JP2004105848A - Equipment and method for cleaning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment and a method for cleaning substrate for surely removing contamination of a substrate by preventing building-up of dusts, etc. on a washing brush, and detecting contamination of the brush. <P>SOLUTION: A brush-cleaning substrate 3 is provided to the outside periphery of a substrate 2. A 1st cleaning brush 7 is brought into contact with a surface 2A of the rotating substrate 2 and a surface 3A of the substrate 3 to scrub and clean the surface 2A of the substrate 2, which is cleaned by the brush-cleaning substrate 3. A 2nd cleaning-brush 12 for cleaning the substrate 3, and a detector 14 for detecting contamination of the 2nd cleaning-brush 12 are placed to appropriate places of the substrate 3 to detect timing for replacement of the brush 12. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate cleaning apparatus and a cleaning method thereof. In particular, the present invention relates to a cleaning method of a cleaning brush for scrub cleaning a substrate surface.
[0002]
[Prior art]
As is well known, a liquid crystal device such as a liquid crystal light valve has a configuration in which liquid crystal is sealed between two substrates such as a glass substrate and a quartz substrate, and a thin film transistor (Thin Film Transistor, In the following, TFTs are arranged in a matrix, an opposing electrode is arranged on the other substrate, and the optical characteristics of the liquid crystal layer sealed between the two substrates are changed according to an image signal, thereby displaying an image. It is possible.
[0003]
In addition, the TFT substrate on which the TFT is disposed and the opposing substrate disposed opposite to the TFT substrate are manufactured separately, and the two substrates are laminated with high precision in a panel assembling process and then filled with liquid crystal. It is supposed to be.
[0004]
In the panel assembling process, first, the TFT substrate and the opposing substrate manufactured in the manufacturing process of each substrate are opposed to each other, and the liquid crystal molecules are placed on the opposing surface, that is, the surface in contact with the liquid crystal layer of the opposing substrate and the TFT substrate. To form an alignment film for orienting the substrate along the substrate surface. This alignment film is formed, for example, by printing polyimide with a thickness of about several tens of nanometers. After that, baking is performed, and further, a rubbing treatment is performed to determine the arrangement of the liquid crystal molecules when no voltage is applied. Next, a seal portion serving as an adhesive is formed on one edge of one substrate, and the TFT substrate and the opposing substrate are bonded to each other using the seal portion, and pressure-bonded and cured while performing alignment. A method of enclosing a liquid crystal through a notch provided is used.
[0005]
Here, the rubbing treatment is to form a fine groove on the surface of the alignment film to make the alignment film anisotropically oriented. By subjecting the alignment film to a rubbing treatment in a certain direction, the alignment of the liquid crystal molecules is performed. Can be defined.
[0006]
By the way, in the firing and rubbing processing at the time of forming such an alignment film, a large amount of dust is generated during the firing and during the rubbing processing and adheres to the substrate surface, thereby causing a pattern defect of the substrate. There is. Therefore, after the alignment film printing and the rubbing treatment of both substrates performed after firing, a cleaning process for removing dust adhered to the substrate surface is performed. The substrate cleaning apparatus and the substrate cleaning method used in the cleaning process are used. Are variously disclosed in Patent Document 1 and the like.
[0007]
As shown in FIG. 13, the substrate cleaning apparatus and the substrate cleaning method disclosed in Patent Document 1 have a rotating shaft 121 and a circular shape that is supported by the rotating shaft 121 and is rotated by the rotating shaft. A turntable 120, a plurality of holding pins 123 extending upward from an edge of the turntable 120 and holding the peripheral surface of the substrate 200, and a brush cleaning mechanism disposed near the turntable 120. 127, a sponge-like cleaning brush 126 that is pivotally supported by the arm shaft 129 of the brush cleaning mechanism 127 and cleans the surface of the substrate 200, an ultrasonic vibration device 131, and a vibration arm shaft 130. And a pair of nozzles 1 attached to a vibration arm shaft 130 of the ultrasonic vibration mechanism 128 for supplying a cleaning liquid with ultrasonic vibration to both front and back surfaces of the substrate 200. 4 is composed of a.
[0008]
In the substrate cleaning apparatus configured as described above, the cleaning liquid accompanied by ultrasonic vibration is supplied from the reciprocating nozzle 124 to the upper and lower surfaces of the substrate 200 rotated by the rotation shaft 121 by the ultrasonic vibration mechanism 128. Further, the cleaning brush 126 operated by the brush cleaning mechanism 127 is rotated and brought into contact with the surface of the substrate while scrubbing dirt on both the front and back surfaces of the substrate 200.
[0009]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2002-124504
[Problems to be solved by the invention]
As described above, in the substrate cleaning apparatus and the substrate cleaning method disclosed in Patent Literature 1, the surface of the substrate 200 is scrub-cleaned by the cleaning brush 126 to remove dirt from the substrate. However, in this method, a part of the dust and the like removed from the substrate 200 adheres again to the cleaning brush 126 side, and dirt is accumulated on the cleaning brush 126. If the substrate to be cleaned next is cleaned using the cleaning brush 126 to which the dust or the like has adhered, the dust or the like adhered to the cleaning brush 126 may be re-adhered to the substrate side in reverse, resulting in poor cleaning. There was a problem. Further, since there is no means for confirming the contamination of the cleaning brush 126, there is a risk that the cleaning brush 126 may be continuously used without being noticed.
[0011]
Further, the scrub cleaning of the substrate by the cleaning brush 126 only cleans the specified position, so that there is a problem that only the dirt at the specified position of the substrate 200 can be cleaned.
[0012]
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to prevent accumulation of dust and the like on a cleaning brush and to enable detection of contamination of the cleaning brush, thereby ensuring that the substrate is contaminated. It is an object of the present invention to provide a substrate cleaning apparatus and a cleaning method capable of removing the substrate.
[0013]
Means and Action for Solving the Problems
As one mode of the substrate cleaning apparatus according to the present invention, in a substrate cleaning apparatus for cleaning a surface of the substrate by bringing a cleaning brush into contact with a substrate mounted on a turntable and sliding the substrate, an outer periphery of the substrate is provided. In addition, a brush cleaning substrate for cleaning the cleaning brush is provided.
[0014]
Further, as a substrate cleaning apparatus of the present invention, there is provided a brush cleaning substrate disposed on an outer periphery of a substrate, a rotating table for mounting the substrate, a surface of the rotating substrate, and a cleaning contacting the surface of the brush cleaning substrate. A cleaning brush, wherein the cleaning brush cleans a surface of the substrate and is cleaned by the brush cleaning substrate.
[0015]
ADVANTAGE OF THE INVENTION According to the board | substrate washing | cleaning apparatus of this invention, a washing | cleaning brush abuts on the surface of the board | substrate attached to a turntable, and rotates with the same turntable, and the surface of a brush washing board | substrate. The brush is also cleaned by the brush cleaning substrate, which has the effect of preventing re-adhesion of dirt to the cleaning brush.
[0016]
Further, in the substrate cleaning apparatus of the present invention, the cleaning brush slides radially from the center of the substrate toward the outside of the brush cleaning substrate with respect to the rotating substrate and the brush cleaning substrate. Abutting and cleaning the surface of the substrate.
[0017]
According to this configuration, the cleaning brush slides radially from the center of the substrate toward the outside of the brush cleaning substrate and sequentially contacts the rotating substrate and the brush cleaning substrate. The surface of the brush cleaning substrate can be slid without leakage, and the surface of the substrate and the cleaning brush can be reliably cleaned.
[0018]
Further, in the substrate cleaning apparatus of the present invention, the cleaning brush is configured to cause the dirt on the substrate surface adhered by the cleaning to adhere to the brush cleaning substrate by sliding on the surface of the brush cleaning substrate. I do.
[0019]
According to this configuration, the cleaning brush moves in the radial direction with respect to the rotating substrate, removes dirt such as dust on the surface of the substrate, and adheres to the cleaning brush by sliding on the surface of the brush cleaning substrate. By adhering the dirt on the cleaned substrate surface to the brush cleaning substrate, the entire surface can be surely cleaned, and the cleaning brush is also cleaned by the brush cleaning substrate, so that re-adhesion of the dirt to the cleaning brush is prevented. This has the effect of being able to
[0020]
Further, in the substrate cleaning apparatus of the present invention, the brush cleaning substrate is in contact with the outer peripheral surface of the substrate by pressure bonding.
[0021]
According to this configuration, by moving the cleaning brush in the radial direction with respect to the rotating substrate, the dirt on the substrate surface cleaned by the cleaning brush is removed by the brush cleaning contacting the outer peripheral surface of the substrate. The brush cleaning substrate can be attached to the substrate, and the outer peripheral surface of the substrate can be held by the brush cleaning substrate.
[0022]
In the substrate cleaning apparatus of the present invention, the brush cleaning substrate is attached to the rotary table together with the substrate by a vacuum suction chuck.
[0023]
According to this configuration, since the brush cleaning substrate is attached to the turntable together with the substrate, the brush cleaning substrate does not always need to be in pressure contact with the outer peripheral surface of the substrate, and is easy to attach. Has an effect.
[0024]
Further, the substrate cleaning apparatus of the present invention is characterized in that the brush cleaning substrate and the substrate are mounted such that their surfaces are flush with each other.
[0025]
According to this configuration, the brush cleaning substrate and the surface of the substrate are flush with each other, so that the sliding operation of the cleaning brush can be performed smoothly, and the substrate surface and the cleaning brush can be cleaned by one linear operation. It has the effect that it can be washed.
[0026]
Further, the substrate cleaning apparatus of the present invention is characterized in that the brush cleaning substrate has a mirror-finished surface.
[0027]
According to this configuration, since the surface of the brush cleaning substrate is mirror-finished, there is an effect that dirt on the cleaning brush that contacts the surface of the brush cleaning substrate can be more effectively cleaned.
[0028]
In one aspect of the substrate cleaning apparatus of the present invention, a substrate cleaning apparatus for supplying a cleaning liquid to a rotating substrate and cleaning the substrate includes: a brush cleaning substrate disposed on an outer periphery of the substrate; A first cleaning brush that slides in contact with the surface of the substrate and the brush cleaning substrate, a substrate driving unit that rotates the brush cleaning substrate while holding the substrate, and a second cleaning brush that contacts the brush cleaning substrate. And a dirt detector for detecting dirt on the brush cleaning substrate.
[0029]
ADVANTAGE OF THE INVENTION According to the board | substrate cleaning apparatus of this invention, a dirt of a brush cleaning board | substrate can be detected and the dirt can be wash | cleaned by contacting a 2nd cleaning brush with a brush cleaning board | substrate, and arrange | positioning a dirt detector. This has the effect.
[0030]
Further, in the substrate cleaning apparatus according to the present invention, the dirt detector is constituted by a CCD camera for detecting dirt on the brush cleaning substrate.
[0031]
According to this configuration, the dirt on the brush cleaning substrate can be more accurately detected by observing the dirt using the CCD camera as the dirt detector, and the replacement time of the second cleaning brush is detected. It has the effect of being able to.
[0032]
As one mode of the cleaning method of the substrate cleaning apparatus of the present invention, in the substrate cleaning step of cleaning the surface of the substrate by bringing the cleaning brush into contact with the substrate attached to the turntable and sliding the cleaning brush, Cleaning the cleaning brush with a brush cleaning substrate disposed on the outer periphery of the substrate.
[0033]
Also, the cleaning method of the substrate cleaning apparatus of the present invention includes a step of arranging a brush cleaning substrate on an outer periphery of the substrate, a step of attaching the substrate to a turntable, a surface of the rotating substrate, and a method of cleaning the brush cleaning substrate. A cleaning brush is brought into contact with the surface; the cleaning brush cleans the surface of the substrate; and the cleaning brush is cleaned by the brush cleaning substrate.
[0034]
According to the cleaning method of the substrate cleaning apparatus of the present invention, the surface of the substrate is cleaned by a process in which the cleaning brush is in contact with the surface of the substrate and the surface of the brush cleaning substrate that is attached to the rotating table and rotates together with the rotating table. In addition, the cleaning brush is also cleaned by the brush cleaning substrate, which has the effect of preventing reattachment of dirt to the cleaning brush.
[0035]
Further, the cleaning method of the substrate cleaning apparatus according to the present invention includes a step of disposing a brush cleaning substrate on an outer periphery of the substrate; a step of attaching the substrate and the brush cleaning substrate to a rotating table by a vacuum suction operation; A step of directing a nozzle toward the surface of the substrate and spraying a cleaning liquid from the nozzle; and a step of bringing a first cleaning brush into contact with the rotating surface of the substrate and moving the cleaning brush in the radial direction of the substrate to clean the substrate surface. A step of attaching dirt on the surface of the substrate to the brush cleaning substrate; a step of cleaning the first cleaning brush by sliding the first cleaning brush on the brush cleaning substrate; And a step of detecting dirt on the second cleaning brush with a dirt detector.
[0036]
According to the cleaning method of the substrate cleaning apparatus of the present invention, the first cleaning brush moves in the radial direction of the substrate and slides on the surface of the rotating substrate and the surface of the brush cleaning substrate, so that the surface of the substrate can be surely removed. The dirt can be cleaned and the dirt can be adhered to the brush cleaning substrate, and the cleaning brush is also cleaned by the brush cleaning substrate, so that the dirt can be prevented from re-adhering to the first cleaning brush. Having. Further, by cleaning the brush cleaning substrate with the second cleaning brush, there is an effect that re-adhesion of dirt to the second cleaning brush can be prevented.
[0037]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0038]
FIG. 1 is a front view partially showing a cross section of a schematic configuration of a substrate cleaning apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view showing only a substrate and a brush cleaning substrate in FIG. 3 to 6 are front views for explaining the cleaning process of the substrate cleaning apparatus of FIG.
[0039]
As shown in FIG. 1, a substrate cleaning apparatus 1 is an apparatus for cleaning a circular substrate 2 made of a flat plate such as quartz, and includes a ring-shaped brush cleaning substrate 3, a rotating device 5, and the like. A rotating shaft 6 extending upward from the rotating device 5 and rotating when the rotating device is turned on, and a circular rotating table 4 supported at the center of the lower surface of the rotating shaft 6 and rotated by the rotating shaft 6. And a vacuum suction chuck 11 disposed inside the turntable 4 for sucking and holding the substrate 2 and the brush cleaning substrate 3 from below by a vacuum device (not shown), and attached to the rotation device 5 by a support arm. A second cleaning brush 12 that contacts the brush cleaning substrate 3 and cleans the dirt on the brush cleaning substrate 3, and a CCD that is disposed on the second cleaning brush 12 and detects a contamination state of the brush cleaning substrate 3. Mosquito A cleaning nozzle 13 which is attached to the rotating device 5 by a support arm and supplies various cleaning liquids onto the substrate 2 at the time of cleaning the substrate; a cleaning nozzle 13 for cleaning the surface of the substrate 2 and the brush at the time of cleaning the substrate; A first cleaning brush 7 made of, for example, polyvinyl alcohol (hereinafter, referred to as PBC) or the like, which is in contact with the surface of the substrate 3 to clean the surface of the substrate 2, and controls the operation of the first cleaning brush 7. A first cleaning brush driving device 10, a first telescopic arm 8 controlled by the first cleaning brush driving device 10 for moving the first cleaning brush 7 in a radial direction of the substrate, and a first cleaning brush 7 And a second telescopic arm 9 that performs a vertical movement on the substrate surface.
[0040]
The brush cleaning substrate 3 is made of mirror-finished silicon or the same material as the substrate 2, and is pressed against the substrate 2 via a fitting portion to be in contact with the substrate 2 to hold the outer peripheral surface of the substrate 2. , For cleaning the first cleaning brush 7 by adhering dirt on the substrate 2.
[0041]
The substrate cleaning apparatus according to the embodiment of the present invention is a single-wafer cleaning apparatus for cleaning substrates one by one.
[0042]
Next, a method of cleaning the substrate 2 and the cleaning brush 7 to be cleaned by the substrate cleaning apparatus configured as described above will be described.
[0043]
First, as shown in FIG. 2, a ring-shaped brush cleaning substrate 3 whose surface 3A is mirror-finished with respect to the outer peripheral surface of the substrate 2 to be cleaned by the substrate cleaning apparatus 1 is fitted to its fitting portion 3a and The outer peripheral surface of the substrate 2 is held by pressing and abutting through the surface 3A so as to be flush with the surface 2A of the substrate 2.
[0044]
Next, the substrate 2 and the brush cleaning substrate 3, the outer circumferences of which are held by the brush cleaning substrate 3, are placed on the turntable 4 of the substrate cleaning apparatus 1 and fixed by the vacuum suction chuck 11. Thereafter, when the power of the rotation device 5 is turned on, the substrate 2 and the brush cleaning substrate 3 rotate together with the turntable 4 by the rotation of the rotation shaft 6. At this time, the second cleaning brush 12 is in contact with the brush cleaning substrate 3. In this state, the cleaning of the substrate 2 is started.
[0045]
First, as shown in FIG. 3, a cleaning liquid such as pure water is sprayed from the cleaning nozzle 13 toward the surface 2A of the rotating substrate 2. Next, under the control of the first cleaning brush driving device 10, the first telescopic arm 8 is extended and retracted, and the first cleaning brush 7 is disposed above the substrate 2 so as to oppose the rotation center position of the substrate 2, and then the second The telescopic arm 9 is reduced, and the first cleaning brush 7 is brought into contact with the rotation center of the surface 2A of the substrate 2.
[0046]
Subsequently, as shown in FIG. 4, the first cleaning brush 7 is moved to the outer peripheral edge of the brush cleaning substrate 3 at a low speed in a direction other than the position where the second cleaning brush 12 is fixed. Then, the substrate surface 2A is scrub-cleaned by one sliding operation of the cleaning brush 7, and is adhered to the surface 2A of the substrate 2, for example, SiO2 or polysilicon adhered at the time of the baking process in the substrate manufacturing process. Dust adheres to the first cleaning brush 7.
[0047]
Since the first cleaning brush 7 is made of a material such as PVA (polyvinyl alcohol) as described above, in cleaning using pure water or the like, the first cleaning brush 7 itself becomes pure water or the like. Therefore, the attached dust is less likely to be separated than in the case where a cleaning brush made of a hairy member is used.
[0048]
Further, as shown in FIG. 5, the first cleaning brush 7 is moved by the first telescopic arm 8 in a direction away from the brush cleaning substrate 3 while sliding on the surface 3A of the rotating brush cleaning substrate 3. . Then, the first cleaning brush 7 slides on the mirror-finished surface 3A of the brush cleaning substrate 3 as described above, so that the dust adhered to the first cleaning brush 7 is removed from the brush cleaning substrate 3. The first cleaning brush 7 attached to the surface 3A is cleaned by the brush cleaning substrate 3.
[0049]
Further, the dust adhered to the brush cleaning substrate 3 is adhered to the second cleaning brush 12 in contact with the brush cleaning substrate 3 and is cleaned. The contamination of the second cleaning brush 12 is determined by the dirt detector 14 disposed on the second cleaning brush 12 after the cleaning is completed, that is, when the rotation of the turntable 4, the substrate 2, and the brush cleaning substrate 3 is stopped. The condition is detected.
[0050]
Finally, as shown in FIG. 6, the first cleaning brush 7 is separated above the substrate 2 by the control of the first cleaning brush driving device 10 to extend the second telescopic arm 9 upward. I do.
[0051]
As described above, in the substrate cleaning apparatus and the cleaning method according to the embodiment of the present invention, the cleaning liquid is supplied from the cleaning nozzle 13 and the first surface 2A of the rotating substrate 2 and the first surface 3A of the brush cleaning substrate 3 are firstly cleaned. The first cleaning brush 7 abuts on the surface 2A of the substrate 2 by linearly sliding once from the center of rotation of the substrate 2 to the outside of the brush cleaning substrate 3 linearly. The dust adheres to the first cleaning brush 7 together with the cleaning liquid, and can scrub clean the surface 2A of the substrate 2.
[0052]
In addition, since the first cleaning brush 7 to which the dust adheres slides on the surface 3A of the brush cleaning substrate 3, the dust of the first cleaning brush 7 adheres to the surface 3A of the brush cleaning substrate 3. The first cleaning brush 7 is cleaned by the brush cleaning substrate 3, and the contamination of the first cleaning brush 7 can be brought into the next cleaning step to prevent reattachment of dust. Further, the first cleaning brush 7 can perform cleaning only by sliding once linearly on the substrate 2 and the brush cleaning substrate 3, so that the efficiency of the cleaning process and the size of the apparatus can be reduced. Can be achieved.
[0053]
Further, dust adhering to the surface 3A of the brush cleaning substrate 3 by cleaning the first cleaning brush 7 is cleaned by the second cleaning brush 12, so that the surface 3A of the brush cleaning substrate 3 is always kept in a clean state. , And the contamination detector 14 detects the contamination state of the second cleaning brush 12, so that the replacement time of the second cleaning brush 12 can be appropriately detected. The re-adhesion of dirt on the second cleaning brush 12 can be prevented.
[0054]
In the above-described embodiment of the present invention, the substrate 2 and the brush cleaning substrate 3 are fixed and held on the rotary table 4 by the vacuum suction chuck 11, but the present invention is not limited to this. 7 is held in pressure contact with the outer peripheral surface of the substrate 2, so as shown in FIG. 7, it is not necessary to vacuum-suction only the substrate 2 on the turntable 4 and hold the brush cleaning substrate 3 on the turntable. The good thing is, of course.
[0055]
Further, as shown in FIG. 8, the brush cleaning substrate 3 does not need to contact the entire outer peripheral surface of the substrate 2, but is arranged in an L-shape so that the lower surface is pressed and contacted from the center of the outer peripheral surface of the substrate 2. In this case as well, in the same manner as in the above-described embodiment of the present invention, the surface 2A of the substrate 2 and the surface 2A of the substrate 2 can be moved by one linear sliding operation in the radial direction of the first cleaning brush 7. Needless to say, the first cleaning brush 7 can be cleaned, and the same effects as those of the above-described embodiment of the present invention can be obtained.
[0056]
As shown in FIG. 9, the brush cleaning substrate 3 may be separated from the outer peripheral surface and fixed to the rotary table 4 by the vacuum suction chuck 11 without being pressed and brought into contact with the outer peripheral surface of the substrate 2, Also in this case, as in the above-described embodiment of the present invention, the surface 2A of the substrate 2 and the first cleaning brush 7 can be moved by one linear sliding operation of the first cleaning brush 7 in the radial direction. It is needless to say that the same effect as that of the above-described embodiment of the present invention can be obtained.
[0057]
Further, in the above-described embodiment of the present invention, the substrate and the like are cleaned by one linear operation of the first cleaning brush 7 in order to improve the work efficiency, but the present invention is not limited to this. Needless to say, in order to perform the cleaning of the substrate 2 more reliably, the first cleaning brush 7 may be slid over the surface 2A of the substrate 2 a plurality of times to perform the scrub cleaning operation. .
[0058]
When it is not necessary to clean the substrate or the like by one linear operation of the first cleaning brush 7, as shown in FIGS. 10 and 11, the surfaces 30A of the brush cleaning substrates 30 and 31, 31A does not have to be flush with the surface 2A of the substrate 2.
[0059]
Further, when the first cleaning brush 7 contacts the substrate 2 and the brush cleaning substrate 3, the cleaning effect can be further enhanced if the first cleaning brush 7 is rotated and contacted. Of course.
[0060]
In the above-described embodiment of the present invention, the first cleaning brush 7 is moved while sliding the surface 2A of the substrate 2 and the surface 3A of the brush cleaning substrate 3 so that the surface 2A of the substrate 2 and Although the first cleaning brush 7 is cleaned, the present invention is not limited to this. The first cleaning brush holding device 101, the support arm 102, and the first cleaning brush 70 are fixed as shown in FIG. The surface 2A of the substrate 2 is brought into contact with the first cleaning brush 70, and the first cleaning brush holding device 101, the support arm 102, the first cleaning brush 70, the rotating device 50, the second cleaning brush 141, the dirt detector The first cleaning brush 70 is moved in a direction other than the position where the second cleaning brush 140 is fixed to the substrate cleaning apparatus 100 including the cleaning nozzle 140, the cleaning nozzle 142, the turntable 40, and the rotating shaft 60. The same effect can be moved up to the outside of the cleaning substrate 3 is obtained, without saying.
[0061]
The substrate to be cleaned according to the present invention is not limited to a substrate for a liquid crystal device, but can be applied to a substrate of an electrophoretic device, an EL device, a semiconductor device, or the like.
[Brief description of the drawings]
FIG. 1 is a front view partially showing a cross section of a schematic configuration of a substrate cleaning apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing only a substrate and a brush cleaning substrate in the substrate cleaning apparatus of FIG. 1;
3 is an essential part front view showing a state in which a first cleaning brush is in contact with a rotation center of the substrate in a cleaning step of the substrate cleaning apparatus of FIG. 1;
4 is an essential part front view showing a state in which a first cleaning brush slides to a brush cleaning substrate in a cleaning step of the substrate cleaning apparatus of FIG. 1;
5 is a main part front view showing a state in which a first cleaning brush has moved to the outside of the brush cleaning substrate in a cleaning step of the substrate cleaning apparatus of FIG. 1;
FIG. 6 is a main part front view showing a state in which the first cleaning brush has moved upward outside the substrate in the cleaning step of the substrate cleaning apparatus of FIG. 1;
FIG. 7 is an essential part front view showing a state in which only the substrate is fixed to the rotary table by a vacuum suction chuck.
FIG. 8 is an essential part front view showing a state in which the L-shaped brush cleaning substrate is pressed and abutted on the lower surface from the center of the outer peripheral surface of the substrate.
FIG. 9 is an essential part front view showing a state in which the brush cleaning substrate is fixed to the turntable while being separated from the substrate;
FIG. 10 is a main part front view showing a state where the surface of the brush cleaning substrate is disposed at a position higher than the surface of the substrate.
FIG. 11 is a main part front view showing a state where the surface of the brush cleaning substrate is disposed at a position lower than the surface of the substrate.
FIG. 12 is a front view showing a modification of the substrate cleaning apparatus according to the embodiment of the present invention;
FIG. 13 is a front view showing an example of a conventional substrate cleaning apparatus.
[Explanation of symbols]
1,100 substrate cleaning device 2 substrate 2A substrate surface 3 brush cleaning substrate surface 3A brush cleaning substrate surface 4,40 rotating table 5,50 rotating device (substrate driving means)
7, 70 first cleaning brushes 11, 110 vacuum suction chucks 12, 141 second cleaning brushes 13, 142 cleaning nozzles 14, 140 dirt detector

Claims (13)

In a substrate cleaning apparatus that cleans the surface of the substrate by bringing the cleaning brush into contact with the substrate attached to the turntable and sliding the cleaning brush,
A substrate cleaning apparatus, wherein a brush cleaning substrate for cleaning the cleaning brush is disposed on an outer periphery of the substrate. A brush cleaning substrate arranged on the outer periphery of the substrate,
A turntable for mounting the board,
A cleaning brush that contacts the surface of the rotating substrate and the surface of the brush cleaning substrate,
With
The substrate cleaning apparatus, wherein the cleaning brush cleans a surface of the substrate and is cleaned by the brush cleaning substrate. The cleaning brush slides radially from the center of the substrate toward the outside of the brush cleaning substrate to sequentially contact the rotating substrate and the brush cleaning substrate to clean the surface of the substrate. The substrate cleaning apparatus according to claim 2, wherein: 3. The substrate cleaning apparatus according to claim 2, wherein the cleaning brush causes the dirt on the substrate surface adhered by the cleaning to adhere to the brush cleaning substrate by sliding on the surface of the brush cleaning substrate. The substrate cleaning apparatus according to claim 2, wherein the brush cleaning substrate is in contact with an outer peripheral surface of the substrate by pressure bonding. The substrate cleaning apparatus according to claim 2, wherein the brush cleaning substrate is attached to the turntable together with the substrate by a vacuum suction chuck. The substrate cleaning apparatus according to claim 2, wherein the brush cleaning substrate and the substrate are mounted such that their surfaces are flush with each other. The substrate cleaning apparatus according to claim 2, wherein a surface of the brush cleaning substrate is mirror-finished. In a substrate cleaning apparatus for supplying a cleaning liquid to a rotating substrate and cleaning the substrate,
A brush cleaning substrate disposed on the outer periphery of the substrate,
A first cleaning brush that slides in contact with the surface of the substrate and the surface of the brush cleaning substrate;
The brush cleaning substrate, and substrate driving means for rotating while holding the substrate,
A second cleaning brush abutting on the brush cleaning substrate, a dirt detector for detecting dirt on the brush cleaning substrate,
A substrate cleaning apparatus comprising: The substrate cleaning apparatus according to claim 9, wherein the dirt detector is configured by a CCD camera that detects dirt on the brush cleaning substrate. In the substrate cleaning step of cleaning the surface of the substrate by sliding the cleaning brush against the substrate attached to the turntable,
A method for cleaning a substrate cleaning apparatus, comprising: a step of cleaning the cleaning brush with a brush cleaning substrate disposed on an outer periphery of the substrate. Arranging a brush cleaning substrate on the outer periphery of the substrate;
Attaching the substrate to a turntable,
A step of bringing a cleaning brush into contact with the surface of the rotating substrate, and the surface of the brush cleaning substrate,
A step of the cleaning brush cleaning the surface of the substrate;
A step in which the cleaning brush is cleaned by the brush cleaning substrate;
The method for cleaning a substrate cleaning apparatus according to claim 11, further comprising: Arranging a brush cleaning substrate on the outer periphery of the substrate;
Mounting the substrate and the brush cleaning substrate on a turntable by vacuum suction,
Aiming a nozzle at the surface of the rotating substrate, and spraying a cleaning liquid from the nozzle,
Contacting a first cleaning brush on the surface of the rotating substrate, moving the cleaning brush in a radial direction of the substrate to clean the substrate surface, and attaching dirt on the substrate surface to the brush cleaning substrate;
Cleaning the first cleaning brush by sliding the first cleaning brush on the brush cleaning substrate;
Cleaning the brush cleaning substrate with a second cleaning brush;
A step of detecting dirt on the second cleaning brush with a dirt detector;
The method for cleaning a substrate cleaning apparatus according to claim 11, wherein the method comprises:

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