JPH04239738A - Bonding equipment - Google Patents

Abstract

PURPOSE:To prevent the occurrence of defective bonding in inner lead bonding, simplify the maintenance work and improve the ratio of operation. CONSTITUTION:A tilt of a pallet 5 on a bonding stage 1 is measured by a laser displacement gauge 7, and the bonding operation of a bonding tool 2 is restricted when the degree of the tilt is judged to be so great that defective bonding may occur.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to bonding technology, and particularly to a technology that is effective when applied to inner lead bonding in the assembly process of semiconductor devices.

0002

2. Description of the Related Art For example, in the assembly process of semiconductor devices, TAB (Tape Automated Board) is used from the viewpoint of achieving high mass productivity through automatic assembly.
(nding) technology is widely used.

That is, finger-shaped leads are formed by adhering to the openings of a long carrier tape made of resin or the like.
The bumps of the pellets are bonded all at once to the inner ends of the leads (inner lead bonding), and in the mounting process, the pellets and leads are punched out of the carrier tape, and the outer ends of the leads (outer leads) are bonded as desired. It is mounted by bonding to a wiring board, etc.

[0004] Conventionally, regarding the inner lead bonding in TAB technology, for example, Kogyo Chosenkai Co., Ltd., published on January 25, 1990, written by Kenzo Hatada,
As described in "Introduction to TAB Technology" P177-P193, pellet positioning during bonding is performed in the X, Y directions and θ (
It was common to perform this on the (rotation) direction.

[0005]

[Problems to be Solved by the Invention] However, in the case of the above-mentioned prior art, since the position of the pellet is controlled only in the horizontal plane, various problems such as those described below due to the inclination of the pellet in the thickness direction cannot be prevented. There is a problem.

That is, in inner lead bonding, the pellets positioned on the bonding stage and the inner lead on the carrier tape side are overlapped, and the pellets are pressed together between a bonding tool and the bonding stage to perform bonding all at once. For this reason, if bonding is performed with the pellet tilted relative to the bonding tool due to foreign objects on the bonding stage, for example, the loads acting on individual bumps and leads of the pellet may be too large or too small, resulting in excessive loads. There are problems in that bonding failures such as damage to pellets and bumps and poor crimping due to insufficient load occur.

[0007] Furthermore, for the above-mentioned reasons, the bonding stage and the bonding tool are required to have a high level of parallelism, so the work of adjusting the parallelism when replacing the bonding tool requires a high degree of proficiency. The working time also becomes longer, which is one of the causes of a decline in the operating rate of the equipment.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a bonding technique that can prevent the occurrence of bonding defects.

Another object of the present invention is to provide a bonding technique that can improve operating efficiency by simplifying maintenance work.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[0011]

[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions will be as follows.
It is as follows.

That is, the bonding apparatus according to the present invention is a bonding apparatus that joins a pellet and a lead by sandwiching the pellet and the lead between the bonding stage and the bonding tool, and prior to the bonding operation, the bonding apparatus The apparatus is equipped with a detection means for non-contactly detecting the inclination of the pellet in the inclination, and determines whether or not the bonding operation can be performed depending on the magnitude of the inclination.

[0013] Furthermore, the bonding apparatus according to the present invention includes:
A bonding device that joins a pellet and a lead by pinching the same between a bonding stage and a bonding tool, and a detection means that non-contact detects the inclination of the pellet on the bonding stage prior to a bonding operation. , an alignment mechanism that adjusts the horizontality of at least one of the bonding stage and the bonding tool, and the bonding operation is performed by controlling the horizontality of the bonding stage and the bonding tool so as to cancel out the inclination of the pellet detected by the detection means. It was designed to do this.

[0014] Furthermore, the bonding apparatus according to the present invention includes:
Some devices are equipped with detection means consisting of a laser displacement meter that detects the inclination of the pellet based on changes in the optical path of the laser reflected light from the pellet.

[0015] Furthermore, the bonding apparatus according to the present invention includes:
It consists of a light emitting part and a light receiving part arranged to face each other with a pellet in between, and the pellet is It is equipped with a detection means for detecting the inclination.

[0016]

[Operation] According to the bonding apparatus of the present invention described above,
Since the presence or absence of an inclination of the pellet on the bonding stage is detected in advance to determine whether or not the bonding operation can be performed, it is possible to prevent bonding failures caused by bonding being performed with the pellet inclined relative to the bonding tool. It can be prevented.

Furthermore, according to the above-described bonding apparatus of the present invention, the inclination of the pellet on the bonding stage is detected in advance, and the horizontality of at least one of the bonding stage and the bonding tool is controlled so as to cancel the inclination. Bonding is performed with the pellet always parallel to the bonding tool, and it is possible to prevent bonding defects caused by pellet inclination.

[0018] Also, in the process of replacing the bonding tool, etc., by adjusting the parallelism between the bonding stage and the bonding tool by using an alignment mechanism and detection means provided on at least one side of the bonding stage and the bonding tool.
Maintenance and management work can be easily performed without requiring a high degree of skill or long hours, and the operating rate is improved.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A bonding apparatus which is an embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a side view schematically showing an example of the configuration of a bonding apparatus according to this embodiment.

The bonding apparatus of this embodiment includes a bonding stage 1 that can freely move parallelly and rotationally in a horizontal plane, and a bonding tool 2 that is arranged parallel to and opposite to the bonding stage 1.

The bonding tool 2 is driven in the vertical direction by a pressure cylinder 3, and the pressure cylinder 3 is configured to operate under the control of a bonding control section 4.

The bonding stage 1 is configured to reciprocate between a bonding position A directly below the bonding tool 2 and a pellet placement position B.
At this point, the pellet 5 is placed and positioned, and the pellet 5 is stably held by a vacuum suction mechanism (not shown) or the like.

A tape carrier 6 is disposed between the bonding stage 1 and the bonding tool 2 at the bonding position A so as to move at a desired pitch in a direction perpendicular to the plane of the drawing.

This tape carrier 6 has pellet mounting holes 6c formed at a desired pitch in the longitudinal center of a long carrier tape 6a made of, for example, resin, and surrounds each of the pellet mounting holes 6c. It is constructed by attaching a plurality of finger-shaped leads 6b, and the inner ends of the leads 6b protrude to a predetermined length inside the pellet mounting hole 6c. Further, holes 6d are provided at a predetermined pitch on both ends of the carrier tape 6a in the longitudinal direction.
is bored, and is adapted to engage with a sprocket (not shown) to perform feeding operation.

In this case, above the bonding stage 1 at the pellet placement position B, a plurality of optical sensors 7a are installed.
A laser displacement meter 7 consisting of an information processing section 7b and an information processing section 7b is arranged.

For example, as shown in FIGS. 2 and 3, the laser displacement meter 7 moves the bonding stage 1 based on the change in the optical path of the reflected light of the laser beam 7c emitted from the plurality of optical sensors 7a. The heights of the measurement positions 5a at the four corners of the pellet 5 placed on the bonding stage 1 are individually measured, and based on the difference in the measured values, it is determined whether the pellet 5 is caused by a foreign object 8 on the bonding stage 1, etc. This detects the presence or absence of an inclination in the height direction, as well as the direction and angle of inclination.

Further, the laser displacement meter 7 is connected to a bonding control section 4 that controls a pressure cylinder 3 that drives the bonding tool 2. Then, the bonding control unit 4 causes the pressurizing cylinder 3 to stop the bonding operation of the bonding tool 2, as necessary, based on information such as the presence or absence of inclination and the size of the pellet 5 obtained from the laser displacement meter 7. is programmed to.

Although not particularly shown, the bonding stage 1 and the bonding tool 2 are provided with a heating mechanism, which heats the inner ends of the pellet 5 and the leads 6b to a desired temperature during the bonding operation as described below. operation is possible.

An example of the operation of the bonding apparatus of this embodiment will be explained below.

First, the bonding stage 1 is moved to the pellet placement position B, and the pellet 5 conveyed from the outside by a pickup arm (not shown) is placed on it, and is positioned at a predetermined position by a positioning claw (not shown). Fix by vacuum suction, etc.

Next, the pellet 5 is measured by the laser displacement meter 7.
The presence or absence and magnitude of an inclination in the height direction are detected, and if the magnitude of the inclination is less than a predetermined value that does not result in bonding failure, the bonding stage 1 is moved to the bonding position A.

Then, by parallel or rotational movement of the bonding stage 1, bumps (not shown) of the pellet 5 are positioned so as to overlap the inner ends of the plurality of leads 6b of the tape carrier 6.

Thereafter, the pressure cylinder 3 is activated to lower the bonding tool 2, and the bonding tool 2 is heated at the desired heating temperature.
Pellet 5 and lead 6 between bonding stage 1
The inner end of b is pinched and crimped.

Next, after raising the bonding tool 2 to release the pinched state, the tape carrier 6 is advanced by a predetermined pitch, and the bonding stage 1 is moved to the pellet placement position B, and the operation of the above example is performed. repeat.

[0035] Furthermore, if it is determined that the inclination of the pellet 5 measured by the laser displacement meter 7 at the pellet placement position B exceeds the limit that would cause a bonding failure due to the presence of foreign matter 8, etc. In this case, the bonding control unit 4 suppresses the bonding operation by the bonding tool 2, and also issues an alarm to an external operator to urge them to take appropriate measures such as cleaning the bonding stage 1.

As described above, according to the bonding apparatus of this embodiment, the existence and degree of inclination in the height direction of the pellet 5 is measured in advance, and if the value of the inclination is determined to be such that bonding failure occurs, Since the bonding operation is stopped, it is possible to prevent bonding defects such as damage to the pellet 5 and leads 6b and insufficient crimping caused by performing bonding with the pellet 5 tilted in the height direction.

As a result, the yield in the inner lead bonding process in TAB technology is improved.

Next, referring to FIG. 4, a bonding apparatus according to another embodiment of the present invention will be described.

In the case of the bonding apparatus shown in FIG. 4, each of the bonding stage 1 and the bonding tool 2 is provided with an alignment mechanism 10 and an alignment mechanism that automatically adjust the horizontality of the bonding stage 1 and the bonding tool 2. 11 is provided, which is different from the case of FIG.

That is, the individual alignment mechanisms 10 and 11
is connected to a laser displacement meter 7, and based on information such as the magnitude and direction of the inclination of the pellet 5 obtained from the laser displacement meter 7, the bonding tool is adjusted so as to cancel out the inclination of the pellet 5 with respect to the bonding tool 2. 2 and the levelness of the bonding stage 1 are automatically controlled.

As a result, in the case of the bonding apparatus of this embodiment, the positional relationship between the bonding tool 2 and the pellet 5 can be adjusted without being affected by the presence or absence of the inclination of the pellet 5 due to foreign matter 8 on the bonding stage 1. The bonding operation can be performed with the two parts always kept in the optimal parallel state for bonding.

As a result, bonding failures such as damage to the pellet 5 and leads 6b and insufficient crimping, which are caused by bonding being performed with the pellet 5 tilted in the height direction with respect to the bonding tool 2, can be prevented. can do.

On the other hand, in the case of the bonding apparatus of this embodiment, it is possible to easily and accurately adjust the parallelism when replacing the bonding tool 2, etc., in the following manner. That is, after replacing the bonding tool 2 in response to a change in the type of pellet 5, while measuring the levelness of the bonding stage 1 with the laser displacement meter 7,
Control operations are performed by the alignment mechanisms 10 and 11 so that the bonding stage 1 is parallel to the bonding tool 2.

[0044] As a result, it is possible to easily and accurately adjust the parallelism between the bonding stage 1 and the bonding tool 2 without requiring a high level of skill or long hours of work, which simplifies maintenance work and improves the bonding process. It is possible to improve the operating rate of the device.

FIG. 5 is an explanatory diagram showing the main parts of a bonding apparatus according to still another embodiment of the present invention.

In the case of the embodiment shown in FIG. 5, a photocoupler 12 is used instead of the laser displacement meter 7 to detect the presence or absence and size of the tilt of the pellet 5.

That is, a light emitting section 12a that emits a laser beam 12c and a light receiving section 12b that detects this laser beam 12c are arranged opposite to each other at positions sandwiching the bonding stage 1. The optical path of the laser beam 12c is
The positions of the light emitting part 12a and the light receiving part 12b are adjusted so that they are parallel to the bonding stage 1 and are separated from each other by a distance slightly larger than the thickness of the pellet 5. Although not particularly shown, another pair of a light emitting section 12a and a light receiving section 12b is also arranged in a direction perpendicular to the paper surface of FIG.

As a result, when the pellet 5 placed on the bonding stage 1 is tilted by the foreign object 8 or the like, the laser beam 12c is blocked, and whether or not the laser beam 12c is detected by the light receiving section 12b is determined. The magnitude and direction of the inclination of the pellet 5 in the height direction can be determined based on the magnitude of the amount of detected light. Therefore, the same effects as in the case of FIG. 1 can be obtained also in the case of this embodiment.

FIG. 6 is a perspective view showing the main parts of a bonding apparatus according to still another embodiment of the present invention.

In the case of this embodiment, the illumination light source 13b emits oblique illumination light 13a onto the plane of the bonding stage 1, and the industrial television camera 13c is placed directly above the bonding stage 1 facing downward. A foreign object detection means 13 is provided.

When a foreign object 8 is present on the bonding stage 1, a shadow 8a of the foreign object 8 is created on the bonding stage 1 by the oblique illumination light 13a, and the presence or absence of this shadow 8a is detected by an industrial television. The presence or absence of the foreign object 8 is detected by detecting it with the camera 13c, and if it is determined that there is a foreign object, the bonding operation is stopped in advance. Therefore, in the case of this embodiment as well, FIG.
The same effect can be obtained as in the case of .

[0052] Although the invention made by the present inventor has been specifically explained based on examples, the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say.

For example, the position of the detecting means for detecting the inclination of the pellet is not limited to the pellet mounting position on the bonding stage, but may be at the bonding position.

Furthermore, the detection means is not limited to the laser displacement meter or photocoupler exemplified in each of the above-described embodiments, but may also be a displacement meter using ultrasonic waves or the like.

[0055]

[Effects of the Invention] Among the inventions disclosed in this application, the effects obtained by the typical inventions are briefly explained as follows.
It is as follows.

That is, according to the bonding apparatus of the present invention, since the presence or absence of the inclination of the pellet on the bonding stage is detected in advance to determine whether or not the bonding operation can be performed, the inclination of the pellet with respect to the bonding tool is determined. It is possible to prevent bonding defects from occurring due to bonding.

Furthermore, according to the above-described bonding apparatus of the present invention, the inclination of the pellet on the bonding stage is detected in advance, and the horizontality of at least one of the bonding stage and the bonding tool is controlled so as to cancel the inclination. Bonding is performed with the pellet always parallel to the bonding tool, and it is possible to prevent bonding defects caused by pellet inclination.

[0058] In addition, during work such as replacing the bonding tool, by adjusting the parallelism between the bonding stage and the bonding tool by using an alignment mechanism and a detection means provided on at least one side of the bonding stage and the bonding tool,
Maintenance and management work can be easily performed without requiring a high degree of skill or long hours, and the operating rate is improved.

[Brief explanation of the drawing]

FIG. 1 is a side view schematically showing an example of the configuration of a bonding apparatus that is an embodiment of the present invention.

FIG. 2 is a plan view schematically showing an example of the operation of a bonding apparatus that is an embodiment of the present invention.

FIG. 3 is a side view schematically showing an example of the operation of a bonding device that is an embodiment of the present invention.

FIG. 4 is a side view schematically showing an example of the configuration of a bonding apparatus according to another embodiment of the present invention.

FIG. 5 is a side view schematically showing an example of a main part of a bonding apparatus according to still another embodiment of the present invention.

FIG. 6 is a perspective view schematically showing an example of a main part of a bonding apparatus according to still another embodiment of the present invention.

[Explanation of symbols]

1 Bonding stage 2 Bonding tool 3 Pressure cylinder 4 Bonding control section 5 Pellets 5a Measurement position 6 Tape carrier 6a Carrier tape 6b lead 6c Pellet loading hole 6d　Feeding hole 7 Laser displacement meter 7a Optical sensor 7b Information processing section 7c Laser beam 8 Foreign matter 8a Shadow 10 Alignment mechanism 11 Alignment mechanism 12 Photocoupler 12a Light emitting part 12b Light receiving part 12c Laser beam 13 Foreign object detection means 13a Slanted illumination light 13b Illumination light source 13c Industrial TV camera A Bonding position B Pellet placement position

Claims (6)

[Claims] 1. A bonding device for joining a pellet and a lead by pinching the same between a bonding stage and a bonding tool, the method comprising: preventing the inclination of the pellet on the bonding stage prior to a bonding operation; A bonding apparatus comprising a detection means for detecting contact, and determining whether or not the bonding operation can be performed depending on the magnitude of the inclination. 2. A bonding device for joining a pellet and a lead by pinching the same between a bonding stage and a bonding tool, the method comprising: preventing the inclination of the pellet on the bonding stage prior to a bonding operation; a detection means for detecting contact;
a centering mechanism that adjusts the horizontality of at least one of the bonding stage and the bonding tool; A bonding apparatus characterized in that the bonding operation is performed by controlling horizontality. 3. The bonding device according to claim 1, wherein the detection means comprises a laser displacement meter that detects the inclination of the pellet based on a change in the optical path of laser reflected light from the pellet. Device. 4. The detection means includes photocouplers disposed to face each other with the pellet interposed therebetween, and detects an optical path of a laser beam parallel to the bonding stage from a light emitting section constituting the photocoupler to a light receiving section. Claim 1 or 2, characterized in that the inclination of the pellet is detected by detecting whether or not the pellet obstructs.
Bonding equipment as described. 5. A bonding device for bonding a pellet and a lead by sandwiching them between a bonding stage and a bonding tool, wherein, prior to placing the pellet on the bonding stage, the pellet is placed on the bonding stage. comprising a foreign object detection means for detecting the presence or absence of a foreign object, and depending on the presence or absence of the foreign object,
A bonding apparatus characterized by determining whether or not the bonding operation can be performed. 6. The foreign object detection means includes an illumination light source that irradiates illumination light that is inclined with respect to the plane of the bonding stage, and an industrial television camera disposed directly above the bonding stage, 6. The bonding apparatus according to claim 5, wherein the presence or absence of the foreign object is determined by detecting the shadow of the foreign object present on the stage.