CN111180349B - Control method and control system for chip welding - Google Patents
Control method and control system for chip welding Download PDFInfo
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- CN111180349B CN111180349B CN201911413952.5A CN201911413952A CN111180349B CN 111180349 B CN111180349 B CN 111180349B CN 201911413952 A CN201911413952 A CN 201911413952A CN 111180349 B CN111180349 B CN 111180349B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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Abstract
The application relates to a control method and a control system for chip welding, which are applied to a chip welding device, wherein the chip welding device comprises a suction head, a push pump, a pressure sensor, a welding seat and a controller, and the method comprises the following steps: the welding seat carries out preheating treatment on the welding object placed on the welding seat; adsorbing the chip to be welded by the suction head; pushing the suction head adsorbed with the chip to be close to the welding object by a pushing pump; the pressure sensor detects the pressure value of the chip pressed on the welding object; and the controller adjusts the pressure for pushing the suction head by the push pump in real time according to the pressure value. According to the method, the pushing pressure of the pushing pump on the suction head can be adjusted in real time, and the problems that damage is caused by overlarge pressure on a chip in the welding process, welding tightness is insufficient due to undersize pressure, and the yield of welding products is influenced are avoided.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a control method and a control system for chip welding.
Background
Because the manufacturing cost of the chip is high, in the process of welding the chip and other devices, the suction nozzle is used for sucking the chip and pressing the chip on a welding object on the welding seat, the gap and the tightness between the chip and the welding object determine the excellent degree of chip welding, the prior art directly presses the chip on the welding object without considering the gap between the chip and the welding object, and the damage of the chip caused by the overlarge pressure of the suction nozzle cannot be avoided when the gap is too small; when the gap is too large, the tightness between the chip and the welding object is not good due to insufficient pressure.
Disclosure of Invention
In order to solve the technical problem, the application provides a control method and a control system for chip welding.
In a first aspect, the present application provides a chip bonding control method applied to a chip bonding apparatus, where the chip bonding apparatus includes a suction head, a push pump, a pressure sensor, a bonding pad, and a controller, and the method includes:
the suction head adsorbs a chip to be welded;
the push pump pushes the suction head adsorbed with the chip to be close to the welding object;
the pressure sensor detects the pressure value of the chip pressed on the welding object;
and the controller adjusts the pressure for pushing the suction head by the push pump in real time according to the pressure value.
Optionally, before the suction head sucks the chip to be welded, the method further comprises:
the suction head sucks the welding object and places the welding object on the welding seat;
the suction head is separated from the welding object;
the welding seat carries out preheating treatment on the welding object placed on the welding seat.
Optionally, the pressure sensor is disposed at a connection between the push pump and the suction head, and the pressure sensor detects a pressure change of the push pump pushing the suction head.
Optionally, the controller adjusts, in real time, a pressure at which the suction head is pushed by the push pump according to the pressure value, and includes:
when the pressure sensor detects that the pressure of the push pump for pushing the suction head is greater than or equal to a preset pressure value, reducing the pressure of the push pump for pushing the suction head;
and when the pressure sensor detects that the pressure of the suction head pushed by the push pump is less than a preset pressure value, increasing the pressure of the suction head pushed by the push pump.
Optionally, after the surface of the solder opposite to the chip is provided with the solid solder, the push pump pushes the suction head with the chip adsorbed thereon to approach the solder placed on the solder seat, and before the pressure value of the chip pressed on the solder is detected according to a pressure sensor arranged on the suction head, the method further comprises:
and the welding seat heats the welding object for the second time to the melting point of the solid soldering tin, so that the solid soldering tin on the surface of the welding object is melted.
Optionally, a temperature sensor is arranged on the side wall of the suction head;
the method further comprises the following steps:
and when the temperature sensor on the suction head detects that the temperature reaches the melting point of the solid soldering tin, increasing the pressure for pushing the suction head by the pushing pump.
In a second aspect, the present application provides a chip bonding control system, which is applied to a chip bonding apparatus, the chip bonding apparatus includes a suction head, a push pump, a pressure sensor, a bonding pad, and a controller, the system includes:
the adsorption module is used for adsorbing the chip to be welded by the suction head;
the telescopic module is used for pushing the suction head adsorbed with the chip to be close to the welding object by the push pump;
the pressure detection module is used for detecting the pressure value of the chip pressed on the welding object by the pressure sensor;
and the adjusting module is used for adjusting the pressure of the suction head pushed by the push pump in real time by the controller according to the pressure value.
Optionally, the system further comprises:
the sucking module is used for sucking the welding object by the suction head and placing the welding object on the welding seat;
a detachment module for detaching the suction head from the welding object;
and the preheating module is used for preheating the welding object placed on the welding seat by the welding seat.
Optionally, the pressure sensor is disposed at a connection between the push pump and the suction head, and the pressure sensor detects a pressure change of the push pump pushing the suction head.
Optionally, the adjusting module includes:
the pressure increasing unit is used for reducing the pressure of the push pump for pushing the suction head when the pressure sensor detects that the pressure of the push pump for pushing the suction head is greater than or equal to a preset pressure value;
and the pressure reducing unit is used for increasing the pressure of the suction head pushed by the push pump when the pressure sensor detects that the pressure of the suction head pushed by the push pump is less than a preset pressure value.
Optionally, a surface of the solder opposite to the chip is provided with a solid solder, and the system further includes:
and the melting module is used for secondarily heating the welding object to the melting point of the solid soldering tin by the welding seat so as to melt the solid soldering tin on the surface of the welding object.
Optionally, the side wall of the suction head is provided with a temperature sensor, and the system further comprises:
and the temperature detection module is used for increasing the pressure for pushing the suction head by the pushing pump when the temperature sensor on the suction head detects that the temperature reaches the melting point of the solid soldering tin.
The invention has the beneficial effects that:
the invention discloses a control method and a control system for chip welding, which are applied to a chip welding device, wherein the chip welding device comprises a suction head, a push pump, a pressure sensor, a welding seat and a controller, and the method comprises the following steps: the suction head adsorbs a chip to be welded; the push pump pushes the suction head adsorbed with the chip to be close to the welding object; the pressure sensor detects the pressure value of the chip pressed on the welding object; and the controller adjusts the pressure for pushing the suction head by the push pump in real time according to the pressure value. According to the method, the pushing pressure of the pushing pump to the suction head can be adjusted in real time, the problem that the chip is directly pressed on the welding object without considering the gap between the chip and the welding object in the traditional welding process, and the damage of the chip caused by overlarge pressure of the suction head cannot be avoided when the gap is too small is solved; the problem that the tightness between chip and the welding object is not good can't be avoided not enough pressure when the clearance is too big, through the driving force of real time monitoring push pump to the suction head, to the suppression power of chip in the control welding process, avoid the chip easily to receive the damage in welding process, influence the yields of welding product.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a method for controlling chip bonding according to an embodiment;
FIG. 2 is a schematic diagram of a chip bonding apparatus according to an embodiment;
fig. 3 is a schematic structural diagram of a control system for chip bonding according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a flowchart illustrating a method for controlling chip bonding according to an embodiment of the present invention, and referring to fig. 1, the method for controlling chip bonding is applied to a chip bonding apparatus including a suction head 210, a push pump 220, a pressure sensor 230, a bonding pad 240, and a controller 250, and includes the steps of:
step S110, the suction head 210 sucks the chip to be welded.
In step S120, the push pump 220 pushes the suction head 210 with the chip adsorbed thereon to approach the solder.
In this embodiment, the push pump 220 receives a control command from the controller 250, and pushes the suction head 210 according to a pressure value carried by the control command, so that the chip adsorbed on the suction head 210 is pressed against the solder on the solder seat 240.
In step S130, the pressure sensor 230 detects a pressure value at which the chip is pressed against the solder.
In this embodiment, the pressure sensor 230 detects a pressure value of the chip pressed on the solder, that is, a pressure value of the suction head 210 pushed by the push pump 220, and the pressure sensor 230 sends the real-time detected pressure value to the controller 250.
In step S140, the controller 250 adjusts the pressure of the push pump 220 for pushing the suction head 210 in real time according to the pressure value.
In this embodiment, the controller 250 determines whether the pressure of the suction head 210 needs to be increased or decreased by the push pump 220 according to the pressure value fed back by the pressure sensor 230.
Specifically, the suction head 210 is used for sucking a chip to be welded, the push pump 220 receives a control command from the controller 250, and pushes the suction head 210 according to a pressure value carried by the control command, so that the chip sucked on the suction head 210 is pressed against a welding object on the welding seat 240. The pressure value of the chip pressed on the solder is detected by the pressure sensor 230, that is, the pressure value of the suction head 210 pushed by the push pump 220 is detected, and the pressure sensor 230 sends the real-time detected pressure value to the controller 250. The controller 250 determines whether the pressure of the suction head 210 needs to be increased or decreased by the push pump 220 according to the pressure value fed back by the pressure sensor 230. The controller 250 adjusts the pressure of the push pump 220 for pushing the suction head 210 in real time according to the pressure value. The phenomenon that the chip is damaged or the tightness is poor when the chip is welded with a welding object due to the fixed and unchangeable pressure value is avoided. The solder may be, but is not limited to, a header, a heat sink, etc.
In one embodiment, the suction head 210 sucks the solder, and places the solder on the solder seat 240; the suction head is separated from the welding object; the soldering nest 240 performs a preheating process on the solder placed thereon.
Specifically, firstly, the suction head 210 is used for sucking the welding object and placing the welding object on the welding seat 240, after the suction head 210 is separated from the welding object, the welding object is subjected to preheating treatment by the welding seat 240, at the moment, the suction head 210 is rotated to suck the chip, the preheating treatment is performed on the welding object, the heating time in the subsequent welding process is shortened, the welding process is accelerated, and the welding efficiency is improved.
In an embodiment, fig. 2 is a schematic structural diagram of a chip soldering apparatus in an embodiment, and referring to fig. 1 and 2, the pressure sensor 230 is disposed at a connection between the push pump 220 and the suction head 210, and the pressure sensor 230 detects a pressure change of the push pump 220 pushing the suction head 210.
Specifically, the pressure sensor 230 is disposed at a connection position between the push pump 220 and the suction head 210, and when the push pump 220 receives a control command from the controller 250, the pushing force of the push pump 220 directly acts on the pressure sensor 230, and the pressure sensor 230 acts on the suction head 210 again with the received pushing force, so as to push the suction head 210 with the chip adsorbed thereon to gradually approach the solder. The pressure sensor 230 detects the pressure value of the push pump 220 to the suction head 210 in real time, so that the subsequent pushing force of the push pump 220 to the suction head 210 can be adjusted according to the detected pressure value.
In one embodiment, when the pressure sensor 230 detects that the pressure of the push pump 220 pushing the suction head 210 is greater than or equal to a preset pressure value, the pressure of the push pump 220 pushing the suction head 210 is reduced; when the pressure sensor 230 detects that the pressure of the push pump 220 pushing the suction head 210 is less than a preset pressure value, the pressure of the push pump 220 pushing the suction head 210 is increased.
Specifically, when the push pump 220 pushes the chip to press against the surface of the solder, and when the chip presses against the surface of the solder, the reaction force of the surface of the solder against the chip is different, which results in different values detected by the pressure sensor 230, the push pump 220 is adjusted to push the chip in real time according to the detected pressure value, and when the pressure sensor 230 detects that the pressure at which the push pump 220 pushes the suction head 210 is greater than or equal to a preset pressure value, the pressure at which the push pump 220 pushes the suction head 210 is reduced; when the pressure sensor 230 detects that the pressure of the push pump 220 pushing the suction head 210 is less than a preset pressure value, the pressure of the push pump 220 pushing the suction head 210 is increased.
In one embodiment, after the surface of the solder opposite to the chip is provided with the solid solder, and the push pump 220 pushes the suction head 210 with the chip adsorbed thereon to approach the solder placed on the solder seat 240, before the pressure value of the chip pressed on the solder is detected by the pressure sensor 230 provided on the suction head 210, i.e. between step S130 and step S140, the method further comprises:
the soldering base 240 heats the soldering object for the second time to the melting point of the solid soldering tin, so that the solid soldering tin on the surface of the soldering object is melted.
Specifically, the welding object after preheating treatment has a certain temperature, the welding object is secondarily heated to melt soldering tin on the surface of the welding object, the welding object is used for being welded with a chip, the heating process after preheating treatment is fast, the welding object is not required to be heated from a lower temperature, the temperature rising process is long, the welding progress is accelerated, and the welding efficiency is improved.
In one embodiment, the side wall of the suction head 210 is provided with a temperature sensor, and the method further comprises:
when the temperature sensor on the tip 210 detects that the temperature reaches the melting point of the solid solder, the pressure of the push pump 220 to push the tip 210 is increased.
Specifically, when the temperature sensor detects that the temperature does not reach the melting point of the solid solder, indicating that the solder on the surface of the welding object is not melted, the solder has certain hardness, the preset pressure values include a first preset pressure value and a second preset pressure value, and when the pressure sensor 230 detects that the pressure value of the pushing pump 220 pushing the chip to press the welding object is greater than the first preset pressure value, the pushing pressure of the pushing pump 220 should be reduced, so that the chip with too large pressure is prevented from being damaged; when the temperature sensor detects that the temperature reaches the melting point of the solid soldering tin, the soldering tin on the surface of the welding object starts to melt, the hardness of the soldering tin is gradually weakened, the matching pressure sensor 230 detects that the pressure value of the pushing pump 220 pushing the chip to press the welding object is smaller than a second preset pressure value, the pushing pressure of the pushing pump 220 is increased, the tightness between the chip and the welding object is enhanced, the pushing force of the pushing pump 220 to the suction head 210 is monitored in real time, the pressing force of the chip in the welding process is controlled, and the phenomenon that the chip is easily damaged in the welding process and the yield of welding products is influenced is avoided.
Fig. 1 is a flowchart illustrating a method for controlling chip bonding according to an embodiment. It should be understood that, although the steps in the flowchart of fig. 1 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 1 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
In one embodiment, fig. 3 is a schematic structural diagram of a control system for die bonding in one embodiment, and referring to fig. 3, there is provided a control system for die bonding, which is applied to a die bonding apparatus including a suction head 210, a push pump 220, a pressure sensor 230, a bonding pad 240, and a controller 250, the system including:
an adsorption module, configured to adsorb a chip to be welded by the suction head 210;
a telescopic module, which is used for the push pump 220 to push the suction head 210 absorbed with the chip to be close to the welding object;
a pressure detection module for detecting the pressure value of the chip pressed on the welding object by the pressure sensor 230;
and an adjusting module, configured to adjust, by the controller 250, the pressure at which the suction head 210 is pushed by the push pump 220 in real time according to the pressure value.
In one embodiment, the system further comprises:
a suction module, configured to suck the solder by the suction head 210 and place the solder on the solder seat 240;
a detachment module for detaching the suction head 210 from the welding object;
and the preheating module is used for performing preheating treatment on the welding object placed on the welding seat 240.
In one embodiment, the pressure sensor 230 is disposed at the connection between the push pump 220 and the pipette tip 210, and the pressure sensor 230 detects the pressure change of the push pump 220 pushing the pipette tip 210.
In one embodiment, the adjustment module comprises:
a pressure increasing unit for decreasing the pressure of the push pump 220 pushing the suction head 210 when the pressure sensor 230 detects that the pressure of the push pump 220 pushing the suction head 210 is greater than or equal to a preset pressure value;
a pressure reducing unit for increasing the pressure of the push pump 220 pushing the suction head 210 when the pressure sensor 230 detects that the pressure of the push pump 220 pushing the suction head 210 is less than a preset pressure value.
In one embodiment, a surface of the solder opposite the chip is provided with solid solder, the system further comprising:
and the melting module is used for secondarily heating the welding object to the melting point of the solid soldering tin by the welding seat 240 so as to melt the solid soldering tin on the surface of the welding object.
In one embodiment, the side wall of the suction head 210 is provided with a temperature sensor, and the system further comprises:
and the temperature detection module is used for increasing the pressure of the push pump 220 for pushing the suction head 210 when the temperature sensor on the suction head 210 detects that the temperature reaches the melting point of the solid soldering tin.
An embodiment of the application provides a computer-readable storage medium storing a computer program comprising program instructions which, when executed by a processor, cause the processor to perform the method according to any one of the above.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A chip welding control method is characterized by being applied to a chip welding device, wherein the chip welding device comprises a suction head, a push pump, a pressure sensor, a welding seat and a controller, and the method comprises the following steps:
the suction head adsorbs a chip to be welded;
the push pump pushes the suction head adsorbed with the chip to be close to the welding object;
the pressure sensor detects the pressure value of the chip pressed on the welding object;
the controller adjusts the pressure of the push pump for pushing the suction head in real time according to the pressure value;
before the suction head sucks the chip to be welded, the method further comprises the following steps:
the suction head sucks the welding object and places the welding object on the welding seat;
the suction head is separated from the welding object;
the welding seat carries out preheating treatment on the welding object placed on the welding seat.
2. The method of claim 1, wherein the pressure sensor is provided at a connection between the push pump and the pipette tip, and the pressure sensor detects a change in pressure at which the push pump pushes the pipette tip.
3. The method of claim 2, wherein the controller adjusts the pressure at which the push pump pushes the suction head in real time according to the pressure value, and comprises:
when the pressure sensor detects that the pressure of the push pump for pushing the suction head is greater than or equal to a preset pressure value, reducing the pressure of the push pump for pushing the suction head;
and when the pressure sensor detects that the pressure of the suction head pushed by the push pump is less than a preset pressure value, increasing the pressure of the suction head pushed by the push pump.
4. The method according to claim 3, wherein a surface of the solder opposite to the chip is provided with solid solder, and after the push pump pushes the suction head with the chip adsorbed thereon to approach the solder placed on the solder stand, before the pressure value of the chip pressed on the solder is detected based on a pressure sensor provided on the suction head, the method further comprises:
and the welding seat heats the welding object for the second time to the melting point of the solid soldering tin, so that the solid soldering tin on the surface of the welding object is melted.
5. The method according to claim 4, characterized in that the side wall of the suction head is provided with a temperature sensor;
the method further comprises the following steps:
and when the temperature sensor on the suction head detects that the temperature reaches the melting point of the solid soldering tin, increasing the pressure for pushing the suction head by the pushing pump.
6. A chip welding control system is characterized in that the chip welding control system is applied to a chip welding device, the chip welding device comprises a suction head, a push pump, a pressure sensor, a welding seat and a controller, and the system comprises:
the adsorption module is used for adsorbing the chip to be welded by the suction head;
the telescopic module is used for pushing the suction head adsorbed with the chip to be close to the welding object by the push pump;
the pressure detection module is used for detecting the pressure value of the chip pressed on the welding object by the pressure sensor;
the adjusting module is used for adjusting the pressure of the push pump for pushing the suction head in real time by the controller according to the pressure value;
before the suction head sucks the chip to be welded, the device further comprises:
the sucking module is used for sucking the welding object by the suction head and placing the welding object on the welding seat;
a detachment module for detaching the suction head from the welding object;
and the preheating module is used for preheating the welding object placed on the welding seat by the welding seat.
7. The system of claim 6, wherein the pressure sensor is disposed at a connection between the push pump and the suction head, and the pressure sensor detects a change in pressure at which the push pump pushes the suction head.
8. The system of claim 7, wherein the adjustment module comprises:
the pressure increasing unit is used for reducing the pressure of the push pump for pushing the suction head when the pressure sensor detects that the pressure of the push pump for pushing the suction head is greater than or equal to a preset pressure value;
and the pressure reducing unit is used for increasing the pressure of the suction head pushed by the push pump when the pressure sensor detects that the pressure of the suction head pushed by the push pump is less than a preset pressure value.
9. The system of claim 8, wherein a surface of the solder opposite the die is provided with solid solder, the system further comprising:
and the melting module is used for secondarily heating the welding object to the melting point of the solid soldering tin by the welding seat so as to melt the solid soldering tin on the surface of the welding object.
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| CN201911413952.5A CN111180349B (en) | 2019-12-31 | 2019-12-31 | Control method and control system for chip welding |
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| CN201911413952.5A CN111180349B (en) | 2019-12-31 | 2019-12-31 | Control method and control system for chip welding |
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| CN111180349B true CN111180349B (en) | 2021-12-10 |
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| CN112478777B (en) * | 2020-12-13 | 2021-09-03 | 恩纳基智能科技无锡有限公司 | Multifunctional chip mounter |
| CN113977028B (en) * | 2021-10-28 | 2023-04-25 | 恩纳基智能科技无锡有限公司 | Eutectic welding equipment |
| CN114345742A (en) * | 2021-12-31 | 2022-04-15 | 苏州汇川控制技术有限公司 | Method, apparatus, device and medium for detecting chip mounting position |
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| TW567574B (en) * | 2001-12-05 | 2003-12-21 | Esec Trading Sa | Apparatus for mounting semiconductor chips |
| JP2009200296A (en) * | 2008-02-22 | 2009-09-03 | Osaki Engineering Co Ltd | Transfer system of semiconductor chip |
| JP2011151179A (en) * | 2010-01-21 | 2011-08-04 | Shibuya Kogyo Co Ltd | Bonding apparatus |
| JP5580163B2 (en) * | 2010-10-13 | 2014-08-27 | 東レエンジニアリング株式会社 | Parallelism adjusting method and parallelism adjusting device for mounting apparatus |
| CN104900575B (en) * | 2015-06-23 | 2018-11-20 | 上海航天电子通讯设备研究所 | Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering |
| CN206931561U (en) * | 2017-06-09 | 2018-01-26 | 惠州市玛尼微电子科技有限公司 | Full-automatic roller die-bonding device |
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