JP7310829B2 - 加工システム、及び、加工方法 - Google Patents

加工システム、及び、加工方法 Download PDF

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Publication number
JP7310829B2
JP7310829B2 JP2020554700A JP2020554700A JP7310829B2 JP 7310829 B2 JP7310829 B2 JP 7310829B2 JP 2020554700 A JP2020554700 A JP 2020554700A JP 2020554700 A JP2020554700 A JP 2020554700A JP 7310829 B2 JP7310829 B2 JP 7310829B2
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Prior art keywords
processing
light
measurement
stage
measuring device
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Japanese (ja)
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JPWO2020090074A1 (ja
Inventor
茂樹 江上
陽介 立崎
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Nikon Corp
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Nikon Corp
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Publication of JPWO2020090074A1 publication Critical patent/JPWO2020090074A1/ja
Priority to JP2023111532A priority Critical patent/JP7533712B2/ja
Application granted granted Critical
Publication of JP7310829B2 publication Critical patent/JP7310829B2/ja
Priority to JP2024118560A priority patent/JP2024133403A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
JP2020554700A 2018-10-31 2018-10-31 加工システム、及び、加工方法 Active JP7310829B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023111532A JP7533712B2 (ja) 2018-10-31 2023-07-06 加工システム、及び、加工方法
JP2024118560A JP2024133403A (ja) 2018-10-31 2024-07-24 加工システム、及び、加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/040625 WO2020090074A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023111532A Division JP7533712B2 (ja) 2018-10-31 2023-07-06 加工システム、及び、加工方法

Publications (2)

Publication Number Publication Date
JPWO2020090074A1 JPWO2020090074A1 (ja) 2021-09-24
JP7310829B2 true JP7310829B2 (ja) 2023-07-19

Family

ID=70461831

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2020554700A Active JP7310829B2 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法
JP2020554024A Ceased JPWO2020090961A1 (ja) 2018-10-31 2019-10-31 加工システム、及び、加工方法
JP2023111532A Active JP7533712B2 (ja) 2018-10-31 2023-07-06 加工システム、及び、加工方法
JP2024118560A Pending JP2024133403A (ja) 2018-10-31 2024-07-24 加工システム、及び、加工方法
JP2024139593A Active JP7775949B2 (ja) 2018-10-31 2024-08-21 加工システム、及び、加工方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2020554024A Ceased JPWO2020090961A1 (ja) 2018-10-31 2019-10-31 加工システム、及び、加工方法
JP2023111532A Active JP7533712B2 (ja) 2018-10-31 2023-07-06 加工システム、及び、加工方法
JP2024118560A Pending JP2024133403A (ja) 2018-10-31 2024-07-24 加工システム、及び、加工方法
JP2024139593A Active JP7775949B2 (ja) 2018-10-31 2024-08-21 加工システム、及び、加工方法

Country Status (6)

Country Link
US (1) US20210339359A1 (enExample)
EP (1) EP3875206B1 (enExample)
JP (5) JP7310829B2 (enExample)
CN (3) CN118237728A (enExample)
TW (1) TW202035047A (enExample)
WO (2) WO2020090074A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113319424B (zh) * 2021-05-31 2022-07-08 中国科学院西安光学精密机械研究所 一种三维形貌精确控制加工系统及加工方法
JP2022185291A (ja) * 2021-06-02 2022-12-14 株式会社ニコン 造形装置及び造形方法、並びに、加工装置及び加工方法
WO2024057496A1 (ja) * 2022-09-15 2024-03-21 株式会社ニコン 加工システム、データ構造及び加工方法
WO2024189767A1 (ja) * 2023-03-14 2024-09-19 株式会社ニコン 加工システム及び加工方法
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
EP4663333A1 (en) 2024-06-11 2025-12-17 United Machining Mill SA Laser machining method and laser machine tool for machining a texture or a cavity on a workpiece

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JP2015196264A (ja) 2014-03-31 2015-11-09 三菱重工業株式会社 三次元積層装置及び三次元積層方法
JP5905060B1 (ja) 2014-09-16 2016-04-20 株式会社東芝 積層造形装置および積層造形方法
JP2018149570A (ja) 2017-03-13 2018-09-27 株式会社神戸製鋼所 積層造形物の製造方法、製造システム、及び製造プログラム

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JPH1015684A (ja) * 1996-07-01 1998-01-20 Nikon Corp レーザ加工装置
JPH10109423A (ja) * 1996-10-08 1998-04-28 Fuji Xerox Co Ltd インクジェット記録ヘッドおよびその製造方法、製造装置
JPH115185A (ja) * 1997-06-11 1999-01-12 Nikon Corp レーザ加工装置
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Publication number Priority date Publication date Assignee Title
JP2006119575A (ja) 2004-09-27 2006-05-11 Hitachi Displays Ltd パターン修正装置および表示装置の製造方法
JP2015196264A (ja) 2014-03-31 2015-11-09 三菱重工業株式会社 三次元積層装置及び三次元積層方法
JP5905060B1 (ja) 2014-09-16 2016-04-20 株式会社東芝 積層造形装置および積層造形方法
JP2018149570A (ja) 2017-03-13 2018-09-27 株式会社神戸製鋼所 積層造形物の製造方法、製造システム、及び製造プログラム

Also Published As

Publication number Publication date
CN112930241A (zh) 2021-06-08
EP3875206B1 (en) 2025-12-03
JP2024152899A (ja) 2024-10-25
WO2020090074A1 (ja) 2020-05-07
JP7775949B2 (ja) 2025-11-26
CN118237729A (zh) 2024-06-25
TW202035047A (zh) 2020-10-01
WO2020090961A1 (ja) 2020-05-07
US20210339359A1 (en) 2021-11-04
EP3875206A4 (en) 2022-08-17
JP2023126943A (ja) 2023-09-12
CN118237728A (zh) 2024-06-25
JP2024133403A (ja) 2024-10-01
JPWO2020090961A1 (ja) 2021-09-30
EP3875206A1 (en) 2021-09-08
JP7533712B2 (ja) 2024-08-14
JPWO2020090074A1 (ja) 2021-09-24

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