JPWO2010041610A1 - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

The backup tool 17 having an upper end surface that supports the lower surface of the side portion on which the TCP of the substrate mounted on the upper surface of the mounting stage is mounted, and the side portion of the substrate whose lower surface is supported by the upper end surface of the backup tool. A pressing tool 15 for mounting TCP on the upper surface, an imaging camera 51 for imaging the upper end surface with the substrate retracted from the upper end surface of the backup tool, and driving the imaging camera along the longitudinal direction of the backup tool A camera drive source that captures the entire end surface, an image processing unit that performs image processing on the imaging signal of the camera drive source, and whether or not there is an attachment on the upper end surface of the backup tool based on the image signal processed by the image processing unit A determination unit for determining whether or not.

Description

  The present invention relates to a mounting apparatus and a mounting method for mounting an electronic component such as a TCP (Tape Carrier Package) on a glass substrate used in a liquid crystal display device, for example.

  When manufacturing a liquid crystal display device, a mounting device for mounting TCP, which is an electronic component, on a substrate such as a glass panel is used. The TCP is often mounted on two or three sides of the four sides of the substrate except at least one side.

  The mounting apparatus has a mounting stage on which the substrate is supplied and mounted. The mounting stage has a mounting surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and mounted on the mounting surface. At that time, the substrate is positioned and held by causing the side portion on which the TCP is mounted to protrude outward from the periphery of the mounting surface of the mounting stage.

  A tape-like anisotropic conductive member having adhesiveness is attached to the side portion of the substrate, and a plurality of TCPs are temporarily pressure-bonded to the anisotropic conductive member at a predetermined interval and then subjected to final pressure bonding. .

  When a plurality of TCPs are temporarily pressure-bonded to the side edges of the substrate or are finally pressure-bonded, the lower surface of the side edges of the substrate is supported by the upper end surface of the backup tool. At the time of temporary pressure bonding, a plurality of TCPs are supplied and mounted one by one on the upper surface of the side portion of the substrate, and at the time of main pressure bonding, the plurality of temporarily pressure-bonded TCPs are simultaneously pressurized and heated by a pressure tool.

By thermally bonding the TCP, the thermosetting anisotropic conductive member is melted by the heat of the pressurizing tool and then cured, so that a plurality of TCPs are fixed to the side of the substrate. Become. Patent Document 1 discloses such a mounting technique.
JP, 2008-124148, A When dust-bonding TCP, dust may adhere to the upper end surface of the backup tool which supports the undersurface of the side part of a substrate. When the upper surface of the side portion of the substrate is pressed with a pressure tool in a state where dust is attached, a larger pressing force than the other portions acts on the portion of the substrate where the dust is interposed. , That part may be damaged.

  Therefore, conventionally, after the main pressure bonding has been performed a predetermined number of times, the upper end surface of the backup tool is manually cleaned with a rotating brush, for example, to remove dust adhering to the upper end surface.

  By the way, when a plurality of TCPs are finally press-bonded at a time, the backup tool and the pressurizing tool must have a length capable of simultaneously pressurizing and heating the plurality of TCPs temporarily bonded to the substrate. Recently, the size of the substrate has increased. Therefore, the backup tool and the pressurizing tool may be elongated to a length of about 1 to 3 m, for example, as the substrate size increases.

  When the backup tool becomes longer, there are more opportunities for dust to adhere to the upper end surface. The upper end surface of the backup tool not only adheres to the dust contained in the surrounding atmosphere but also a part of the anisotropic conductive member melted by the pressurizing tool during the main pressure bonding as an adhering material. May adhere to and solidify.

  If dust is simply adhered to the upper end surface of the backup tool, it can be easily removed by cleaning the upper end surface with a rotating brush. However, if an adherent formed by solidifying a part of the anisotropic conductive member adheres to the upper end surface of the backup tool, it may not be removed by simply cleaning with a rotating brush.

  Conventionally, the upper end surface of the backup tool has been cleaned with a rotating brush. And if it cleaned with a rotating brush, this crimping | compression-bonding was performed as that from which the dust was removed from the upper end surface of the backup tool.

  For this reason, if the anisotropic conductive member is solidified and adhered to the upper end surface of the backup tool, the substrate is partially subjected to a large stress by the adhered material when the TCP is finally pressure-bonded. In some cases, the substrate is damaged due to chipping.

  It is an object of the present invention to provide an electronic component mounting apparatus and mounting method that can reliably confirm whether or not there is an adherent on the upper end surface of a backup tool.

In order to solve the above problems, the present invention provides a mounting apparatus for mounting an electronic component on a side portion of a substrate,
A mounting stage on which the substrate is placed on the upper surface by projecting a side portion on which the electronic component is mounted;
A backup tool having an upper end surface that supports the lower surface of the side portion of the substrate protruding outward from the upper surface of the mounting stage;
A pressure tool for mounting the electronic component on the upper surface of the side portion of the substrate whose lower surface is supported by the upper end surface of the backup tool;
Imaging means for imaging the upper end surface in a state where the substrate is retracted from the upper end surface of the backup tool;
Driving means for driving the imaging means along the longitudinal direction of the backup tool to image the upper end surface over the entire length; and
An image processing unit that performs image processing on an imaging signal of the imaging unit;
An electronic component mounting apparatus comprising: a determination unit that determines whether or not there is a deposit on the upper end surface of the backup tool based on an image signal processed by the image processing unit. It is in.

Further, the present invention is a mounting method for mounting an electronic component on a side portion of a substrate,
Placing the lower surface of the side portion of the substrate placed on the mounting stage on the upper end surface of the backup tool;
Mounting the electronic component on the upper surface of the side portion of the substrate whose lower surface is placed on the upper end surface of the backup tool;
Imaging the upper end surface of the backup tool over the entire length in the longitudinal direction with the substrate retracted from the upper end surface of the backup tool;
And a step of determining whether or not there is a deposit on the upper end surface of the backup tool based on the imaging of the upper end surface of the backup tool.

FIG. 1 is a schematic configuration diagram showing a mounting apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the inspection apparatus provided on the mount of the crimping unit. FIG. 3 is a front view of the inspection apparatus in the standby position on one end side of the backup tool. FIG. 4 is a block diagram showing a control system by the control device. FIG. 5A is an explanatory diagram of an image captured by the imaging camera in a state where no deposit is attached to the receiving surface of the backup unit, and FIG. 5B is a state where the deposit is attached to the receiving surface of the backup unit. It is explanatory drawing of the captured image by the imaging camera of. FIG. 6 is a perspective view of a substrate on which TCP is mounted on the side portion.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of a mounting apparatus according to an embodiment of the present invention. In this mounting apparatus, the TCP 6 as an electronic component temporarily bonded to the peripheral portion of the substrate W made of a glass liquid crystal cell shown in FIG. 6 via an adhesive tape-like anisotropic conductive member 5 is provided. It is designed to be crimped.

  The substrate W adheres a pair of glass plates 4a through a sealing agent (not shown) at a predetermined interval, liquid crystal is sealed between them, and the outer surface of each glass plate 4a covers the entire surface excluding the peripheral portion. A polarizing plate 4b is adhered to each.

  The TCP 6 is temporarily pressure-bonded to the upper surface of the side portion of the lower glass plate 4a via the anisotropic conductive member 5, and is finally pressure-bonded as will be described later. FIG. 6 is a perspective view showing a substrate W in which a plurality of TCPs 6 are temporarily bonded to two side portions, respectively.

  As shown in FIG. 1, the mounting apparatus includes a pressing unit 11 as a pressing unit and a mounting stage 37 to be described later in the horizontal direction (X and Y directions), the rotational direction (θ direction), and the vertical direction (Z direction) indicated by arrows. ) Is provided.

  The crimping unit 11 has a gantry 13, and a pressing tool 15 is provided on a support portion 14 provided at the upper end of the gantry 13 so as to be driven up and down by a cylinder 16. The pressure tool 15 has a built-in heater 15b so that the pressure tool 15 can be heated to several hundred degrees. The lower end surface of the pressurizing tool 15 is formed on the pressurizing surface 15a, and a backup tool 17 is erected below the pressurizing surface 15a with the upper end surface, that is, the receiving surface 17a facing each other.

  The backup tool 17 has a length capable of supporting the length of the side portion of the substrate W, and the pressing tool 15 is set to a length corresponding to the backup tool 17. When the substrate W is large, the pressure tool 15 and the backup tool 17 may be 1 m or longer in length.

  The positioning unit 12 is disposed on the side of the crimping unit 11. The positioning unit 12 includes an X stage 18, and the X stage 18 is provided with an X movable body 20 driven in the X direction by an X drive source 19.

  A direction perpendicular to the paper surface of FIG. 1, which is a direction parallel to the longitudinal direction of the backup tool 17 of the crimping unit 11, is defined as an X direction, and a direction intersecting the X direction is defined as a Y direction. The Y direction is indicated by an arrow in FIG.

  A Y stage 21 is integrally provided on the upper surface of the X movable body 20. A Y movable body 22 is provided on the upper surface of the Y stage 21. The Y movable body 22 is driven by a Y drive source 23 in the Y direction orthogonal to the X direction.

  On the upper surface of the Y movable body 22, a support body 25 having a crank-shaped side surface is erected. A screw shaft 27 and a guide shaft 28 are provided between the support portion 26 at the upper end of the support body 25 and the Y movable body 22 so that the axis is perpendicular to the plane formed by the X and Y directions. Yes. The screw shaft 27 is rotatably provided, and the guide shaft 28 is fixedly provided.

  A Z movable body 29 is screwed onto the screw shaft 27, and the guide shaft 28 is slidably inserted into the Z movable body 29. Therefore, when the screw shaft 27 is rotated, the Z movable body 29 moves up and down along the guide shaft 28 without rotating together with the screw shaft 27.

  An upper end portion of the screw shaft 27 protrudes from the upper surface of the support portion 26, and a driven gear 30 is fitted to the protruding end. A driving gear 31 is engaged with the driven gear 30. The drive gear 31 is coaxially fixed to a drive shaft 32 a of a Z drive source 32 provided on the support 25. Therefore, when the Z drive source 32 is actuated and the drive shaft 32a rotates, the screw shaft 27 is rotated via the pair of meshed gears 30, 31, so that the Z movable body 29 is indicated by an arrow in FIG. It is driven in the Z direction shown.

  One side of an L-shaped attachment member 34 is fixed to the Z movable body 29. A θ drive source 35 is provided on the lower surface of the other side of the mounting member 34 that is horizontal, and a θ movable body 36 that is rotationally driven about the vertical axis by the θ drive source 35 is provided on the upper surface. .

On the upper surface of the θ movable body 36, the mounting stage 37 having a rectangular planar shape is provided with its central portion aligned with the center of rotation of the θ movable body 36. The upper surface 37a of the mounting stage 37 is formed with suction holes (both not shown) that generate suction force by a vacuum pump so that the substrate W is sucked and held.
As shown in FIG. 1, the substrate W is held on the mounting stage 37 in a state in which the side portion to which the TCP 6 is temporarily bonded is protruded outward from the side edge along the X direction of the mounting stage 37. .

  When the TCP 6 temporarily bonded to the side of the substrate W is finally bonded, the side of the substrate W to which the TCP 6 is temporarily bonded is mounted on the receiving surface 17a of the backup tool 17 as shown by a chain line in FIG. Placed. In this state, when the pressing tool 15 is driven in the downward direction by the cylinder 16, the TCP 6 is pressurized and heated by the pressing tool 15, so that the anisotropic conductive member 5 is melted and solidified to cause the TCP 6 to move. It is finally bonded to the side portion of the substrate W.

  Before starting the main crimping of the TCP 6 or after performing the final crimping for a predetermined number of times, the receiving surface 17a of the backup tool 17 is cleaned with a rotating brush 62 described later, and deposits remain on the receiving surface 17a. It is inspected by the inspection device 41 whether or not it exists.

  As shown in FIGS. 2 and 3, the inspection device 41 has a pair of guide rails 43 suspended from the lower surface of the support portion 14 of the crimping unit 11. The pair of guide rails 43 are formed to be longer than the length of the backup tool 17 along the X direction, and are provided on both sides in the width direction of the backup tool 17 with their lower ends positioned above the receiving surface 17a. It has been.

  The pair of guide rails 43 are formed with dovetail-shaped guide grooves 43a opened on the lower surface, and convex portions 44a provided at the upper end of the movable body 44 are movably engaged with the guide grooves 43a. . One end and the other end of the base member 45 are attached to the pair of movable bodies 44. That is, the base member 45 is provided in a direction crossing the longitudinal direction of the backup tool 17.

  A female screw body 46 is provided on the upper surface of the base member 45, and a screw shaft 47 is screwed onto the female screw body 46. The screw shaft 47 has substantially the same length as the support portion 14 and is provided with an axis parallel to the longitudinal direction of the backup tool 17. As shown in FIG. 3, one end of the screw shaft 47 is connected to a camera drive source 48 formed of a pulse motor, and the other end is rotatably supported by a bearing (not shown).

  Therefore, when the camera drive source 48 is operated and the screw shaft 47 is rotationally driven, the base member 45 is driven along the longitudinal direction of the backup tool 17 through the female screw body 46 by the rotation. It has become.

  At one end in the longitudinal direction of the lower surface of the base member 45, an imaging camera 51 as an imaging means is provided at a height at which the imaging unit 51a can image the receiving surface 17a of the backup tool 17 from the side, and the other end. Is provided with a light source 52 that illuminates a portion of the receiving surface 17a that is imaged by the imaging camera 51. That is, the imaging camera 51 and the light source 52 are integrally driven in the same direction with respect to the backup tool 17.

  As shown in FIG. 4, the imaging signal of the imaging camera 51 is output to an image processing unit 53, where the imaging signal is converted from an analog signal to a digital signal. That is, the imaging signal is binarized by the difference in brightness. The binarized imaging signal is output to the comparison unit 55 of the control device 54. A reference image G1 shown in FIG. 5A is preset in the comparison unit 55, and the comparison unit 55 obtains the reference image G1 and the image pickup signal shown in FIG. The obtained captured images G2 are compared.

  The reference image G1 is a case where no deposit is attached to the receiving surface 17a of the backup tool 17, and in this case, the receiving surface 17a is a flat surface. On the other hand, when a deposit is attached to the receiving surface 17a, in the captured image G2 obtained by binarizing the imaging signal from the imaging camera 51, the receiving surface 17a is not a flat surface. As shown in (b), the portion where the deposit is attached becomes the convex portion P.

  Therefore, the comparison unit 55 compares the reference image G1 and the captured image G2 to determine whether dust is attached to the receiving surface 17a. The result is output from the determination unit 56 to the display unit 57. It is displayed. Note that the display unit 57 may be a monitor that displays an image of this, but may also notify the operator of that fact by voice.

  Imaging of the receiving surface 17a by the imaging camera 51 is continuously performed from one end in the longitudinal direction of the backup tool 17 toward the other end. That is, a pulse signal is output from the drive unit 58 of the control device 54 to the camera drive source 48, and the camera drive source 48 operates according to the number of pulses received from the drive unit 58. It is done while driving in the direction. The pulse signal from the driving unit 58 is output to the camera driving source 48 and simultaneously to the determination unit 56.

  The position of the imaging camera 51 can be specified by a pulse signal output from the driving unit 58 to the camera driving source 48. That is, the moving distance from the moving start point of the imaging camera 51 can be obtained from the number of pulse signals output from the driving unit 58 to the camera driving source 48.

  The pulse signal from the drive unit 58 is output to the determination unit 56 simultaneously with the camera drive source 48. Accordingly, the determination unit 56 can determine that dust is present on the receiving surface 17a of the backup tool 17, and at the same time, can determine the position of the deposit in the longitudinal direction of the receiving surface 17a of the backup tool 17.

  The inspection apparatus 41 waits at a standby position S deviated from one end in the longitudinal direction of the backup tool 17 as shown in FIG. When the kimono is inspected, it is driven from the standby position S toward the other end in the longitudinal direction of the backup tool 17 indicated by an arrow X in FIG.

  As shown in FIGS. 2 and 3, a pair of support tools 61 are provided at the portion corresponding to the receiving surface 17 a of the backup tool 17 in the longitudinal direction of the base member 45 of the inspection device 41. They are spaced apart by a distance slightly larger than their dimensions.

  The pair of supports 61 support the rotary brush 62 as a cleaning means at a height that can rotate and contact the receiving surface. The rotating brush 62 is rotationally driven by a brush drive source 63 provided on one support 61.

  The brush drive source 63 is rotationally driven by a drive signal from the drive unit 58 of the control device 54 as shown in FIG. The cleaning means is not limited to the rotating brush 62, and a disc-shaped or roll-shaped polishing cloth or the like may be used.

  As shown in FIG. 3, the rotary brush 62 is provided on the downstream side in the movement direction indicated by the arrow X of the inspection apparatus 41 that waits at the standby position S. Accordingly, when the inspection device 41 is driven in the arrow X direction, the rotary brush 62 moves in the arrow X direction integrally with the inspection device 41.

  At this time, if the rotary brush 62 is driven to rotate, the receiving surface 17a of the backup tool 17 is brushed by the rotary brush 62 before being imaged by the imaging camera 51.

  When the rotary brush 62 is moved in the direction opposite to the arrow X, the rotary brush 62 does not act on the receiving surface 17a unless the rotary brush 62 is driven to rotate.

  Imaging of the receiving surface 17a by the imaging camera 51 may be performed continuously when the inspection apparatus 41 is driven in the direction of the arrow X shown in FIG. 3, and the image may be obtained as a moving image. Each time the inspection apparatus 41 moves a predetermined distance, it may be obtained as a still image by intermittently taking an image with the imaging camera 51.

  The driving of the X drive source 19, Y drive source 23, Z drive source 32, and θ drive source 35 of the positioning unit 12 is controlled by a drive signal from the drive unit 58 of the control device 54. .

  According to the mounting apparatus having the above-described configuration, when inspecting whether there is any deposit on the receiving surface 17a of the backup tool 17, the inspection apparatus 41 is driven in the direction indicated by the arrow X from the standby position S shown in FIG. When the inspection apparatus 41 is driven, the rotating brush 62 is provided integrally with the inspection apparatus 41 on the downstream side in the driving direction, so that the receiving surface 17a is imaged before being imaged by the imaging camera 51 of the inspection apparatus 41. Brushing is performed by the rotating brush 62.

  Then, the portion brushed by the rotating brush 62 of the receiving surface 17a is imaged by the imaging camera 51, and it can be determined from the imaging signal whether or not the deposit is attached to the receiving surface 17a of the backup tool 17. . That is, it is possible to reliably detect whether or not deposits remain on the receiving surface 17a.

  Therefore, if the deposit remains on the receiving surface 17a, the TCP 6 is finally bonded to the substrate W in a state where dust adheres to the receiving surface 17a by removing the deposit adhering to the receiving surface 17a after the inspection. Can be prevented beforehand. That is, it is possible to prevent the substrate W from adhering to the receiving surface 17a and being damaged by the deposits.

  The determination unit 56 of the control device 54 not only detects the presence of dust on the substrate W, but also specifies the position in the longitudinal direction of the receiving surface 17a of the backup tool 17 simultaneously with the detection. be able to.

  That is, the pulse signal from the drive unit 58 is simultaneously output to the camera drive source 48 that drives the imaging camera 51 and the determination unit 56. Therefore, the determination unit 56 can detect the presence of the deposit on the receiving surface 17a of the backup tool 17, and at the same time specify the position in the longitudinal direction of the backup tool 17 of the imaging camera 51 at that time.

  As a result, when removing the adhering matter adhering to the receiving surface 17a of the backup tool 17, it is possible to know in advance where the adhering matter is adhering to the longitudinal direction of the receiving surface 17a of the backup tool 17. The removal work of the deposits can be easily and reliably performed.

  In particular, when the substrate W is enlarged and the backup tool 17 is lengthened, it is not easy to find the position on the receiving surface 17a where the deposit is attached. However, since the above-described inspection apparatus 41 can specify not only the presence or absence of deposits but also the position, the dust remaining on the receiving surface 17a of the backup tool 17 can be easily and reliably removed as described above. it can.

  The removal work of the deposits may be performed manually, but since the position where the deposits are attached can be specified by the determination unit 56, the rotary brush 62 provided integrally with the inspection device 41 is provided at that position. You may make it move and brush the part again. Note that the brushing result may be determined by imaging the brushed portion with the imaging camera 51. In this way, both the inspection of the receiving surface and the removal of deposits can be automated.

  The receiving surface 17a is imaged by the imaging camera 51, and the receiving surface 17a is brushed by the rotating brush 62 that is driven integrally with the imaging camera 51 before determining whether or not the deposit surface remains on the receiving surface 17a. I tried to do it.

  Therefore, compared with the case where the receiving surface 17a is not brushed before the receiving surface 17a is imaged, the degree of deposits remaining on the receiving surface 17a can be reduced. It becomes possible to work easily and quickly.

  As shown in FIG. 2, the imaging camera 51 images the deposits attached to the receiving surface 17 a by irradiating illumination light from a light source 52 located at one end in the width direction of the backup tool 17 and at the other end in the width direction. This is performed by the imaging camera 51.

  For this reason, if the deposit is attached to the receiving surface 17a, the imaging camera 51 images the shadow of the deposit, so that the deposit is not affected by the reflection state of the illumination light on the receiving surface 17a. It is possible to reliably perform the imaging.

  In the above-described embodiment, the case where the anisotropic conductive member is fixed to the receiving surface of the backup tool by performing the main pressure bonding of TCP to the substrate as the attached material has been described as an example. It is not limited to the anisotropic conductive member that adheres to the surface, but may be a case where dust generated in the space where the mounting apparatus is installed adheres. The position can be specified simultaneously with the detection.

  According to the present invention, the upper end surface of the backup tool is imaged over the entire length in the longitudinal direction, and it is determined whether or not there is a deposit on the upper end surface of the backup tool based on the imaging. After cleaning, it is possible to accurately determine whether or not the deposit remains on the upper end surface.

Claims (7)

A mounting device for mounting electronic components on the side of a substrate,
A mounting stage on which the substrate is placed on the upper surface by projecting a side portion on which the electronic component is mounted;
A backup tool having an upper end surface that supports the lower surface of the side portion of the substrate protruding outward from the upper surface of the mounting stage;
A pressure tool for mounting the electronic component on the upper surface of the side portion of the substrate whose lower surface is supported by the upper end surface of the backup tool;
Imaging means for imaging the upper end surface in a state where the substrate is retracted from the upper end surface of the backup tool;
Driving means for driving the imaging means along the longitudinal direction of the backup tool to image the upper end surface over the entire length; and
An image processing unit that performs image processing on an imaging signal of the imaging unit;
An electronic component mounting apparatus comprising: determination means for determining whether or not there is a deposit on the upper end surface of the backup tool based on an image signal processed by the image processing unit.   The determination unit specifies a position in the longitudinal direction of the upper end surface of the backup tool of the backup tool based on an image signal from the image processing unit and a driving position of the imaging unit by the driving unit. The electronic component mounting apparatus according to claim 1.   The imaging means is provided along a width direction intersecting with the longitudinal direction of the backup tool and driven in the longitudinal direction of the backup tool by the drive source, and provided at one end of the base member. An imaging camera that images the upper end from the side, and a light source that is provided at the other end of the base member and that illuminates the upper end of the backup tool captured by the imaging camera from the side. The electronic component mounting apparatus according to claim 1.   4. The electronic component mounting apparatus according to claim 1, further comprising a cleaning unit that is driven integrally with the imaging unit by the driving unit to clean an upper end surface of the backup tool. 5. .   The electronic component mounting apparatus according to claim 4, wherein the cleaning unit is provided at a position where the portion of the upper end surface of the backup tool before being imaged by the imaging unit can be cleaned. A mounting method for mounting an electronic component on a side of a substrate,
Placing the lower surface of the side portion of the substrate placed on the mounting stage on the upper end surface of the backup tool;
Mounting the electronic component on the upper surface of the side portion of the substrate whose lower surface is placed on the upper end surface of the backup tool;
Imaging the upper end surface of the backup tool over the entire length in the longitudinal direction with the substrate retracted from the upper end surface of the backup tool;
And a step of determining whether or not there is a deposit on the upper end surface based on imaging of the upper end surface of the backup tool.   The electronic component mounting method according to claim 6, wherein the position of the dust in the longitudinal direction of the backup tool is specified when it is determined that there is a deposit on the upper end surface of the backup tool.

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