JP4991249B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

  The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping a temporarily crimped electronic component to a substrate, and more particularly, a plurality of substrates to which the electronic component is permanently crimped due to foreign matters on a backup tool. The present invention relates to an electronic component crimping apparatus and an electronic component crimping method capable of preventing continuous damage.

  As shown in FIG. 6, the conventional electronic component crimping apparatus presses the backup tool 20 that supports the substrate 60 and the electronic component 65 that is temporarily crimped onto the substrate 60 supported by the backup tool 20 via a tape. The pressure part 30 for press-bonding the electronic component 65 onto the substrate 60 and the drive part 10 connected to the pressure part 30 and driving the pressure part 30 toward the backup tool 20 are provided.

  With such an electronic component crimping device, the electronic component 65 temporarily pressed onto the substrate 60 is pressed via a tape, and the substrate 60 is prevented from being damaged when the electronic component 65 is finally crimped onto the substrate 60. In order to do this, foreign matter on the backup tool 20 is detected and removed.

  However, in the conventional method, since it is not possible to directly detect that the substrate 60 is damaged, when the damage to the substrate 60 is small, the electronic component 65 is continuously attached to the plurality of substrates 60 without noticing the cause of the damage. There is a case where the substrate 60 is continuously pressed and the substrate 60 is continuously damaged.

  The present invention has been made in consideration of such points, and when the electronic component temporarily bonded onto the substrate via the tape is finally bonded onto the substrate, due to foreign matter on the backup tool, An object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of preventing a plurality of substrates from being damaged continuously.

An electronic component crimping apparatus according to the present invention presses an electronic component temporarily bonded via a tape onto a substrate supported by the backup tool and a substrate supported by the backup tool, and finally crimps the electronic component onto the substrate. A pressure unit, a drive unit coupled to the pressure unit and driving the pressure unit toward the backup tool, and a load measurement unit coupled to the pressure unit and measuring a load applied from the electronic component to the pressure unit. And a control mechanism connected to the load measurement unit and the drive unit, the control mechanism measures the load value applied to the pressurization unit measured by the load measurement unit with respect to time, and to the pressurization unit with respect to time Based on the load curve composed of the load values, the drive unit is controlled so that the load curve has a desired shape, and it is determined that the substrate is damaged when the load value changes discontinuously with time .

  This configuration prevents multiple substrates from being damaged continuously due to foreign matter on the backup tool when an electronic component is temporarily bonded onto the substrate via a tape. In addition, it is possible to prevent the substrate from being damaged due to a rapid force applied to the substrate.

  In the present invention, the load measuring unit amplifies the load cell for measuring the load value to the pressurizing unit and the load cell connected to the load cell and obtained from the load cell to the control mechanism. An electronic component crimping apparatus comprising a load cell amplifier.

  The present invention is an electronic component crimping device, wherein the drive unit includes a motor that drives the pressurizing unit, and an encoder that is coupled to the motor and indicates the number of rotations of the motor.

  According to the present invention, there is provided an electronic component crimping apparatus, wherein the pressurizing unit includes a main pressure tool for press-bonding an electronic component onto a substrate, and a heater connected to the main pressure tool to heat the main pressure tool. It is.

  With such a configuration, when the electronic component is finally crimped onto the substrate, the tape disposed between the electronic component and the substrate can be heated, and the electronic component can be easily crimped onto the substrate.

  In the present invention, the drive unit is coupled to a ball screw that is rotationally driven by the drive unit, the ball screw is coupled to a drive plate that is driven in the direction of the backup tool by the rotation of the ball screw, and the drive plate is coupled to the additional plate. The electronic component crimping apparatus is connected to a pressure part.

The electronic component crimping method according to the present invention includes a backup process for supporting a substrate by a backup tool, a drive process for driving the pressurization unit toward the backup tool by the drive unit, and a pressurization unit driven by the drive unit. Pressing the electronic component temporarily press-bonded onto the substrate supported by the backup tool via the tape, and finally pressing the electronic component onto the substrate, and the load measuring unit connected to the pressing unit by comprising a load measuring step of measuring the load applied to the pressing from the electronic component, and the linked control mechanism to the load measuring unit and drive unit, the load applied to the pressing portion measured by the load measuring unit measured values against time, based on the load curve consisting of load value to pressing against time, controls the driving unit so that the load curve becomes the desired shape Rutotomoni, it is determined that the substrate was damaged when a load value changes discontinuously with respect to time.

  This configuration prevents multiple substrates from being damaged continuously due to foreign matter on the backup tool when an electronic component is temporarily bonded onto the substrate via a tape. In addition, it is possible to prevent the substrate from being damaged due to a rapid force applied to the substrate.

  According to the present invention, on the basis of a load curve composed of a load value applied to the pressurizing unit with respect to time, the drive unit is controlled so that the load curve has a desired shape, thereby temporarily pressing onto the substrate via the tape. When this electronic component is finally press-bonded onto the substrate, it is possible to prevent the substrate from being damaged due to a rapid force applied to the substrate. In addition, by detecting damage to the substrate based on the load curve, when electronically bonding the electronic component temporarily bonded on the substrate via the tape, due to foreign matters on the backup tool, It is possible to prevent a plurality of substrates from being damaged continuously.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component crimping apparatus according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 5 are diagrams showing an embodiment of the present invention.

  As shown in FIG. 1, the electronic component crimping apparatus includes a backup tool 20 that supports a substrate 60, and an electronic component 65 that is temporarily crimped onto the substrate 60 supported by the backup tool 20 via a tape (not shown). , And pressurizing unit 30 for press-bonding electronic component 65 onto substrate 60, driving unit 10 connected to pressurizing unit 30 to drive pressurizing unit 30 toward backup tool 20, and pressurizing A load measuring unit 40 that is connected to the unit 30 and measures a load applied to the pressing unit 30 from the electronic component 65, and a control mechanism 50 that is connected to the load measuring unit 40 and the driving unit 10 are provided. By the way, the electronic component 65 which is finally bonded by such an electronic component crimping apparatus is made of TCP, FPC, bare chip, or the like.

  Among these, the control mechanism 50 shown in FIG. 1 and FIG. 2 is a load curve composed of the load value applied to the pressurizing unit 30 with respect to time, obtained from the load value applied to the pressurizing unit 30 measured by the load measuring unit 40. Based on the LD, the drive unit 10 is controlled so that the load curve LD has a desired shape (see FIG. 3). Further, the control mechanism 50 detects the breakage of the substrate 60 based on the load curve LD (see FIG. 4).

  FIG. 3 is a graph showing a normal load curve LD obtained based on the load value measured by the load measuring unit 40 when the electronic component 65 is finally press-bonded to the substrate 60 by the pressurizing unit 30. FIG. FIG. 4 shows an abnormal state (when the substrate 60 is broken) obtained based on the load value measured by the load measuring unit 40 when the electronic component 65 is finally press-bonded to the substrate 60 by the pressurizing unit 30. It is a graph which shows load curve LD.

  As shown in FIG. 2, the load measuring unit 40 includes a load cell 41 that measures a load value applied to the pressurizing unit 30, and a load applied to the pressurizing unit 30 that is connected to the load cell 41 and obtained from the load cell 41. A load cell amplifier 43 that amplifies information about the value and outputs the amplified information to the control mechanism 50.

  As shown in FIGS. 1 and 2, the drive unit 10 includes a motor 11 that drives the pressurizing unit 30, and an encoder 12 that is connected to the motor 11 and indicates the number of rotations of the motor 11.

As shown in FIGS. 1 and 2, the control mechanism 50 includes a load value applied to the pressurizing unit 30 with respect to time obtained from the load value applied to the pressurizing unit 30 measured by the load measuring unit 40. Based on the load curve LD (see FIG. 3), the control unit 51 controls the drive unit 10 so that the load curve LD has a desired shape, and detects damage to the substrate 60 based on the load curve LD. And a servo driver 52 that outputs a signal from the control device 51 to the drive unit 10. The servo driver 52 is connected to the motor 11 and the encoder 12 of the drive unit 10.

  Further, as shown in FIG. 1, the pressurizing unit 30 includes a main pressure tool 31 that performs main pressure bonding of the electronic component 65 onto the substrate 60, and a heater 31 h that is connected to the main pressure tool 31 and heats the main pressure tool 31. And have.

  As shown in FIG. 1, the motor 11 of the drive unit 10 is connected via a coupling 13 to a ball screw 14 that is rotationally driven by the motor 11. The ball screw 14 is connected to a drive plate 15 that is driven in the direction of the backup tool 20 by the rotation of the ball screw 14. The driving plate 15 is connected to the main pressure tool 31 of the pressurizing unit 30 via the load measuring unit 40.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 60 is supported by the backup tool 20 (backup step 81) (see FIGS. 1 and 5).

  Next, the pressing unit 30 is driven by the driving unit 10 toward the backup tool 20 (driving step 82) (see FIGS. 1 and 5). Specifically, the ball screw 14 is rotationally driven by the motor 11 of the driving unit 10. As the ball screw 14 is rotationally driven in this manner, the driving plate 15 moves toward the backup tool 20. As a result, the pressure unit 30 connected to the lower part of the driving plate 15 via the load measuring unit 40 moves downward.

  Thereafter, the electronic component 65 temporarily pressed through the tape is pressed onto the substrate 60 supported by the backup tool 20 by the pressing unit 30 driven by the driving unit 10 as described above, and the electronic component 65 is A main press-fitting is performed on the substrate 60 (pressurizing step 83) (see FIGS. 1 and 5). At this time, the main pressure tool 31 is heated by the heater 31h and becomes hot. For this reason, the tape arrange | positioned between the electronic component 65 and the board | substrate 60 can be heated, and the electronic component 65 can be crimped | bonded to the board | substrate 60 easily.

  At this time, the load applied to the pressurizing unit 30 from the electronic component 65 is measured by the load measuring unit 40 connected to the pressurizing unit 30 (load measuring step 85) (see FIGS. 1, 2 and 5). .

  Next, a load curve LD including a load value to the pressurization unit 30 with respect to time is calculated from a load value to the pressurization unit 30 measured by the load measurement unit 40 by the control mechanism 50 connected to the load measurement unit 40. Obtained (load curve calculation step 86) (see FIGS. 3 and 5).

  Thereafter, based on the calculated load curve LD, the control mechanism 50 specifically controls the rotation speed of the motor 11 of the drive unit 10 so that the load curve LD has a desired shape (load speed control). Step 91) (see FIGS. 3 and 5).

That is, in FIG. 1 and FIG. 2, the control mechanism 50 causes the motor 11 via the servo driver 52 so that the load value applied to the pressurizing unit 30 changes with time with a predetermined value (see FIG. 3). Is driven to rotate. At this time, the rotation speed of the motor 11 is fed back to the control mechanism 50 via the encoder 12.

  In this way, by pressing the electronic component 65 temporarily press-bonded onto the substrate 60 via the tape at a desired speed, it is possible to prevent the substrate 60 from being damaged due to a rapid force applied to the substrate 60. it can.

  Note that the load curve LD is applied to the electronic component 65 temporarily bonded onto the substrate 60 via a tape at a maximum speed at which the substrate 60 is not damaged (empirically) or at a maximum speed suitable for the compression process. It is preferably defined to apply a pressing force. This is because by defining the load curve LD in this way, the electronic component 65 can be finally press-bonded to the substrate 60.

  At this time, the control mechanism 50 also detects whether or not the substrate 60 is damaged based on the load curve LD (damage detection step 92) (see FIGS. 4 and 5). Specifically, in FIG. 1 and FIG. 2, the control mechanism 50 measures the load value applied to the pressurizing unit 30 with respect to time, and the load value is discontinuous with respect to time as shown in FIG. If it has changed, it is determined that the substrate 60 has been damaged.

  For this reason, the breakage of the substrate 60 can be grasped in real time, and the breakage can be detected even if the breakage occurring in the substrate 60 is small. As a result, the cause of breakage of the substrate 60 can be identified easily and quickly, and the cause of breakage can be eliminated (for example, foreign matter on the backup tool 20 is removed). It is possible to prevent the 60 from being damaged continuously.

  By the way, since the speed at which the substrate 60 is damaged is measured in real time by the control mechanism 50, the load speed when the pressing unit 30 presses the substrate 60 via the electronic component 65 is set to the maximum speed at which the substrate 60 is not damaged. Can be set easily.

  That is, when it is determined that when the substrate 60 is damaged, the cause of the damage is not the foreign matter on the backup tool 20 but the load speed on the substrate 60 is high, the substrate 60 of the pressurizing unit 30 is transferred to the substrate 60. The load speed is adjusted to be appropriate. As a result, the load speed of the pressing unit 30 to the substrate 60 can be set to the maximum speed at which the substrate 60 is not damaged, and the preferable load curve LD can be defined as described above.

The block diagram which shows embodiment of the electronic component crimping | compression-bonding apparatus by this invention. Schematic which shows the relationship between the drive part in the embodiment of the electronic component crimping apparatus by this invention, a load measurement part, and a control mechanism. In the electronic component crimping apparatus according to the embodiment of the present invention, a normal load curve obtained based on the load value measured by the load measuring unit when the electronic component is finally crimped to the substrate by the pressurizing unit. Graphical diagram showing In the electronic component crimping apparatus according to the embodiment of the present invention, when the electronic component is finally crimped to the substrate by the pressurizing unit, an abnormality is obtained based on the load value measured by the load measuring unit (when the substrate is broken). ) Is a graph showing a load curve. The flowchart which shows embodiment of the electronic component crimping method by this invention. The block diagram which shows the conventional electronic component crimping | compression-bonding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Drive part 11 Motor 12 Encoder 13 Coupling 14 Ball screw 15 Drive plate 20 Backup tool 30 Pressurization part 31 Main pressure tool 31h Heater 40 Load measurement part 41 Load cell 43 Load cell amplifier 50 Control mechanism 60 Board 65 Electronic component 81 Backup process 82 Drive process 83 Pressurization process 85 Load measurement process 86 Load curve calculation process 91 Load speed control process 92 Damage detection process LD Load curve

Claims (6)

A backup tool to support the substrate,
A pressure unit that presses an electronic component temporarily bonded to the substrate supported by the backup tool via a tape, and performs main pressure bonding of the electronic component on the substrate;
A drive unit connected to the pressurization unit and driving the pressurization unit toward the backup tool;
A load measuring unit connected to the pressing unit and measuring a load applied from the electronic component to the pressing unit;
A load measuring unit and a control mechanism coupled to the drive unit,
The control mechanism measures the load value applied to the pressurization unit measured by the load measurement unit with respect to time, and based on the load curve composed of the load value to the pressurization unit with respect to time , the load curve has a desired shape. The electronic component crimping apparatus is characterized in that the drive unit is controlled so that the load value changes discontinuously with time, and the substrate is determined to be damaged .   The load measuring unit includes a load cell that measures a load value to the pressurizing unit, a load cell amplifier that is connected to the load cell, amplifies information on the load value to the pressurizing unit obtained from the load cell, and outputs the amplified information to the control mechanism. The electronic component crimping apparatus according to claim 1, further comprising:   The electronic component crimping apparatus according to claim 1, wherein the driving unit includes a motor that drives the pressurizing unit, and an encoder that is coupled to the motor and indicates a rotation speed of the motor.   2. The electronic component crimping according to claim 1, wherein the pressurizing unit includes a main pressure tool that performs main pressure bonding of the electronic component on the substrate, and a heater that is connected to the main pressure tool and heats the main pressure tool. apparatus. The drive unit is connected to a ball screw that is rotationally driven by the drive unit,
The ball screw is connected to a driving plate that is driven in the direction of the backup tool by rotating the ball screw,
The electronic component crimping apparatus according to claim 1, wherein the driving plate is connected to the pressing portion. Backup process to support the substrate with the backup tool,
A driving process in which the pressing unit is driven toward the backup tool by the driving unit;
A pressing step of pressing the electronic component temporarily bonded onto the substrate supported by the backup tool by the pressing unit driven by the driving unit via the tape, and finally pressing the electronic component on the substrate;
A load measurement step of measuring a load applied from the electronic component to the pressurization unit by a load measurement unit connected to the pressurization unit, and
The load value applied to the pressurization unit measured by the load measurement unit is measured with respect to time by a control mechanism connected to the load measurement unit and the drive unit, and a load curve consisting of the load value to the pressurization unit with respect to time is obtained. An electronic component crimping method comprising: controlling a driving unit so that the load curve has a desired shape based on the load curve; and determining that the substrate is damaged when the load value changes discontinuously with time. .

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