CN104900575B - Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering - Google Patents
Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering Download PDFInfo
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- CN104900575B CN104900575B CN201510348147.4A CN201510348147A CN104900575B CN 104900575 B CN104900575 B CN 104900575B CN 201510348147 A CN201510348147 A CN 201510348147A CN 104900575 B CN104900575 B CN 104900575B
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- support level
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses positioning fixture, manufacturing method and the chip conveyer methods of a kind of weldering of Vacuum Eutectic, the positioning fixture includes substrate, support level and limited step, adsorption hole is provided on substrate, support level is used to support chip, and limited step is for limiting chip.The manufacturing method includes：Support level is formed in substrate surface；Limited step is formed on support level surface；Heart position processes adsorption hole in the substrate.The chip conveyer method includes：Chip positioning fixture is sucked in suction nozzle；Chip is adsorbed in the limited step of chip positioning fixture by suction nozzle by adsorption hole；Suitable position chip being moved in packaging cartridge；Suction nozzle is removed, press rods are installed.Positioning fixture, manufacturing method and chip conveyer method of the invention simplifies chip transport process, saves the process time, reduces the position of related features in chip transhipment, improves position precision.
Description
Technical field
The present invention relates to field of semiconductor package, in particular to a kind of chip positioning fixture of Vacuum Eutectic weldering, production side
Method and chip conveyer method.
Background technique
T/R component is the core of phased-array radar, mainly plays transmitting-receiving and amplification microwave signal in radar.
Currently, the assembly of T/R component mostly uses greatly multi-chip to assemble mounting technology, wherein the installation of chip and fixation use chip eutectic
Technology.Chip is mainly microwave high power chip in T/R component, and the heat dissipation and ground connection performance to substrate have very high want
It asks, chip eutectic technology can meet above-mentioned requirements well.Chip eutectic technology between chip bottom and substrate by adding
It is welded with material, realizes that the eutectic object on two surfaces fuses by suitable temperature, time, pressure and gas part, eutectic, which realizes, to be divided
The combination of sub- size, therefore have the advantages that connection resistance is small, heat transfer efficiency is high, heat dissipation is uniform and weld strength is high.
Chip eutectic technology is divided into manual eutectic weldering and the weldering of equipment eutectic, and manual eutectic weldering includes：Solder, chip on substrate
Pickup, chip eutectic and chip contraposition, manual eutectic soldering set have the features such as flexibility is big, eutectic quality is high, at low cost, but opposite
For the weldering of equipment eutectic, eutectic efficiency and stability want much lower.Showing for thousands of a T/R components is needed for single radar
Shape, manual eutectic weldering are unable to meet production demand, equipment eutectic are mostly used to weld greatly at present.Vacuum Eutectic weldering is the weldering of equipment eutectic
A kind of relatively effective method, basic procedure are：Substrate soaks → coats solder → assembly chip → chip protective cover
→ plus-pressure tooling → is transported to eutectic furnace → Vacuum Eutectic welding.It wherein removes to be transported to eutectic furnace and open Vacuum Eutectic and weld
It need to manually complete outer, and all be completed by automatically or semi-automatically equipment.During the weldering of existing Vacuum Eutectic, chip is from being installed to
It is limited in transport process by a series of position deviations, each procedure can all increase its position deviation：△Always=±（△1+△2
+△3+…）, wherein a position of related features △ can be generated in assembly chip processes1, as shown in Fig. 3 A to 3B；Chip is protected
There are a position of related features △ during shield2, as shown in Fig. 3 C to 3D；Chip generates a △ in limit adapts to3Tolerance,
As shown in FIGURE 3 E.Position deviation after cumulative is bigger, but microwave has very high requirement to the conllinear degree of signal wire, needs to survey
The line angle of amount is at ± 2 °, and range difference is within ± 0.1mm, beyond will have a direct impact on microwave power.
Therefore, reduce the position deviation of equipment eutectic weldering, improving the precision that equipment eutectic welds, it is very important.
Summary of the invention
The present invention is directed to above-mentioned problems of the prior art, propose a kind of weldering of Vacuum Eutectic chip positioning fixture,
Production method and chip conveyer method reduce the position deviation during Vacuum Eutectic weldering, improve its precision.
In order to solve the above technical problems, the present invention is achieved through the following technical solutions：
The present invention provides a kind of chip positioning fixture of Vacuum Eutectic weldering comprising：Substrate, support level and limiting stand
Rank, wherein：
It is provided with adsorption hole on the substrate, for adsorbing the chip；
The support level is located at the surface region of the substrate, is used to support the chip；
The limited step is located at the surface region away from the substrate of the support level, for limiting the chip
Movement.
Preferably, the substrate is ceramic substrate, compared with existing metal and composite material, the substrate of ceramic material has
Higher flatness and rigidity are unlikely to deform in strength absorption and stress, can preferably protect the chip in transhipment.
Preferably, the adsorption hole is located at the center of the substrate, the transhipment of more convenient chip keeps balance.
Preferably, the substrate with a thickness of 0.2mm-1mm.
Preferably, the support level includes first part and second part, wherein：
The first part is the first frame around the substrate surrounding；
The second part is the isolated island in the first part, the thickness of the isolated island and first frame
Consistency of thickness.
Preferably, the limited step be around the substrate surrounding the second frame, the thickness of second frame with
The consistency of thickness of the chip；
The outer rim of second frame is aligned with the outer rim of first frame, the interior frame of second frame with
The size of the chip is consistent.
The present invention also provides a kind of production methods of the chip positioning fixture of Vacuum Eutectic weldering comprising following steps：
S71：Support level is formed in substrate surface；
S72：Limited step is formed on support level；
S73：Adsorption hole is processed in the center of substrate.
Preferably, the step S71 further comprises：
S711：One layer of copper seed layer is sputtered in substrate surface；
S712：The exposure mask of support level is lithographically formed by SU8 glue on copper seed layer surface；
S713：Support level is formed in the electroforming of copper seed layer surface.
Preferably, the step S72 further comprises：
S721：The exposure mask of limited step is lithographically formed by LC100 glue on support level surface；
S722：Corrode copper seed layer；
S723：SU8 glue is filled in the recess region of support level, and is lithographically formed the figure of limited step
S724：Limited step is formed in the electroforming of support level surface.
It is lithographically formed the electroforming exposure mask of limited step using positive photoresist LC100, can guarantee the high-precision of mask pattern, it is more smart
Really chip is limited, reduces the error in transport process.
Preferably, the step S73 is further：In the center of substrate by laser machining out adsorption hole.
The present invention also provides a kind of chip conveyer methods of Vacuum Eutectic weldering comprising following steps：
S111：Chip positioning fixture is sucked in suction nozzle；
S112：Chip is adsorbed in the limited step of chip positioning fixture by suction nozzle by adsorption hole；
S113：Suitable position chip being moved in packaging cartridge；
S114：Suction nozzle is removed, press rods are installed.
By chip limit, the assembly technology together with is realized with wafer support, is reduced the process time, is improved chip
Position precision.
Compared to the prior art, the present invention has the following advantages that：
（1）Chip positioning fixture, production method and the chip conveyer method of Vacuum Eutectic weldering provided by the invention, use
Two-stage step realizes wafer support and chip limit, and twice assembly technology is switched to a step, reduces the process time, subtracts simultaneously
The position deviation generated in small assembling process, improves the position precision of chip；
（2）The present invention uses ceramic substrate, and compared with metal and composite material, flatness is more preferable, and rigidity is stronger, in strength
It is unlikely to deform when absorption and stress, can preferably protect the chip in transhipment；
（3）The present invention uses semiconductor processing technology, realizes relatively high dimensional accuracy；It is realized using galvanoplastics
The growth of high-aspect-ratio type step.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
Embodiments of the present invention are described further with reference to the accompanying drawing：
Fig. 1 is the cross-sectional view for the positioning fixture that Vacuum Eutectic of the invention welds；
Fig. 2 is the top view for the positioning fixture that Vacuum Eutectic of the invention welds；
Fig. 3 A-3E is that the chip of the fixture of existing Vacuum Eutectic weldering transports flow chart；
Fig. 4 A-4D is that the chip for the positioning fixture that Vacuum Eutectic of the invention welds transports flow chart；
Fig. 5 is the production method process flow chart for the positioning fixture that Vacuum Eutectic of the invention welds；
Fig. 6 A-6H is the production flow diagram for the positioning fixture that Vacuum Eutectic of the invention welds；
Fig. 7 is the chip conveyer method process flow chart that Vacuum Eutectic of the invention welds.
Label declaration：1- substrate, 2- support level, 3- limited step, 4- chip, 5- suction nozzle, the existing chip tray of 6-, 7-
Existing chip pressure shield, 8- press rods, 9- packaging cartridge, 10- chip limit pallet；
11- adsorption hole；
The first frame of 21-, 22- isolated island;
101- copper seed layer, 102-SU8 glue, 103-LC100 glue.
Specific embodiment
It elaborates below to the embodiment of the present invention, the present embodiment carries out under the premise of the technical scheme of the present invention
Implement, the detailed implementation method and specific operation process are given, but protection scope of the present invention is not limited to following implementation
Example.
Embodiment 1：
In conjunction with Fig. 1-Fig. 4, the positioning fixture of the present embodiment detailed description of the present invention Vacuum Eutectic weldering is as shown in Figure 1
The cross-sectional view of positioning fixture is illustrated in figure 2 its top view comprising：Substrate 1, support level 2 and limited step 3,
In：Adsorption hole 11 is provided on substrate 1, for adsorbing chip；Support level 2 is located at the surface region of substrate, is used to support core
Piece；Limited step 3 is located at the surface region away from substrate of support level, for limiting the movement of chip.
The positioning fixture of the present embodiment is the positioning fixture for GaAs bare chip, and substrate 1 is slightly over the rectangle of chip
Potsherd, adsorption hole 11 are located at the center of substrate 1；Support level 2 includes the first frame 21 and isolated island 22, the first frame 21
For around the rectangle frame at the edge of substrate 1, isolated island 22 is set to inside the first frame 21, the thickness of isolated island 22 and the first frame
21 consistency of thickness；Limited step 3 is the second frame for being set to 21 edge surface of the first frame, and the second frame is also rectangle
Frame, outer rim are aligned with the outer rim of the first frame 21, and interior frame is consistent with the size of GaAs chip, limited step 3
The consistency of thickness of depth and chip.
Be illustrated in figure 3 using existing chip fixture realize chip transhipment flow chart, successively include 3A → 3B →
3C → 3D → 3E is as shown in Figure 3B core as shown in Figure 3A to be located at the chip 4 in existing chip tray 6 using suction nozzle absorption
Piece 4 positions, and places it in the suitable position of packaging cartridge 9；It is as shown in Figure 3 C to be adsorbed in existing chip tray 6 using suction nozzle 5
Existing chip pressure shield 7；It positions, places it in packaging cartridge 9 on chip 4 for existing chip pressure shield 7 as shown in Figure 3D
The suitable position of side；As shown in FIGURE 3 E for suction nozzle 5 will be removed, press rods 8 are installed in existing chip pressure shield 7, to complete
The transhipment of chip, 3A → 3B can generate a position of related features in the process, a position of related features, 3E can be generated during 3B → 3C
A position of related features can be generated in the process, technique is more, and position of related features is more, after the completion of transhipment chip have one it is bigger
Position deviation.
It is illustrated in figure 4 the chip transhipment flow chart using chip positioning fixture of the invention, successively includes 4A → 4B
→ 4C → 4D is that suction nozzle 21 is utilized to adsorb positioning fixture as shown in Figure 4 A；It is as shown in Figure 4 B to penetrate adsorption hole 11 using suction nozzle 5
The chip 4 in chip limit pallet 10 is adsorbed, is located at chip 4 in limited step 3；It is as shown in Figure 4 C by chip 4 and to determine
Position fixture is placed into the suitable position in packaging cartridge；As shown in Figure 4 D to remove suction nozzle 5, press rods are installed in the top of substrate 1
8, complete the transhipment to chip.Using chip positioning fixture of the invention, by original chip positioning and core for needing two steps to complete
Piece support synthesizes step completion, reduces the position of related features generated in chip transport process, improves the position precision of chip,
And shorten the process time.
Embodiment 2：
In conjunction with Fig. 5-Fig. 6, the production method of the present embodiment detailed description of the present invention chip positioning fixture, as shown in figure 5,
It includes the following steps：
S71：Support level is formed in substrate surface；
S72：Limited step is formed on support level；
S73：Adsorption hole is processed in the center of substrate.
Wherein：Step S71 further comprises：
S711：One substrate is provided, surface thereof is cleaned, sputters one layer of copper seed layer, corresponding positioning fixture
Cross-sectional view it is as shown in Figure 6A；
S712：The electroforming exposure mask of support level, corresponding locating clip are lithographically formed by SU8 glue on copper seed layer surface
The cross-sectional view of tool is as shown in Figure 6B；
S713：In copper seed layer surface electroformed nickel, the first frame and isolated island of support level, corresponding locating clip are formed
The cross-sectional view of tool is as shown in Figure 6 C.
Step S72 further comprises：
S721：SU8 glue is removed, is lithographically formed the electroforming exposure mask of limited step by LC100 glue on support level surface,
The cross-sectional view of corresponding positioning fixture is as shown in Figure 6 D；
S722：Using hydrochloric acid plus dioxygen aqueous corrosion copper seed layer, the cross-sectional view of corresponding positioning fixture is as illustrated in fig. 6e；
S723：Using SU8 glue filling support level recess region, and at etching limited step figure, it is corresponding
The cross-sectional view of positioning fixture is as fig 6 f illustrates；
S724：In support level surface electroformed nickel, limited step, the cross-sectional view of corresponding positioning fixture such as Fig. 6 G are formed
It is shown.
Step S73 is further：SU8 is removed, in the center of substrate by laser machining out adsorption hole, is then utilized
Scribing machine cutting profile, the cross-sectional view of corresponding positioning fixture is as shown in figure 6h.
Embodiment 3：
In conjunction with Fig. 7, the present embodiment detailed description of the present invention chip conveyer method comprising following steps：
S111：Chip positioning fixture is sucked in suction nozzle；
S112：Chip is adsorbed in the limited step of chip positioning fixture by suction nozzle by adsorption hole；
S113：Suitable position chip being moved in packaging cartridge；
S114：Suction nozzle is removed, press rods are installed in the top of the substrate of chip positioning fixture.
Disclosed herein is merely a preferred embodiment of the present invention, these embodiments are chosen and specifically described to this specification, is
Principle and practical application in order to better explain the present invention is not limitation of the invention.Anyone skilled in the art
The modifications and variations done within the scope of specification should all be fallen in the range of of the invention protect.
Claims (9)
1. a kind of chip positioning fixture of Vacuum Eutectic weldering, which is characterized in that including：Substrate, support level and limited step,
Wherein：
It is provided with adsorption hole on the substrate, for adsorbing the chip；
The support level is located at the surface region of the substrate, is used to support the chip；
The limited step is located at the surface region away from the substrate of the support level, for limiting the fortune of the chip
It is dynamic；
The support level includes first part and second part, wherein：
The first part is the first frame around the substrate surrounding；
The second part is the isolated island in the first part, the thickness of the thickness of the isolated island and first frame
Unanimously；
The limited step is the second frame around the substrate surrounding, the thickness of second frame and the thickness of the chip
Degree is consistent；
The outer rim of second frame is aligned with the outer rim of first frame, the interior frame of second frame with it is described
The size of chip is consistent.
2. chip positioning fixture according to claim 1, which is characterized in that the substrate is ceramic substrate.
3. chip positioning fixture according to claim 1, which is characterized in that the adsorption hole is located at the center of the substrate
Position.
4. chip positioning fixture according to claim 1, which is characterized in that the substrate with a thickness of 0.2mm-1mm.
5. a kind of production method of the chip positioning fixture of Vacuum Eutectic weldering according to any one of claims 1 to 4, special
Sign is, includes the following steps：
S71：Support level is formed in substrate surface；
S72：Limited step is formed on support level；
S73：Adsorption hole is processed in the center of substrate.
6. production method according to claim 5, which is characterized in that the step S71 further comprises：
S711：One layer of copper seed layer is sputtered in substrate surface；
S712：The exposure mask of support level is lithographically formed by SU8 glue on copper seed layer surface；
S713：Support level is formed in the electroforming of copper seed layer surface.
7. production method according to claim 6, which is characterized in that the step S72 further comprises：
S721：The exposure mask of limited step is lithographically formed by LC100 glue on support level surface；
S722：Corrode copper seed layer；
S723：SU8 glue is filled in the recess region of support level, and is lithographically formed the figure of limited step
S724：Limited step is formed in the electroforming of support level surface.
8. production method according to claim 7, which is characterized in that the step S73 is further：At the center of substrate
Position is by laser machining out adsorption hole.
9. a kind of chip conveyer method of Vacuum Eutectic weldering according to any one of claims 1 to 4, which is characterized in that packet
Include following steps：
S111：Chip positioning fixture is sucked in suction nozzle；
S112：Chip is adsorbed in the limited step of chip positioning fixture by suction nozzle by adsorption hole；In this step, limiting stand
Component level is in the surface region away from substrate of support level, and for limiting the movement of the chip, support level is located at substrate
Surface region is used to support the chip；
S113：Suitable position chip being moved in packaging cartridge；
S114：Suction nozzle is removed, press rods are installed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348147.4A CN104900575B (en) | 2015-06-23 | 2015-06-23 | Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510348147.4A CN104900575B (en) | 2015-06-23 | 2015-06-23 | Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering |
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| CN104900575A CN104900575A (en) | 2015-09-09 |
| CN104900575B true CN104900575B (en) | 2018-11-20 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105204287B (en) * | 2015-09-23 | 2020-04-21 | 中国科学院上海微系统与信息技术研究所 | Clamp for manufacturing process of photoetching mask plate |
| CN106392940A (en) * | 2016-11-28 | 2017-02-15 | 中国电子科技集团公司第二十四研究所 | Universal fixture compatible with integrated circuit microassembly technology |
| CN107680929B (en) * | 2017-09-05 | 2019-12-03 | 深圳先进技术研究院 | The localization method of electronic packing body |
| CN111180349B (en) * | 2019-12-31 | 2021-12-10 | 芯思杰技术(深圳)股份有限公司 | Control method and control system for chip welding |
| CN113296350A (en) * | 2021-05-10 | 2021-08-24 | 中国电子科技集团公司第十一研究所 | Photoetching plate frame |
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| CN202503025U (en) * | 2011-12-23 | 2012-10-24 | 彩虹集团公司 | Multiple LED integrated packaging eutectic fixture |
| CN103000559A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Positioning clamp for semiconductor chip and manufacture method for semiconductor device |
| CN104347435A (en) * | 2013-08-09 | 2015-02-11 | 株式会社日立高新技术仪器 | An adsorption collet chuck and a chip adapter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007208088A (en) * | 2006-02-03 | 2007-08-16 | Nec Electronics Corp | Semiconductor manufacturing apparatus and conveyance carrier |
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|---|---|---|---|---|
| CN103000559A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Positioning clamp for semiconductor chip and manufacture method for semiconductor device |
| CN202503025U (en) * | 2011-12-23 | 2012-10-24 | 彩虹集团公司 | Multiple LED integrated packaging eutectic fixture |
| CN104347435A (en) * | 2013-08-09 | 2015-02-11 | 株式会社日立高新技术仪器 | An adsorption collet chuck and a chip adapter |
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Effective date of registration: 20160415 Address after: 200082 Qigihar Road, Shanghai, No. 76, No. Applicant after: Shanghai Aerospace Electronic Communication Equipment Inst. Address before: 200080 Shanghai city Hongkou District street Xingang Tianbao Road No. 881 Applicant before: Shanghai Aerospace Measurement Control Communication Institute |
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