TWI764188B - installation device - Google Patents

Abstract

The present invention provides a mounting device capable of accurately stabilizing temperature while shortening the aging work. The bonding head (2) and bonding platform (3) are moved to a belt outer position (92) offset from the belt (300) as an aging operation before the actual operation of mounting the electronic part (100) to the belt (300). Then, the bonding head ( 2 ) and the bonding platform ( 3 ) contact or approach relatively at the belt outer position ( 92 ), and are heated by the head side heater ( 21 ) and the table side heater ( 31 ) to stabilize the temperature.

Description

installation device

The present invention relates to a mounting apparatus for mounting electronic components on a strip-shaped circuit board in a mounting area in which electronic components are arranged in parallel.

The mounting device is also called a die bonder or a flip chip bonder. Electronic components are placed on the mounting area of the tape circuit board (hereinafter, referred to as "tape"), and pressure and heating are performed while sandwiching the mounting area and the electronic components. Thereby, the mounting device electrically and mechanically connects the electronic component to the mounting area of the tape.

The mounting device includes a bonding stage that is in surface contact with the lower surface of the tape, and a bonding head that holds and mounts electronic components on the tape. The bonding head and the bonding stage are heated in advance, and the electronic components held by the bonding head are pressed against the tape to transfer heat to the electronic components and the tape, thereby bonding the electrodes of the electronic components to the wiring circuit pattern in the mounting area of the tape.

The belt is elongated by heating. Therefore, it is estimated that the mounting area of the electronic components (circuits in the mounting area) is uniformly formed to be small due to the elongation of the tape due to heating. That is, the bonding head and the bonding stage are required to transfer the same amount of heat to each mounting area, and the temperature of the bonding head and the bonding stage is required to be stable.

However, the temperature of the bonding head and the bonding table becomes unstable until a certain amount of time elapses from the start of the operation of the mounting apparatus. That is, in the initial stage of operation start, heat moves from the bonding head to the bonding stage, and the temperature of the bonding head decreases. When a certain amount of time elapses, the thermal gradient between the bonding stage and the bonding head becomes gentle, the heat transfer from the bonding head to the bonding stage also becomes smaller, and the temperature tends to be stable.

In this way, when a plurality of electronic components are sequentially mounted, the temperatures of the bonding head and the bonding stage during initial mounting and the temperatures of the bonding head and the bonding stage during mounting after a certain period of time have elapsed are different. Therefore, from the start of operation to the initial installation, the belt does not exhibit a desired elongation pattern, and the installation accuracy decreases.

Here, an aging operation in which the bonding head is preheated to an equilibrium temperature before the operation of the mounting apparatus is started is proposed (for example, refer to Patent Document 1). In Patent Document 1, the aging operation is a disguised operation of installation. In the aging operation, in the same manner as in the mounting operation, in the absence of the semiconductor wafer, the bonding head is brought close to and away from the substrate such as the lead frame on the heater rail. Thereby, thermal movement to the bonding head is generated during the aging operation, and the temperature of the bonding head is stabilized before the actual operation. Therefore, from the initial mounting, the temperature of the bonding head is stabilized, thereby suppressing a decrease in the mounting accuracy of the electronic components to be initially mounted. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-270359

[The problem to be solved by the invention]

In Patent Document 1, it is premised that electronic components are arranged on a base material such as a lead frame. Assuming that the technique of Patent Document 1 is applied to a mounting device for mounting electronic components on a tape such as the COF tape, the same portion of the tape is continuously heated for a long time due to the aging operation, and the same portion is repeatedly contacted with the bonding head several times. There is a possibility that the thin and flexible tape or the wiring circuit pattern formed on the tape may be damaged due to contact.

Therefore, consider not configuring the band to perform aging operations. However, after the aging operation is completed, it is not possible to quickly transfer to the actual operation of the installation, and the work of configuring the tape must be intervened in the meantime. In this way, when shifting to the actual operation of the mounting, the temperature of the bonding head and the bonding platform are self-stabilizing temperature changes, and there is a possibility that the aging operation is actually ineffective.

The problem to be solved by the present invention is to provide a mounting device that can perform the actual operation of mounting in a state where the temperature is stabilized while preventing damage to the belt. [Means of Solving Problems]

In order to achieve the above-mentioned object, the mounting device of the present invention is a mounting device for mounting electronic components in a mounting area arranged in parallel on a strip circuit board, and the mounting device is characterized by comprising: a strip traveling unit having a structure for bridging the strip circuit A conveyance path for the substrate, and in the actual operation of performing the mounting, the strip circuit board is advanced along the conveyance path along the conveyance path; and a bonding platform can be arranged on the strip circuit board. on a conveying line and supporting the tape circuit board from the lower surface; a bonding head for pressing and heating the electronic part to the mounting area of the tape circuit board supported by the bonding platform; and heating a device that heats the bonding head or, in addition, heats the bonding platform, and the bonding head and the bonding platform are moved from the belt as an aging operation before the actual operation. The outer position of the belt is deviated on the conveying route of the circuit board, and the contact or proximity is maintained at the outer position of the belt, or the contact and separation or the repeated proximity and separation are repeated, and the heater is used for heating at the same time.

The mounting device may include a cleaner that cleans the bonding head and the bonding stage at a cleaning position deviated from the conveying route of the tape circuit board, and the tape is outside the tape. The position is set to the cleaning position.

The mounting device may include a control section including: a bonding head control section that controls movement of the bonding head; a bonding platform control section that controls movement of the bonding platform; and a heating control section that controls the heating The control unit controls the bonding head control unit and the bonding platform control unit to move the bonding head and the bonding platform from the mounting position where the actual operation is performed to the belt outside position, and at The belt outer position moves the bonding head and the bonding platform in a contacting or approaching manner, and the control section controls the heating control section to drive the heater to control the aging operation.

After completing the erection of the strip circuit board on the conveying path, the control unit may perform the aging operation.

The mounting device may include: a parts supply part that makes the electronic parts to be mounted stand by; and a pick-up head that receives the electronic parts to be mounted next from the parts supply part and transfers it to the bonding head, and The pickup head may hand over the electronic part to the bonding head at a location outside the tape during the actual operation.

The heater may be equipped with the bonding head, the bonding platform, or both.

The heater may be placed on the bonding platform during the aging operation.

In the actual operation, the bonding head and the bonding platform are in a state of approaching pressing the electronic component to the mounting area during a first time, and are in a state of being closer than all the electronic components during a second time. The approaching and separation are repeated in the manner of the disengagement state separated from the approaching state, and in the aging operation, the bonding head may repeatedly perform: contacting or approaching the bonding platform during the same time period as the first time, During the second time, disengage with respect to the engagement platform.

In the aging operation, the distance between the bonding head and the bonding platform may be a distance corresponding to the thickness of the electronic component and the strip-shaped circuit board when the bonding head and the bonding platform are approached. [Effect of invention]

According to the present invention, the actual operation of mounting can be performed in a state where the temperature is stabilized while preventing damage to the strip circuit board.

(first embodiment) (overall composition) Embodiments of the mounting device of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a top view showing the configuration of the mounting device 1 . FIG. 2 is a side view showing the configuration of the mounting device 1, and for convenience of explanation, the loader 42 and the unloader 43 to be described later are omitted. FIG. 3 is a block diagram showing the configuration of the control unit 8 included in the mounting device 1 . The mounting apparatus 1 is also called a die bonder or a flip chip bonder, and presses the electronic components 100 to the mounting area 301 of the tape circuit board 300 (hereinafter, referred to as "tape 300"), and aligns the mounting area 301 with the electronic components. 100 for heating. Thereby, the mounting apparatus 1 electrically and mechanically connects the electronic component 100 to the mounting area 301 of the tape 300 .

The mounting method is, for example, a chip on film (Chip On Film, COF) method. The tape 300 is a film made of polyimide or the like, and the attachment regions 301 are arranged side by side at regular intervals along the longitudinal direction (tape direction) of the tape. A wiring circuit pattern is formed in the mounting region 301 . It is estimated that the tape 300 is stretched by heating during mounting, and the wiring circuit patterns of the mounting region 301 are uniformly formed so as to be small so as to have a desired size after being stretched.

The electronic component 100 is directly connected to the wiring circuit pattern of the mounting region 301 by means of bump electrodes. The electronic component 100 is a component used in electronic circuits, including chips of Micro-Electro-Mechanical-System (MEMS), semiconductor elements, resistors and capacitors, etc. The semiconductor elements include transistors, two crystals (diode), light-emitting diode (Light Emitting Diode, LED) and thyristor (thyristor) and other discrete (discrete) semiconductors, as well as integrated circuit (integrated circuit, IC) or large-scale integration (large scale integration, LSI), etc. integrated circuit.

Such a mounting device 1 includes a conveying path 41 as a belt traveling unit, a loader 42 and an unloader 43 . The conveyance path 41 , the loader 42 , and the unloader 43 are constructed to guide the belt 300 so that the belt 300 passes through the attachment position 91 . Moreover, the conveyance path 41, the loader 42, and the unloader 43 make the belt 300 run intermittently so that each attachment area|region 301 may stop at the attachment position 91. The mounting position 91 is a site where the mounting process is scheduled to be performed, and is a predetermined fixing position where the electronic component 100 and the tape 300 are electrically and mechanically connected.

In addition, the mounting apparatus 1 includes the parts supply part 5 and the pick-up head 6 as parts supply means. The component supply unit 5 makes the electronic components 100 stand by side by side. The pick-up head 6 receives the electronic part 100 from the parts supply part 5 and transfers it to the tape out-of-band position 92 . The belt outer position 92 is a position deviated from the conveyance path 41 and is a position deviated from the conveyance route of the belt 300 .

The mounting device 1 also includes a bonding head 2 and a bonding platform 3 as a mounting unit. The bonding platform 3 is configured to be arranged at the installation position 91 and to support the lower surface of the belt 300 where the installation area 301 is stopped at the installation position 91 . The bonding head 2 receives the electronic part 100 from the pick-up head 6 at the tape outside position 92 and moves the electronic part 100 to the mounting position 91 . Then, the bonding head 2 presses the electronic component 100 against the mounting area 301 of the tape 300 supported by the bonding stage 3 at the mounting position 91 and heats it.

The main use of the tape outer position 92 is to use the bonding head 2 and the pick-up head 6 for the handover of the electronic part 100 . This belt outer position 92 is also used as a temperature stabilization position in the preprocessing operation for stabilizing the temperature of the bonding head 2 and the bonding stage 3, as will be described later.

The mounting device 1 also includes a cleaner 7 for cleaning the bonding head 2 and the bonding platform 3 at the belt outer position 92 . That is, the belt outer position 92 also serves as a cleaning position for cleaning the bonding head 2 and the bonding table 3 with the cleaner 7 . Moreover, as shown in FIG. 3, the mounting apparatus 1 includes the control part 8 which controls each of these hardware components.

(with travel unit) The conveyance path 41 has a pair of guide rails 411 that guide the belt 300 . The belt 300 travels intermittently while being guided by the two guide rails 411 . The travel distance of each pitch of the tape 300 corresponds to the distance between the centers of adjacent installation areas 301 . A loader 42 for feeding out the tape 300 and an unloader 43 for winding the tape 300 are provided on both end sides of the conveyance path 41 , and the belt 300 passes through the conveyance path 41 and is spanned over the loader 42 and the unloader 43 .

(mounting unit) The engagement head 2 is arranged to be movable to the mounting position 91 and the belt outside position 92 . The bonding head 2 holds the electronic component 100 at the tape outside position 92 , moves to the mounting position 91 , descends, and heats the electronic component 100 while pressing the electronic component 100 against the tape 300 directly below. The bonding stage 3 ascends at the mounting position 91 and enters the gap 412 of the conveyance path 41, and is in surface contact with the lower surface of the tape 300 pressed by the bonding head 2 from above, and supports the electronic component 100 and the tape 300 from below while heating. . In addition, the engagement platform 3 is also provided so as to be movable to the belt outside position 92 .

The bonding head 2 has a flat lower surface. The flat lower surface is a holding surface of the electronic component 100 , and suction holes for sucking the electronic component 100 are formed on the holding surface. The engagement platform 3 has a flat upper surface. The flat upper surface is the support surface that is in surface contact with the lower surface of the belt 300 .

In addition, as shown in FIG. 3 , the head-side heater 21 is embedded in the bonding head 2 , and the stage-side heater 31 is embedded in the bonding stage 3 . The head side heater 21 and the stage side heater 31 are, for example, a pulse heater or the like. The head-side heater 21 heats the bonding head 2 , and the table-side heater 31 heats the bonding table 3 . The temperature limit of the bonding stage 3 in surface contact with the tape 300 formed of polyimide or the like is stricter than that of the bonding head 2 , and the temperature of the bonding head 2 is higher than that of the bonding stage 3 .

In addition, it is preferable to use the material with a low thermal expansion coefficient for the bonding head 2 and the bonding stage 3 . As a material with a low thermal expansion coefficient, stainless steel (Steel Use Stainless, SUS) 304, SUS430, ceramics, etc. are mentioned. The bonding head 2 and the bonding stage 3 are formed of a material with a low thermal expansion coefficient, and it is possible to suppress displacement of the electronic component 100 and the mounting area 301 caused by thermal expansion of the bonding head 2 and the bonding stage 3 .

Such a joint head 2 is mounted on a lift mechanism 22 for descending at the mounting position 91 and a parallel movement mechanism 23 for moving to the mounting position 91 and the belt outside position 92 . In addition, the joint platform 3 is mounted on the lift mechanism 32 and the parallel movement mechanism 33 for ascending at the mounting position 91 , and the parallel movement mechanism 33 for moving to the mounting position 91 and the belt outside position 92 .

The elevating mechanism 22 , the parallel movement mechanism 23 , the elevating mechanism 32 , and the parallel movement mechanism 33 are, for example, a ball screw mechanism driven by a motor. The moving direction of the elevating mechanism 22 and the elevating mechanism 32 is the vertical direction (Z direction), and the moving direction of the parallel moving mechanism 23 and the parallel moving mechanism 33 is the Y direction passing through the mounting position 91 and the belt external position 92 with a fixed height. That is, the attachment position 91 and the belt outer position 92 are set on a straight line along the Y direction.

The mounting device 1 further includes the upper and lower field-of-view cameras 11 , and a position correction mechanism 24 for mounting the joint head 2 . The upper and lower field-of-view cameras 11 can be inserted and moved to the conveyance path 41 directly above the mounting position 91 , and photograph the positions of the electronic component 100 and the mounting area 301 located at the mounting position 91 . The position correction mechanism 24 is, for example, a ball screw mechanism driven by a motor, moves the bonding head 2 in the direction (X direction) along the conveyance path 41 , and corrects the positional deviation along the extension direction of the conveyance path 41 . The positional deviation along the direction (Y direction) orthogonal to the conveyance path 41 is corrected by the parallel movement mechanism 23 .

(parts supply unit) The component supply unit 5 holds the wafer sheet 200 in which the electronic components 100 are arranged two-dimensionally. The electronic component 100 is bonded in a face-up state in which the electrode formation surface on which the bump electrodes are formed faces upward. Then, the parts supply unit 5 places the electronic parts 100 at the pick-up position 93 one by one. The pickup position 93 is a location where the pickup head 6 picks up the electronic component 100 from the component supply unit 5 .

The parts supply unit 5 includes a camera 51 for recognizing the positional relationship between the electronic parts 100 to be picked up and the pickup position 93 in order to position the electronic parts 100 at the pickup position 93 with high accuracy. The pickup 6 has a flat holding surface at the front end for holding the electronic component 100 , and suction holes for generating negative pressure are formed on the holding surface. In addition, the pickup head 6 is attached to the elevating mechanism 61 , the parallel movement mechanism 62 , and the reversing mechanism 63 .

The lift mechanism 61 moves the pickup head 6 toward or away from the parts supply unit 5 at the pickup position 93 . The parallel movement mechanism 62 transfers the pickup head 6 between the pickup position 93 and the tape outside position 92 . The elevating mechanism 61 and the parallel movement mechanism 62 are, for example, ball screw mechanisms, like the elevating mechanism 22 , the parallel movement mechanism 23 , the elevating mechanism 32 , and the parallel movement mechanism 33 . The inversion mechanism 63 inverts the pickup head 6 holding the electronic component 100 upside down. This reversing mechanism 63 is, for example, a rotary motor that pivotally supports the pickup head 6 with a rotary shaft extending at a fixed height, and rotates the rotary shaft by 180°.

Thereby, the pick-up head 6 picks up the electronic component 100 from the component supply part 5 at the pick-up position 93, moves to the tape outside position 92, and transfers the electronic component 100 to the bonding head 2 on standby. At this time, since the holding surface of the bonding head 2 faces downward, the pickup head 6 is vertically reversed from picking up the electronic component 100 at the pickup position 93 to transferring the electronic component 100 to the bonding head 2 .

(Cleaner) The cleaner 7 has grindstones on both upper and lower surfaces, for example, and is attached to the parallel movement mechanism 71 . The parallel movement mechanism 71 is moved from the retracted position to the belt outside position 92 by moving the cleaner 7 in the direction (X direction) along the conveyance path 41 . For example, the parallel movement mechanism 71 is a ball screw mechanism driven by a motor. In the belt outer position 92 , the cleaner 7 is located between the bonding head 2 and the bonding platform 3 . The bonding head 2 and the bonding table 3 are brought into contact with the grindstones present on the upper and lower surfaces of the cleaner 7 by the lowering of the bonding head 2 and the raising of the bonding table 3 . Furthermore, by relatively swinging one of them, the bonding head 2 and the bonding table 3 can be cleaned.

(Control Department) The control unit 8 is a so-called computer including an arithmetic control device also called a central processing unit (CPU) or a micro processor unit (MPU), also called a random access memory The main memory device of the random access memory (RAM), the external memory device such as a hard disk drive (HDD) or a solid state disk (SSD), and the hardware of the installation device 1 An interface for sending and receiving control signals between them. The control unit 8 expands the program and data stored in the external memory device in the main memory device, executes the program using the arithmetic control device, and outputs a drive signal corresponding to the execution result through the interface, thereby controlling the installation device 1 .

The controller 8 performs processing according to a program, and includes a bonding head control unit 82 mainly composed of an arithmetic control unit and an interface, a bonding platform control unit 83, a tape travel control unit 84, a pickup control unit 85, a cleaner control unit 87, Heating control unit 88 and timer unit 89 . If the bonding head control unit 82 and the bonding platform control unit 83 are described in more detail, the bonding head control unit 82 includes a lift control unit 822 and a parallel movement control unit 823, and the bonding platform control unit 83 includes a lift control unit 832 and a parallel movement control unit. 833.

The timer unit 89 outputs a timing signal. The bonding head controller 82 measures timing based on the timing signal according to the main operation, the preprocessing operation, or the cleaning operation, and simultaneously outputs a drive signal for raising and lowering the bonding head 2 by a predetermined distance and moving in parallel by a predetermined distance. The bonding stage control unit 83 measures the timing based on the timing signal according to the preprocessing operation or the cleaning operation, and simultaneously outputs a drive signal for raising and lowering the bonding stage 3 by a predetermined distance and moving in parallel by a predetermined distance. The heating control unit 88 outputs a drive signal for turning on and off the head-side heater 21 and the stage-side heater 31 during the main operation and the pre-processing operation.

The belt travel control unit 84 measures timing based on the timing signal during the actual operation, and simultaneously outputs drive signals for feeding and winding of the loader 42 and the unloader 43 . The pickup control unit 85 measures timing based on the timing signal during normal operation, and simultaneously outputs a two-dimensional movement that causes the pickup head 6 to move up and down by a predetermined distance, move in parallel by a predetermined distance, and reverse at a predetermined inversion angle, along the parts supply unit 5 . Drive signal for direction movement. The cleaner control unit 87 outputs a drive signal for moving the cleaner 7 in parallel by a predetermined distance based on the timing signal during the cleaning operation.

(operate) (formal operation) The actual operation of the mounting device 1 under the control of the control unit 8 will be described with reference to FIGS. 4 to 7 . The actual operation is an operation of mounting the electronic component 100 on the mounting area 301 of the tape 300 . The main operation is performed after the belt 300 is stretched through the conveyance path 41 and the temperatures of the bonding head 2 and the bonding stage 3 are stabilized by an aging operation described later.

First, as shown in FIG. 4 , the component supply unit 5 aligns the electronic component 100 to be picked up at the pickup position 93 . The pickup head 6 descends at the pickup position 93 , sucks and holds the electronic component 100 , and then ascends again so as to be away from the component supply unit 5 . Then, the pick-up head 6 is directed towards the tape outer position 92 . During or after the movement to the belt outer position 92, the pick-up head 6 is reversed by 180°.

The splice head 2 is moved in parallel towards the belt outer position 92 and is lowered at the belt outer position 92 . Then, the bonding head 2 suction-holds and receives the electronic component 100 from the pickup head 6 . At this time, the pickup 6 separates the electronic components 100 due to vacuum break or atmospheric release.

As shown in FIG. 5 , the bonding head 2 that has received the electronic part 100 faces the mounting position 91 and descends at the mounting position 91 . The joining platform 3 supports the belt 300 on the conveying path 41 from below at the mounting position 91 . The loader 42 and the unloader 43 stop the traveling of the belt 300 and position the mounting area 301 at the mounting position 91 .

The bonding head 2 presses the electronic component 100 against the mounting area 301 on the tape 300 and heats it. Through the pressing and pressing, the electronic component 100 is electrically and mechanically connected to the mounting area 301 .

As shown in FIG. 6 , after the installation of one electronic part 100 is completed, the bonding head 2 leaves the electronic part 100 and ascends toward the belt outer position 92 to receive the next electronic part 100 . After transferring the electronic part 100 to the bonding head 2 , the pickup head 6 goes toward the pickup position 93 to pick up the next electronic part 100 . The parts supply part 5 moves in the two-dimensional direction so that the next electronic part 100 is located at the pick-up position 93 . The loader 42 and the unloader 43 feed and wind the tape 300 , so that the tape 300 is advanced, and the empty mounting area 301 adjacent to the mounting area 301 where the electronic component 100 is mounted is stopped at the mounting position 91 .

FIG. 7 is a timing chart showing the operation timing of the bonding head 2 . As shown in FIG. 7 , the bonding head 2 repeats the operation of bringing the bonding head 2 into an approaching state and a separation state with respect to the bonding stage 3 . In the approaching state, the bonding head 2 is brought close to the bonding stage 3 in order to press the electronic component 100 against the tape 300 at the mounting position 91 and heat it. The separated state refers to the state before the electronic component 100 is moved away from the bonding platform 3 after the mounting of the electronic component 100 is completed, and the next electronic component 100 is received at the belt outer position 92, and the electronic component 100 is brought into contact with the mounting area 301, and is brought into the close state again.

The same time S1 is spent in each approaching state. The same time S2 is spent in each separation state. That is, in the actual operation of the bonding head 2, the same approach-separation pattern is repeated. This approach-separation mode is based on the timing at which the bonding head 2 approaches the bonding stage 3, the time S1 for approaching, the timing for separation from the bonding stage 3, and the time S2 for separation. Included in the elements of the near-far pattern.

(cleaning operation) When the electronic component 100 is repeatedly mounted based on the above-mentioned actual operation, dirt or the like adheres to the bonding head 2 or the bonding stage 3, and therefore, the cleaning operation is performed every preset time or every preset number of mountings. In the cleaning operation, as shown in FIG. 12 , the bonding head 2 , the bonding platform 3 and the cleaner 7 are moved to the belt outer position 92 . The engaging head 2 descends and swings in contact with the grindstone on the upper surface of the cleaner 7 . The engaging platform 3 is moved up and is swung in contact with the grindstone on the lower surface of the cleaner 7 . When cleaning is completed, the cleaner 7 is retracted to a retracted position offset from the belt outer position 92 .

(preprocessing operation) The preprocessing operation of the mounting device 1 under the control of the control unit 8 will be described with reference to (a) to (d) of FIGS. 8 to 11 . The preprocessing operation is carried out before the formal operation, including the belt erection operation and the aging operation. In the belt setting operation, the loader 42 is caused to feed out the belt 300 , the belt 300 is set in the conveyance path 41 , and the belt 300 is wound around the unloader 43 . The belt erection operation ends before the aging operation, or in parallel with the aging operation until the aging operation is completed.

In the aging operation before the main operation, the head-side heater 21 and the deck-side heater 31 are turned on, and under the same operating conditions as the main operation (for example, the same amount of heat per unit time as in the main operation, that is, the same as in the main operation At the same set temperature), the bonding head 2 and the bonding platform 3 are heated. The head-side heater 21 and the stage-side heater 31 are continuously turned on until the pre-processing operation is completed and transferred to the main operation, generate the same amount of heat per unit time as in the main operation, and continue to heat the bonding head 2 and the bonding table 3 .

In the aging operation, in heating, as shown in FIG. 8 , the bonding head 2 and the bonding platform 3 are brought together at the belt outer position 92 and separated from each other. Then, first, the bonding platform 3 is raised to the same height as that of the support belt 300 , and then, as shown in FIG. 9 , the bonding head 2 is lowered. Thereby, the holding surface of the bonding head 2 is brought into contact with or close to the supporting surface of the bonding platform 3 . The distance between the bonding head 2 and the bonding stage 3 when approaching is preferably a distance equivalent to the thickness of the electronic component 100 and the tape 300 , or the same distance as the thermal conductivity when the electronic component 100 and the tape 300 are present.

In the aging operation, the separation state shown in FIG. 8 and the contact or approach state shown in FIG. 9 (hereinafter, the contact or approach state is simply referred to as the contact state) are repeated a predetermined number of times, for example, 20 to 30 times or more. As the number of repetitions, 20 to 30 times or more are exemplified, and the number of repetitions required to achieve a stable temperature can be derived empirically, experimentally, by calculation, or by analogy. The separation state in the aging operation lasts for the same time S2 as the separation state in the main operation shown in FIG. 7 . The contact state continues for the same time S1 as the approaching state in the actual operation shown in FIG. 7 . That is, as shown in FIG. 10( b ), in the aging operation, the bonding head 2 and the bonding stage 3 are at the tape outer position 92 , in a state where the tape 300 and the electronic component 100 do not exist, in the same manner as in the actual operation. Proximity-split mode operation. Furthermore, (a) in FIG. 10 shows the approach-separation mode in the actual operation.

(a) of FIG. 11 is a timing chart showing the timing of the separation state and the contact state of the bonding head 2 in the aging operation, and (b) of FIG. 11 is a schematic diagram showing the temperature change of the bonding head 2 in the aging operation The graph of FIG. 11( c ) is a graph schematically showing the temperature change of the bonding platform 3 in the aging operation.

As shown in FIGS. 11( a ) to ( c ), in the initial stage of the aging operation, the temperature difference between the bonding head 2 and the bonding stage 3 is large. The temperature of the bonding head 2 is higher than that of the bonding table 3 . Therefore, during the time S1 during which the bonding head 2 is in contact with or approaching the bonding stage 3 , the temperature of the bonding head 2 drops significantly, and the temperature of the bonding stage 3 greatly increases.

On the other hand, the difference between the bonding head 2 and the room temperature is large, and the difference between the bonding stage 3 and the room temperature is small. Therefore, during the time S2 when the bonding head 2 is separated from the bonding stage 3, the temperature rise of the bonding head 2 is small, and the temperature drop of the bonding stage 3 is small. Therefore, in (a) to (c) of FIG. 11 , the temperature of the bonding head 2 continues to decrease, and the temperature of the bonding stage 3 continues to increase until the separation state and the contact state are repeated for the fourth time.

However, since the temperature of the bonding head 2 continues to drop and the temperature of the bonding stage 3 continues to rise, in the later stage of the aging operation, the temperature difference between the bonding head 2 and the bonding stage 3 becomes smaller than the initial stage. Therefore, during the time S1 when the bonding head 2 contacts or approaches the bonding stage 3, the temperature drop of the bonding head 2 is smaller than the initial stage, and the temperature rise of the bonding stage 3 is smaller than the initial stage.

On the other hand, since the temperature of the bonding head 2 continues to drop, the difference between the bonding head 2 and the room temperature is reduced. In addition, since the temperature of the bonding stage 3 continues to rise, the difference between the bonding stage 3 and the room temperature increases. Therefore, during the time S2 when the bonding head 2 is separated from the bonding stage 3, the temperature rise of the bonding head 2 heated by the head-side heater 21 becomes larger than the initial stage, and the temperature drop of the bonding stage 3 becomes larger than the initial stage. .

Finally, the temperature drop of the bonding head 2 at the time S1 is balanced with the temperature increase of the bonding head 2 at the time S2. 11 (a) to (c) schematically show that after the fifth time, the temperature upper limit T1, the temperature lower limit T2, the temperature decrease rate, and the temperature increase rate of the bonding head 2 are maintained substantially constant, respectively. value, the state in which the moving average is stable. In addition, the temperature rise of the bonding stage 3 at the time S1 is balanced with the temperature drop of the bonding stage 3 at the time S2, and (a) to (c) in FIG. 11 schematically show that the bonding stage 3 after the fifth time The temperature upper limit T3 , the temperature lower limit T4 , the temperature decrease rate, and the temperature increase rate are maintained at approximately constant values, respectively, and the moving average is stable. That is, the temperatures of the bonding head 2 and the bonding stage 3 are stabilized by the same temperature change pattern and temperature change amount for each time after the fifth time.

When the above preprocessing operation is finished, the belt 300 has been erected, and on the belt 300, the mounting area 301 originally used to mount the electronic part 100 is positioned at the mounting position 91, and thus can be quickly transferred to the actual operation. Therefore, in a state where the temperatures of the bonding head 2 and the bonding stage 3 are kept stable, from the first mounting to the last mounting, the temperature upper limit T1 and the temperature upper limit T3 (moreover, T1≠T3) and the same temperature lower limit are the same. T2 and the lower temperature limit T4 (moreover, T2≠T4), the same temperature decrease rate and the same temperature increase rate, apply heat of a fixed average value to the belt 300 . In this way, from the first mounting to the last mounting, the extension of the mounting region 301 due to heat is made uniform, and all the electronic components 100 can be mounted on all the mounting regions 301 with the same accuracy.

In addition, during the above-mentioned preprocessing operation, the user's trial and error of setting the respective stable temperatures of the bonding head 2 and the bonding stage 3 is not performed. In the preprocessing operation, the contact, approach and separation of the bonding head 2 and the bonding stage 3 may be repeated at the same timing as the actual operation at the belt outer position 92 .

(Effect) As described above, the mounting apparatus 1 for mounting the electronic component 100 on the mounting area 301 may include the conveyance path 41 , the bonding head 2 , and the bonding stage 3 . The conveyance path 41 runs the belt 300 in which the attachment areas 301 are arranged in parallel in the belt direction. The joining platform 3 can be arranged on the conveying route of the belt 300 through the conveying path 41, and supports the belt 300 from the lower surface. The bonding head 2 holds the electronic part 100 and presses it to the mounting area 301 of the tape 300 supported by the bonding platform 3 and heats it. The bonding head 2 and the bonding stage 3 are provided with a head-side heater 21 and a stage-side heater 31 .

Furthermore, the bonding head 2 and the bonding stage 3 are moved to the tape outside position 92 deviated from the tape 300 as an aging operation before the actual operation of mounting the electronic component 100 to the tape 300 , and contact is repeated at the tape outside position 92 Or approach, and separate, while being heated.

Thereby, the aging operation can be performed in a state where the belt 300 is installed on the conveyance path 41, or simultaneously with the installation. More specifically, the mounting area 301 where the electronic part 100 is initially mounted may be located at the mounting position 91 in the tape 300 when the aging operation starts or until the aging operation is completed. In this way, by intervening the work of erecting the tape 300 after the aging operation, the temperature of the bonding head 2 and the bonding stage 3 can be suppressed from changing from a stable temperature, thereby further improving the mounting accuracy.

Furthermore, since the aging operation is performed by moving to the belt outside position 92 , which is a position deviated from the conveying path 41 of the belt 300 at the installation position 91 , the belt 300 mounted on the conveying path 41 can be prevented from being damaged. The bonding head 3 in the aging operation is heated by heat (radiant heat). As a result, it is possible to prevent the belt 300 from being accidentally thermally expanded or damaged by heating. Therefore, it is possible to expect not only a further improvement in the mounting accuracy but also an improvement in the mounting quality.

Furthermore, when the aging operation is performed while the belt 300 is installed on the conveyance path 41, the aging operation can be automatically started in response to the completion of the positioning of the first installation area 301 of the belt 300 to the installation position 91. For example, based on a signal from the tape travel control unit 84 , the control unit 8 receives a signal from the tape travel control unit 84 indicating that the first mounting region 301 of the tape 300 has stopped at the mounting position 91 . Then, on the basis of the signal reception, the bonding head control unit 82 and the bonding stage control section 83 output drive signals so that the movement of the bonding head 2 and the bonding stage 3 becomes an aging operation. Thereby, the aging operation can be automatically performed and completed only by performing the belt erection operation.

In addition, the belt outer position 92 where the aging operation is performed is set as a position where the bonding head 2 and the bonding table 3 are cleaned by the cleaner 7 . Thus, the movement mechanism located at the belt outer position 92 can be used for aging operations. However, the aging operation, cleaning operation, and transfer operation of the electronic components 100 do not hinder the temperature stabilization of the bonding head 2 and the bonding stage 3 as long as the position is deviated from the belt 300 , regardless of whether it is a common location or a different location.

In the above-described mounting apparatus 1, both the head-side heater 21 and the table-side heater 31 may be provided, but any one of them may be provided as long as the temperature can be stabilized to a desired temperature. However, if the head-side heater 21 is provided in the bonding head 2, the temperature of the bonding head 2 that is not in contact with the tape 300 can be set higher, and the bonding time between the electronic component 100 and the mounting area 301 of the tape 300 can be shortened . However, in order to stabilize in a range close to the desired temperature, or to stabilize rapidly, it is desirable to also provide the deck-side heater 31 .

In addition, in order to completely simulate the actual operation, the dummy electronic components 100 and the missing pieces of the dummy tape 300 may be stacked on the bonding platform 3 , and the aging operation may be performed while sandwiching these dummy parts. It is also possible to reproduce the form of heat transfer via the electronic component 100 and the belt 300 , and to precisely match the temperature stable in the main operation with the temperature stable in aging. That is, the temperature change at the time of initial installation in the actual operation is further suppressed.

(Second Embodiment) In the first embodiment, as an aging operation, the bonding head 2 alternately repeats a predetermined number of times of contacting or approaching the bonding stage 3 and separation from the bonding stage 3 at the operation timing simulating the actual operation of mounting. However, the heating method of the bonding head 2 and the bonding stage 3 is not limited to this.

For example, as shown in FIG. 13, the installation device 1 includes a heater 12 which is provided only during the aging operation and is removed during the actual operation of the installation. The heater 12 is placed on the joining platform 3 by an operator during the aging operation. The bonding head 2 is moved towards the bonding platform 3 at the belt outer position 92 . Then, it is kept close to or in contact with the heater 12 on the bonding stage 3 for a predetermined time. In other words, the bonding head 2 approaches or contacts the bonding stage 3 on which the heater 12 is placed. The specified time of approach or contact is the time to reach a stable temperature, derived by experience, experiment, calculation or simulation.

When a predetermined time elapses, the heater 12 may be removed by the operator, or may be adsorbed and held by the bonding head 2, and moved to a place different from the attachment position 91 and the belt outer position 92. In the case of the method in which the heater 12 is removed by the bonding head 2, it is possible to automatically shift to the actual operation of the mounting.

In addition to the heater 12 , the head-side heater 21 and the stage-side heater 31 can also be turned on to provide more heat to the bonding head 2 and the bonding stage 3 and shorten the time required for the aging operation. The heater 12 may not be arranged on the bonding stage 3, but the head-side heater 21 and the stage-side heater 31 may be turned on, and the bonding head 2 and the bonding stage 3 may be continuously contacted or separated for a predetermined time, and the head-side heater may be used only. 21 and the platform side heater 31 perform an aging operation for heating.

In addition, as a method of deriving the predetermined time empirically or experimentally, the following method is mentioned. That is, a thermometer such as a thermocouple is placed on the bonding stage 3 or attached to the bonding head 2 , and the bonding head 2 and the bonding stage 3 are brought into contact with or approached. Observe the temperature change displayed on the thermometer, measure the time required for the temperature to stabilize, and set the measurement result as a predetermined time. Similarly, as an aging operation, when the bonding head 2 and the bonding platform 3 repeat the approaching state and the separation state as in the actual operation of the simulated installation, as a method of empirically or experimentally deriving the number of repetitions, it is only necessary to count until The number of repetitions until the thermometer detects that the temperature is stable is sufficient.

(Other implementations) As mentioned above, although the embodiment and the modification of each part of this invention were described, the said embodiment and the modification of each part are shown as an example, Comprising: It is not intending limiting the scope of invention. The novel embodiment described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are also included in the invention described in the claims.

1: Install the device 11: Up and down two field of view cameras 12: Heater 2: Splice head 21: Head side heater 22: Lifting mechanism 23: Parallel movement mechanism 24: Position Correction Mechanism 3: Engage the platform 31: Platform side heater 32: Lifting mechanism 33: Parallel movement mechanism 41: Conveyor Road 411: Rails 412: Clearance 42: Loader 43: Unloader 5: Parts Supply Department 51: Camera 6: Pick up head 61: Lifting mechanism 62: Parallel movement mechanism 63: Reverse Mechanism 7: Cleaner 71: Parallel movement mechanism 8: Control Department 82: Joint head control part 822: Lift Control Department 823: Parallel movement control 83: Engagement platform controls 832: Lift Control Department 833: Parallel movement control 84: With travel control part 85: Pickup Control 87: Cleaner Control Department 88: Heating Control Department 89: Timing Department 91: Installation location 92: with external position 93: Pickup Location 100: Electronic Parts 200: wafer sheet 300: Strip circuit substrate (belt) 301: Installation area S1: time of proximity/time of contact or proximity S2: time of separation T1: Upper temperature limit of bonding head 2 T2: Lower temperature limit for bonding head 2 T3: Upper temperature limit for bonding platform 3 T4: Lower temperature limit for bonding platform 3

FIG. 1 is a plan view showing the configuration of a mounting device according to the first embodiment. FIG. 2 is a side view showing the configuration of the mounting device according to the first embodiment. FIG. 3 is a schematic diagram showing the position of the heater and the configuration of the control unit. FIG. 4 is a schematic diagram showing a first process of the actual operation of the mounting device according to the first embodiment. FIG. 5 is a schematic diagram showing a second process of the actual operation of the mounting device of the first embodiment. 6 is a schematic diagram showing a third process of the actual operation of the mounting device of the first embodiment. FIG. 7 is a timing chart showing the raising and lowering timing of the bonding head according to the first embodiment. FIG. 8 is a schematic diagram showing a first process of the aging operation of the mounting device of the first embodiment. 9 is a schematic diagram showing a second process of the aging operation of the mounting device of the first embodiment. (a) and (b) of FIG. 10 are graphs comparing the timing of contact and separation between the bonding head and the bonding stage in the main operation and the aging operation according to the first embodiment. (a) to (c) of FIG. 11 relate to the first embodiment, (a) of FIG. 11 is a timing chart showing the timing of contact and separation of the bonding head and the bonding stage in the aging operation, and ( b) is a graph showing the temperature change of the bonding head, and (c) in FIG. 11 is a graph showing the temperature change of the bonding platform. FIG. 12 is a schematic diagram showing a cleaning operation of the mounting device of the first embodiment. FIG. 13 is a side view showing the configuration of the mounting device according to the second embodiment.

1: Install the device

11: Up and down two field of view cameras

2: Splice head

22: Lifting mechanism

23: Parallel movement mechanism

24: Position Correction Mechanism

3: Engage the platform

32: Lifting mechanism

33: Parallel movement mechanism

41: Conveyor Road

5: Parts Supply Department

51: Camera

6: Pick up head

61: Lifting mechanism

62: Parallel movement mechanism

91: Installation location

92: with external position

93: Pickup Location

100: Electronic Parts

200: wafer sheet

300: Strip circuit substrate (belt)

Claims (9)

A mounting device for mounting electronic components in a mounting area arranged side by side on a strip-shaped circuit board, comprising: a tape traveling unit having a conveying path for bridging the strip-shaped circuit board; advancing the tape circuit board along the conveying path of the conveying path; joining a stage capable of being arranged on the conveying path of the tape circuit board and supporting the tape circuit board from the lower surface; bonding a head that presses and heats the electronic component against the mounting area of the strip-shaped circuit board supported by the bonding platform; and a heater that heats the bonding head, or additionally heats the bonding head The bonding stage is heated, and the bonding head and the bonding stage are moved to a tape outer position deviated from the conveying route of the tape circuit board as an aging operation before the actual operation, and Contact or proximity, or repeated contact and separation or repeated proximity and separation, is maintained at a location outside the belt while heating is performed by the heater. The mounting device according to claim 1, further comprising: a cleaner that cleans the bonding head and the bonding stage at a cleaning position deviated from the conveyance route of the strip-shaped circuit board. For cleaning, the belt outer position is set to the cleaning position. The installation device according to claim 1 or claim 2, further comprising: a control unit including: a bonding head control unit that controls movement of the bonding head; a bonding stage control unit that controls movement of the bonding stage; and a heating control unit that controls the heater and is related to the a control unit that controls the bonding head control unit and the bonding platform control unit to move the bonding head and the bonding platform from a mounting position where the actual operation is performed to a position outside the belt, The external position moves the bonding head and the bonding platform in a manner of contacting or approaching, and controls the heating control part to drive the heater to control the aging operation. The mounting device according to claim 3, wherein the control section performs the aging operation after the erection of the strip circuit board is completed on the conveyance path. The mounting device according to claim 1 or claim 2, further comprising: a parts supply part that makes the electronic parts to be mounted stand by, and a pickup head that receives the electronic parts to be mounted next from the parts supply part , and transferred to the bonding head, and the pick-up head hands over the electronic part to the bonding head at a position outside the belt during the actual operation. The mounting device of claim 1 or claim 2, wherein the heater is equipped with either or both of the bonding head and the bonding platform By. The mounting device of claim 1 or claim 2, wherein the heater rests on the engagement platform during the aging operation. The mounting apparatus of claim 1 or claim 2, wherein the bonding head and the bonding platform are in the actual operation to press the electronic part to the mounting area during a first time The approaching state is repeated during the second time, and the approach and separation are repeated in such a manner that the separation state is separated from the approaching state, and the bonding head is repeated in the aging operation: at the same time as the first time. During the second time, in contact with or in proximity to the engagement platform, and during the second time, disengage relative to the engagement platform. The mounting device according to claim 1 or claim 2, wherein in the aging operation, the distance between the bonding head and the bonding platform when they approach is equal to the distance between the electronic part and the strip The distance of the thickness of the circuit board.

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