KR20080049359A - Apparatus for polshing substrate - Google Patents

Abstract

A grinding apparatus is provided to remove dirt stuck to substrates with a grinding material for improving productivity of flat panel displays. A grinding apparatus(110) for removing dirt(116) stuck to substrates includes a grinding material(112) for removing dirt attached on the surface of a substrate(114) placed on a stage(134), a head(118) for making the grinding material contact with dirt to be removed, a first main roller(120) and a second main roller(122) for running the grinding material, and a first auxiliary roller(126) and a second auxiliary roller(128) for keeping the grinding material in a proper position.

Description

Substrate Polishing Machine {APPARATUS FOR POLSHING SUBSTRATE}

1 is a view schematically showing a substrate polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a view for explaining a state in which the polishing tape shown in FIG. 1 maintains its position.

{Description of symbols for main parts of the drawing}

110: substrate polishing apparatus 112: polishing member

114: substrate 116: foreign matter

118: head 120: first main roller

122: second main roller 124: fixing member

126: first auxiliary roller 128: second auxiliary roller

130: cleaning member 134: stage

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of flat panel displays, and more particularly, to a substrate polishing apparatus for removing foreign matter on a substrate used in a flat panel display.

In response to the development of the information society, the use of flat panel displays (FPDs) such as liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) is increasing. Among such flat panel display devices, a liquid crystal display device will be described below as an example.

Liquid crystal displays are devices that display images by using the electro-optical properties of liquid crystal molecules. To this end, the liquid crystal display includes a liquid crystal panel, a backlight unit, and a driving circuit unit.

The liquid crystal panel displays an image, and includes a color filter substrate and a thin film transistor substrate bonded together with a liquid crystal layer made of liquid crystal molecules therebetween.

The color filter substrate expresses color and includes a red / green / blue color filter formed as a thin film on a transparent substrate such as glass or plastic.

The thin film transistor substrate applies a voltage to the liquid crystal layer and includes a thin film transistor, a pixel electrode, and a common electrode formed of a thin film on another transparent substrate made of a material such as glass or plastic.

The backlight unit is located at the rear of the liquid crystal panel to provide light to the liquid crystal panel.

The driving circuit unit generates driving voltages for driving the liquid crystal panel, and supplies the generated driving voltages to the liquid crystal panel connected thereto.

The conventional liquid crystal display device having the above structure is largely manufactured through a substrate manufacturing process, a cell manufacturing process, and a module manufacturing process. Here, a substrate manufacturing process means the process of manufacturing the color filter substrate using the cleaned board | substrate, and the process of manufacturing the thin film transistor substrate using the other board | substrate cleaned. The cell manufacturing process refers to a process of forming a liquid crystal panel by forming a liquid crystal layer between a color filter substrate and a thin film transistor substrate and then joining the two substrates together. The module manufacturing step refers to a step of assembling the liquid crystal panel having the driving circuit unit with the backlight unit after attaching the driving circuit unit to the pad portion of the liquid crystal panel.

On the other hand, each unit process of the substrate manufacturing process and the cell manufacturing process of the manufacturing process is often carried out at a high temperature. At this time, if a foreign material is attached to the substrate on a high temperature, the foreign material may be fixed on the substrate. There is a problem that the foreign matter stuck on the substrate may not be easily removed by brush cleaning or ultrasonic cleaning. Foreign matter adhered to the substrate eventually degrades the display quality of the liquid crystal display.

For this reason, the foreign material on a board | substrate is removed conventionally using a blade. That is, the blade is brought into contact with foreign matter on the substrate, and then the blade is moved along the surface of the substrate to remove the foreign matter.

However, the method using the blade has a problem that the substrate itself may be damaged by the blade. For this reason, there exists a problem that a large amount of defective liquid crystal panels may arise. This, in turn, may deteriorate the productivity of the liquid crystal display.

Accordingly, an object of the present invention is to provide a substrate polishing apparatus capable of removing foreign substances on a substrate by using a polishing member.

In addition, another technical problem to be achieved by the present invention is to provide a substrate polishing apparatus that can increase the productivity of the flat panel display by removing foreign matter on the substrate using the polishing member.

Further technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above are clearly understood by those skilled in the art from the following description. It can be understood.

A substrate polishing apparatus according to the present invention for achieving the above technical problem is a polishing member for removing the foreign matter on the substrate by polishing the foreign material on the substrate; A head for contacting the polishing member with a foreign material on the substrate; First and second main rollers respectively provided on both sides with the head interposed therebetween for moving the polishing member; And a fixing member for preventing the polishing member from being out of position.

Here, the fixing member may be provided adjacent to each of the first and second main rollers, and include first and second auxiliary rollers that rotate in a direction opposite to a rotation direction of each of the first and second main rollers. Can be.

Here, the first and second main rollers may be driven by one motor.

Here, the polishing member may be an abrasive tape.

Here, the substrate polishing apparatus may further include a cleaning member for cleaning the substrate when the foreign material is polished on the substrate.

Here, the cleaning member may be an air knife.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings.

Hereinafter, a substrate polishing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view schematically showing a substrate polishing apparatus according to an embodiment of the present invention. FIG. 2 is a view for explaining a state in which the polishing tape shown in FIG. 1 maintains its position.

1 and 2, a substrate polishing apparatus 110 according to an embodiment of the present invention may include an abrasive member 112, a head 118, first and second main rollers 120 and 122, and a fixing member. 124. In addition, the substrate polishing apparatus 110 according to the embodiment of the present invention further includes a cleaning member 130 and a stage 134.

The polishing member 112 removes the foreign material 116 on the substrate 114 by polishing the foreign material 116 on the substrate 114. The substrate 114 may be a substrate 114 used for manufacturing a flat panel display such as a liquid crystal display and an organic light emitting diode. Here, the material of the substrate 114 may be glass, plastic, or the like, but is not limited thereto.

Both sides of the polishing member 112 may be wound around first and second reels (not shown). Here, each of the first and second reels may be installed above each of the first and second main rollers 120 and 122.

The polishing member 112 is brought into contact with the foreign material 116 on the substrate 114 by the lowering operation of the head 118, and moves in the horizontal direction by the rotation operation of the first and second main rollers 120 and 122. Thus, the foreign material 116 on the substrate 114 is polished. At this time, the polishing member 112 is moved in the horizontal direction by the first and second main rollers 120 and 122 in a state in which the polishing member 112 is maintained in the fixed position.

When the polishing member 112 completely removes the foreign matter 116 on the substrate 114, the polishing member 112 may be separated from the substrate 114 by the lifting operation of the head 118.

The polishing member 112 may include a support for polishing the foreign material 116 on the substrate 114, and a polishing layer formed on the support.

The abrasive member 112 may be specifically, but not limited to, an abrasive tape. Here, the abrasive tape can be obtained by applying an abrasive paint composed of an abrasive, a binder polymer, a curing agent, a mixed solvent, and the like on a support, and then drying the abrasive tape to form an abrasive layer on the support.

As the surface roughness of the polishing layer is increased, the substrate 114 may be damaged. Therefore, the average particle diameter of the abrasive may be, for example, 0.1 to remove only the foreign matter 116 on the substrate 114 and not damage the quality of the substrate 114. The surface roughness of the polishing layer can be adjusted to within the range of µm to 10 µm. Here, the material of the abrasive may be, for example, at least one or more of alumina, industrial diamond, silicon carbide, iron oxide, chromium oxide, and the like, but is not limited thereto.

The head 118 contacts the polishing member 112 with the foreign material 116 on the substrate 114.

Specifically, the head 118 is installed to move in the vertical direction along the guide block (not shown). Here, the polishing member 112 may contact the foreign material 116 on the substrate 114 by the lowering operation of the head 118. In addition, the polishing member 112 may be separated from the substrate 114 by the lifting operation of the head 118.

The head 118 may have a cylindrical shape. This is to allow the polishing member 112 lowered by the head 118 to contact only the foreign material 116 on the substrate 114.

Each of the first and second main rollers 120 and 122 is provided at both sides with the head 118 interposed therebetween, and moves the polishing member 112.

Specifically, the first and second main rollers 120 and 122 move the polishing member 112 in contact with the foreign material 116 on the substrate 114 in the horizontal direction by the lowering operation of the head 118. This is to move the worn part of the polishing member 112 in the horizontal direction during the polishing process of the foreign material 116 on the substrate 114.

The first and second main rollers 120 and 122 may be driven by one motor not shown. This is for simultaneously rotating the first and second main rollers 120 and 122 in the same direction and speed.

The fixing member 124 prevents the polishing member 112 from leaving in position.

To this end, the fixing member 124 is installed adjacent to each of the first and second main rollers 120 and 122, and rotates in a direction opposite to the rotation direction of each of the first and second main rollers 120 and 122. First and second auxiliary rollers 126 and 128 may be included.

In this case, the polishing member 112 may be positioned between the first main roller 120 and the first auxiliary roller 126, and each of the second main roller 122 and the second auxiliary roller 128. have.

At this time, by moving the first auxiliary roller 126 to the first main roller 120 side, it is possible to prevent the polishing member 112 from leaving the correct position. Similarly, by moving the second auxiliary roller 128 to the second main roller 122 side, it is possible to prevent the polishing member 112 from being out of position. Here, since the polishing member 112 must be able to move in the horizontal direction by the rotational operation of the first and second main rollers 120 and 122, the first and second auxiliary rollers 126 and 128 are respectively the first and the second How much to move to each side of the second main roller (120, 122) can be determined in consideration of the above.

The cleaning member 130 cleans the substrate 114 when polishing the foreign material 116 on the substrate 114.

To this end, the cleaning member 130 may be installed on the guide member 132 connecting the first and second main rollers 120 and 122, but the location and number of the cleaning member 130 are limited. It doesn't work.

The cleaning member 130 may be an air knife that cleans the substrate 114 when the foreign material 116 is polished by spraying high pressure air toward the substrate 114, but is not limited thereto.

The stage 134 is installed to be movable by, for example, an LM guide (not shown), and the substrate 114 is seated on the stage 134. In this case, the substrate 114 mounted on the stage 134 may be fixed on the stage 134 by being vacuum-adsorbed to the stage 134 through a vacuum hole formed on the stage 134.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can realize that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. I can understand that.

Therefore, since the embodiments described above are provided to completely inform the scope of the invention to those skilled in the art, it should be understood that they are exemplary in all respects and not limited. The invention is only defined by the scope of the claims.

According to the present invention, the foreign matter on the substrate can be easily removed using the polishing member, thereby increasing the productivity of the flat panel display.

In addition, the first and second main rollers can be operated simultaneously with one motor, and the fixing member can be prevented from leaving the home position. As a result, the operator's mistake can be reduced.

Claims (6)

A polishing member for removing the foreign matter on the substrate by polishing the foreign matter on the substrate; A head for contacting the polishing member with a foreign material on the substrate; First and second main rollers respectively provided on both sides with the head interposed therebetween for moving the polishing member; And Fixing member for ensuring that the polishing member is not out of position Substrate polishing apparatus comprising a. The method of claim 1, wherein the fixing member, First and second auxiliary rollers installed adjacent to each of the first and second main rollers and rotating in a direction opposite to the rotation direction of each of the first and second main rollers. Substrate polishing apparatus comprising a. The method of claim 1, And said first and second main rollers are driven by one motor. The method of claim 1, The polishing member is a substrate polishing apparatus, characterized in that the polishing tape. The method of claim 1, Cleaning member for cleaning the substrate when the foreign material polishing on the substrate Substrate polishing apparatus further comprising. The method of claim 5, The said cleaning member is an air knife, The board | substrate grinding apparatus characterized by the above-mentioned.

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