CN112902717B - 蒸发室用片、蒸发室和电子设备 - Google Patents

蒸发室用片、蒸发室和电子设备 Download PDF

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Publication number
CN112902717B
CN112902717B CN202110214684.5A CN202110214684A CN112902717B CN 112902717 B CN112902717 B CN 112902717B CN 202110214684 A CN202110214684 A CN 202110214684A CN 112902717 B CN112902717 B CN 112902717B
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China
Prior art keywords
flow path
region
vapor
evaporation chamber
sheet
Prior art date
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Active
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CN202110214684.5A
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English (en)
Chinese (zh)
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CN112902717A (zh
Inventor
高桥伸一郎
太田贵之
小田和范
武田利彦
竹松清隆
百濑辉寿
中村阳子
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Publication of CN112902717A publication Critical patent/CN112902717A/zh
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Publication of CN112902717B publication Critical patent/CN112902717B/zh
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Fuel Cell (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Push-Button Switches (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CN202110214684.5A 2018-05-30 2019-05-30 蒸发室用片、蒸发室和电子设备 Active CN112902717B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2018-103620 2018-05-30
JP2018103620 2018-05-30
JP2018103633 2018-05-30
JP2018-103633 2018-05-30
CN201980032165.8A CN112166294B (zh) 2018-05-30 2019-05-30 蒸发室和电子设备
PCT/JP2019/021609 WO2019230911A1 (ja) 2018-05-30 2019-05-30 ベーパーチャンバー、及び電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201980032165.8A Division CN112166294B (zh) 2018-05-30 2019-05-30 蒸发室和电子设备

Publications (2)

Publication Number Publication Date
CN112902717A CN112902717A (zh) 2021-06-04
CN112902717B true CN112902717B (zh) 2022-03-11

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CN202110214684.5A Active CN112902717B (zh) 2018-05-30 2019-05-30 蒸发室用片、蒸发室和电子设备
CN201980032165.8A Active CN112166294B (zh) 2018-05-30 2019-05-30 蒸发室和电子设备

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US (3) US11903167B2 (https=)
JP (3) JP6806285B2 (https=)
KR (1) KR102501074B1 (https=)
CN (2) CN112902717B (https=)
TW (3) TWI878179B (https=)
WO (1) WO2019230911A1 (https=)

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JP6888751B2 (ja) 2019-03-11 2021-06-16 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
JP6923091B2 (ja) * 2019-06-21 2021-08-18 株式会社村田製作所 ベーパーチャンバー
US12520457B2 (en) * 2019-09-06 2026-01-06 Dai Nippon Printing Co., Ltd. Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber
JP7565002B2 (ja) * 2020-01-07 2024-10-10 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JPWO2021141110A1 (https=) * 2020-01-10 2021-07-15
TWI738602B (zh) * 2020-01-22 2021-09-01 訊凱國際股份有限公司 多通道薄熱交換器
EP4113596A4 (en) * 2020-02-26 2024-03-27 Kyocera Corporation HEAT DISSIPATION ELEMENT
CN114199056A (zh) * 2020-09-02 2022-03-18 泽鸿(广州)电子科技有限公司 薄型均温板
TWI804767B (zh) * 2020-11-05 2023-06-11 大陸商尼得科巨仲電子（昆山）有限公司 均溫板結構及其毛細層結構
KR20230137960A (ko) * 2021-02-03 2023-10-05 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버용 본체 시트, 베이퍼 챔버 및 전자 기기
WO2022181453A1 (ja) 2021-02-26 2022-09-01 京セラ株式会社 熱デバイス
TWI878479B (zh) * 2021-03-04 2025-04-01 宸寰科技有限公司 薄型化封裝接著結構
KR102851862B1 (ko) * 2021-04-02 2025-08-28 에스케이하이닉스 주식회사 방열 모듈
JP2023006702A (ja) * 2021-06-30 2023-01-18 尼得科超▲しゅう▼科技股▲ふん▼有限公司 熱伝導部材
CN113473807A (zh) * 2021-07-06 2021-10-01 中国电子科技集团公司第三十八研究所 一种基于毛细力驱动的整体式两相流散热装置
TWI872435B (zh) * 2023-01-12 2025-02-11 薩摩亞商塔普林克科技有限公司 整合式均熱板
US20250123059A1 (en) * 2023-10-11 2025-04-17 Dell Products L.P. Wick structure for thin heatpipes
TW202530625A (zh) 2024-01-25 2025-08-01 邁萪科技股份有限公司 溝槽式均溫板毛細回流結構

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JPS5855687A (ja) * 1981-09-29 1983-04-02 Hisateru Akachi ヒ−トパイプのコンテナとその製造方法
JP2000074578A (ja) * 1998-08-28 2000-03-14 Furukawa Electric Co Ltd:The 扁平ヒートパイプとその製造方法
WO2001063195A1 (en) * 2000-02-25 2001-08-30 Fujitsu Limited Thin heat pipe and method of manufacturing the heat pipe
JP2002039693A (ja) * 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
JP2007095762A (ja) * 2005-09-27 2007-04-12 Matsushita Electric Ind Co Ltd フレキシブルヒートパイプ
CN101047045A (zh) * 2006-03-28 2007-10-03 索尼株式会社 板式热输送装置及电子设备
JP2012202570A (ja) * 2011-03-24 2012-10-22 Toshiba Corp 蒸発器及び冷却装置
JP2014142143A (ja) * 2013-01-24 2014-08-07 Ntec Co Ltd ヒートパイプ
CN104976910A (zh) * 2014-04-14 2015-10-14 金兴倍 由具有毛细管力的结构形成的均热板
JP2015219639A (ja) * 2014-05-15 2015-12-07 レノボ・シンガポール・プライベート・リミテッド 携帯用情報機器

Also Published As

Publication number Publication date
JP2021014981A (ja) 2021-02-12
US11903167B2 (en) 2024-02-13
US20250338441A1 (en) 2025-10-30
JP6806285B2 (ja) 2021-01-06
WO2019230911A1 (ja) 2019-12-05
JP6809643B1 (ja) 2021-01-06
CN112166294B (zh) 2023-03-24
KR102501074B1 (ko) 2023-02-21
KR20210016537A (ko) 2021-02-16
CN112166294A (zh) 2021-01-01
JPWO2019230911A1 (ja) 2020-12-17
US12382610B2 (en) 2025-08-05
TWI878179B (zh) 2025-03-21
CN112902717A (zh) 2021-06-04
JP2021055992A (ja) 2021-04-08
US20240130083A1 (en) 2024-04-18
TWI812723B (zh) 2023-08-21
TWI856760B (zh) 2024-09-21
JP7318628B2 (ja) 2023-08-01
TW202012865A (zh) 2020-04-01
US20210168969A1 (en) 2021-06-03
TW202500939A (zh) 2025-01-01
TW202344791A (zh) 2023-11-16

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