10-31 | 加工装置以及加工系统 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202610306907.3A Pending CN121988868A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202410540065.9A Pending CN118237729A (zh) | 2018-10-31 | 2019-10-31 | 加工系统以及加工方法 |
| CN202410540060.6A Pending CN118237728A (zh) | 2018-10-31 | 2019-10-31 | 加工装置以及加工系统 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210339359A1 (enExample) |
| EP (1) | EP3875206B1 (enExample) |
| JP (5) | JP7310829B2 (enExample) |
| CN (4) | CN112930241A (enExample) |
| TW (1) | TW202035047A (enExample) |
| WO (2) | WO2020090074A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113319424A (zh) * | 2021-05-31 | 2021-08-31 | 中国科学院西安光学精密机械研究所 | 一种三维形貌精确控制加工系统及加工方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755030B (zh) * | 2020-08-18 | 2022-02-11 | 財團法人工業技術研究院 | 用於整形工件的整形設備與整形方法、及可執行整形方法的電腦可讀取非暫態媒體 |
| JP2022185291A (ja) * | 2021-06-02 | 2022-12-14 | 株式会社ニコン | 造形装置及び造形方法、並びに、加工装置及び加工方法 |
| CN119855675A (zh) * | 2022-09-15 | 2025-04-18 | 株式会社 尼康 | 加工系统、数据结构以及加工方法 |
| WO2024189767A1 (ja) * | 2023-03-14 | 2024-09-19 | 株式会社ニコン | 加工システム及び加工方法 |
| JPWO2025094320A1 (enExample) * | 2023-11-01 | 2025-05-08 | ||
| EP4663333A1 (en) | 2024-06-11 | 2025-12-17 | United Machining Mill SA | Laser machining method and laser machine tool for machining a texture or a cavity on a workpiece |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907704A (zh) * | 2014-04-02 | 2015-09-16 | 温州大学 | 一种变焦距激光精密加工深槽深孔装置 |
| CN204747769U (zh) * | 2015-05-27 | 2015-11-11 | 华中科技大学 | 一种激光在线测量加工检测装置 |
| JP2016115787A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社ディスコ | 被加工物の分割方法 |
| CN107378255A (zh) * | 2017-07-14 | 2017-11-24 | 中国科学院微电子研究所 | 一种激光加工晶圆的方法及装置 |
| DE102016124742A1 (de) * | 2016-12-19 | 2018-06-21 | GFH GmbH | Vorrichtung und Verfahren zur Bearbeitung eines Werkstückes mittels Laserstrahlung |
| US20180254221A1 (en) * | 2017-03-03 | 2018-09-06 | Veeco Precision Surface Processing Llc | Apparatus and method for wafer thinning in advanced packaging applications |
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| JPS6049887A (ja) * | 1983-08-29 | 1985-03-19 | Mitsubishi Motors Corp | レ−ザ溶接方法 |
| JPH0513635A (ja) * | 1991-07-02 | 1993-01-22 | Nec Corp | タイバー切断方法 |
| JPH08187586A (ja) * | 1994-12-28 | 1996-07-23 | Sharp Corp | インクジェット記録ヘッド及びその製造方法及びその製造装置 |
| JPH1015684A (ja) * | 1996-07-01 | 1998-01-20 | Nikon Corp | レーザ加工装置 |
| JPH10109423A (ja) * | 1996-10-08 | 1998-04-28 | Fuji Xerox Co Ltd | インクジェット記録ヘッドおよびその製造方法、製造装置 |
| JPH115185A (ja) * | 1997-06-11 | 1999-01-12 | Nikon Corp | レーザ加工装置 |
| JP2000162243A (ja) * | 1998-11-30 | 2000-06-16 | Ando Electric Co Ltd | 電気光学サンプリングプローバ |
| JP2001219282A (ja) * | 1999-06-30 | 2001-08-14 | Canon Inc | レーザ加工方法、該レーザ加工方法を用いたインクジェット記録ヘッドの製造方法、該製造方法で製造されたインクジェット記録ヘッド |
| US6277659B1 (en) * | 1999-09-29 | 2001-08-21 | Advanced Micro Devices, Inc. | Substrate removal using thermal analysis |
| JP3819662B2 (ja) * | 1999-12-24 | 2006-09-13 | 三洋電機株式会社 | 三次元モデリング装置、方法及び媒体並びに三次形状データ記録装置、方法及び媒体 |
| JP3686317B2 (ja) | 2000-08-10 | 2005-08-24 | 三菱重工業株式会社 | レーザ加工ヘッド及びこれを備えたレーザ加工装置 |
| JP3926620B2 (ja) * | 2001-12-19 | 2007-06-06 | 日立ビアメカニクス株式会社 | レーザ加工装置およびその方法 |
| US7047095B2 (en) * | 2002-12-06 | 2006-05-16 | Tokyo Electron Limited | Process control system and process control method |
| JP4688525B2 (ja) | 2004-09-27 | 2011-05-25 | 株式会社 日立ディスプレイズ | パターン修正装置および表示装置の製造方法 |
| JP5209883B2 (ja) * | 2006-02-14 | 2013-06-12 | 芝浦メカトロニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP3938785B2 (ja) * | 2006-04-17 | 2007-06-27 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| JP4977411B2 (ja) * | 2006-07-06 | 2012-07-18 | 株式会社ディスコ | レーザー加工装置 |
| JP2008032524A (ja) * | 2006-07-28 | 2008-02-14 | National Institute Of Advanced Industrial & Technology | レーザ加工装置および計測用レーザ光の焦点検出方法 |
| JP2008119716A (ja) * | 2006-11-10 | 2008-05-29 | Marubun Corp | レーザ加工装置およびレーザ加工装置における焦点維持方法 |
| US8237084B2 (en) * | 2006-12-22 | 2012-08-07 | Taylor Fresh Foods, Inc. | Laser microperforated fresh produce trays for modified/controlled atmosphere packaging |
| JP2009045637A (ja) * | 2007-08-17 | 2009-03-05 | Fuji Xerox Co Ltd | レーザ加工装置 |
| KR100990519B1 (ko) * | 2008-08-07 | 2010-10-29 | (주)하드램 | 레이저를 이용한 기판 절단 장치 및 기판 절단 방법 |
| JP2010082663A (ja) * | 2008-09-30 | 2010-04-15 | Sunx Ltd | レーザ加工機 |
| CH700111B1 (fr) * | 2009-09-25 | 2010-06-30 | Agie Sa | Machine d'usinage par laser. |
| JP2013102019A (ja) * | 2011-11-08 | 2013-05-23 | Toshiba Corp | 光中継器及びレーザ加工装置 |
| KR101279578B1 (ko) * | 2012-04-03 | 2013-06-27 | 주식회사 이오테크닉스 | 레이저 가공용 오토포커싱 장치 및 이를 이용한 오토포커싱 방법 |
| JP6320123B2 (ja) * | 2014-03-31 | 2018-05-09 | 三菱重工業株式会社 | 三次元積層装置及び三次元積層方法 |
| JP6218770B2 (ja) * | 2014-06-23 | 2017-10-25 | 三菱電機株式会社 | レーザ加工装置 |
| JP5905060B1 (ja) | 2014-09-16 | 2016-04-20 | 株式会社東芝 | 積層造形装置および積層造形方法 |
| EP3389915B1 (en) * | 2016-01-19 | 2021-05-05 | NLIGHT, Inc. | Method of processing calibration data in 3d laser scanner systems |
| WO2018117510A2 (ko) * | 2016-12-23 | 2018-06-28 | 주식회사 포스코 | 방향성 전기강판의 자구미세화 방법과 그 장치 |
| JP6751040B2 (ja) | 2017-03-13 | 2020-09-02 | 株式会社神戸製鋼所 | 積層造形物の製造方法、製造システム、及び製造プログラム |
-
2018
- 2018-10-31 WO PCT/JP2018/040625 patent/WO2020090074A1/ja not_active Ceased
- 2018-10-31 US US17/286,688 patent/US20210339359A1/en active Pending
- 2018-10-31 JP JP2020554700A patent/JP7310829B2/ja active Active
-
2019
- 2019-10-30 TW TW108139306A patent/TW202035047A/zh unknown
- 2019-10-31 CN CN201980070423.1A patent/CN112930241A/zh active Pending
- 2019-10-31 JP JP2020554024A patent/JPWO2020090961A1/ja not_active Ceased
- 2019-10-31 CN CN202610306907.3A patent/CN121988868A/zh active Pending
- 2019-10-31 EP EP19880348.8A patent/EP3875206B1/en active Active
- 2019-10-31 CN CN202410540065.9A patent/CN118237729A/zh active Pending
- 2019-10-31 WO PCT/JP2019/042734 patent/WO2020090961A1/ja not_active Ceased
- 2019-10-31 CN CN202410540060.6A patent/CN118237728A/zh active Pending
-
2023
- 2023-07-06 JP JP2023111532A patent/JP7533712B2/ja active Active
-
2024
- 2024-07-24 JP JP2024118560A patent/JP2024133403A/ja active Pending
- 2024-08-21 JP JP2024139593A patent/JP7775949B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907704A (zh) * | 2014-04-02 | 2015-09-16 | 温州大学 | 一种变焦距激光精密加工深槽深孔装置 |
| JP2016115787A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社ディスコ | 被加工物の分割方法 |
| CN204747769U (zh) * | 2015-05-27 | 2015-11-11 | 华中科技大学 | 一种激光在线测量加工检测装置 |
| DE102016124742A1 (de) * | 2016-12-19 | 2018-06-21 | GFH GmbH | Vorrichtung und Verfahren zur Bearbeitung eines Werkstückes mittels Laserstrahlung |
| US20180254221A1 (en) * | 2017-03-03 | 2018-09-06 | Veeco Precision Surface Processing Llc | Apparatus and method for wafer thinning in advanced packaging applications |
| CN107378255A (zh) * | 2017-07-14 | 2017-11-24 | 中国科学院微电子研究所 | 一种激光加工晶圆的方法及装置 |
Non-Patent Citations (1)
| Title |
|---|
| 王国文等: "《激光与光电子技术》", 上海科学技术出版社, pages: 175 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113319424A (zh) * | 2021-05-31 | 2021-08-31 | 中国科学院西安光学精密机械研究所 | 一种三维形貌精确控制加工系统及加工方法 |
| CN113319424B (zh) * | 2021-05-31 | 2022-07-08 | 中国科学院西安光学精密机械研究所 | 一种三维形貌精确控制加工系统及加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3875206A1 (en) | 2021-09-08 |
| CN118237729A (zh) | 2024-06-25 |
| JP7775949B2 (ja) | 2025-11-26 |
| JPWO2020090961A1 (ja) | 2021-09-30 |
| JPWO2020090074A1 (ja) | 2021-09-24 |
| JP7310829B2 (ja) | 2023-07-19 |
| JP2024152899A (ja) | 2024-10-25 |
| JP2024133403A (ja) | 2024-10-01 |
| JP2023126943A (ja) | 2023-09-12 |
| TW202035047A (zh) | 2020-10-01 |
| EP3875206B1 (en) | 2025-12-03 |
| CN118237728A (zh) | 2024-06-25 |
| CN121988868A (zh) | 2026-05-08 |
| WO2020090074A1 (ja) | 2020-05-07 |
| JP7533712B2 (ja) | 2024-08-14 |
| EP3875206A4 (en) | 2022-08-17 |
| WO2020090961A1 (ja) | 2020-05-07 |
| US20210339359A1 (en) | 2021-11-04 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |