WO2022100377A1 - 薄膜电容器芯子 - Google Patents

薄膜电容器芯子 Download PDF

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Publication number
WO2022100377A1
WO2022100377A1 PCT/CN2021/124640 CN2021124640W WO2022100377A1 WO 2022100377 A1 WO2022100377 A1 WO 2022100377A1 CN 2021124640 W CN2021124640 W CN 2021124640W WO 2022100377 A1 WO2022100377 A1 WO 2022100377A1
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WO
WIPO (PCT)
Prior art keywords
waterproof layer
film
base film
film capacitor
layer
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PCT/CN2021/124640
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English (en)
French (fr)
Inventor
林晋涛
兰韶涵
张文刚
Original Assignee
厦门法拉电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 厦门法拉电子股份有限公司 filed Critical 厦门法拉电子股份有限公司
Priority to EP21890904.2A priority Critical patent/EP4246544A1/en
Priority to JP2023528618A priority patent/JP2023552972A/ja
Priority to US18/036,426 priority patent/US20240021374A1/en
Publication of WO2022100377A1 publication Critical patent/WO2022100377A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • the invention relates to the technical field of capacitors, in particular to a film capacitor core, a film capacitor loaded with the core and a printed circuit board loaded with the film capacitor.
  • Capacitors are one of the most widely used electronic components in electronic equipment, and are widely used in DC blocking, coupling, bypassing, filtering, tuning circuits, energy conversion and control circuits, etc. Film capacitors are widely used in circuit cross-line anti-electromagnetic interference , in the PCB board circuit of AC and DC filtering; most electrical appliances and electrical equipment operate in the indoor environment, with good temperature and humidity conditions; but with the development of new energy technology, such as photovoltaic inverters, charging piles and other outdoor Installation equipment; its environmental conditions are relatively harsh, and the continuous operation time is long; higher humidity and heat reliability requirements are put forward for the electronic components on the PCB board.
  • the core of the film capacitor is additionally coated with aluminum foil by means of artificial processing.
  • This method makes the production of the core of the film capacitor consume a lot of human resources, and the production of the core of the film capacitor requires a lot of human resources. The efficiency is low; or, the core of the film capacitor is not covered, the thickness of the film capacitor packaging material is increased, and the packaging material with better moisture resistance is used.
  • this method can also improve the moisture resistance of the film capacitor, it makes the final film Capacitors are oversized and cost-increasing, making them uncompetitive.
  • an object of the present invention is to provide a film capacitor core, using the coating film of the present invention to replace the original protective film of the film capacitor core, so that the waterproof coating process of the film capacitor core can be produced by producing the core.
  • the mechanical winding of the main body is completed, and further, on the premise of ensuring the production efficiency of the film capacitor core, the moisture resistance of the film capacitor core is improved.
  • the first aspect of the present invention provides a film capacitor core, which includes a core body, a coating film and a gold spray layer, and a coating film is wound on the peripheral outer surface of the core body,
  • the coating film includes a base film and a waterproof layer, the base film is attached with a waterproof layer, and the gold spray layers are arranged on both ends of the core body to form electrodes.
  • the film capacitor core according to the embodiment of the present invention includes a core body, a coating film and a gold spray layer, a coating film is wound on the peripheral outer surface of the core body, and the coating film includes a base film and a waterproof layer , and a waterproof layer is attached to the base film, and the sprayed gold layer is arranged at both ends of the core body to form electrodes, so that the waterproof coating process of the film capacitor core can be completed by the winding machine that produces the core body, and then , On the premise of ensuring the production efficiency of the film capacitor core, the moisture resistance of the film capacitor core is improved.
  • film capacitor core proposed according to the above embodiments of the present invention may also have the following additional technical features:
  • the gold spray layer covers at least one outer periphery of the waterproof layer.
  • the waterproof layer is a metal waterproof layer.
  • the waterproof layer is a metal oxide waterproof layer.
  • the waterproof layer is attached to the outer surface of one side of the base film, the width of the base film is consistent with the width of the core body, and a part of the waterproof layer is left blank to pass through the part.
  • the blank areas form electrical clearances.
  • part of the blank area of the waterproof layer is a single blank area, and the single blank area runs through the waterproof layer along the length direction of the waterproof layer.
  • part of the blank area of the waterproof layer is a plurality of blank areas, and the multiple blank areas are evenly distributed along the length direction of the waterproof layer.
  • the waterproof layer includes a first waterproof layer and a second waterproof layer, the first waterproof layer and the second waterproof layer are respectively attached to the outer surfaces of both sides of the base film, and the base film is The width is the same as the width of the core body, and both the first waterproof layer and the second waterproof layer are partially left blank, so as to form an electrical gap through the blank.
  • the base film includes a first base film and a second base film
  • the waterproof layer includes a first waterproof layer and a second waterproof layer
  • the first waterproof layer is attached to one side of the first base film
  • the second waterproof layer is attached to the outer surface of one side of the second base film
  • the first waterproof layer and the second waterproof layer are partially left blank
  • the first waterproof layer is dislocated from the blank area of the second waterproof layer.
  • the blank area of the first waterproof layer is located at the first end of the first base film
  • the blank area of the second waterproof layer is located at the second end of the second base film
  • the The first end is located opposite the second end.
  • a gap is provided at both ends of the waterproof layer close to the gold spray layer, and the width of the gap is smaller than the tolerance distance of the gold spray layer.
  • the base film includes a first base film and a second base film
  • the waterproof layer includes a first waterproof layer and a second waterproof layer
  • the first waterproof layer is attached to one side of the first base film
  • the second waterproof layer is attached to the outer surface of one side of the second base film
  • the first base film and the first waterproof layer have the same width
  • the second base film and the first waterproof layer have the same width.
  • the two waterproof layers are of equal width
  • a gap is set between the first base film and the first end of the first waterproof layer and the gold spray layer
  • the second base film and the first end of the second waterproof layer are provided with a gap.
  • There is a gap between the two ends and the gold spray layer, and the first end of the first base film and the first waterproof layer is opposite to the second end of the second base film and the second waterproof layer .
  • an embodiment of the second aspect of the present invention provides a film capacitor, which includes the above-mentioned film capacitor core.
  • the film capacitor of the embodiment of the present invention by loading the above-mentioned film capacitor core, the production efficiency of the film capacitor can be ensured, and at the same time, the moisture resistance of the film capacitor can be improved, so that it is suitable for high temperature and humid environment.
  • the embodiment of the third aspect of the present invention provides a printed circuit board, and the above-mentioned film capacitor is mounted on the printed circuit board.
  • the printed circuit board of the embodiment of the present invention by loading the above-mentioned film capacitor, the production efficiency of the printed circuit board is ensured, and at the same time, the moisture resistance of the printed circuit board is improved, and the printed circuit board is suitable for high temperature and humid environment.
  • FIG. 1 is a schematic structural diagram of a film capacitor core according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional structural diagram of a film capacitor core according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a coating film provided on one side of a waterproof layer according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a unilateral arrangement of a waterproof layer according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a unilateral arrangement of a waterproof layer according to another embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a unilateral arrangement of a waterproof layer according to another embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a double-sided arrangement of a waterproof layer according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a coating film according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a coating film according to another embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a coating film according to another embodiment of the present invention.
  • the core of the film capacitor is often covered with aluminum foil by means of artificial processing.
  • This method makes the production of the core of the film capacitor consume a lot of human resources, and the production efficiency of the core of the film capacitor is low. , and if the coating of the core is abandoned, the final film capacitor will have poor moisture resistance, and it is difficult to be suitable for use in a high temperature and humid environment;
  • the film capacitor core according to the embodiment of the present invention includes a core body, a coating film and gold spray layer, a coating film is wound on the peripheral outer surface of the core body, the coating film includes a base film and a waterproof layer, and a waterproof layer is attached to the base film, and the gold spray layer is arranged on the core body
  • the two ends are formed to form electrodes; so that the waterproof coating process of the film capacitor core can be completed by the winding machine that produces the core body, and then, under the premise of ensuring the production efficiency of the film capacitor core, the film capacitor core can be improved. moisture resistance.
  • FIG. 1 is a schematic structural diagram of a film capacitor core according to an embodiment of the present invention.
  • the film capacitor includes a core body 10 , a coating film 20 and a gold spray layer 30 .
  • the outer peripheral surface of the core body 10 is wound with a coating film 20, the coating film 20 includes a base film 21 and a waterproof layer 22, and the waterproof layer 22 is attached to the base film 21; the gold spray layer 30 is disposed on the core Both ends of the body 10 to form electrodes. Therefore, the coating film 20 can be directly wound on the core body 10 in a winding manner through the winding machine for producing the film capacitor core body, and further, the winding operation does not require any additional expenditure, and at the same time, It ensures the moisture resistance of the film capacitor core, making it suitable for high temperature and humid working environment.
  • the gold spray layer 30 covers at least one outer periphery of the waterproof layer 22 , so that the close contact between the gold spray layer 30 and the waterproof layer 22 can prevent the water vapor from the edge of the gold spray layer 30 from penetrating into the core body 10 , to further improve the moisture resistance of the film capacitor core.
  • the waterproof layer 22 may be a metal waterproof layer or a metal oxide waterproof layer; and when the waterproof layer 22 is a metal waterproof layer, an electrical gap needs to be formed to prevent short circuit.
  • the waterproof layer 22 is a metal waterproof layer
  • the waterproof layer 22 is attached to one outer surface of the base film 21 , and the width of the base film 21 is consistent with the width of the core body 10 to ensure the waterproof effect of the covering film 20 , A partial area of the waterproof layer 22 is left blank to form an electrical gap through the partially blank area.
  • part of the blank area of the waterproof layer 22 is a single blank area, and the single blank area runs through the waterproof layer 22 along the length direction of the waterproof layer 22 ; it should be noted that, as shown in FIG. 4, the opening position of the single blank area can be various, for example, the single blank area is opened in the middle of the waterproof layer 22; or the single blank area is opened at the end of the waterproof layer 22.
  • the waterproof layer 22 can be arranged on the side close to the core body 10 , or can be arranged on the side away from the core body 10 .
  • the film capacitor core claimed in the present invention is not limited to this; and, the single blank area is preferably a rectangular space, not only a rectangular space, any space that does not affect the formation of electrical gaps All shapes are acceptable.
  • some blank areas of the waterproof layer 22 are multiple blank areas, and the multiple blank areas are evenly distributed along the length direction of the waterproof layer 22 .
  • the waterproof layer 22 includes a first waterproof layer 221 and a second waterproof layer 222 , and the first waterproof layer 221 and the second waterproof layer 222 are respectively attached to the outer surfaces of both sides of the base film 21 .
  • the width of the base film 21 is the same as the width of the core body 10 , and the first waterproof layer 221 and the second waterproof layer 222 are partially left blank to form an electrical gap.
  • the waterproof layer 22 is attached to the outer surface of one side of the base film 21, there are many ways to attach the waterproof layer 22 to the base film 21 on one side; There are also various combinations on the membrane 21 .
  • the blank areas on both sides are located in the middle of the base film 21; alternatively, one of the blank areas may be located in the middle of the first waterproof layer 221, and the other side may be located at the center of the first waterproof layer 221.
  • the end of the second waterproof layer 222; or, one side of the blank area is located in the middle of the first waterproof layer 221, and the other layer is a plurality of rectangular blank areas evenly distributed. It can be understood that by attaching the waterproof layer 22 to the base film 21 on both sides, the moisture resistance of the film capacitor core after the wrapping film 20 is wound can be further improved.
  • the base film 21 includes a first base film 211 and a second base film 222
  • the waterproof layer 22 includes a first base film 211 and a second base film 222 .
  • a waterproof layer 221 and a second waterproof layer 222 the first waterproof layer 221 is attached to the outer surface of one side of the first base film 211
  • the second waterproof layer 221 is attached to the outer surface of one side of the second base film 222
  • Both the layer 221 and the second waterproof layer 222 are partially left blank, and the blank area of the first waterproof layer and the blank area of the second waterproof layer are dislocated.
  • the staggered arrangement of the blank areas of the second waterproof layer can make the first waterproof layer 221 and the second waterproof layer 222 form a complementary relationship, thereby making it difficult for ions to penetrate into the core body 10 and further improving the moisture resistance.
  • first base film 211 the second base film 222 , the first waterproof layer 221 and the second waterproof layer 222 .
  • the blank area of the first waterproof layer 221 is located at the first end of the first base film 211
  • the blank area of the second waterproof layer 222 is located at the second end of the second base film 212 .
  • the first end is opposite to the second end, and the blank area is staggered, so that the first waterproof layer 221 and the second waterproof layer 222 form a complementary relationship.
  • the blank area of the first waterproof layer 221 is located on the side of the first base film 211
  • the blank area of the second waterproof layer 222 is located on the second base film 212 relative to the first base film 212 .
  • the other side of one base film side is to stagger the two blank areas, so that the first waterproof layer 221 and the second waterproof layer 222 form a complementary relationship.
  • the blank area of the first waterproof layer 221 is located in the middle of the first base film 211 , and the blank areas of the second waterproof layer 222 are evenly distributed in the second base film 212
  • the blank area of the first waterproof layer 221 is staggered from the blank areas of the second waterproof layer 222 , so that the first waterproof layer 221 and the second waterproof layer 222 form a complementary relationship.
  • a gap is provided at both ends of the waterproof layer 20 close to the gold spray layer, and the width of the gap is smaller than the tolerance distance of the gold spray layer.
  • the gold spray layer has a certain tolerance. Therefore, the end of the waterproof layer 20 does not necessarily have to be flush with the end of the core body 10 .
  • the base film 21 includes a first base film 211 and a second base film 212
  • the waterproof layer 22 includes a first waterproof layer 221 and a second waterproof layer 222
  • the first waterproof layer 221 is attached On the outer surface of one side of the first base film 211
  • the second waterproof layer 222 is attached to the outer surface of one side of the second base film 212
  • the first base film 211 and the first waterproof layer 221 are of equal width
  • the second waterproof layer 222 has the same width, and a gap is provided between the first end of the first base film 211 and the first waterproof layer 221 and the gold spray layer to form an electrical gap through the gap.
  • the second base film 212 and the second waterproof layer A gap is provided between the second end of the layer 222 and the gold spray layer to form an electrical gap through the gap, and the first end of the first base film 211 and the first waterproof layer 221 and the second base film 212 and the second waterproof layer
  • the second ends of 222 are opposite to each other, so that the waterproof structures of the first base film 211 and the first waterproof layer 221 and the waterproof structures of the second base film 212 and the second waterproof layer 222 form a complementary relationship.
  • the film capacitor core includes a core body, a coating film and a gold spray layer, and a coating film is wound on the peripheral outer surface of the core body, and the coating film includes The base film and the waterproof layer, and the waterproof layer is attached to the base film, and the gold spray layer is arranged on both ends of the core body to form electrodes, so that the waterproof coating process of the film capacitor core can be produced by the winding machine of the core body.
  • the winding is completed, and further, on the premise of ensuring the production efficiency of the film capacitor core, the moisture resistance of the film capacitor core is improved.
  • the embodiments of the present invention provide a film capacitor, which includes the above-mentioned film capacitor core.
  • the film capacitor of the embodiment of the present invention by loading the above-mentioned film capacitor core, the production efficiency of the film capacitor can be ensured, and at the same time, the moisture resistance of the film capacitor can be improved, making it suitable for high temperature and humid environment.
  • the embodiment of the present invention provides a printed circuit board, and the above-mentioned film capacitor is mounted on the printed circuit board.
  • the printed circuit board of the embodiment of the present invention by loading the above-mentioned film capacitor, the production efficiency of the printed circuit board is ensured, and at the same time, the moisture resistance of the printed circuit board is improved, and the printed circuit board is suitable for high temperature and humid environment.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • “plurality” means two or more, unless otherwise expressly and specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements.
  • installed may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements.
  • a first feature "on” or “under” a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

Abstract

本发明提出了一种薄膜电容器芯子、薄膜电容器和印制电路板，其中，薄膜电容器芯子包括芯子本体、包覆膜和喷金层，所述芯子本体的周向外表面上卷绕有所述包覆膜，其中，所述包覆膜包括基膜和防水层，所述基膜上附着所述防水层，喷金层设置在芯子本体两端以形成电极。以使得薄膜电容器芯子的防水包覆过程可以通过生产芯子本体的卷绕机械卷绕完成，进而，在保证薄膜电容器芯子生产效率的前提下，提高薄膜电容器芯子的耐湿性能。

Description

薄膜电容器芯子 技术领域
本发明涉及电容器技术领域，特别涉及一种薄膜电容器芯子、一种装载有该芯子的薄膜电容器和一种装载有该薄膜电容器的印制电路板。
背景技术
电容器是电子设备中大量使用的电子元件之一，广泛应用于隔直、耦合、旁路、滤波、调谐回路、能量转换和控制电路等方面；而薄膜电容器则广泛应用于电路跨线抗电磁干扰、交流直流滤波的PCB板电路中；大部分电器和电气设备均运行在室内环境，有着较好的温度、湿度条件；但随着新能源技术的发展，如光伏逆变器、充电桩等室外安装设备；其环境条件相对恶劣，且连续运行时间长；对PCB板上的电子元件提出了更高的湿热可靠性要求。
相关技术中，多采用通过人为加工的方式以铝箔对薄膜电容器的芯子进行额外的包覆，这种方式使得薄膜电容器的芯子生产需要耗费大量的人力资源，并且，薄膜电容器的芯子生产效率低下；或者，不对薄膜电容器的芯子进行包覆，增加薄膜电容器封装材料厚度、使用防潮性更好的封装材料，这种方式虽然也能提高薄膜电容器的耐湿性能，却使得最终得到的薄膜电容器的尺寸过大、成本增加，没有竞争力。
发明内容
本发明旨在至少在一定程度上解决上述技术中的技术问题之一。为此，本发明的一个目的在于提出一种薄膜电容器芯子，使用本发明的包覆膜替代薄膜电容器芯子的原有保护膜，使得薄膜电容器芯子的防水包覆过程可以通过生产芯子本体的卷绕机械卷绕完成，进而，在保证薄膜电容器芯子生产效率的前提下，提高薄膜电容器芯子的耐湿性能。
为达到上述目的，本发明第一方面实施例提出了一种薄膜电容器芯子，包括芯子本体、包覆膜和喷金层，芯子本体的周向外表面上卷绕有包覆膜，其中，包覆膜包括基膜和防水层，基膜上附着防水层，所述喷金层设置在芯子本体两端以形成电极。
根据本发明实施例的薄膜电容器芯子，包括芯子本体、包覆膜和喷金层，芯子本体的周向外表面上卷绕有包覆膜，该包覆膜包括基膜和防水层，并且，基膜上附着防水层，喷金层设置在芯子本体两端以形成电极，以使得薄膜电容器芯子的防水包覆过程可以通过生产芯子本体的卷绕机械卷绕完成，进而，在保证薄膜电容器芯子生产效率的前提下，提高 薄膜电容器芯子的耐湿性能。
另外，根据本发明上述实施例提出的薄膜电容器芯子还可以具有如下附加的技术特征：
可选地，所述喷金层覆盖所述防水层至少一侧外周沿。
可选地，所述防水层为金属防水层。
可选地，所述防水层为金属氧化物防水层。
可选地，所述防水层附着在所述基膜一侧外表面上，所述基膜的宽度与所述芯子本体的宽度一致，所述防水层的部分区域留白，以通过该部分留白区域形成电气间隙。
可选地，所述防水层的部分留白区域为单一留白区域，且该单一留白区域沿所述防水层长度方向贯穿所述防水层。
可选地，所述防水层的部分留白区域为多个留白区域，所述多个留白区域沿所述防水层长度方向均匀分布。
可选地，所述防水层包括第一防水层和第二防水层，所述第一防水层和所述第二防水层分别附着在所述基膜两侧外表面上，所述基膜的宽度与所述芯子本体的宽度一致，所述第一防水层和所述第二防水层均部分区域留白，以通过留白形成电气间隙。
可选地，所述基膜包括第一基膜、第二基膜，所述防水层包括第一防水层、第二防水层，所述第一防水层附着在所述第一基膜一侧外表面上，所述第二防水层附着在所述第二基膜一侧外表面上，所述第一防水层和所述第二防水层均部分区域留白，且所述第一防水层的留白区域与所述第二防水层的留白区域错位设置。
可选地，所述第一防水层的留白区域位于所述第一基膜的第一端，所述第二防水层的留白区域位于所述第二基膜的第二端，所述第一端与所述第二端位置相对。
可选地，所述防水层靠近所述喷金层的两端设有间隙，且该间隙的宽度小于喷金层的容差距离。
可选地，所述基膜包括第一基膜、第二基膜，所述防水层包括第一防水层、第二防水层，所述第一防水层附着在所述第一基膜一侧外表面上，所述第二防水层附着在所述第二基膜一侧外表面上，所述第一基膜和所述第一防水层等宽，所述第二基膜和所述第二防水层等宽，所述第一基膜和所述第一防水层的第一端与所述喷金层之间设有间隙，所述第二基膜和所述第二防水层的第二端与所述喷金层之间设有间隙，所述一基膜和所述第一防水层的第一端与所述第二基膜和所述第二防水层的第二端位置相对。
为达到上述目的，本发明第二方面实施例提出了一种薄膜电容器，该薄膜电容器包括上述的薄膜电容器芯子。
根据本发明实施例的薄膜电容器，通过装载上述的薄膜电容器芯子，能够保证薄膜电 容器的生产效率，同时，提高薄膜电容器的耐湿性能，使其适用于高温潮湿的环境。
为达到上述目的，本发明第三方面实施例提出了一种印制电路板，该印制电路板上装载有如上述的薄膜电容器。
根据本发明实施例的印制电路板，通过装载如上述的薄膜电容器，保证了印制电路板的生产效率，同时，使得印制电路板的耐湿性能提高，适用于高温潮湿环境。
附图说明
图1为根据本发明实施例的薄膜电容器芯子的结构示意图；
图2为根据本发明一实施例的薄膜电容器芯子剖面结构示意图；
图3为根据本发明实施例的防水层单侧设置包覆膜结构示意图；
图4为根据本发明实施例的防水层单侧设置方式示意图；
图5为根据本发明另一实施例的防水层单侧设置方式示意图；
图6为根据本发明又一实施例的防水层单侧设置方式示意图；
图7为根据本发明实施例的防水层双侧设置方式示意图；
图8为根据本发明一实施例的包覆膜结构示意图；
图9为根据本发明另一实施例的包覆膜结构示意图；
图10为根据本发明又一实施例的包覆膜结构示意图。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
相关技术中，多采用通过人为加工的方式以铝箔对薄膜电容器的芯子进行包覆，这种方式使得薄膜电容器的芯子生产需要耗费大量的人力资源，并且，薄膜电容器的芯子生产效率低下，而如果放弃对芯子的包覆，则会使得最终得到的薄膜电容器耐湿性能差，难以适用于高温潮湿的使用环境；根据本发明实施例的薄膜电容器芯子，包括芯子本体、包覆膜和喷金层，芯子本体的周向外表面上卷绕有包覆膜，该包覆膜包括基膜和防水层，并且，基膜上附着防水层，喷金层设置在芯子本体两端以形成电极；以使得薄膜电容器芯子的防水包覆过程可以通过生产芯子本体的卷绕机械卷绕完成，进而，在保证薄膜电容器芯子生产效率的前提下，提高薄膜电容器芯子的耐湿性能。
为了更好的理解上述技术方案，下面将参照附图更详细地描述本发明的示例性实施例。虽然附图中显示了本发明的示例性实施例，然而应当理解，可以以各种形式实现本发明而 不应被这里阐述的实施例所限制。相反，提供这些实施例是为了能够更透彻地理解本发明，并且能够将本发明的范围完整的传达给本领域的技术人员。
为了更好的理解上述技术方案，下面将结合说明书附图以及具体的实施方式对上述技术方案进行详细的说明。
图1为根据本发明实施例的薄膜电容器芯子的结构示意图，如图1所示，该薄膜电容器包括芯子本体10、包覆膜20和喷金层30。
其中，芯子本体10的周向外表面上卷绕有包覆膜20，包覆膜20包括基膜21和防水层22，基膜21上附着防水层22；喷金层30设置在芯子本体10两端以形成电极。从而，该包覆膜20可以直接通过生产薄膜电容器芯子本体的卷绕机械以卷绕的方式直接卷绕在芯子本体10上，进而，该卷绕操作无需增加任何的额外支出，同时，保证了薄膜电容器芯子的耐湿性能耐湿性能，使其适用于高温潮湿的工作环境。
在一些实施例中，喷金层30覆盖防水层22至少一侧外周沿，从而，通过喷金层30与防水层22的紧密接触，可以防止喷金层30边缘部位水汽渗透入芯子本体10，进一步提高薄膜电容器芯子的耐湿性能。
需要说明的是，防水层22可以是金属防水层，也可以是金属氧化物防水层；而当防水层22为金属防水层时，需要形成电气间隙，以防止短路。
其中，当防水层22为金属防水层时，基膜21上附着防水层22的方式可以有多种。
在一些实施例中，如图2所示，防水层22附着在基膜21的一侧外表面上，基膜21的宽度与芯子本体10的宽度一致以保证包覆膜20的防水效果，防水层22的部分区域留白，以通过该部分留白区域形成电气间隙。
其中，留白区域的设置方式可以有多种。
作为一种示例，如图3所示，防水层22的部分留白区域为单一留白区域，且该单一留白区域沿防水层22的长度方向贯穿防水层22；需要说明的是，如图4所示，该单一留白区域的开设位置可以有多种，例如，将该单一留白区域开设在防水层22的中部；或者将该单一留白区域开设在防水层22的端部。
需要说明的是，如图5所示，将防水层22附着在基膜21的一侧外表面上的过程中，防水层22可以设置在靠近芯子本体10一侧，也可以设置在远离芯子本体10一侧，本发明要求保护的薄膜电容器芯子并不以此为限；并且，该单一留白区域只是优选为矩形空间，并非只能是矩形空间，任何不影响电气间隙形成的空间形状均是可以被接受的。
作为另一种示例，如图6所示，防水层22的部分留白区域为多个留白区域，多个留白区域沿防水层22长度方向均匀分布。
在一些实施例中，如图7所示，防水层22包括第一防水层221和第二防水层222，第一防水层221和第二防水层222分别附着在基膜21的两侧外表面上，基膜21的宽度与芯 子本体10的宽度一致，第一防水层221和第二防水层222均部分区域留白，以通过留白形成电气间隙。
可以理解，由上述防水层22附着在基膜21一侧外表面的描述可知，防水层22单侧附着在基膜21上的方式可以有多种；因此，将防水层22双侧附着在基膜21上的组合方式也可以有多种。例如，如图7所示，两侧的留白区域均位于基膜21的中部；或者，其中一侧可以为留白区域位于第一防水层221的中部，而另一侧为留白区域位于第二防水层222的端部；或者，其中一侧为留白区域位于第一防水层221的中部，而另一层为多个矩形留白区域均匀分布。可以理解，通过将防水层22双侧附着在基膜21上，可以进一步提高卷绕包覆膜20后的薄膜电容器芯子的耐湿性能。
在一些实施例中，如图8所示，为了进一步提高本发明实施例提出的薄膜电容器芯子的耐湿性能，基膜21包括第一基膜211和第二基膜222，防水层22包括第一防水层221和第二防水层222，第一防水层221附着在第一基膜211一侧外表面上，第二防水层221附着在第二基膜222一侧外表面上，第一防水层221和第二防水层222均部分区域留白，且第一防水层的留白区域与第二防水层的留白区域错位设置，可以理解，通过将第一防水层的留白区域与第二防水层的留白区域错位设置，可以使得第一防水层与221和第二防水层222形成互补关系，进而使得电离子难以渗透入芯子本体10内部，进一步提高耐湿性能。
需要说明的是，为了提高耐湿性能，第一基膜211、第二基膜222、第一防水层221和第二防水层222的组合方式可以有多种。
作为一种示例，如图8所示，第一防水层221的留白区域位于第一基膜211的第一端，第二防水层222的留白区域位于第二基膜212的第二端，而第一端与第二端位置相对，错开留白区域，以使得第一防水层221和第二方防水层222形成互补关系。
作为另一种示例，如图8所示，第一防水层221的留白区域位于第一基膜211一侧，而第二防水层222的留白区域位于第二基膜212上相对于第一基膜侧的另一侧，以将两个留白区域错开，使得第一防水层221和第二方防水层222形成互补关系。
作为又一种示例，如图8所示，第一防水层221的留白区域位于第一基膜211的中部，而第二防水层222的多个留白区域均匀分布在第二基膜212上，其中，第一防水层221的留白区域与第二防水层222的多个留白区域错开，使得第一防水层221和第二方防水层222形成互补关系。
在一些实施例中，如图9所示，防水层20靠近喷金层的两端设有间隙，且该间隙的宽度小于喷金层的容差距离，即言，喷金层具有一定的容差距离，从而，防水层20端部不一定要和芯子本体10的端部相平齐。
在一些实施例中，如图10所示，基膜21包括第一基膜211、第二基膜212，防水层22包括第一防水层221、第二防水层222，第一防水层221附着在第一基膜211一侧外表面上， 第二防水层222附着在第二基膜212一侧外表面上，第一基膜211和第一防水层221等宽，第二基膜212和第二防水层222等宽，第一基膜211和第一防水层221的第一端与喷金层之间设有间隙，以通过该间隙形成电气间隙，第二基膜212和第二防水层222的第二端与喷金层之间设有间隙，以通过该间隙形成电气间隙，第一基膜211和第一防水层221的第一端与第二基膜212和第二防水层222的第二端位置相对，以使得第一基膜211和第一防水层221的防水结构与第二基膜212和第二防水层222的防水结构形成互补关系。
为了更好地说明本发明实施例提出的薄膜电容器芯子对于耐湿性能的提高效果；将装载了本发明实施例的薄膜电容器芯子的薄膜电容器和未包覆包覆膜的普通薄膜电容器置于同条件下进行了试验；其中，在湿热条件85℃、85％RH下持续施加275VAC交流电压1000小时的试验结果如以下表格所示：
Figure PCTCN2021124640-appb-000001
综上所述，根据本发明实施例的薄膜电容器芯子，包括芯子本体、包覆膜和喷金层，芯子本体的周向外表面上卷绕有包覆膜，该包覆膜包括基膜和防水层，并且，基膜上附着防水层，喷金层设置在芯子本体两端以形成电极，以使得薄膜电容器芯子的防水包覆过程可以通过生产芯子本体的卷绕机械卷绕完成，进而，在保证薄膜电容器芯子生产效率的前提下，提高薄膜电容器芯子的耐湿性能。
为了实现上述实施例，本发明实施例提出了一种薄膜电容器，该薄膜电容器包括上述的薄膜电容器芯子。
根据本发明实施例的薄膜电容器，通过装载上述的薄膜电容器芯子，能够保证薄膜电容器的生产效率，同时，提高薄膜电容器的耐湿性能，使其适用于高温潮湿的环境。
为了实现上述实施例，本发明实施例提出了一种印制电路板，该印制电路板上装载有如上述的薄膜电容器。
根据本发明实施例的印制电路板，通过装载如上述的薄膜电容器，保证了印制电路板的生产效率，同时，使得印制电路板的耐湿性能提高，适用于高温潮湿环境。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方 位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不应理解为必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。此外，本领域的技术人员可以将本说明书中描述的不同实施例或示例进行接合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (14)

  1. 一种薄膜电容器芯子，其特征在于，包括：芯子本体、包覆膜和喷金层，所述芯子本体的周向外表面上卷绕有所述包覆膜，其中，所述包覆膜包括基膜和防水层，所述基膜上附着所述防水层，所述喷金层设置在芯子本体两端以形成电极。
  2. 如权利要求1所述的薄膜电容器芯子，其特征在于，所述喷金层覆盖所述防水层至少一侧外周沿。
  3. 如权利要求1或2所述的薄膜电容器芯子，其特征在于，所述防水层为金属防水层。
  4. 如权利要求1或2所述的薄膜电容器芯子，其特征在于，所述防水层为金属氧化物防水层。
  5. 如权利要求3所述的薄膜电容器芯子，其特征在于，所述防水层附着在所述基膜一侧外表面上，所述基膜的宽度与所述芯子本体的宽度一致，所述防水层的部分区域留白，以通过该部分留白区域形成电气间隙。
  6. 如权利要求5所述的薄膜电容器芯子，其特征在于，所述防水层的部分留白区域为单一留白区域，且该单一留白区域沿所述防水层长度方向贯穿所述防水层。
  7. 如权利要求5所述的薄膜电容器芯子，其特征在于，所述防水层的部分留白区域为多个留白区域，所述多个留白区域沿所述防水层长度方向均匀分布。
  8. 如权利要求3所述的薄膜电容器芯子，其特征在于，所述防水层包括第一防水层和第二防水层，所述第一防水层和所述第二防水层分别附着在所述基膜两侧外表面上，所述基膜的宽度与所述芯子本体的宽度一致，所述第一防水层和所述第二防水层均部分区域留白，以通过留白形成电气间隙。
  9. 如权利要求3所述的薄膜电容器芯子，其特征在于，所述基膜包括第一基膜、第二基膜，所述防水层包括第一防水层、第二防水层，所述第一防水层附着在所述第一基膜一侧外表面上，所述第二防水层附着在所述第二基膜一侧外表面上，所述第一防水层和所述第二防水层均部分区域留白，且所述第一防水层的留白区域与所述第二防水层的留白区域错位设置。
  10. 如权利要求7所述的薄膜电容器芯子，其特征在于，所述第一防水层的留白区域位于所述第一基膜的第一端，所述第二防水层的留白区域位于所述第二基膜的第二端，所述第一端与所述第二端位置相对。
  11. 如权利要求1所述的薄膜电容器芯子，其特征在于，所述防水层靠近所述喷金层的两端设有间隙，且该间隙的宽度小于喷金层的容差距离。
  12. 如权利要求1所述的薄膜电容器芯子，其特征在于，所述基膜包括第一基膜、第二基膜，所述防水层包括第一防水层、第二防水层，所述第一防水层附着在所述第一基膜一 侧外表面上，所述第二防水层附着在所述第二基膜一侧外表面上，所述第一基膜和所述第一防水层等宽，所述第二基膜和所述第二防水层等宽，所述第一基膜和所述第一防水层的第一端与所述喷金层之间设有间隙，所述第二基膜和所述第二防水层的第二端与所述喷金层之间设有间隙，所述第一基膜和所述第一防水层的第一端与所述第二基膜和所述第二防水层的第二端位置相对。
  13. 一种薄膜电容器，其特征在于，包括如权利要求1-12中任一项所述的薄膜电容器芯子。
  14. 一种印制电路板，其特征在于，其上装载有如权利要求13所述的薄膜电容器。
PCT/CN2021/124640 2020-11-13 2021-10-19 薄膜电容器芯子 WO2022100377A1 (zh)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102468052A (zh) * 2010-11-08 2012-05-23 佛山市南海区欣源电子有限公司 有感串联结构高压薄膜电容器及制造方法
CN102881452A (zh) * 2012-10-18 2013-01-16 厦门法拉电子股份有限公司 一种防潮的金属化薄膜电容器
JP2015053331A (ja) * 2013-09-05 2015-03-19 トヨタ自動車株式会社 フィルムコンデンサ
CN106480406A (zh) * 2016-10-17 2017-03-08 东丽薄膜加工（中山）有限公司 金属化薄膜及其制备方法和电容器
CN206451602U (zh) * 2016-12-30 2017-08-29 扬州日精电子有限公司 一种金属化薄膜电容器
CN112397308A (zh) * 2020-11-13 2021-02-23 厦门法拉电子股份有限公司 薄膜电容器芯子
CN214624759U (zh) * 2020-11-13 2021-11-05 厦门法拉电子股份有限公司 薄膜电容器芯子、薄膜电容器以及印制电路板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102468052A (zh) * 2010-11-08 2012-05-23 佛山市南海区欣源电子有限公司 有感串联结构高压薄膜电容器及制造方法
CN102881452A (zh) * 2012-10-18 2013-01-16 厦门法拉电子股份有限公司 一种防潮的金属化薄膜电容器
JP2015053331A (ja) * 2013-09-05 2015-03-19 トヨタ自動車株式会社 フィルムコンデンサ
CN106480406A (zh) * 2016-10-17 2017-03-08 东丽薄膜加工（中山）有限公司 金属化薄膜及其制备方法和电容器
CN206451602U (zh) * 2016-12-30 2017-08-29 扬州日精电子有限公司 一种金属化薄膜电容器
CN112397308A (zh) * 2020-11-13 2021-02-23 厦门法拉电子股份有限公司 薄膜电容器芯子
CN214624759U (zh) * 2020-11-13 2021-11-05 厦门法拉电子股份有限公司 薄膜电容器芯子、薄膜电容器以及印制电路板

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