CN118237728A - 加工装置以及加工系统 - Google Patents

加工装置以及加工系统 Download PDF

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Publication number
CN118237728A
CN118237728A CN202410540060.6A CN202410540060A CN118237728A CN 118237728 A CN118237728 A CN 118237728A CN 202410540060 A CN202410540060 A CN 202410540060A CN 118237728 A CN118237728 A CN 118237728A
Authority
CN
China
Prior art keywords
processing
workpiece
light
measurement
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410540060.6A
Other languages
English (en)
Chinese (zh)
Inventor
江上茂树
立崎阳介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN118237728A publication Critical patent/CN118237728A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
CN202410540060.6A 2018-10-31 2019-10-31 加工装置以及加工系统 Pending CN118237728A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PCT/JP2018/040625 WO2020090074A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法
JPPCT/JP2018/040625 2018-10-31
CN201980070423.1A CN112930241A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法
PCT/JP2019/042734 WO2020090961A1 (ja) 2018-10-31 2019-10-31 加工システム、及び、加工方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201980070423.1A Division CN112930241A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法

Publications (1)

Publication Number Publication Date
CN118237728A true CN118237728A (zh) 2024-06-25

Family

ID=70461831

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202410540060.6A Pending CN118237728A (zh) 2018-10-31 2019-10-31 加工装置以及加工系统
CN201980070423.1A Pending CN112930241A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法
CN202410540065.9A Pending CN118237729A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201980070423.1A Pending CN112930241A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法
CN202410540065.9A Pending CN118237729A (zh) 2018-10-31 2019-10-31 加工系统以及加工方法

Country Status (6)

Country Link
US (1) US20210339359A1 (enExample)
EP (1) EP3875206B1 (enExample)
JP (5) JP7310829B2 (enExample)
CN (3) CN118237728A (enExample)
TW (1) TW202035047A (enExample)
WO (2) WO2020090074A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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CN113319424B (zh) * 2021-05-31 2022-07-08 中国科学院西安光学精密机械研究所 一种三维形貌精确控制加工系统及加工方法
JP2022185291A (ja) * 2021-06-02 2022-12-14 株式会社ニコン 造形装置及び造形方法、並びに、加工装置及び加工方法
WO2024057496A1 (ja) * 2022-09-15 2024-03-21 株式会社ニコン 加工システム、データ構造及び加工方法
WO2024189767A1 (ja) * 2023-03-14 2024-09-19 株式会社ニコン 加工システム及び加工方法
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
EP4663333A1 (en) 2024-06-11 2025-12-17 United Machining Mill SA Laser machining method and laser machine tool for machining a texture or a cavity on a workpiece

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JPH08187586A (ja) * 1994-12-28 1996-07-23 Sharp Corp インクジェット記録ヘッド及びその製造方法及びその製造装置
JPH1015684A (ja) * 1996-07-01 1998-01-20 Nikon Corp レーザ加工装置
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JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP3926620B2 (ja) * 2001-12-19 2007-06-06 日立ビアメカニクス株式会社 レーザ加工装置およびその方法
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CN107378255B (zh) * 2017-07-14 2019-03-15 中国科学院微电子研究所 一种激光加工晶圆的方法及装置

Also Published As

Publication number Publication date
CN112930241A (zh) 2021-06-08
EP3875206B1 (en) 2025-12-03
JP2024152899A (ja) 2024-10-25
WO2020090074A1 (ja) 2020-05-07
JP7775949B2 (ja) 2025-11-26
CN118237729A (zh) 2024-06-25
TW202035047A (zh) 2020-10-01
JP7310829B2 (ja) 2023-07-19
WO2020090961A1 (ja) 2020-05-07
US20210339359A1 (en) 2021-11-04
EP3875206A4 (en) 2022-08-17
JP2023126943A (ja) 2023-09-12
JP2024133403A (ja) 2024-10-01
JPWO2020090961A1 (ja) 2021-09-30
EP3875206A1 (en) 2021-09-08
JP7533712B2 (ja) 2024-08-14
JPWO2020090074A1 (ja) 2021-09-24

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