TW202035047A - 加工系統以及加工方法 - Google Patents

加工系統以及加工方法 Download PDF

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Publication number
TW202035047A
TW202035047A TW108139306A TW108139306A TW202035047A TW 202035047 A TW202035047 A TW 202035047A TW 108139306 A TW108139306 A TW 108139306A TW 108139306 A TW108139306 A TW 108139306A TW 202035047 A TW202035047 A TW 202035047A
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TW
Taiwan
Prior art keywords
processing
light
measurement
workpiece
measuring device
Prior art date
Application number
TW108139306A
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English (en)
Chinese (zh)
Inventor
江上茂樹
立崎陽介
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202035047A publication Critical patent/TW202035047A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
TW108139306A 2018-10-31 2019-10-30 加工系統以及加工方法 TW202035047A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2018/040625 2018-10-31
PCT/JP2018/040625 WO2020090074A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法

Publications (1)

Publication Number Publication Date
TW202035047A true TW202035047A (zh) 2020-10-01

Family

ID=70461831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139306A TW202035047A (zh) 2018-10-31 2019-10-30 加工系統以及加工方法

Country Status (6)

Country Link
US (1) US20210339359A1 (enExample)
EP (1) EP3875206B1 (enExample)
JP (5) JP7310829B2 (enExample)
CN (3) CN118237728A (enExample)
TW (1) TW202035047A (enExample)
WO (2) WO2020090074A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113319424B (zh) * 2021-05-31 2022-07-08 中国科学院西安光学精密机械研究所 一种三维形貌精确控制加工系统及加工方法
JP2022185291A (ja) * 2021-06-02 2022-12-14 株式会社ニコン 造形装置及び造形方法、並びに、加工装置及び加工方法
WO2024057496A1 (ja) * 2022-09-15 2024-03-21 株式会社ニコン 加工システム、データ構造及び加工方法
WO2024189767A1 (ja) * 2023-03-14 2024-09-19 株式会社ニコン 加工システム及び加工方法
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
EP4663333A1 (en) 2024-06-11 2025-12-17 United Machining Mill SA Laser machining method and laser machine tool for machining a texture or a cavity on a workpiece

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049887A (ja) * 1983-08-29 1985-03-19 Mitsubishi Motors Corp レ−ザ溶接方法
JPH0513635A (ja) * 1991-07-02 1993-01-22 Nec Corp タイバー切断方法
JPH08187586A (ja) * 1994-12-28 1996-07-23 Sharp Corp インクジェット記録ヘッド及びその製造方法及びその製造装置
JPH1015684A (ja) * 1996-07-01 1998-01-20 Nikon Corp レーザ加工装置
JPH10109423A (ja) * 1996-10-08 1998-04-28 Fuji Xerox Co Ltd インクジェット記録ヘッドおよびその製造方法、製造装置
JPH115185A (ja) * 1997-06-11 1999-01-12 Nikon Corp レーザ加工装置
JP2000162243A (ja) * 1998-11-30 2000-06-16 Ando Electric Co Ltd 電気光学サンプリングプローバ
JP2001219282A (ja) * 1999-06-30 2001-08-14 Canon Inc レーザ加工方法、該レーザ加工方法を用いたインクジェット記録ヘッドの製造方法、該製造方法で製造されたインクジェット記録ヘッド
US6277659B1 (en) * 1999-09-29 2001-08-21 Advanced Micro Devices, Inc. Substrate removal using thermal analysis
JP3819662B2 (ja) 1999-12-24 2006-09-13 三洋電機株式会社 三次元モデリング装置、方法及び媒体並びに三次形状データ記録装置、方法及び媒体
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP3926620B2 (ja) * 2001-12-19 2007-06-06 日立ビアメカニクス株式会社 レーザ加工装置およびその方法
US7047095B2 (en) * 2002-12-06 2006-05-16 Tokyo Electron Limited Process control system and process control method
JP4688525B2 (ja) * 2004-09-27 2011-05-25 株式会社 日立ディスプレイズ パターン修正装置および表示装置の製造方法
JP5209883B2 (ja) 2006-02-14 2013-06-12 芝浦メカトロニクス株式会社 レーザ加工装置及びレーザ加工方法
JP3938785B2 (ja) * 2006-04-17 2007-06-27 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP4977411B2 (ja) * 2006-07-06 2012-07-18 株式会社ディスコ レーザー加工装置
JP2008032524A (ja) * 2006-07-28 2008-02-14 National Institute Of Advanced Industrial & Technology レーザ加工装置および計測用レーザ光の焦点検出方法
JP2008119716A (ja) * 2006-11-10 2008-05-29 Marubun Corp レーザ加工装置およびレーザ加工装置における焦点維持方法
US8237084B2 (en) * 2006-12-22 2012-08-07 Taylor Fresh Foods, Inc. Laser microperforated fresh produce trays for modified/controlled atmosphere packaging
JP2009045637A (ja) * 2007-08-17 2009-03-05 Fuji Xerox Co Ltd レーザ加工装置
KR100990519B1 (ko) * 2008-08-07 2010-10-29 (주)하드램 레이저를 이용한 기판 절단 장치 및 기판 절단 방법
JP2010082663A (ja) * 2008-09-30 2010-04-15 Sunx Ltd レーザ加工機
CH700111B1 (fr) * 2009-09-25 2010-06-30 Agie Sa Machine d'usinage par laser.
JP2013102019A (ja) * 2011-11-08 2013-05-23 Toshiba Corp 光中継器及びレーザ加工装置
KR101279578B1 (ko) * 2012-04-03 2013-06-27 주식회사 이오테크닉스 레이저 가공용 오토포커싱 장치 및 이를 이용한 오토포커싱 방법
JP6320123B2 (ja) * 2014-03-31 2018-05-09 三菱重工業株式会社 三次元積層装置及び三次元積層方法
CN104907704B (zh) * 2014-04-02 2016-10-05 温州大学 一种变焦距激光精密加工深槽深孔装置
JP6218770B2 (ja) * 2014-06-23 2017-10-25 三菱電機株式会社 レーザ加工装置
JP5905060B1 (ja) * 2014-09-16 2016-04-20 株式会社東芝 積層造形装置および積層造形方法
JP6395586B2 (ja) * 2014-12-15 2018-09-26 株式会社ディスコ 被加工物の分割方法
CN204747769U (zh) * 2015-05-27 2015-11-11 华中科技大学 一种激光在线测量加工检测装置
DE102016124742A1 (de) * 2016-12-19 2018-06-21 GFH GmbH Vorrichtung und Verfahren zur Bearbeitung eines Werkstückes mittels Laserstrahlung
WO2018117510A2 (ko) * 2016-12-23 2018-06-28 주식회사 포스코 방향성 전기강판의 자구미세화 방법과 그 장치
EP3590128A1 (en) * 2017-03-03 2020-01-08 Veeco Precision Surface Processing LLC An apparatus and method for wafer thinning in advanced packaging applications
JP6751040B2 (ja) * 2017-03-13 2020-09-02 株式会社神戸製鋼所 積層造形物の製造方法、製造システム、及び製造プログラム
CN107378255B (zh) * 2017-07-14 2019-03-15 中国科学院微电子研究所 一种激光加工晶圆的方法及装置

Also Published As

Publication number Publication date
CN112930241A (zh) 2021-06-08
EP3875206B1 (en) 2025-12-03
JP2024152899A (ja) 2024-10-25
WO2020090074A1 (ja) 2020-05-07
JP7775949B2 (ja) 2025-11-26
CN118237729A (zh) 2024-06-25
JP7310829B2 (ja) 2023-07-19
WO2020090961A1 (ja) 2020-05-07
US20210339359A1 (en) 2021-11-04
EP3875206A4 (en) 2022-08-17
JP2023126943A (ja) 2023-09-12
CN118237728A (zh) 2024-06-25
JP2024133403A (ja) 2024-10-01
JPWO2020090961A1 (ja) 2021-09-30
EP3875206A1 (en) 2021-09-08
JP7533712B2 (ja) 2024-08-14
JPWO2020090074A1 (ja) 2021-09-24

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