CN112218516A

CN112218516A - Mounting device

Info

Publication number: CN112218516A
Application number: CN202010629211.7A
Authority: CN
Inventors: 原智之
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2019-07-09
Filing date: 2020-07-02
Publication date: 2021-01-12
Anticipated expiration: 2040-07-02
Also published as: CN112218516B; TWI764188B; KR102386562B1; JP2021013002A; KR20210006857A; JP7368962B2; JP2023171668A; TW202103549A; JP2023171669A; JP7524441B2

Abstract

The invention provides a mounting device capable of shortening aging operation and stabilizing temperature with high precision. As an aging operation before a main operation of mounting the electronic part (100) to the tape (300), the bonding head (2) and the bonding stage (3) are moved to an out-of-tape position (92) deviated from the tape (300). Then, the bonding head (2) and the bonding stage (3) are brought into contact with or close to each other at the tape-out position (92), and are heated to a stable temperature by the head-side heater (21), the stage-side heater (31), and the like.

Description

Mounting device

Technical Field

The present invention relates to a mounting apparatus for mounting electronic components on a tape-shaped circuit board in a mounting area where the electronic components are arranged in parallel.

Background

The mounting apparatus is also called a die bonder or a flip Chip bonder, and places electronic components On a mounting region of a Tape circuit board (hereinafter, referred to as a "Tape") such as a Chip On Film (COF) Tape or a Tape Automated Bonding (TAB) Tape, and presses and heats the mounting region and the electronic components while sandwiching them. Thus, the mounting device electrically and mechanically connects the electronic component to the mounting area of the tape.

The mounting device includes: a bonding stage in surface contact with the lower surface of the tape; and a bonding head (bonding head) that holds the electronic part and mounts it on the tape. The bonding head and the bonding stage are heated in advance, and the electronic component held by the bonding head is pressed against the tape, whereby the electronic component and the tape are thermally transferred, thereby bonding the electrodes of the electronic component to the wiring circuit pattern of the mounting region of the tape.

The tape is elongated by heating. Therefore, it is expected that the mounting area of the electronic components (the circuit in the mounting area) is uniformly formed small due to the elongation of the tape caused by the heating. That is, the bonding head and the bonding stage are required to transfer the same amount of heat to each mounting region, and the temperature of the bonding head and the bonding stage is required to be stable.

However, the temperature of the bonding head and the bonding stage is unstable until a certain time elapses from the start of the operation of the mounting apparatus. That is, at the initial stage of the start of the operation, heat moves from the bonding head to the bonding stage, and the temperature of the bonding head decreases. When a certain time elapses, the thermal gradient between the bonding stage and the bonding head becomes gentle, the heat transfer from the bonding head to the bonding stage also becomes small, and the temperature tends to be stable.

In this way, when a plurality of electronic components are mounted in order, the temperature of the bonding head and the bonding stage in the initial mounting is different from the temperature of the bonding head and the bonding stage in the mounting after a certain period of time has elapsed. Therefore, the belt does not exhibit a desired elongation form from the start of operation to the initial mounting, and the mounting accuracy is lowered.

Here, an aging operation (aging) in which the bonding head is heated to an equilibrium temperature in advance before the operation of the mounting apparatus is started has been proposed (for example, see patent document 1). In patent document 1, the aging operation is a disguising operation of mounting. In the aging operation, in a state where the semiconductor chip is not present, the bonding head is brought close to and away from the base material such as the lead frame on the heater track in the same manner as in the mounting operation. Thereby, heat transfer to the bonding head is generated in the aging operation, and the temperature of the bonding head is stabilized before the formal operation. Therefore, the temperature of the bonding head is stabilized from the initial mounting, and the reduction in mounting accuracy of the initially mounted electronic component is suppressed.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2008-270359

Disclosure of Invention

[ problems to be solved by the invention ]

In patent document 1, it is assumed that an electronic component is disposed on a base material such as a lead frame. If the technique of patent document 1 is applied to a mounting apparatus for mounting electronic components on a tape such as the COF tape, the same portion of the tape is continuously heated for a long time due to aging operation, and the same portion is repeatedly brought into contact with a bonding head many times, so that there is a possibility that a thin and flexible tape or a wiring circuit pattern formed on the tape is damaged.

Therefore, it is considered that the aging operation is performed without configuring the band. However, after the aging operation is completed, the operation cannot be quickly shifted to the main operation of mounting, and the operation of inserting the placement tape is required. In this way, when the mounting is shifted to the main operation of mounting, the temperature of the bonding head and the bonding stage changes from a stable temperature, and the aging operation may be practically ineffective.

The problem to be solved by the present invention is to provide a mounting device capable of performing a formal mounting operation in a state where the temperature is stabilized while preventing damage to a belt.

[ means for solving problems ]

In order to achieve the above object, a mounting apparatus according to the present invention is a mounting apparatus for mounting electronic components in a mounting region provided in parallel on a tape-shaped circuit board, the mounting apparatus including: a tape advancing unit having a transport path on which the tape-shaped circuit board is mounted, and advancing the tape-shaped circuit board along a transport path along the transport path in a main operation of the mounting; a bonding stage which can be disposed on the conveyance path of the tape-shaped circuit board and supports the tape-shaped circuit board from a lower surface; a bonding head that presses and heats the electronic component to the mounting region of the tape-shaped circuit substrate supported by the bonding stage; and a heater that heats the bonding head or heats the bonding stage in addition thereto, wherein the bonding head and the bonding stage are moved to a belt-outside position that is deviated from the transport path of the tape-shaped circuit substrate as an aging operation before the main operation, and are heated by the heater while maintaining contact or approach at the belt-outside position, or repeating contact and separation or repeating approach and separation.

The mounting device may include a cleaner that cleans the bonding head and the bonding stage at a cleaning position deviated from the conveying path of the tape-shaped circuit substrate, and the tape outside position is set to the cleaning position.

The mounting device may include a control portion including: a bonding head control part for controlling the movement of the bonding head; a bonding stage control unit that controls movement of the bonding stage; and a heating control unit that controls the heater, wherein the control unit controls the bonding head control unit and the bonding stage control unit to move the bonding head and the bonding stage from an installation position where the main operation is performed to the out-of-band position, and to move the bonding head and the bonding stage so as to contact or approach each other at the out-of-band position, and the control unit controls the heating control unit to drive the heater to control the aging operation.

The control section may perform the aging operation after the completion of the erection of the strip circuit substrate on the conveyance path.

The mounting device may include: a component supply unit for making the electronic component to be mounted stand by; and a pickup head that receives the electronic part mounted next from the part supply section and transfers it to the bonding head, and that can hand over the electronic part to the bonding head at the tape outside position at the time of the normal operation.

The heater may be provided to the bond head, the bond platform, or both.

The heater may be carried on the engagement platform during the aging operation.

The bonding head and the bonding stage are repeatedly moved closer to and away from each other so that the electronic component is pressed against the mounting area in a first time period and the electronic component is moved away from the mounting area in a second time period, and the bonding head is repeatedly moved in the aging operation: contacting or approaching the engagement platform during the same time as the first time and separating relative to the engagement platform during the second time.

In the aging operation, a distance between the bonding head and the bonding stage when they are close to each other may be a distance corresponding to a thickness of the electronic part and the tape circuit substrate.

[ Effect of the invention ]

According to the present invention, it is possible to perform formal mounting operations in a state in which the temperature is stabilized while preventing damage to the strip circuit board.

Drawings

Fig. 1 is a plan view showing a structure of a mounting device according to a first embodiment.

Fig. 2 is a side view showing a structure of the mounting device of the first embodiment.

Fig. 3 is a schematic diagram showing the position of the heater and the configuration of the control unit.

Fig. 4 is a schematic diagram showing a first procedure of the formal operation of the mounting device of the first embodiment.

Fig. 5 is a schematic diagram showing a second procedure of the formal operation of the mounting device of the first embodiment.

Fig. 6 is a schematic diagram showing a third procedure of the formal operation of the mounting device of the first embodiment.

Fig. 7 is a timing chart showing the raising and lowering timing of the bonding head according to the first embodiment.

Fig. 8 is a schematic diagram showing a first procedure of the aging operation of the mounting device of the first embodiment.

Fig. 9 is a schematic diagram showing a second procedure of the aging operation of the mounting device of the first embodiment.

Fig. 10 (a) and (b) are graphs comparing timings of contact and separation between the bonding head and the bonding stage in the normal operation and the aging operation according to the first embodiment.

Fig. 11 (a) to (c) relate to the first embodiment, fig. 11 (a) is a timing chart showing the timing of contact and separation of the bonding head and the bonding stage in the aging operation, fig. 11 (b) is a graph showing a temperature change of the bonding head, and fig. 11 (c) is a graph showing a temperature change of the bonding stage.

Fig. 12 is a schematic view showing a cleaning operation of the mounting device of the first embodiment.

Fig. 13 is a side view showing the structure of the mounting device of the second embodiment.

[ description of symbols ]

1: mounting device

11: camera with upper and lower fields of view

12: heating device

2: joint head

21: head side heater

22: lifting mechanism

23: parallel moving mechanism

24: position correction mechanism

3: joint platform

31: platform side heater

32: lifting mechanism

33: parallel moving mechanism

41: conveying path

411: guide rail

412: gap

42: loading machine

43: unloading machine

5: parts supply part

51: camera with a camera module

6: pick-up head

61: lifting mechanism

62: parallel moving mechanism

63: reversing mechanism

7: cleaning device

71: parallel moving mechanism

8: control unit

82: control part of joint head

822: elevation control part

823: parallel movement control unit

83: bonding stage control unit

832: elevation control part

833: parallel movement control unit

84: belt advance control unit

85: pickup control unit

87: cleaner control part

88: heating control part

89: timing part

91: mounting location

92: with external position

93: pick-up position

100: electronic component

200: wafer sheet

300: belt-shaped circuit substrate (Belt)

301: mounting area

S1: time of approach/contact or time of approach

S2: time of separation

T1: upper limit of temperature of bonding head 2

T2: lower limit of temperature of bonding head 2

T3: upper temperature limit of bonding stage 3

T4: lower temperature limit of the bonding stage 3

Detailed Description

(first embodiment)

(integral constitution)

Embodiments of the mounting device of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a top view showing the structure of the mounting device 1. Fig. 2 is a side view showing the structure of the mounting apparatus 1, and the loader 42 and the unloader 43, which will be described later, are omitted for convenience of explanation. Fig. 3 is a block diagram showing the configuration of the control unit 8 included in the mounting device 1. The mounting apparatus 1 is also called a die bonder or a flip chip bonder, presses the electronic component 100 to a mounting region 301 of a tape circuit board 300 (hereinafter, referred to as a "tape 300"), and heats the mounting region 301 and the electronic component 100. Thus, the mounting device 1 electrically and mechanically connects the electronic component 100 to the mounting region 301 of the tape 300.

The mounting method is, for example, a Chip On Film (COF) method. The tape 300 is a film made of polyimide or the like, and the mounting regions 301 are arranged in parallel at a fixed interval along the longitudinal direction of the tape (tape direction). A wiring circuit pattern is formed in the mounting region 301. It is estimated that the tape 300 is elongated by heating at the time of mounting, and the wiring circuit pattern of the mounting area 301 is uniformly formed small so as to have a desired size after the elongation.

The electronic component 100 is directly connected to the wiring circuit pattern of the mounting region 301 by the bump electrode. The electronic component 100 is a component used in an electronic circuit, and includes chips such as a Micro-Electro-Mechanical System (MEMS), a semiconductor element, a resistor, and a capacitor, and the semiconductor element includes discrete semiconductors such as a transistor (transistor), a transistor (Diode), a Light Emitting Diode (LED), and a thyristor (thyristor), and an integrated circuit such as an Integrated Circuit (IC) or a Large Scale Integration (LSI).

Such a mounting device 1 comprises: a conveyance path 41 as a belt traveling unit, a loader 42, and an unloader 43. The conveyance path 41, the loader 42, and the unloader 43 span and guide the belt 300 so that the belt 300 passes through the mounting position 91. The conveyor path 41, the loader 42, and the unloader 43 intermittently move the belt 300 so that each of the mounting areas 301 is stopped at the mounting position 91. The mounting position 91 is a position where mounting processing is to be performed, and is a predetermined fixed position where the electronic component 100 and the tape 300 are electrically and mechanically connected.

In addition, the mounting apparatus 1 includes a parts supply section 5 and a pickup head 6 as parts supply units. The component supply unit 5 puts the electronic components 100 on standby side by side. The pickup head 6 receives the electronic component 100 from the component supply section 5 and transfers it to the tape outside position 92. The belt outside position 92 is a position deviated from the conveyance path 41 and is a position deviated from the conveyance route of the belt 300.

The mounting device 1 further includes an engagement head 2 and an engagement platform 3 as a mounting unit. The bonding stage 3 is configured to be disposed at the mounting position 91, and supports the lower surface of the belt 300 in which the mounting region 301 is stopped at the mounting position 91. The bonding head 2 receives the electronic part 100 from the pickup head 6 at the out-of-band position 92, and transfers the electronic part 100 to the mounting position 91. Then, the bonding head 2 presses the electronic component 100 against the mounting region 301 of the tape 300 supported by the bonding stage 3 at the mounting position 91, and heats the electronic component.

The main purpose of the out-of-band position 92 is to perform transfer of the electronic part 100 by using the bonding head 2 and the pickup head 6. As will be described later, this out-of-band position 92 doubles as a temperature stabilization position in a preprocessing operation for stabilizing the temperature of the bonding head 2 and the bonding stage 3.

The mounting device 1 further includes a cleaner 7 that cleans the bonding head 2 and the bonding stage 3 at the out-of-band position 92. That is, the belt outside position 92 also serves as a cleaning position for cleaning the bonding head 2 and the bonding stage 3 with the cleaner 7. As shown in fig. 3, the mounting apparatus 1 includes a control unit 8 that controls each of these hardware elements.

(with traveling unit)

The conveyance path 41 includes a pair of guide rails 411 for guiding the belt 300. The belt 300 intermittently travels while being guided by the two guide rails 411. The travel distance of each pitch of the belt 300 coincides with the distance between the centers of the adjacent mounting areas 301. The loader 42 that sends out the belt 300 and the unloader 43 that winds up the belt 300 are provided on both end sides of the conveyance path 41, and the belt 300 is bridged over the loader 42 and the unloader 43 through the conveyance path 41.

(installation unit)

The bonding head 2 is provided so as to be movable to a mounting position 91 and a belt outside position 92. The bonding head 2 holds the electronic component 100 at the tape outside position 92, moves to the mounting position 91, and then lowers, and heats the electronic component 100 while pressing the tape 300 directly below. The bonding stage 3 is raised at the mounting position 91 to enter the gap 412 of the conveyance path 41, and is brought into contact with the lower surface of the tape 300 pressed from above by the bonding head 2, thereby heating the tape 300 while supporting the electronic component 100 from below. In addition, the engagement platform 3 is also arranged to be movable to the out-of-band position 92.

The bonding head 2 has a flat lower surface. The flat lower surface is a holding surface for the electronic component 100, and a suction hole for sucking the electronic component 100 is formed in the holding surface. The engagement platform 3 has a flat upper surface. The flat upper surface is a support surface that is in surface contact with the lower surface of the belt 300.

As shown in fig. 3, a head-side heater 21 is embedded in the bonding head 2, and a stage-side heater 31 is embedded in the bonding stage 3. The head-side heater 21 and the stage-side heater 31 are, for example, pulse heaters. The head-side heater 21 heats the bonding head 2, and the stage-side heater 31 heats the bonding stage 3. The bonding stage 3 in surface contact with the tape 300 made of polyimide or the like is more strictly temperature-limited than the bonding head 2, and the bonding head 2 is higher in temperature than the bonding stage 3.

Furthermore, the bonding head 2 and the bonding stage 3 are preferably made of a material having a low thermal expansion coefficient. Examples of the material having a low thermal expansion coefficient include Stainless Steel (SUS) 304, SUS430, and ceramics. Since the bonding head 2 and the bonding stage 3 are formed of a material having a low thermal expansion coefficient, the displacement of the electronic component 100 from the mounting region 301 due to the thermal expansion of the bonding head 2 and the bonding stage 3 can be suppressed.

Such a bonding head 2 is mounted on an elevating mechanism 22 for elevating at a mounting position 91 and a parallel moving mechanism 23 for moving to the mounting position 91 and a tape outside position 92, the elevating mechanism 22 being configured to descend. Further, the bonding stage 3 is mounted on an elevating mechanism 32 for elevating at the mounting position 91 and a parallel moving mechanism 33 for moving to the mounting position 91 and the belt outside position 92.

The elevating mechanism 22, the parallel-moving mechanism 23, the elevating mechanism 32, and the parallel-moving mechanism 33 are, for example, ball screw mechanisms driven by motors. The movement direction of the elevating mechanism 22 and the elevating mechanism 32 is the vertical direction (Z direction), and the movement direction of the parallel movement mechanism 23 and the parallel movement mechanism 33 is the Y direction which is fixed in height and passes through the mounting position 91 and the belt outer position 92. That is, the mounting position 91 and the band outside position 92 are set on a straight line along the Y direction.

The mounting apparatus 1 further includes upper and lower two-field cameras 11, and a position correcting mechanism 24 for mounting the bonding head 2. The upper and lower two-field cameras 11 are insertably moved to the conveyance path 41 just above the mounting position 91, and capture images of the positions of the electronic component 100 and the mounting area 301 located at the mounting position 91. The position correcting mechanism 24 is, for example, a ball screw mechanism driven by a motor, and corrects a positional deviation along the extending direction of the conveying path 41 by moving the bonding head 2 in the direction (X direction) along the conveying path 41. The positional displacement along the direction (Y direction) orthogonal to the conveyance path 41 is corrected by the parallel movement mechanism 23.

(parts supply Unit)

The component supply section 5 holds the wafer sheet 200 in which the electronic components 100 are arrayed in the two-dimensional direction. The electronic component 100 is attached in a face-up state in which the electrode formation surface on which the bump electrode is formed faces upward. Further, the parts feeder 5 positions the electronic parts 100 one by one at the pickup position 93. The pickup position 93 is a position where the pickup head 6 picks up the electronic part 100 from the part supply section 5.

The parts supply section 5 includes a camera 51 in order to position the electronic parts 100 at the pickup position 93 with high accuracy, and the camera 51 recognizes a positional relationship between the electronic parts 100 to be picked up and the pickup position 93. The pickup head 6 has a flat holding surface for holding the electronic component 100 at the tip, and a suction hole for generating a negative pressure is formed in the holding surface. The pickup head 6 is attached to the lifting mechanism 61, the parallel movement mechanism 62, and the reversing mechanism 63.

The elevating mechanism 61 moves the pickup head 6 closer to or away from the parts feeder 5 at the pickup position 93. The parallel movement mechanism 62 moves the pickup head 6 between the pickup position 93 and the out-of-band position 92. These elevating mechanism 61 and parallel movement mechanism 62 are ball screw mechanisms, for example, similar to the elevating mechanism 22, parallel movement mechanism 23, elevating mechanism 32, and parallel movement mechanism 33. The reversing mechanism 63 reverses the pickup head 6 holding the electronic component 100 upside down. This reversing mechanism 63 is, for example, a rotary motor that shaft-supports the pickup 6 with a rotary shaft extending highly fixedly, and rotates the rotary shaft by 180 °.

Thereby, the pickup head 6 picks up the electronic component 100 from the component supply section 5 at the pickup position 93, moves to the tape-out position 92, and transfers the electronic component 100 to the bonding head 2 on standby. At this time, since the holding surface of the bonding head 2 faces downward, the pickup head 6 is turned upside down from the time when the pickup head 6 picks up the electronic component 100 at the pickup position 93 to the time when the electronic component 100 is transferred to the bonding head 2.

(Cleaner)

The cleaner 7 has grindstones on both upper and lower surfaces, for example, and is attached to the parallel movement mechanism 71. The parallel movement mechanism 71 moves the cleaner 7 in the direction along the conveyance path 41 (X direction) from the retracted position to the belt-outside position 92. For example, the parallel movement mechanism 71 is a ball screw mechanism driven by a motor. In the out-of-band position 92, the cleaner 7 is located between the bond head 2 and the bond platform 3. By the lowering of the bonding head 2 and the raising of the bonding stage 3, the bonding head 2 and the bonding stage 3 are brought into contact with grindstones existing above and below the cleaner 7. Then, if one of the two is swung relatively, the bonding head 2 and the bonding stage 3 can be cleaned.

(control section)

The control Unit 8 is a so-called computer including an arithmetic control device also called a Central Processing Unit (CPU) or a microprocessor Unit (MPU), a main storage device also called a Random Access Memory (RAM), an external storage device such as a Hard Disk Drive (HDD) or a Solid State Disk (SSD), and an interface for transmitting and receiving control signals to and from each hardware component of the mounting apparatus 1. The control unit 8 expands the program and data stored in the external storage device in the main storage device, executes the program by the arithmetic control device, and outputs a drive signal according to the execution result through the interface, thereby controlling the mounting device 1.

The controller 8, according to the processing of the program, includes: a bonding head control section 82, a bonding stage control section 83, a belt travel control section 84, a pickup control section 85, a cleaner control section 87, a heating control section 88, and a timer section 89, which are mainly composed of an arithmetic control section and an interface. If the bonding head control part 82 and the bonding stage control part 83 are described in more detail, the bonding head control part 82 includes an elevation control part 822 and a parallel movement control part 823, and the bonding stage control part 83 includes an elevation control part 832 and a parallel movement control part 833.

The timer section 89 outputs a timing signal. The bonding head controller 82 measures the timing based on the timing signal in accordance with the main operation, the preprocessing operation, or the cleaning operation, and outputs a drive signal for moving the bonding head 2 up and down by a predetermined distance and moving it in parallel by a predetermined distance. The bonding stage control unit 83 measures the timing based on the timing signal in accordance with the preprocessing operation or the cleaning operation, and outputs a drive signal for moving the bonding stage 3 up and down by a predetermined distance and moving it in parallel by a predetermined distance. The heating control unit 88 outputs a drive signal for turning on and off the head-side heater 21 and the stage-side heater 31 during the main operation and the preprocessing operation.

The tape running control unit 84 measures the timing based on the timing signal during the main operation, and outputs drive signals for feeding and winding the loader 42 and the unloader 43. The pickup control section 85 measures timing based on the timing signal during normal operation, and outputs a drive signal for moving the pickup head 6 in the two-dimensional direction of the parts supply section 5 while moving the pickup head 6 up and down by a predetermined distance and moving the pickup head parallel by a predetermined distance, and inverting the pickup head by a predetermined inversion angle. The cleaner control unit 87 outputs a drive signal for moving the cleaner 7 in parallel at a predetermined distance based on the timing signal during the cleaning operation.

(operation)

(official working)

The main operation of the mounting apparatus 1 controlled by the control unit 8 will be described with reference to fig. 4 to 7. The formal operation is an operation of mounting the electronic part 100 in the mounting area 301 of the tape 300. The tape 300 is stretched to pass through the conveyance path 41, and the temperature of the bonding head 2 and the bonding stage 3 is stabilized by an aging operation described later, and then a main operation is performed.

First, as shown in fig. 4, the parts supply section 5 aligns an electronic part 100 scheduled to be picked up with the pickup position 93. The pickup head 6 is lowered at the pickup position 93, adsorbs and holds the electronic part 100, and is raised again so as to be away from the part supply section 5. The pick-up head 6 is then directed towards the tape out position 92. During or after the movement to the out-of-band position 92, the pick-up head 6 is reversed 180 °.

The bonding head 2 is moved in parallel toward the tape outside position 92, and is lowered at the tape outside position 92. Then, the bonding head 2 suction-holds and receives the electronic part 100 from the pickup head 6. At this time, the pickup head 6 separates the electronic component 100 due to vacuum breakdown or open air.

As shown in fig. 5, the bonding head 2 having received the electronic part 100 is directed toward the mounting position 91 and lowered at the mounting position 91. The joining platform 3 supports the belt 300 on the conveyance path 41 from below at the mounting position 91. The loader 42 and the unloader 43 stop the travel of the belt 300 and position the mounting area 301 at the mounting position 91.

The bonding head 2 presses the electronic component 100 against the mounting region 301 on the tape 300 and heats it. By the pressing and pressing, the electronic component 100 is electrically and mechanically connected to the mounting region 301.

As shown in fig. 6, after the mounting of one electronic part 100 is completed, the bonding head 2 is moved away from the electronic part 100 and raised toward the tape out position 92 to receive the next electronic part 100. The pickup head 6, after transferring the electronic part 100 to the bonding head 2, faces the pickup position 93 to pick up the next electronic part 100. The parts supply section 5 moves in the two-dimensional direction to locate the next electronic part 100 at the pickup position 93. The loader 42 and the unloader 43 feed and wind the tape 300, thereby advancing the tape 300 and stopping the empty mounting region 301 adjacent to the mounting region 301 where the electronic component 100 is mounted at the mounting position 91.

Fig. 7 is a timing chart showing the operation timing of the bonding head 2. As shown in fig. 7, the bonding head 2 repeats the operation of bringing the bonding head into the close state and the separated state with respect to the bonding stage 3. In the close state, the bonding head 2 is close to the bonding stage 3 in order to press the electronic component 100 against the tape 300 at the mounting position 91 and heat it. The separated state is a state before the electronic component 100 is separated from the bonding stage 3 after the mounting of the electronic component 100 is completed, and the next electronic component 100 is received at the out-of-band position 92 so that the electronic component 100 comes into contact with the mounting region 301 and comes into the close state again.

The same time S1 is consumed in each approaching state. The same time S2 is consumed in each separated state. That is, the bonding head 2 repeats the same approach-separation pattern in the normal operation. This approach-separation mode has as elements the timing at which the bonding head 2 approaches the bonding stage 3, the time of approach S1, the timing of separation with respect to the bonding stage 3, and the time of separation S2, and in the case of approach, the content of movement during separation is not included in the elements of the approach-separation mode.

(cleaning operation)

When the electronic part 100 is repeatedly mounted based on the above-described regular operation, dirt or the like adheres to the bonding head 2 or the bonding stage 3, and therefore, the cleaning operation is performed at every predetermined time or every predetermined number of times of mounting. In the cleaning operation, as shown in fig. 12, the bonding head 2, the bonding stage 3, and the cleaner 7 are moved to the out-of-band position 92. The bonding head 2 is lowered to swing in contact with the grindstone of the upper surface of the cleaner 7. The engaging platform 3 is lifted to swing in contact with the grindstone of the lower surface of the cleaner 7. When the cleaning is completed, the cleaner 7 is retracted to a retreat position deviated from the belt outside position 92.

(pretreatment operation)

The preprocessing operation of the mounting apparatus 1 under the control of the control section 8 will be described with reference to (a) to (d) in fig. 8 to 11. The pretreatment operation is performed before the formal operation, and comprises a belt erection operation and an aging operation. In the tape erecting operation, the loader 42 is caused to send out the tape 300, the tape 300 is set in the conveyance path 41, and the unloader 43 is caused to wind the tape 300. The belt erection operation is performed before the aging operation or in parallel with the aging operation until the aging operation is completed.

In the aging operation before the main operation, the head-side heater 21 and the stage-side heater 31 are turned on, and the joint 2 and the stage 3 are heated under the same operating conditions as the main operation (for example, the same amount of heat per unit time as the main operation, that is, the same set temperature as the main operation). The head-side heater 21 and the stage-side heater 31 are continuously turned on before the preprocessing operation is completed and the main operation is shifted to, and generate the same amount of heat per unit time as the main operation to continuously heat the bonding head 2 and the bonding stage 3.

In the aging operation, in the heating, as shown in fig. 8, the bonding head 2 is located together with the bonding stage 3 at the out-of-band position 92 and separated from each other. Also, the bonding stage 3 is first raised to the same height as that of the support belt 300, and then, as shown in fig. 9, the bonding head 2 is lowered. Thereby, the holding surface of the bonding head 2 is brought into contact with or close to the support surface of the bonding stage 3. The distance between the bonding head 2 and the bonding stage 3 when they are close to each other is preferably a distance corresponding to the thickness of the electronic component 100 and the tape 300, or a distance equal to the amount of heat conduction when the electronic component 100 and the tape 300 are present.

In the aging operation, for example, the separated state shown in fig. 8 and the contact or close state shown in fig. 9 (hereinafter, the contact or close state is simply referred to as the contact state) are repeated 20 to 30 times or more. The number of repetitions is exemplified as 20 to 30 or more, and the number of repetitions necessary to achieve a stable temperature can be derived empirically, experimentally, by calculation, or by simulation. The detached state in the aging operation continues for the same time S2 as the detached state in the main operation shown in fig. 7. The contact state continues for the same time S1 as the approach state in the normal operation shown in fig. 7. That is, as shown in fig. 10 (b), in the aging operation, the bonding head 2 and the bonding stage 3 are operated in the close-apart mode in the same manner as the main operation in the state where the tape 300 and the electronic part 100 are not present at the tape outside position 92. Further, (a) in fig. 10 shows a close-separate mode in the main operation.

Fig. 11 (a) is a timing chart showing the timing of the separation state and the contact state of the bonding head 2 in the aging operation, fig. 11 (b) is a graph schematically showing the temperature change of the bonding head 2 in the aging operation, and fig. 11 (c) is a graph schematically showing the temperature change of the bonding stage 3 in the aging operation.

As shown in (a) to (c) of fig. 11, the temperature difference between the bonding head 2 and the bonding stage 3 is large at the initial stage of the aging operation. The bonding head 2 is at a higher temperature than the bonding stage 3. Therefore, during the time S1 when the bonding head 2 is in contact with or approaches the bonding stage 3, the temperature of the bonding head 2 is greatly decreased, and the temperature of the bonding stage 3 is greatly increased.

On the other hand, the difference between the bonding head 2 and the room temperature is large, and the difference between the bonding stage 3 and the room temperature is small. Therefore, during the time S2 when the bonding head 2 is separated from the bonding stage 3, the temperature of the bonding head 2 rises to a small extent, and the temperature of the bonding stage 3 falls to a small extent. Therefore, in fig. 11 (a) to (c), the temperature of the bonding head 2 is continuously decreased, and the temperature of the bonding stage 3 is continuously increased until the 4 th repeated separation state and contact state.

However, since the temperature of the bonding head 2 continues to decrease and the temperature of the bonding stage 3 continues to increase, the temperature difference between the bonding head 2 and the bonding stage 3 becomes smaller in the later stage of the aging operation than in the initial stage. Therefore, during the time S1 when the bonding head 2 is in contact with or approaches the bonding stage 3, the temperature drop of the bonding head 2 is smaller than the initial temperature drop, and the temperature rise of the bonding stage 3 is smaller than the initial temperature rise.

On the other hand, the temperature of the bonding head 2 continues to decrease, and therefore the difference between the bonding head 2 and the room temperature becomes small. In addition, since the temperature of the bonding stage 3 continues to rise, the difference between the bonding stage 3 and the room temperature becomes large. Therefore, during the time S2 when the bonding head 2 and the bonding stage 3 are separated, the temperature rise of the bonding head 2 heated by the head-side heater 21 becomes larger than the initial temperature rise, and the temperature drop of the bonding stage 3 becomes larger than the initial temperature drop.

Finally, the temperature drop of the bonding head 2 at time S1 is balanced with the temperature rise of the bonding head 2 at time S2. Fig. 11 (a) to (c) schematically show a state in which the upper temperature limit T1, the lower temperature limit T2, the temperature decrease rate, and the temperature increase rate of the bonding head 2 are maintained at substantially constant values after the fifth time, and the moving average value is stable. Further, the temperature rise of the bonding stage 3 at the time S1 is balanced with the temperature fall of the bonding stage 3 at the time S2, and (a) to (c) in fig. 11 schematically show a state in which the upper temperature limit T3, the lower temperature limit T4, the temperature fall rate, and the temperature rise rate of the bonding stage 3 are maintained at substantially constant values after the fifth time, and the moving average value is stable. That is, the temperatures of the bonding head 2 and the bonding stage 3 are stabilized in the same temperature change pattern and the same temperature change amount in each of the fifth and subsequent steps.

When the above preprocessing operation is finished, the tape 300 is already erected, and the tape 300, the mounting area 301 for initially mounting the electronic part 100, is positioned at the mounting position 91, and thus can be quickly shifted to the main operation. Therefore, in a state where the temperatures of the bonding head 2 and the bonding stage 3 are kept stable, the heat of a fixed average value is applied to the tape 300 from the first mounting to the last mounting at the same upper temperature limit T1 and upper temperature limit T3 (T1 ≠ T3), the same lower temperature limit T2 and lower temperature limit T4 (T2 ≠ T4), the same temperature decrease rate, and the same temperature increase rate. In this way, the extension of the mounting region 301 due to heat is made uniform from the first mounting to the last mounting, and all the electronic components 100 can be mounted on all the mounting regions 301 with the same accuracy.

Further, during the preprocessing operation, trial and error in which the user sets each stable temperature of the bonding head 2 and the bonding stage 3 is not performed. In the preprocessing operation, it is sufficient if the contact or approach and separation of the bonding head 2 and the bonding stage 3 are repeated at the same timing as the regular operation in the out-of-band position 92.

(Effect)

As described above, the mounting apparatus 1 for mounting the electronic component 100 to the mounting area 301 may include the conveyance path 41, the bonding head 2, and the bonding stage 3. The conveyance path 41 is for the belt 300 having the mounting areas 301 arranged in parallel in the belt direction to travel. The bonding stage 3 is disposed on the transport path of the belt 300 via the transport path 41, and supports the belt 300 from the lower surface. The bonding head 2 holds and presses the electronic part 100 to the mounting region 301 of the tape 300 supported by the bonding stage 3, and heats it. The bonding head 2 and the bonding stage 3 are provided with a head-side heater 21 and a stage-side heater 31.

Further, with respect to the bonding head 2 and the bonding stage 3, as an aging operation before a main operation of mounting the electronic part 100 to the tape 300, the tape is moved to the tape outside position 92 deviated from the tape 300, and is heated while repeatedly being contacted or approached and separated at the tape outside position 92.

Thus, the aging operation can be performed in a state where the belt 300 is erected on the conveyance path 41 or while being erected. More specifically, the mounting region 301 where the electronic part 100 is initially mounted may be located at the mounting position 91 in the tape 300 at the start of the aging operation or until the aging operation is completed. In this way, by inserting the strap 300 after the aging operation, it is possible to suppress a temperature change from a stable temperature between the bonding head 2 and the bonding stage 3, and to further improve the mounting accuracy.

Further, since the aging operation is performed while being moved to the belt outside position 92, which is a position deviated from the conveyance path 41 of the belt 300 at the mounting position 91, the belt 300 stretched on the conveyance path 41 can be prevented from being heated by the heat (radiant heat) of the bonding head 3 during the aging operation. This can prevent the belt 300 from being accidentally thermally expanded or damaged by heating. Therefore, not only can further improvement in mounting accuracy be expected, but also mounting quality can be improved.

Further, when the aging operation is performed in a state in which the belt 300 is erected on the conveyance path 41, the aging operation may be automatically started in response to completion of positioning of the first mounting region 301 of the belt 300 to the mounting position 91. For example, the control unit 8 receives a signal indicating that the first mounting region 301 of the tape 300 is stopped at the mounting position 91 from the tape running control unit 84 in accordance with a signal from the tape running control unit 84. Then, when the signal reception is triggered, the bonding head control unit 82 and the bonding stage control unit 83 output drive signals so that the movement of the bonding head 2 and the bonding stage 3 becomes an aging operation. Thereby, the aging operation can be automatically performed and completed only by performing the belt setting operation.

The belt outside position 92 at which the aging operation is performed is a position at which the bonding head 2 and the bonding stage 3 are cleaned by the cleaner 7. Thus, the moving mechanism at the belt outer position 92 can be used for the aging operation. However, the aging operation, the cleaning operation, and the transferring operation of the electronic component 100 do not hinder the temperature stabilization of the bonding head 2 and the bonding stage 3, as long as the positions are deviated from the tape 300, regardless of the common place or the different places.

The mounting apparatus 1 may include both the head-side heater 21 and the stage-side heater 31, but any one may be used as long as the temperature can be stabilized to a desired temperature. However, if the head-side heater 21 is provided in the bonding head 2, the temperature of the bonding head 2 not in contact with the tape 300 can be set higher, and the bonding time of the electronic component 100 and the mounting region 301 of the tape 300 can be shortened. However, in order to stabilize the temperature in a range close to a desired temperature or to stabilize the temperature quickly, it is desirable to provide the stage-side heater 31.

In order to completely simulate the actual operation, the dummy (dummy) electronic component 100 and the dummy tape 300 may be stacked on the bonding stage 3, and the aging operation may be performed while sandwiching the dummy component. The heat transfer pattern through the electronic component 100 and the tape 300 can be reproduced, and the temperature stable in the main operation and the temperature stable in the aging can be made to coincide with each other with high accuracy. That is, the temperature change at the initial mounting in the main operation is further suppressed.

(second embodiment)

In the first embodiment, as the aging operation, the bonding head 2 alternately repeats contact with or approach to the bonding stage 3 and separation from the bonding stage 3 a predetermined number of times at the operation timing of the main operation of the simulation mounting. However, the method of heating the bonding head 2 and the bonding stage 3 is not limited to this.

For example, as shown in fig. 13, the mounting device 1 includes a heater 12, and the heater 12 is provided only at the time of aging operation and is removed in the normal operation of mounting. The heater 12 is placed on the joining platform 3 by an operator during aging operation. The bonding head 2 moves towards the bonding stage 3 at the out-of-band position 92. Further, the contact with the heater 12 on the bonding stage 3 is maintained for a predetermined time. In other words, the bonding head 2 approaches or contacts the bonding stage 3 on which the heater 12 is mounted. The prescribed time of approach or contact is the time to reach a stable temperature, derived by, experiment, calculation, or simulation.

When a predetermined time has elapsed, the heater 12 may be removed by the worker, or may be moved to a place different from the mounting position 91 or the out-of-tape position 92 by being sucked and held by the bonding head 2. In the case of the system of removing the heater 12 by the bonding head 2, it is possible to automatically shift to the main operation of mounting.

The head-side heater 21 and the stage-side heater 31 may be turned on in addition to the heater 12 to supply more heat to the bonding head 2 and the bonding stage 3, shortening the time required for the aging operation. The heater 12 is not disposed on the bonding stage 3, but the head side heater 21 and the stage side heater 31 are turned on, and the bonding head 2 and the bonding stage 3 are continuously brought into contact with each other or separated from each other for a predetermined time, so that the aging operation of heating only the head side heater 21 and the stage side heater 31 can be performed.

As a method of deriving the predetermined time empirically or experimentally, the following method can be mentioned. That is, a thermometer such as a thermocouple is placed on the bonding stage 3 or attached to the bonding head 2, and the bonding head 2 is brought into contact with or close to the bonding stage 3. The temperature change indicated by the thermometer may be observed, the time required until the temperature becomes stable may be measured, and the measurement result may be set as a predetermined time. Similarly, as the aging operation, in the case where the bonding head 2 and the bonding stage 3 are repeatedly brought into the close state and the separated state as in the main operation of the simulation mounting, the number of repetitions may be derived empirically or experimentally, and the number of repetitions may be counted until the temperature detected by the thermometer is stabilized.

(other embodiments)

While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as an example, and are not intended to limit the scope of the present invention. The novel embodiment can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

Claims

1. A mounting apparatus for mounting electronic components in a mounting area provided in parallel on a tape-shaped circuit board, comprising:

a tape advancing unit having a transport path on which the tape-shaped circuit board is mounted, and advancing the tape-shaped circuit board along a transport path along the transport path in a main operation of the mounting;

a bonding stage which can be disposed on the conveyance path of the tape-shaped circuit board and supports the tape-shaped circuit board from a lower surface;

a bonding head that presses the electronic component against the mounting region of the tape-shaped circuit substrate supported by the bonding stage and heats the electronic component; and

a heater to heat the bonding head or to otherwise heat the bonding stage,

with respect to the bond head and the bond platform,

as an aging operation before the main operation, the tape-shaped circuit substrate is moved to an out-of-band position deviated from the transport path of the tape-shaped circuit substrate, and

the contact or approach is maintained at a position outside the belt, or the contact and separation or the approach and separation are repeated while heating is performed by the heater.

2. The mounting device according to claim 1, comprising a cleaner that cleans the bonding head and the bonding stage at a cleaning position deviated from the conveying path of the tape-like circuit substrate,

the belt outer position is set to the cleaning position.

3. The mounting device according to claim 1 or 2, comprising a control unit, the control unit including:

a bonding head control part for controlling the movement of the bonding head;

a bonding stage control unit that controls movement of the bonding stage; and

a heating control part for controlling the heater, and

with regard to the control section, it is preferable that,

controlling the bonding head control part and the bonding stage control part to move the bonding head and the bonding stage from an installation position where the main operation is performed to the out-of-band position, and to move the bonding head and the bonding stage in contact with or close to each other at the out-of-band position, and

controlling the heating control section to drive the heater to control the aging operation.

4. The mounting device of claim 3, wherein:

the control section performs the aging operation after the completion of the erection of the strip-shaped circuit substrate on the conveyance path.

5. The mounting device of any one of claims 1 to 4, comprising:

a component supply section for making the electronic component to be mounted stand by, an

A pickup head which receives the electronic part mounted next from the part supply part and transfers it to the bonding head, and

the pickup head hands over the electronic part to the bonding head at the tape outside position at the time of the normal operation.

6. The mounting device of any one of claims 1 to 5, wherein:

the heater is provided to either or both of the bond head and the bond platform.

7. The mounting device of any one of claims 1 to 5, wherein:

the heater is placed on the bonding stage during the aging operation.

8. The mounting device of any one of claims 1 to 7, wherein:

the bonding head and the bonding stage repeat the approaching and separating operation so that the electronic component is pressed against the mounting region in a first time period and the electronic component is separated from the mounting region in a second time period in the main operation, and the bonding head and the bonding stage are separated from each other in the first time period

The bonding head repeats, in the aging operation: contact or approach the engagement platform during the same time as the first time, and separate relative to the engagement platform during the second time.

9. The mounting device of any one of claims 1 to 7, wherein:

in the aging operation, the distance between the bonding head and the bonding stage when they are close to each other is a distance corresponding to the thickness of the electronic part and the thickness of the strip circuit substrate.