CN112397308B - 薄膜电容器芯子 - Google Patents

薄膜电容器芯子

Info

Publication number
CN112397308B
CN112397308B CN202011267506.0A CN202011267506A CN112397308B CN 112397308 B CN112397308 B CN 112397308B CN 202011267506 A CN202011267506 A CN 202011267506A CN 112397308 B CN112397308 B CN 112397308B
Authority
CN
China
Prior art keywords
waterproof layer
base film
film
layer
film capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011267506.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN112397308A (zh
Inventor
林晋涛
兰韶涵
张文刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN FARATRONIC CO Ltd
Original Assignee
XIAMEN FARATRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN FARATRONIC CO Ltd filed Critical XIAMEN FARATRONIC CO Ltd
Priority to CN202011267506.0A priority Critical patent/CN112397308B/zh
Publication of CN112397308A publication Critical patent/CN112397308A/zh
Priority to US18/036,426 priority patent/US20240021374A1/en
Priority to JP2023528618A priority patent/JP7578820B2/ja
Priority to EP21890904.2A priority patent/EP4246544A4/en
Priority to PCT/CN2021/124640 priority patent/WO2022100377A1/zh
Application granted granted Critical
Publication of CN112397308B publication Critical patent/CN112397308B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202011267506.0A 2020-11-13 2020-11-13 薄膜电容器芯子 Active CN112397308B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202011267506.0A CN112397308B (zh) 2020-11-13 2020-11-13 薄膜电容器芯子
US18/036,426 US20240021374A1 (en) 2020-11-13 2021-10-19 Thin-Film Capacitor Core
JP2023528618A JP7578820B2 (ja) 2020-11-13 2021-10-19 フィルムコンデンサコア
EP21890904.2A EP4246544A4 (en) 2020-11-13 2021-10-19 Thin-film capacitor core
PCT/CN2021/124640 WO2022100377A1 (zh) 2020-11-13 2021-10-19 薄膜电容器芯子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011267506.0A CN112397308B (zh) 2020-11-13 2020-11-13 薄膜电容器芯子

Publications (2)

Publication Number Publication Date
CN112397308A CN112397308A (zh) 2021-02-23
CN112397308B true CN112397308B (zh) 2025-12-09

Family

ID=74599316

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011267506.0A Active CN112397308B (zh) 2020-11-13 2020-11-13 薄膜电容器芯子

Country Status (5)

Country Link
US (1) US20240021374A1 (https=)
EP (1) EP4246544A4 (https=)
JP (1) JP7578820B2 (https=)
CN (1) CN112397308B (https=)
WO (1) WO2022100377A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112397308B (zh) * 2020-11-13 2025-12-09 厦门法拉电子股份有限公司 薄膜电容器芯子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287829A (ja) * 2006-04-14 2007-11-01 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2007311625A (ja) * 2006-05-19 2007-11-29 Hitachi Aic Inc 金属化フィルムコンデンサ
CN214624759U (zh) * 2020-11-13 2021-11-05 厦门法拉电子股份有限公司 薄膜电容器芯子、薄膜电容器以及印制电路板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603373A (en) * 1983-07-13 1986-07-29 Electronic Concepts, Inc. Outer wrapping for a metallized wound capacitor
US5032950A (en) * 1989-12-20 1991-07-16 Electronic Concepts, Inc. Cuffed tape wrap and fill wound capacitor
JP2009283270A (ja) * 2008-05-22 2009-12-03 Panasonic Corp 非水系二次電池用電極板およびその製造方法、並びにそれを用いた非水系二次電池
CN102468052B (zh) * 2010-11-08 2016-01-20 佛山市南海区欣源电子有限公司 有感串联结构高压薄膜电容器及制造方法
JP5792676B2 (ja) * 2012-05-22 2015-10-14 トヨタ自動車株式会社 フィルムコンデンサ
CN102881452A (zh) * 2012-10-18 2013-01-16 厦门法拉电子股份有限公司 一种防潮的金属化薄膜电容器
JP2015053331A (ja) * 2013-09-05 2015-03-19 トヨタ自動車株式会社 フィルムコンデンサ
CN106480406B (zh) * 2016-10-17 2018-11-13 东丽薄膜加工（中山）有限公司 金属化薄膜及其制备方法和电容器
CN206451602U (zh) * 2016-12-30 2017-08-29 扬州日精电子有限公司 一种金属化薄膜电容器
CN107464694A (zh) * 2017-08-03 2017-12-12 安徽省宁国市海伟电子有限公司 一种防腐蚀的金属化薄膜
CN108538578A (zh) * 2018-05-11 2018-09-14 长兴友畅电子有限公司 一种基于纳米蒸镀金属化薄膜技术的电容及其制备工艺
JP7300637B2 (ja) * 2019-02-20 2023-06-30 パナソニックＩｐマネジメント株式会社 ケースレスフィルムコンデンサの製造方法
JP7390559B2 (ja) * 2019-03-26 2023-12-04 パナソニックＩｐマネジメント株式会社 コンデンサ
CN110164691A (zh) * 2019-05-06 2019-08-23 艾华新动力电容(苏州)有限公司 一种高耐湿性金属化聚丙烯薄膜电容器及其加工方法
CN210378771U (zh) * 2019-05-31 2020-04-21 东莞市纬迪实业有限公司 一种防潮薄膜电容器
CN112397308B (zh) * 2020-11-13 2025-12-09 厦门法拉电子股份有限公司 薄膜电容器芯子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287829A (ja) * 2006-04-14 2007-11-01 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2007311625A (ja) * 2006-05-19 2007-11-29 Hitachi Aic Inc 金属化フィルムコンデンサ
CN214624759U (zh) * 2020-11-13 2021-11-05 厦门法拉电子股份有限公司 薄膜电容器芯子、薄膜电容器以及印制电路板

Also Published As

Publication number Publication date
JP7578820B2 (ja) 2024-11-06
US20240021374A1 (en) 2024-01-18
WO2022100377A1 (zh) 2022-05-19
EP4246544A1 (en) 2023-09-20
CN112397308A (zh) 2021-02-23
EP4246544A4 (en) 2025-01-15
JP2023552972A (ja) 2023-12-20

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