TW201028061A - Electronic component mounting device and mounting method - Google Patents

Electronic component mounting device and mounting method Download PDF

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Publication number
TW201028061A
TW201028061A TW098133696A TW98133696A TW201028061A TW 201028061 A TW201028061 A TW 201028061A TW 098133696 A TW098133696 A TW 098133696A TW 98133696 A TW98133696 A TW 98133696A TW 201028061 A TW201028061 A TW 201028061A
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TW
Taiwan
Prior art keywords
substrate
tool
end surface
electronic component
support tool
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TW098133696A
Other languages
Chinese (zh)
Inventor
Etsuo Minamihama
Mitsuhiro Okazawa
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Shibaura Mechatronics Corp
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201028061A publication Critical patent/TW201028061A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788Glasses, e.g. amorphous oxides, nitrides or fluorides

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Liquid Crystal (AREA)

Abstract

An electronic component mounting device comprises: a backup tool (17) that has a top end surface for supporting a bottom surface of a side edge portion whereon a TCP of a substrate that is placed on the top surface of a mounting stage is to be mounted; a pressing tool (15) for mounting the TCP onto the top surface of the side edge portion of the substrate of which the bottom surface is supported by the top end surface of the backup tool; an imaging camera (51) for imaging the top end surface in a state wherein the substrate has been retracted from the top end surface of the backup tool; a camera driving source for driving the imaging camera in the lengthwise direction of the backup tool, to cause imaging across the entire length of the top end surface; an image processing unit for processing the image signals of the camera driving source; and an evaluating unit for evaluating whether or not there is contamination on the top surface of the backup tool, based on the image signal processed by the image processing unit.

Description

201028061 六、發明說明: κ:發明所屬之技術領域】 本發明係關於一種安裝裝置及安裝方法,係可於例如使用 於液晶顯示裝置之玻璃基板安裝TCP (Tape Carrier Package) 等電子零件者。 I:先前技術3 在製造液晶顯示裝置時,會使用安裝裝置將作為電子 元件之TCP安裝於玻璃製面板等基板上^ TCP大多安裝於前 述基板的四個邊中,至少一邊以外之兩個邊或三個邊上。 前述安裝裝置具有供給載置前述基板之安裝台。該安 裝台具有較前述基板的平面形狀小之載置面,而可供給載 置前述基板於該載置面上。此時,前述基板係經定位保持 成使安裝前述TCP之侧邊部由前述安裝台之載置面邊緣向 外突出。 前述基板之側邊部貼合有具有黏合性之帶狀異向性導 電構件,而複數TCP會以預定間隔預壓焊於該異向性導電 構件後正式壓焊。 將複數TCP預壓焊或正式壓焊於基板之側邊部時前 述基板之侧邊部下面係由支撐工具之上端面所支撐。預壓 焊時,係將TCP-個個供、给、安裝於基板之側邊部上面, 而正式壓焊時則以加壓工具同時加壓加熱已預壓焊之複數 TCP。藉著正式壓焊前述Tcp,熱硬化性之前述異向性導電 構件會因壓工具的熱而融化後再硬化,因此可將複數 TCP固著於基板側邊部。專利文獻1顯示了上述安裝記述。 3 201028061 【專利文獻1】日本專利公開公報特開2008_124148號 當正式壓焊TCP時’有時支撐基板之側邊部下面的支 撐工具上端面會附著塵埃。在附著塵埃的狀態下,以加壓 工具加壓基板之側邊部上面時,會有較其它部分大的加壓 力作用於有前述基板塵埃的部分,有時會造成該部分破損。 故,以往若進行預定次數之正式壓焊後,會以例如手 動作業而用旋轉刷等來清掃前述支撐工具之上端面,以去 除附著於該上端面之塵埃。 然而’在一次同時正式壓焊複數TCP時,支撐工具與 加壓工具必須具備可將已預壓焊於基板之複數TCP同時加 壓加熱的長度。最近基板已趨大型化◊因此,隨著基板的 大型化,支撐工具與加壓工具亦會增長例如1〜3公尺左右。 支撐工具一旦增長,其上端面附著塵埃的機會會增 加。支撐工具之上端面,不僅會附著周圍氣體中所含之塵 埃,正式壓焊時,因加壓工具融化之異向性導電構件的一 部分亦會成為附著物而附著、固化於支撐工具之上端面。 若支撐工具的上端面僅附著有塵埃,則可藉由旋轉刷 清掃其上端面而輕易的去除。惟,一旦支撐工具之上端面 附著異向性導電構件的一部分固化而成之附著物,只以旋 轉刷清掃會無法去除乾淨。 以往’以旋轉刷來清潔支撐工具的上端面。且,只要 以旋轉刷清潔,則視為已由支撐工具之上端面去除塵埃者 而進行正式壓焊。 因此’一旦支撐工具之上端面附著異向性導電構件的 4 201028061 - 一部分固化而成之附著物,在正式壓焊TCP時,會因該附 著物而使基板一部份承受較大的應力,故會成為該部分產 生缺陷等損傷基板的原因。 t 明内穷】 本發明係提供一電子元件之安裝裝置及安裝方法,係 可確實地確sS支撑工具之上端面有無附著物者。為解決前 ❿ 迷課通’本發明提供一種電子元件的安裝裝置,係將電子 元件女裝於基板之侧邊部者,其特徵在於具有:安裝台, 係使安裝則述電子元件之側邊部向外突出,而將前述基板 載至於上面者;支撐工具,係具有支撑前述基板之侧邊部 I面之上端面者;且前述基板已由前述安裝台之上面向外 大出,加壓工具’係將前述電子元件安裝於前述基板之側 邊部上面者’且前述基板係下面被前述支擇工具之上端面 所支擇;攝像機構,係在基板已由前述支樓工具之上端面 _ 移退之狀態下’拍攝前述上端面者;躁動機構,係沿前述 支撐工具之長方向來縣動該攝像機構而使其拍攝前述上 端面之全長者,影像處理部,係將前述攝像機構之拍攝訊 號加以影像處理者;及,判定機構,係根據前述影像處理 部所處理之影像訊號;判定前述支撐工具之上端面有 著物。 又,本發明提供一種電子元件的安裝方法,係將電子 元件安裝於基板之側邊部者,其特徵在於具有下列步驟·· 將已載置於安裝台之基板之侧邊部下面,載置於支擇工具 5 201028061 的上端面;於下面已載置於前述支禮工具之上端面的基板 之側邊部上面’安裝前述電子元件;在基板已由前述支撐 工具之上端面移退之狀態下,於長方向全長拍攝前述支樓 工具之上端面;及’根據前述支撐工具之上端面的拍攝來 判定其上端面有無附著物。 圖式簡單說明 第1圖係顯示本發明其中—實施形態之安裝裝置的概 略構成圖。 第2圖係顯不設於壓合單元之支架楼的檢查裝置之側 面圖。 第3圖係位於支撐工具之_端侧的待機位置之檢查裝 置的正面圖。 第4圖係顯不控制裝置之控制系統的方塊圖。 第5A圖係於支撐卫具之承受面沒有附著鏡著的狀態 下,由攝像相機所拍攝之拍攝影像的說明圖。 第5B圖係於支推工具之承受面附著了附著物的狀態 下,由攝像相機所拍攝之拍攝影像的說明圖。2010. The invention relates to a mounting device and a mounting method, and can be used, for example, for mounting electronic components such as TCP (Tape Carrier Package) on a glass substrate of a liquid crystal display device. I: Prior Art 3 When manufacturing a liquid crystal display device, a TCP as an electronic component is mounted on a substrate such as a glass panel by using a mounting device. TCP is often mounted on four sides of the substrate, and at least two sides of the substrate. Or three sides. The mounting device has a mounting table for supplying the substrate. The mounting table has a mounting surface that is smaller than the planar shape of the substrate, and the substrate is placed on the mounting surface. At this time, the substrate is positioned and held such that the side portion on which the TCP is attached protrudes outward from the edge of the mounting surface of the mounting table. The side edge portion of the substrate is bonded with a band-shaped anisotropic conductive member having adhesiveness, and the plurality of TCPs are pre-compression-bonded to the anisotropic conductive member at a predetermined interval and then formally welded. When the plurality of TCP is pre-welded or formally welded to the side portions of the substrate, the lower side of the side portion of the substrate is supported by the upper end surface of the supporting tool. In the pre-welding, TCP is supplied, supplied, and mounted on the side of the substrate, and in the case of the formal pressure welding, the pre-compression-bonded TCP is simultaneously pressurized by the pressurizing tool. By the conventional pressure welding of the above Tcp, the anisotropic conductive member having thermosetting property is melted by the heat of the pressing tool and then hardened, so that the plurality of TCP can be fixed to the side edge portion of the substrate. Patent Document 1 shows the above-described mounting description. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-124148 When the TCP is officially pressure-bonded, dust may adhere to the upper end surface of the support tool below the side portion of the support substrate. When the upper side of the substrate is pressed by the pressurizing tool in a state where dust is adhered, a large pressing force is applied to the portion where the substrate dust is present, and the portion may be damaged. Therefore, in the past, after the predetermined number of times of the final pressure welding, the upper end surface of the support tool is cleaned by, for example, a manual operation using a rotating brush or the like to remove dust adhering to the upper end surface. However, when a plurality of TCPs are officially pressure-bonded at the same time, the supporting tool and the pressing tool must have a length capable of simultaneously heating and heating the plurality of TCPs which have been pre-welded to the substrate. Recently, the substrate has become larger, and therefore, as the substrate is enlarged, the supporting tool and the pressing tool are also increased by, for example, about 1 to 3 meters. Once the support tool grows, the chance of dust adhering to the upper end surface increases. The upper end surface of the supporting tool not only adheres to the dust contained in the surrounding gas, but also forms a part of the anisotropic conductive member that is melted by the pressing tool during the formal welding, and adheres to and solidifies on the upper end surface of the supporting tool. . If only the dust is attached to the upper end surface of the supporting tool, it can be easily removed by rotating the upper end surface of the supporting brush. However, once the end surface of the supporting tool is adhered to a part of the anisotropic conductive member which is solidified, it can not be removed only by the rotating brush. In the past, the upper end surface of the support tool was cleaned by a rotating brush. Further, if it is cleaned by a rotating brush, it is considered that the dust has been removed from the upper end surface of the supporting tool, and the final welding is performed. Therefore, once the end surface of the supporting tool is attached with the anisotropic conductive member 4 201028061 - a part of the cured deposit, when the TCP is officially welded, the substrate is subjected to a large stress due to the deposit. Therefore, it may become a cause of damage to the substrate such as defects. The present invention provides an electronic component mounting device and mounting method, which can reliably confirm the presence or absence of attachment on the upper end surface of the sS support tool. In order to solve the problem, the present invention provides an electronic component mounting device, which is characterized in that the electronic component is worn on the side of the substrate, and is characterized in that it has a mounting table for mounting the side of the electronic component. a portion protruding outwardly to carry the substrate to the upper surface; the supporting tool having an end surface supporting the side surface of the side surface of the substrate; and the substrate has been enlarged outward from the upper surface of the mounting table, and pressurized The tool 'mounts the aforementioned electronic component on the side of the side of the substrate' and the bottom of the substrate is selected by the upper end surface of the cutting tool; the image pickup mechanism is attached to the upper end surface of the substrate _ in the state of retracting, 'the upper end face is photographed; the swaying mechanism is to move the image capturing mechanism along the longitudinal direction of the supporting tool to capture the entire length of the upper end surface, and the image processing unit is to use the image capturing mechanism The imaging signal is applied to the image processor; and the determining mechanism is based on the image signal processed by the image processing unit; the upper end surface of the supporting tool is determined to have . Moreover, the present invention provides a method of mounting an electronic component, which is characterized in that the electronic component is mounted on a side edge of the substrate, and has the following steps: - placing the substrate placed under the side of the substrate of the mounting table The upper end surface of the cutting tool 5 201028061; the electronic component mounted on the side of the substrate on the upper end surface of the above-mentioned gift tool; the state in which the substrate has been removed from the upper end surface of the supporting tool Next, the upper end surface of the above-mentioned branch tool is photographed in the long direction; and 'the upper end surface is judged to have any adhering matter according to the photographing of the upper end surface of the support tool. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the configuration of a mounting apparatus according to an embodiment of the present invention. Figure 2 is a side elevational view of the inspection apparatus not shown in the support floor of the press unit. Fig. 3 is a front view of the inspection device at the standby position on the side of the support tool. Figure 4 is a block diagram showing the control system of the control device. Fig. 5A is an explanatory view of a captured image taken by a camera camera in a state where the receiving surface of the supporting guard is not attached to the mirror. Fig. 5B is an explanatory view of a captured image taken by a camera camera in a state where an attached object is attached to the receiving surface of the supporting tool.

第6圖係侧邊部安裝有TCP之基板的立體圖。 【實施方式;J 以下參照圖式來說明本發明其中一實施形態。 第1圖係顯示本發明其中一實施形態之安裝裝置的概 略構成圖。該安裝裝置中,,將已透過具有黏合性之帶狀 異向性導電構件預壓焊之電子元件TCP6,正式壓焊於第6 圖所示之玻璃製液晶室所構成的基板墀的周緣部分可。 201028061 刖述基板w係透過未圖示之封著劑㈣定間隔接合〆 對玻璃板4a ’並於該等間封人液晶,且除了在各玻璃板如 外面之周緣處外,全面分別貼合有㉟光板仆。 下側玻璃板4a之側邊部上面已透過異向性導電構件5 預壓知則述TCP6,預壓焊後再如後述進行正式壓焊。第6 圖係顯示兩側邊部各自預壓焊有複數7(::1>6的基板w之立體 圖。 如第1圖所示,前述安裝裝置具有作為加壓構件之壓合 單元11 ’以及使後述安裝台37往水平方向(χ、γ方向)、 旋轉方向(0方向)與箭頭所示之上下方向(Ζ方向)移動 之定位單元12。 前述壓合單元11具有支架檯13,且加壓工具15設在該 支架檯13上端所設之支撐部14,而可藉由汽缸上下驅動。 前述加壓工具15内藏有加熱器15b,而可加熱該加壓工具15 至數百度。又,加壓工具15的下端面形成有加壓面15a,且 該加壓面15a之下方直立設置有支撐工具17,使支撐工具17 之上端面(即承受面17a)與加壓面15a相對向。 前述支撐工具17具有可支撐基板W側邊部的長度,而 前述加壓工具15則設定成對應前述支撐工具17之長度。當 基板W為大型者時,有時前述加壓工具15與前述支撐工具 17可達1公尺以上。 前述定位單元12係配置於前述壓合單元11之侧邊。該 定位單元12具有X台18,而於該X台18設置有以X驅動源19 來向X方向驅動之X可動體20。 201028061 又,將與前述壓合單元11之支撐工具17之長方向平 行、並與第1圖之紙面正交之方向作為X方向,而與該X方 向父叉之方向作為Y方向。γ方向於第】圖中以箭頭表示。 前述X可動體20之上面一體地設置有γ台2b該¥台21 之上面設置有Y可動體22。該γ可動體22係以γ驅動源23而 向與前述X方向垂直之γ方向驅動。 前述Y可動體22之上面直立設置有侧面形狀呈曲柄狀 的支撐體25。於該支撐體25之上端部的支撐部26與前述γ 可動體22之間,將螺桿軸27與導引軸28設置為其軸線相對χ 方向與Υ方向所成的平面呈垂直。螺桿轴27設置為可旋轉, 而導引軸28則設置為固定式。 Ζ可動體29螺合於前述螺桿轴27,且前述導引轴28可滑 動地連通插入於該Ζ可動體29。故,只要旋轉螺桿軸27,^ 述Ζ可動體29便可在不與螺桿轴27同時旋轉之情形下,沿前 述導引軸28上下動。 前螺桿轴27之上端部係由前述支撐部26之上面突出, 而於該突出歧合有從動齒輪3G。該從動齒輪3()咬合有驅 動齒輪31。該驅動齒輪31係同軸地固定於設置於前述支撐 體25的Z驅動源32之驅動軸32a。故,只要z驅動源32作動而 旋轉該驅動軸32a,則螺桿轴27會透過—對已咬合之齒輪 3〇、31而旋轉,因此前述z可動體29會往第丨圖中箭頭所示χ 之方向驅動。 前述Z可動體29固定有呈L字型之安裝構件_一邊。 該安農構件34呈水平之另一邊的下面設置有θ驅動源”, 201028061 而上面則設有以垂直轴線為中心並以Θ驅動源35旋轉驅動 之6►可動體36。 前述Θ可動體36之上面設置有平面形狀為矩形之前述 女裝台37 ’而該安裝台37之中央部係與0可動體36之旋轉 中心一致。該安裝台37之上面37a開口形成有以真空幫浦產 生°及著力之吸引孔(皆無圖示),而可吸著保持前述基板 W。 又’如第1圖所示,前述基板W係在使已預壓焊TCP6 之侧邊部由沿安裝台37之X方向的侧緣向外突出的狀態 下’保持於安裝台37上。 在正式壓焊已預壓焊於前述基板W側邊部之TCP6時, 如同一圖中虛線所示,將基板W之已預壓焊TCP6之側邊部 載置於前述支撐工具17之承受面17a。在此情態下,當前述 加壓工具15以汽缸16向下降方向驅動時,前述TCP6會被加 壓工具15加壓加熱,因此異向性導電構件5會溶融固化,而 將前述TCP6正式壓焊於基板W之側邊部。 在開始前述TCP6之正式壓焊前、或已進行正式壓焊一 預定次數後,以後述旋轉刷62來清潔前述支撐工具17之承 受面17a後,以檢查裝置41來檢查該承受面17a是否殘留有 附著物。 如第2圖與第3圖所示,前述檢查裝置41具有懸吊於前 述壓合單元11之支撐部14下面的一對導引軌道43。一對導 引軌道43係形成為較沿前述支撐工具17之X方向的長度尺 寸長,且設置於前述支撐工具17之寬方向兩側,並使其下 9 201028061 端位於較前述承受面17a靠近上方。 前述一對導引軌道43形成有朝下面開放之桶端凹槽狀 的導引溝43a,且設置於可動體44上端之凸出部44a係可移 動地卡合於該導引溝43a。一對可動體44安裝有基底構件45 的一端與另一端。換言之’基底構件45設置於與前述支撐 工具17之長方向交又之方向。 前述基底構件45的上面設置有螺旋體46,而於該螺旋 鱧46旋合有螺桿軸47。該螺桿轴47具有與前述支撐部14大 致相同的長度,且將其轴線設置成與前述支撐工具17的長 方向平行。如第3圖所示,該螺桿軸47的一端連結於由脈衝 馬達構成之相機驅動源48,另一端則以無圖示之軸承支樓 而可旋轉。 故,若前述相機驅動源48作動而旋轉驅動螺桿轴47, 前述基底構件45會因該旋轉而透過螺旋體46沿上述支擇工 具17的長方向驅動。 前述基底構件45之下面的長方向之一端設置有作為攝 像機構之攝像相機51,且設置於可由側面來拍攝支撐工具 17的承受面17a的高度,而另一端設置有光源52而用來照明 前述承受面17a之攝像相機51所拍攝的部分。換言之,攝相 相機51與光源52係相對於支撐工具17而朝同方向一體地驅 動0 如第4圖所示,前述攝像相機51的攝像訊號會輸出至影 像處理部53,並在此將攝像訊號由類比訊號轉換為數位訊 號。亦即,攝像訊號係根據明暗差而做二進位化處理。已 201028061 二進位化處理之攝像訊號係輸出至控制裝置54之比較部 55比較。卩55中預先設定有第5八圖顯示之基準影像,再 以比較部5S纽較祕基準料G1與第测所示之已二 進位化處理前述攝像訊號所得之攝像影像G2。 則述基準影像G1為支稽·工具π之承受面17a沒有附著 物附著時,此時,前述承受面17a係平坦面。相對於此,當 承跫面17a附著有附著物時,二進位化處理來自攝像相機51 之攝像訊號所得之攝像影像G2中,前述承受面17&不會是平 坦面,而如第5B圖中所示,有附著物附著的部分為凸部p。 故,利用前述比較部55比較基準影像G1與攝像影像 G2 ’藉此可得知於前述承受面17a是否有塵埃附著,而該結 果係由判定部56輸出至顯示部57並顯示。又,顯示部57可 為將該情況以影像表示之螢幕,亦可以聲音將該情形告知 作業者。 以前述攝像相機51所進行之前述承受面17a的拍攝,係 由支撐工具17長方向之一端向另一端連續地進行。亦即, 脈衝訊號由控制裝置54的驅動部58輸出至相機驅動源48, 該相機驅動源48則根據由驅動部58接收之脈衝數來作動, 並將前述攝像相機51往支撐工具17之長方向驅動。而來自 前述驅動部58之脈衝訊號會輸出至前述相機驅動源48,同 時亦輸出至前述判定部56。 藉著由前述驅動部58輸出至前述相機驅動源48之脈衝 訊號,可特定前述攝像相機51的位置。亦即,根據由前述 驅動部58輸出至相機驅動源48之脈衝訊號之數,可求得攝 11 201028061 像相機51從移動開始點起的移動距離。 來自前述驅動部58之脈衝訊號會同時輸出至前述相機 驅動源48與判定部56。藉此,可在前述判定部56判定前述 支撐工具17之承受面17a有塵埃時,同時特定該附著物於前 述支撐工具17之承受面17a之長方向上的位置。 前述檢查裝置41在前述壓合單元11將TCP6正式壓焊 於基板W時,如第3圖所示,會在離開前述支樓工具17之長 方向一端的待機位置S待機,而在檢查附著物時,則由待機 位置S往同圖中箭頭X所示之前述支撐工具Π之長方向另一 端驅動。 如第2圖與第3圖所示,於前述檢查裝置41之基底構件 45長方向中途部對應前述支撑工具17之承受面17a的部 位,以較前述承受面17a之寬尺寸稍大之間隔分隔設置有一 對支撐具61。 一對支撐具61支撐有作為清潔構件之前述旋轉刷62, 並使其可旋轉且呈可接觸前述承受面之高度。且,該旋轉 刷62可利用設置於其中一支撐具61的刷驅動源63來旋轉驅 動。 如第4圖所示,前述刷驅動源63根據來自前述控制裝置 54之驅動部58的驅動訊號來旋轉驅動。又,清潔構件不限 於旋轉刷62,亦可使用呈圓盤狀或滾筒狀之研磨布等。 如第3圖所示,前述旋轉刷62係設置於箭頭X所示之移 動方向的下游侧,而箭頭X為在前述待機位置S待機之前述 檢查裝置41之箭頭X。藉此,當前述檢查裝置41向箭頭X所 12 201028061 示的方向移動時’前述旋轉刷62會同時與檢查裝置41 —體 地向箭頭X之方向移動。 此時,若旋轉驅動前述旋轉刷62,就可在前述攝像相 機51拍攝前述支撐工具π之承受面17a前,先以前述旋轉刷 62進行清刷。 又’使旋轉刷62朝與箭頭X相反之方向移動時,若不旋 轉驅動前述旋轉刷62,便不會對承受面17a作用。 以前述攝像相機51所進行之前述承受面17a的拍攝,可 ® 為前述檢查裝置41朝第3圖所示之箭頭X方向驅動時連續地 拍攝,而由該影像所得之動畫,亦可為每當檢查裝置41移 動一預定距離時以攝像相機51間歇地拍攝而得之靜止畫 面。 又,前述定位單元12之X驅動源19、Y驅動源23、z驅 " 動源32及Θ驅動源35係根據來自前述控制裝置54之驅動部 58之驅動訊號而控制驅動。 根據前述構成之安裝裝置,在檢查支撐工具17之承受 ® 面17a是否有附著物時,檢查裝置41會由第3圖所示之待機 位置S向箭頭X所示之方向驅動。檢查裝置41驅動時,由於 旋轉刷62與檢查裝置41 一體地設置於驅動方向之下游側, 因此前述承受面17a在被前述檢查裝置41之攝像相機51拍 攝前,會先被前述旋轉刷62清刷。 接著,以前述攝像相機51來拍攝前述承受面17a被旋轉 刷62清刷的部分,而可由該攝像訊號來判定是否有附著物 附著於支撐工具17之承受面17a。亦即,可確實檢測出前述 13 201028061 承受面17a是否有附著物殘留。 故,當承受面17a有附著物殘留時,只要於檢查後去除 承受面17a上所附著之附著物,便可預先防止在承受面17a 附著有塵埃的情態下將TCP6正式焊壓於基板W。亦即,可 防止基板W因附著於承受面17a之附著物而造成損傷。 控制裝置54之判定部56,不僅可檢測出有塵埃存在於 基板W’在檢測出該事實的同時’亦可特定塵埃位於支樓 工具17之承受面17a之長方向上的哪個位置。 亦即,來自驅動部58之脈衝訊號會同時輸出至驅動攝 像相機51的相機驅動源48與判定部56。因此,判定部56在 檢測出支撐工具17之承受面17a有附著物的同時,可特定者 時攝像相機51於支撐工具17之承受面i7a之長方向位置。 藉此,於去除支撐工具17之承受面na所附著之附著物 時,由於可預知該附著物於支撐工具17之承受面17a之長方 向的哪個位置,因此可輕易且亦確實地去除該附著物。 特別是,當基板w大型化而支撐工具17長型化時要 找到支撐工具Π之承受面na的哪個位置附著了附著物並 不容易。惟’前述檢查裝置41不僅是附著物的有無,亦^ 特定其位置,因此可如前述輕易且確實地去除支撐工具I? 之承受面17a所殘留的塵埃。 ^ 附著物的去除作業亦可以手動作業來進行,但因可以 前述判定部56來特定附著物_著的位置,故亦使與檢= 裝置41 一體地設置之旋轉刷62移動至該位置,而再度清; 該部分。又,清刷之結果只要以攝像相_拍攝已清刷^ 14 201028061 彳份來狀即可。如此—來,可將承受面的檢查與附著物 的去除兩方面的作業自動化。 以前述攝像相機51拍攝承受面17a,而判定該處是否有 附著物殘留别’可利用與前述攝像相機51一體地驅動之旋 轉刷62來清刷前述承受面17a。 因此,比起沒有在拍攝承受面17a前清刷承受面17a的 情況,更可減低承受面17a有附著物殘留的程度,因此可輕 _ ^且迅速地進行已做完附著部之殘留檢查後的去除作業。 以前述攝像相機51所進行之附著於前述承受面17a之 附著物的拍攝,如第2圖所示,係以來自位於支撐工具17寬 方向一端之光源52來照射照明光來,並以位於寬方向另一 端之前述攝像相機51來進行。 因此,承受面17a附著了附著物時,攝像相機51會拍攝 附著物的影子,因此可在不受承受面17a上照明光之反射狀 態影響下’確實進行附著物的拍攝。 ❹ ㈤述""實施形態巾所舉例說明者,係將TC P作為附著 物正式壓焊於基板,而因此使異向性導電構件固著於支撐 工具的情況,但附著物並不限於固著於承受面之異向性導 電構件,亦可為附著了在設置安裝襄置之空間所產生之塵 埃的情況,只要是有附著殘留於承受面之物,就可在將其 檢測出的同時特定其位置。 產業上之利用性 根據本發明,係沿長方向全長來拍攝支撐工具之上端 面,而根據該拍攝影像來判定支禮工具之上端面是否有附 15 201028061 著物,因此可正確地判定清掃支撐工具之上端面後,該上 端面是否殘留有附著物。 C圖式簡單說明】 第1圖係顯示本發明其中一實施形態之安裝裝置的概 略構成圖。 第2圖係顯示設於壓合單元之支架檯的檢查裝置之側 面圖。 第3圖係位於支撐工具之一端側的待機位置之檢查裝 置的正面圖。 第4圖係顯示控制裝置之控制系統的方塊圖。 第5A圖係於支撐工具之承受面沒有附著物附著的狀態 下,由攝像相機所拍攝之拍攝影像的說明圖。 第5B圖係於支撐工具之承受面附著了附著物的狀態 下,由攝像相機所拍攝之拍攝影像的說明圖。 第6圖係侧邊部安裝有TCP之基板的立體圖。 【主要元件符號說明】 4a…玻璃基板 15…加壓工具 4b…偏光板 15a…加壓面 5···異向性導電構件 15b…加熱器 6 …TCP 16…汽缸 11…壓合單元 17…支樓工具 12…定位單元 17a…承受面 13…支架檯 18…X台 14…支撐部 19···Χ驅動源 16Fig. 6 is a perspective view of a substrate on which TCP is mounted on the side. [Embodiment] J Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic configuration view showing a mounting device according to an embodiment of the present invention. In the mounting device, the electronic component TCP6 which has been pre-welded through the adhesive anisotropic conductive member is officially pressure-bonded to the peripheral portion of the substrate 构成 formed by the glass liquid crystal chamber shown in FIG. can. 201028061 The reference substrate w is bonded to the glass plate 4a' at intervals by a sealant (4) (not shown), and the liquid crystal is sealed in the space, and is completely bonded except for the periphery of each glass plate. There are 35 light board servants. The upper side of the side edge portion of the lower glass plate 4a is preliminarily pressed through the anisotropic conductive member 5, and the TCP 6 is described. After the pre-welding, the final pressure welding is performed as will be described later. Fig. 6 is a perspective view showing the substrate w of the plurality of sides (:: 1 > 6) pre-welded at both side edges. As shown in Fig. 1, the mounting device has a press unit 11' as a pressing member and The positioning unit 12 that moves the mounting table 37 described later in the horizontal direction (χ, γ direction), the rotation direction (0 direction), and the upward direction (Ζ direction) indicated by the arrow. The nip unit 11 has the holder table 13 and The pressing tool 15 is disposed on the supporting portion 14 provided at the upper end of the bracket table 13, and can be driven up and down by the cylinder. The pressing tool 15 has a heater 15b built therein, and the pressing tool 15 can be heated to several hundred degrees. The pressing surface 15a is formed on the lower end surface of the pressing tool 15, and the supporting tool 17 is erected below the pressing surface 15a so that the upper end surface of the supporting tool 17 (i.e., the receiving surface 17a) faces the pressing surface 15a. The supporting tool 17 has a length that can support the side portion of the substrate W, and the pressing tool 15 is set to correspond to the length of the supporting tool 17. When the substrate W is large, the pressing tool 15 is sometimes the same as the foregoing The support tool 17 can be more than 1 meter. The positioning unit 12 is disposed on a side of the pressing unit 11. The positioning unit 12 has an X stage 18, and the X stage 18 is provided with an X movable body 20 that is driven in the X direction by an X driving source 19. 201028061 The direction parallel to the longitudinal direction of the support tool 17 of the press-fit unit 11 and orthogonal to the plane of the first figure is the X direction, and the direction of the X-direction parent fork is the Y direction. The γ direction is the first] The upper surface of the X movable body 20 is integrally provided with a γ stage 2b. The upper surface of the ¥ table 21 is provided with a Y movable body 22. The γ movable body 22 is driven by the γ driving source 23 to the X direction. The vertical direction of the Y movable body 22 is provided with a support body 25 having a crank shape on the side of the Y movable body 22. The screw shaft is disposed between the support portion 26 at the upper end portion of the support body 25 and the γ movable body 22 27 and the guide shaft 28 are disposed such that the axis thereof is perpendicular to the plane formed by the Υ direction. The screw shaft 27 is set to be rotatable, and the guide shaft 28 is set to be fixed. The Ζ movable body 29 is screwed to the foregoing. a screw shaft 27, and the aforementioned guide shaft 28 is slidably coupled to The movable body 29 is so long as to rotate the screw shaft 27, and the movable body 29 can be moved up and down along the guide shaft 28 without rotating simultaneously with the screw shaft 27. The upper end of the front screw shaft 27 is The driven gear 3G protrudes from the upper surface of the support portion 26. The driven gear 3 () has a drive gear 31. The drive gear 31 is coaxially fixed to the support body 25. Z drives the drive shaft 32a of the source 32. Therefore, as long as the z drive source 32 is actuated to rotate the drive shaft 32a, the screw shaft 27 is transmitted through the pair of gears 3, 31, so that the z movable body 29 will Drive in the direction indicated by the arrow in the figure. The Z movable body 29 is fixed with an L-shaped mounting member_side. The Annon member 34 is provided with a θ drive source on the lower side of the other horizontal side, 201028061 and a 6► movable body 36 centered on the vertical axis and rotationally driven by the Θ drive source 35. The Θ moveable body The upper surface of the 36 is provided with the aforementioned women's table 37' having a rectangular shape, and the central portion of the mounting table 37 is aligned with the center of rotation of the 0 movable body 36. The upper surface 37a of the mounting table 37 is formed with a vacuum pump. ° and the suction holes of the force (all are not shown), and the substrate W can be sucked and held. As shown in Fig. 1, the substrate W is placed on the side of the pre-welded TCP 6 along the mounting table 37. When the side edge of the X direction protrudes outward, it is held on the mounting table 37. When the formal pressure welding is pre-compressed to the TCP 6 of the side portion of the substrate W, the substrate W is as shown by the broken line in the same figure. The side portion of the pre-welded welding TCP 6 is placed on the receiving surface 17a of the aforementioned supporting tool 17. In this case, when the pressing tool 15 is driven in the descending direction by the cylinder 16, the aforementioned TCP 6 is pressed by the pressing tool 15. Pressurized heating, so the anisotropic conductive member 5 will melt and solidify The TCP 6 is officially pressure-bonded to the side portion of the substrate W. Before the initial pressure welding of the TCP 6 is started or after a predetermined number of times of the final pressure welding, the rotating brush 62 is used to clean the receiving surface of the supporting tool 17 later. After 17a, the inspection device 41 checks whether or not the attachment surface 17a remains. As shown in Figs. 2 and 3, the inspection device 41 has a suspension suspended under the support portion 14 of the press unit 11. The pair of guide rails 43 are formed to be longer than the length dimension of the support tool 17 in the X direction, and are disposed on both sides of the width direction of the support tool 17, so that the lower end is located at the end of 2010. The pair of guide rails 43 are formed with a groove groove-shaped guide groove 43a opened toward the lower surface, and the projection portion 44a provided at the upper end of the movable body 44 is movably engaged. The guide groove 43a is attached to the pair of movable bodies 44. One end and the other end of the base member 45 are attached. In other words, the base member 45 is disposed in a direction overlapping with the longitudinal direction of the support tool 17. The upper surface of the base member 45 is disposed. Snail The rotary body 46 is screwed to the screw shaft 47. The screw shaft 47 has substantially the same length as the aforementioned support portion 14, and its axis is disposed in parallel with the longitudinal direction of the aforementioned support tool 17. As shown in Fig. 3, one end of the screw shaft 47 is coupled to a camera drive source 48 composed of a pulse motor, and the other end is rotatable by a bearing support (not shown). Therefore, if the camera drive source 48 is actuated and rotated The screw shaft 47 is driven, and the base member 45 is driven by the spiral body 46 in the longitudinal direction of the cutting tool 17 by the rotation. One end of the lower surface of the base member 45 is provided with an imaging camera 51 as an imaging mechanism, and It is disposed at a height at which the receiving surface 17a of the supporting tool 17 can be photographed from the side, and the other end is provided with a light source 52 for illuminating a portion photographed by the imaging camera 51 of the receiving surface 17a. In other words, the camera 51 and the light source 52 are integrally driven in the same direction with respect to the support tool 17. As shown in FIG. 4, the image pickup signal of the camera 51 is output to the image processing unit 53, and the image is captured there. The signal is converted into a digital signal by an analog signal. That is, the camera signal is binary-processed according to the difference in brightness and darkness. The image signal of the 201028061 binary processing is output to the comparison unit 55 of the control device 54 for comparison. The reference image displayed in the fifth figure is preset in the 卩55, and the image G2 obtained by processing the image pickup signal by the comparison unit 5S is compared with the secret reference material G1 and the second measurement. When the reference image G1 is attached to the receiving surface 17a of the tool π without adhering matter, the receiving surface 17a is a flat surface. On the other hand, when the attachment surface is adhered to the bearing surface 17a, the binary image processing is performed on the image pickup image G2 obtained from the image pickup signal of the image pickup camera 51, and the receiving surface 17& is not a flat surface, but as shown in FIG. 5B. As shown, the portion where the adhering matter adheres is the convex portion p. Therefore, the comparison unit 55 compares the reference image G1 with the imaged image G2' to determine whether or not dust is adhered to the receiving surface 17a, and the result is output from the determining unit 56 to the display unit 57 and displayed. Further, the display unit 57 may display the screen as an image in this case, or may notify the operator of the situation by sound. The photographing of the receiving surface 17a by the image pickup camera 51 is continuously performed from one end of the support tool 17 in the longitudinal direction to the other end. That is, the pulse signal is output from the driving portion 58 of the control device 54 to the camera driving source 48, and the camera driving source 48 is actuated according to the number of pulses received by the driving portion 58, and the camera camera 51 is moved to the length of the supporting tool 17. Directional drive. The pulse signal from the drive unit 58 is output to the camera drive source 48, and is also output to the determination unit 56. The position of the aforementioned camera 51 can be specified by the pulse signal outputted from the drive unit 58 to the camera drive source 48. That is, based on the number of pulse signals output from the driving unit 58 to the camera driving source 48, the moving distance of the camera 51 from the movement start point can be obtained. The pulse signal from the drive unit 58 is simultaneously outputted to the camera drive source 48 and the determination unit 56. Thereby, when the determining unit 56 determines that the receiving surface 17a of the supporting tool 17 is dusty, the position of the adhering object in the longitudinal direction of the receiving surface 17a of the supporting tool 17 can be specified. When the press unit 11 is used to press-form the TCP 6 on the substrate W, the inspection device 41 stands by at the standby position S away from the one end in the longitudinal direction of the branch tool 17, as shown in Fig. 3, and checks the attached matter. At the time, the standby position S is driven to the other end of the support tool 所示 shown by the arrow X in the same figure. As shown in Fig. 2 and Fig. 3, the portion of the inspection device 41 in the middle of the longitudinal direction of the base member 45 corresponding to the receiving surface 17a of the supporting tool 17 is separated by a slightly larger interval than the width of the receiving surface 17a. A pair of support members 61 are provided. The pair of support members 61 support the aforementioned rotating brush 62 as a cleaning member, and are rotatable and have a height that can contact the aforementioned receiving surface. Moreover, the rotary brush 62 can be rotationally driven by a brush drive source 63 provided to one of the supports 61. As shown in Fig. 4, the brush drive source 63 is rotationally driven in accordance with a drive signal from the drive unit 58 of the control unit 54. Further, the cleaning member is not limited to the rotating brush 62, and a polishing cloth having a disk shape or a drum shape may be used. As shown in Fig. 3, the rotating brush 62 is provided on the downstream side in the moving direction indicated by the arrow X, and the arrow X is the arrow X of the inspection device 41 which is waiting at the standby position S. Thereby, when the inspection device 41 moves in the direction indicated by the arrow X 12 201028061, the rotating brush 62 simultaneously moves in the direction of the arrow X with the inspection device 41. At this time, if the rotating brush 62 is rotationally driven, the image pickup camera 51 can perform cleaning by the rotating brush 62 before the imaging surface 51 of the supporting tool π is imaged. Further, when the rotary brush 62 is moved in the opposite direction to the arrow X, the rotation of the rotary brush 62 is not applied to the receiving surface 17a. The imaging of the receiving surface 17a by the imaging camera 51 can be continuously photographed when the inspection device 41 is driven in the direction of the arrow X shown in FIG. 3, and the animation obtained from the image may be A still picture obtained by the camera camera 51 intermittently when the inspection device 41 is moved by a predetermined distance. Further, the X drive source 19, the Y drive source 23, the z drive " the drive source 32 and the Θ drive source 35 of the positioning unit 12 are controlled to be driven in accordance with the drive signal from the drive unit 58 of the control unit 54. According to the mounting device having the above configuration, when the attachment surface 17a of the support tool 17 is inspected for attachment, the inspection device 41 is driven by the standby position S shown in Fig. 3 in the direction indicated by the arrow X. When the inspection device 41 is driven, since the rotary brush 62 and the inspection device 41 are integrally provided on the downstream side in the driving direction, the receiving surface 17a is first cleared by the rotating brush 62 before being imaged by the imaging camera 51 of the inspection device 41. brush. Then, the image pickup camera 51 captures a portion of the receiving surface 17a that has been cleaned by the rotating brush 62, and the image pickup signal can determine whether or not the adhering matter adheres to the receiving surface 17a of the supporting tool 17. That is, it is possible to surely detect whether or not the above-mentioned 13 201028061 bearing surface 17a has any residue. Therefore, when the receiving surface 17a has residual deposits, it is possible to prevent the TCP 6 from being officially welded to the substrate W in a state where dust adheres to the receiving surface 17a as long as the adhering matter adhering to the receiving surface 17a is removed after the inspection. That is, it is possible to prevent the substrate W from being damaged by adhering to the adhering surface of the receiving surface 17a. The determination unit 56 of the control device 54 can detect not only that dust is present on the substrate W' but also detecting the fact, and it is also possible to specify which position in the longitudinal direction of the receiving surface 17a of the branching tool 17 is the dust. That is, the pulse signal from the drive unit 58 is simultaneously output to the camera drive source 48 of the drive camera 51 and the determination unit 56. Therefore, the judging unit 56 detects that there is a deposit on the receiving surface 17a of the supporting tool 17, and can specify the position of the camera 51 on the longitudinal direction of the receiving surface i7a of the supporting tool 17 when it is specified. Therefore, when the adhering matter adhering to the receiving surface na of the supporting tool 17 is removed, it is possible to predict which position in the longitudinal direction of the receiving surface 17a of the supporting tool 17 in the longitudinal direction of the supporting tool 17, so that the attachment can be easily and surely removed. Things. In particular, when the substrate w is enlarged and the support tool 17 is elongated, it is not easy to find the attachment surface of the support surface of the support tool. However, the inspection apparatus 41 is not only the presence or absence of the attachment but also the position thereof, so that the dust remaining on the receiving surface 17a of the supporting tool I can be easily and surely removed as described above. ^ The attachment removal operation can be performed manually. However, since the determination unit 56 can specify the position of the attachment, the rotary brush 62 integrally provided with the inspection device 41 is moved to the position. Clear again; this part. In addition, the result of cleaning can be as long as the camera phase _ shooting has been cleaned ^ 14 201028061. In this way, the operation of both the inspection of the bearing surface and the removal of the attachment can be automated. The receiving surface 17a is imaged by the image pickup camera 51, and it is determined whether or not there is any residue in the portion. The rotating surface 62 that is driven integrally with the image pickup camera 51 can be used to clean the receiving surface 17a. Therefore, compared with the case where the receiving surface 17a is not cleaned before the photographing receiving surface 17a, the amount of deposit remaining on the receiving surface 17a can be reduced, so that the residual inspection of the attached portion can be performed lightly and quickly. Removal of the job. As shown in FIG. 2, the image pickup camera 51 is attached to the receiving surface 17a, and the illumination light is irradiated from the light source 52 located at one end in the width direction of the support tool 17, and is positioned wide. The camera camera 51 is operated at the other end of the direction. Therefore, when the attachment surface 17a adheres to the attached object, the imaging camera 51 captures the shadow of the attached object, so that the attachment of the attached object can be surely performed under the influence of the reflection state of the illumination light on the unreceiving surface 17a.五 (5) The quotation of the embodiment of the embossed towel is that the TC P is officially pressure-bonded to the substrate as an attachment, and thus the anisotropic conductive member is fixed to the supporting tool, but the attachment is not limited. The anisotropic conductive member fixed to the receiving surface may be attached to the dust generated in the space in which the mounting device is installed, and may be detected as long as it adheres to the receiving surface. Also specify its location. Industrial Applicability According to the present invention, the upper end surface of the supporting tool is photographed along the entire length of the long direction, and it is determined whether or not the upper end surface of the ritual tool has the attached surface according to the captured image, so that the cleaning support can be correctly determined. After the upper end surface of the tool, whether or not the upper end surface remains attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic configuration view showing a mounting apparatus according to an embodiment of the present invention. Fig. 2 is a side view showing an inspection apparatus provided on a stand of a press unit. Fig. 3 is a front elevational view of the inspection device in a standby position on one end side of the support tool. Figure 4 is a block diagram showing the control system of the control device. Fig. 5A is an explanatory view of a captured image taken by a camera camera in a state where the receiving surface of the supporting tool is not attached. Fig. 5B is an explanatory view of a captured image taken by a camera camera in a state where an attached object is attached to the receiving surface of the supporting tool. Fig. 6 is a perspective view of a substrate on which TCP is mounted on the side. [Description of main component symbols] 4a...glass substrate 15...pressurizing tool 4b...polarizing plate 15a...pressing surface 5·· anisotropic conductive member 15b...heater 6 ...TCP 16...cylinder 11...compression unit 17... Abutment tool 12...positioning unit 17a... receiving surface 13... bracket table 18...X table 14...support portion 19···Χ drive source 16

201028061 20···Χ可動體 21…丫台 22···Υ可動體 23···Υ驅動源 25…支撐體 26…支撐部 27…螺桿轴 28…導引轴 29···Ζ可動體 30…從動齒輪 31…驅動齒輪 32···Ζ驅動源 32a…驅動軸 34…安裝構件 35…0驅動源 36…0可動體 37…安裝台 37a”·安裝台37之上面 41…檢查裝置 43…導引軌道 43a…導引溝 44…可動體 44a…可動體之凸出部 45…基底構件 46…螺旋體 47…螺桿軸 48…相機驅動源 51…攝像相機 51a…攝像部 52…光源 53…影像處理部 54…控制裝置 55…比較部 56…判定部 57…顯示部 58…驅動部 61…支撐具 62…旋轉刷 63…刷驅動源 G1…基準影像 G2···攝像影像 S…待機位置 W…基板 17201028061 20···Χ movable body 21...丫台22···Υ movable body 23···Υ drive source 25...support 26...support unit 27...screw shaft 28...guide shaft 29···Ζ moveable body 30...driven gear 31... drive gear 32···Ζ drive source 32a... drive shaft 34... mounting member 35...0 drive source 36...0 moveable body 37...mounting table 37a”·upper surface of mounting table 37...inspection device 43...guide rail 43a...guide groove 44...movable body 44a...movable body projection 45...base member 46...spiral 47...screw shaft 48...camera drive source 51...camera camera 51a...camera 52...light source 53 ...image processing unit 54...control device 55...comparison unit 56...determination unit 57...display unit 58...drive unit 61...support 62...rotary brush 63...brush drive source G1...reference image G2···imaging image S...standby Position W...substrate 17

Claims (1)

201028061 七、申請專利範圍: 1. 一種電子元件的安裝裝置,係將電子元件安裝於基板之 側邊部者’其特徵在於具有: 安裝台’係使安裝前述電子元件之側邊部向外突 出’而將前述基板載至於上面者; 支揮工具’係具有支樓前述基板之側邊部下面之上 端面者’且前述基板已由前述安裝台之上面向外突出; 加壓工具’係將前述電子元件安裝於前述基板之側 邊部上面者’且前述基板係下面被前述支樓工具之上# © 面所支撐; 攝像機構’係在基板已由前述支撐工具之上端面移 退之狀態下’拍攝前述上端面者; 驅動機構’係沿前述支撐工具之長方向來驅動該攝 像機構’而使其拍攝前述上端面之全長者; 影像處理部,係將前述攝像機構之拍攝訊號加以影 像處理者;及 判疋機構,係根據前述影像處理部所處理之影像訊 修 號,判定前述支撐工具之上端面有無附著物。 2. 如申請專利範圍第1項之電子元件的安震裝置,其中前述 判疋機構根據來自前述影像處理部之影像訊號與由前述 驅動機構產生之前述攝像機構的驅動位置,而特定前述 附著物在前述支撐工具之上端面之長方向上的位置。 3. 如申請專利範圍第1項之電子元件的安袭裝置,其中前述 攝像機構由下列構件所構成: 18 201028061 基底構件,係沿著與前述支撐工具之長方向交叉之 寬方向設置,並以前述驅動源向前述支撐工具之長方向 驅動者; 攝像相機,係設置於前述基底構件的一端,而由側 面攝像前述支撐工具之上端部者;及 光源,係設置於前述基底構件的另一端,而由側面 照明以前述攝像相機拍攝的支撐工具之上端部。 4. 如申請專利範圍第1至3項中任一項之電子元件的安裝裝 置,其係設置有清潔機構,該清潔機構與前述攝像機構 一體地被前述驅動機構驅動,以清掃前述支撐工具的上 端面。 5. 如申請專利範圍第4項之電子元件的安裝裝置,其中前述 清潔機構設置之位置,係可清潔前述支撐工具的上端面 之前述攝像機構拍攝前的部分。 6. —種電子元件的安裝方法,係將電子元件安裝於基板之 側邊部者,其特徵在於具有下列步驟: 將已載置於安裝台之基板之側邊部下面,載置於支 撐工具的上端面; 於下面已載置於前述支撐工具之上端面的基板之側 邊部上面,安裝前述電子元件; 在基板已由前述支撐工具之上端面移退之狀態下, 於長方向全長拍攝前述支撐工具之上端面;及 根據前述支撐工具之上端面的拍攝來判定其上端面 有無附著物。 19 201028061 7.如申請專利範圍第6項之電子元件的安裝裝置,其中當判 定前述支撐工具之上端面有附著物時,可特定前述塵埃 在前述支撐工具之長方向上的位置。201028061 VII. Patent application scope: 1. A mounting device for an electronic component, wherein the electronic component is mounted on a side edge of the substrate, which is characterized in that: the mounting platform is configured to protrude the side portion of the electronic component. 'When the substrate is carried to the above; the support tool' has an upper end surface of the lower side of the side portion of the substrate, and the substrate has protruded outward from the upper surface of the mounting table; the pressing tool' The electronic component is mounted on the side of the side of the substrate and the bottom of the substrate is supported by the #© surface of the support tool; the image pickup mechanism is in a state where the substrate has been removed from the upper end surface of the support tool. Lowering 'the upper end face; the drive mechanism' drives the camera mechanism ' along the length of the support tool to capture the full length of the upper end face; the image processing unit images the image of the camera mechanism The processor; and the judging mechanism determines the support tool according to the image repair number processed by the image processing unit With or without attachments on the end face. 2. The anti-shock device for an electronic component according to claim 1, wherein the judging means specifies the attachment according to an image signal from the image processing unit and a driving position of the image pickup mechanism generated by the driving mechanism The position in the longitudinal direction of the upper end surface of the aforementioned support tool. 3. The device for assaulting an electronic component according to claim 1, wherein the camera mechanism is composed of the following members: 18 201028061 The base member is disposed along a width direction crossing the longitudinal direction of the support tool, and The driving source is driven to the long direction of the supporting tool; the imaging camera is disposed at one end of the base member, and the upper end of the supporting tool is imaged by the side surface; and the light source is disposed at the other end of the base member. The upper end of the support tool is photographed by the aforementioned camera camera by side illumination. 4. The mounting device for an electronic component according to any one of claims 1 to 3, wherein the cleaning device is provided with a cleaning mechanism integrally driven by the driving mechanism to clean the support tool. Upper end face. 5. The mounting device for an electronic component according to the fourth aspect of the invention, wherein the cleaning mechanism is disposed at a position to clean a portion of the upper end surface of the support tool before the photographing mechanism. 6. A method of mounting an electronic component, wherein the electronic component is mounted on a side edge of the substrate, characterized by the following steps: placing the underside of the substrate that has been placed on the mounting table, and placing it on the support tool The upper end surface is mounted on the side of the substrate on the upper end surface of the support tool, and the electronic component is mounted; and the substrate is photographed in the long direction in a state where the substrate has been removed from the upper end surface of the support tool. The upper end surface of the support tool; and the presence or absence of the attachment on the upper end surface according to the photographing of the upper end surface of the support tool. The mounting device for an electronic component according to claim 6, wherein the position of the dust in the longitudinal direction of the supporting tool can be specified when it is determined that there is an adhering object on the upper end surface of the supporting tool. 2020
TW098133696A 2008-10-07 2009-10-05 Electronic component mounting device and mounting method TW201028061A (en)

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Publication number Priority date Publication date Assignee Title
TWI764188B (en) * 2019-07-09 2022-05-11 日商芝浦機械電子裝置股份有限公司 installation device

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