CN112625247A - 固化性组合物、其固化物及半导体装置 - Google Patents

固化性组合物、其固化物及半导体装置 Download PDF

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Publication number
CN112625247A
CN112625247A CN202011047701.2A CN202011047701A CN112625247A CN 112625247 A CN112625247 A CN 112625247A CN 202011047701 A CN202011047701 A CN 202011047701A CN 112625247 A CN112625247 A CN 112625247A
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curable composition
cured product
integer
molecule
phenyl
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CN202011047701.2A
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Chinese (zh)
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平野大辅
安田成纪
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN112625247A publication Critical patent/CN112625247A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
CN202011047701.2A 2019-10-08 2020-09-29 固化性组合物、其固化物及半导体装置 Pending CN112625247A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019185531A JP7436175B2 (ja) 2019-10-08 2019-10-08 硬化性組成物、その硬化物、及び半導体装置
JP2019-185531 2019-10-08

Publications (1)

Publication Number Publication Date
CN112625247A true CN112625247A (zh) 2021-04-09

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CN202011047701.2A Pending CN112625247A (zh) 2019-10-08 2020-09-29 固化性组合物、其固化物及半导体装置

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JP (1) JP7436175B2 (ja)
KR (1) KR20210042021A (ja)
CN (1) CN112625247A (ja)
TW (1) TW202128844A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7401247B2 (ja) * 2019-10-08 2023-12-19 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050213926A1 (en) * 2004-03-25 2005-09-29 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device
JP2009173910A (ja) * 2007-12-27 2009-08-06 Nagase Chemtex Corp 硬化性組成物
CN109651420A (zh) * 2017-10-12 2019-04-19 弗洛里光电材料（苏州）有限公司 含三个硅氢键的异氰酸酯化合物及其应用
CN109651419A (zh) * 2017-10-12 2019-04-19 弗洛里光电材料（苏州）有限公司 含多个硅氢键和苯基的异氰酸酯化合物及其应用
CN109836445A (zh) * 2017-10-12 2019-06-04 弗洛里光电材料（苏州）有限公司 含多个硅烷基苯基的异氰酸酯化合物及其应用
CN110294936A (zh) * 2018-03-23 2019-10-01 信越化学工业株式会社 加成固化型硅酮组合物、硅酮固化物及光半导体装置

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Publication number Priority date Publication date Assignee Title
JP3394331B2 (ja) * 1993-08-23 2003-04-07 ナショナル スターチ アンド ケミカル インヴェストメント ホウルディング コーポレイション オルガノシリコーンポリマー用ＳｉＨ末端連鎖伸長剤
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JPH10228249A (ja) 1996-12-12 1998-08-25 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置
JP4286935B2 (ja) 1998-10-14 2009-07-01 株式会社朝日ラバー 調色照明装置
JP2002251918A (ja) * 2001-02-23 2002-09-06 Mitsubishi Paper Mills Ltd 非水系ゲル状組成物、及びこれを用いた電気化学素子
JP2002332417A (ja) * 2001-05-09 2002-11-22 Mitsubishi Paper Mills Ltd 非水系ゲル組成物、およびこれを用いた電気化学素子
JP2003055557A (ja) * 2001-08-21 2003-02-26 Mitsubishi Paper Mills Ltd ゲル状組成物、それをベースとするゲル状イオン伝導性組成物、並びにそれを用いた電気化学素子
CA2573501A1 (en) * 2004-07-14 2006-01-19 3M Espe Ag Dental composition containing si-h functional carbosilane components
JP5539252B2 (ja) * 2011-03-24 2014-07-02 信越化学工業株式会社 硬化性組成物
JP6038824B2 (ja) * 2014-02-07 2016-12-07 信越化学工業株式会社 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物
TWI743440B (zh) * 2018-01-31 2021-10-21 日商信越化學工業股份有限公司 紅外線穿透性硬化型組成物、其硬化物及光半導體裝置
JP6981933B2 (ja) * 2018-08-15 2021-12-17 信越化学工業株式会社 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置
JP7401247B2 (ja) * 2019-10-08 2023-12-19 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050213926A1 (en) * 2004-03-25 2005-09-29 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device
JP2009173910A (ja) * 2007-12-27 2009-08-06 Nagase Chemtex Corp 硬化性組成物
CN109651420A (zh) * 2017-10-12 2019-04-19 弗洛里光电材料（苏州）有限公司 含三个硅氢键的异氰酸酯化合物及其应用
CN109651419A (zh) * 2017-10-12 2019-04-19 弗洛里光电材料（苏州）有限公司 含多个硅氢键和苯基的异氰酸酯化合物及其应用
CN109836445A (zh) * 2017-10-12 2019-06-04 弗洛里光电材料（苏州）有限公司 含多个硅烷基苯基的异氰酸酯化合物及其应用
CN110294936A (zh) * 2018-03-23 2019-10-01 信越化学工业株式会社 加成固化型硅酮组合物、硅酮固化物及光半导体装置

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JP7436175B2 (ja) 2024-02-21
TW202128844A (zh) 2021-08-01
KR20210042021A (ko) 2021-04-16
JP2021059684A (ja) 2021-04-15

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