JP2017103402A - Substrate transfer method, component mounting method, substrate transfer apparatus and component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer method, a component mounting method, a substrate transfer apparatus and a component mounting apparatus that can shorten the tact time.SOLUTION: A substrate is carried in at a working position, and a lower part receiving unit is upwardly moved to a lower part receiving position with respect to the lower surface of the transferred substrate to receive the lower surface of the substrate. The lower part receiving unit is downwardly moved from the lower part receiving position to a standby position (first position) which is set so that a predetermined margin is provided for the lower surface of the substrate or an interfering object (such as a part) provided to the lower surface, and the substrate is carried out. At the time of carry-out of a predetermined substrate which is the timing of a correction operation, the lower part receiving unit is downwardly moved to a lower limit position (second position) below the standby position (ST11) to obtain a correction value related to the downward moving operation of the lower part receiving unit (ST13). When the substrate is carried out, the downward moving operation of downwardly moving the lower part receiving unit to the standby position is corrected based on the acquired correction value.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a substrate transport method using a substrate transport device that transports a substrate by lowering a receiving unit for receiving the substrate, a component mounting method for mounting components on a substrate transported by the substrate transport device, and the substrate The present invention relates to a transfer device and a component mounting apparatus including the board transfer device.

  A component mounting apparatus for mounting a component on a substrate includes a substrate transfer device having a transfer conveyor for transferring the substrate. In this board transfer device, a board holding system is widely used in which a plurality of receiving pins are held in contact with the lower surface of the board at a work position in the transfer path for transferring the board and for component mounting. In this method, the mounting of the component is executed in a state where the receiving pin is in contact with the lower surface of the substrate, and the conveyance of the substrate is executed in a state where the receiving pin is lowered so as not to interfere with the component on the lower surface of the substrate. At this time, in order to shorten the tact time, when unloading the substrate, the lower receiving pin is not lowered to the lower limit of the apparatus, but is lowered to a position where it does not interfere with the components on the lower surface of the substrate, and the next substrate is loaded. The lower receiving pin is raised from this standby position (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 7-7299

  Incidentally, an air cylinder is used as means for driving the lower receiving pin up and down. If the pressure of the air supplied to the air cylinder varies, the lowering speed of the receiving pin when the substrate is carried out may fluctuate and the stop position may vary. For this reason, in the prior art including Patent Document 1, in consideration of the variation in air pressure, the standby position of the lower pin is set at a position where a margin is provided so that a margin where the component on the lower surface of the board does not interfere with the lower pin is provided. There is a problem that the effect of shortening the tact time is suppressed due to the margin to be added.

  Accordingly, an object of the present invention is to provide a substrate carrying method, a component mounting method, a substrate carrying device, and a component mounting device that can shorten the tact time.

  The substrate transport method of the present invention includes a step of carrying a substrate into a working position, a step of raising a lower receiving unit to a lower receiving position with respect to the lower surface of the loaded substrate, and receiving the lower receiving unit. A step of lowering the substrate from the receiving position to a first position set so that a predetermined margin is provided for an interference provided on the lower surface or the lower surface of the substrate, and unloading the substrate. Acquired in the step of unloading the substrate by lowering the lower receiving unit to a second position lower than the first position to obtain a correction value relating to the lowering operation of the lower receiving unit. Based on the correction value, the lowering operation of lowering the lower receiving unit to the first position is corrected.

  The component mounting method of the present invention includes a step of carrying a board into a mounting work position, a step of raising a lower receiving unit to a lower receiving position with respect to the lower surface of the carried board, and a lowering. Mounting the component on the board, and lowering the lower receiving unit from the lower receiving position to a first position that is set to have a predetermined margin with respect to the interference provided on the lower surface or the lower surface of the substrate. And unloading the substrate on which the component is mounted, and when the predetermined substrate is unloaded, the lower receiving unit is lowered to a second position below the first position. In the step of acquiring a correction value related to the lowering operation and unloading the substrate, the operation of lowering the receiving unit to the first position is corrected based on the acquired correction value.

  The substrate transport apparatus according to the present invention includes a substrate transport unit that transports a substrate, a lower receiving unit that receives a substrate that has been transported from below to a work position where work on the substrate is performed by the substrate transport unit, and the lower unit When the receiving unit is driven up and down to raise the lower receiving unit to the lower receiving position with respect to the lower surface of the loaded board, the lower receiving unit is moved from the lower receiving position to carry out the lower receiving. A lower receiving unit raising / lowering drive unit for lowering to a first position set so as to leave a predetermined margin with respect to an interference provided on the lower surface or the lower surface of the substrate, and the lower receiving unit at the first position A correction value acquisition unit that acquires a correction value related to the lowering operation of the lowering unit elevating drive unit for stopping, and when the predetermined substrate is unloaded, the lower elevating drive unit When lowering the lower receiving unit to a second position below the first position, the correction value acquiring unit acquires the correction value relating to the lowering operation of the lower receiving unit, and unloads the substrate. In addition, the lower receiving unit raising / lowering driving unit corrects the lowering operation based on the acquired correction value and lowers the lower receiving unit to the first position.

  The component mounting apparatus according to the present invention includes a substrate transport unit that transports a substrate, a lower receiving unit that receives a substrate that has been loaded into a mounting work position on which a component is mounted by the substrate transport unit, from below, and the lower receiving unit. Is moved up and down to raise the lower receiving unit to the lower receiving position with respect to the lower surface of the loaded board, and when the board for which the component mounting operation is completed is carried out, the lower receiving unit is moved to the lower position. A lower unit driving unit for lowering the lower receiving unit from a lower receiving position to a first position set to have a predetermined margin with respect to an interference provided on the lower surface or the lower surface of the substrate; and A correction value acquisition unit that acquires a correction value related to a lowering operation of the lowering unit elevating drive unit for stopping at the position 1, and when the predetermined substrate is unloaded, the lower receiving unit The descending drive unit lowers the lower receiving unit to a second position below the first position, and the correction value acquisition unit acquires the correction value relating to the lowering operation of the lower receiving unit, and mounts a component. When unloading the substrate on which the work has been completed, the lower receiving unit lifting and lowering drive unit corrects the lowering operation based on the acquired correction value and lowers the lower receiving unit to the first position.

  According to the present invention, the tact time can be shortened.

The top view of the component mounting apparatus of one embodiment of this invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Side view (b) Top view of a board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is provided. Explanatory drawing of the position sensor part of the board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is provided (A) (b) Explanatory drawing of the position sensor part in the state in which the receiving unit of the board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is provided is in a receiving position. (A) (b) Explanatory drawing of the position sensor part of the state which has the base unit of the board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is in a lower limit position Explanatory drawing of the state which has the receiving unit of the board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is in a standby position The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Flow chart of component mounting work in component mounting apparatus of one embodiment of the present invention The flowchart of the correction | amendment operation | movement in the board | substrate conveyance apparatus with which the component mounting apparatus of one embodiment of this invention is provided Explanatory drawing of the stop position of the receiving pin unit at the time of board | substrate carrying-out of the board | substrate conveying apparatus with which the component mounting apparatus of one embodiment of this invention is equipped

  Next, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting components on a board. In the following, the substrate transport direction (left and right direction in FIG. 1) is the X direction, the direction orthogonal to the X direction in the horizontal plane (up and down direction in FIG. 1) is the Y direction, and the height direction orthogonal to the horizontal plane (FIG. 3) is defined as the Z direction.

  In FIG. 1, a substrate transport mechanism 2 (substrate transport device) including a pair of transport belts extending in the X direction is disposed at the center of the base 1a. The board transport mechanism 2 transports the board 3 carried from the upstream side, and positions and holds the board 3 at a mounting work position 2a that is a work position set for executing the component mounting work. Component supply units 4 are arranged on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are arranged in parallel in the component supply unit 4. The tape feeder 5 feeds a component to a component suction position by a mounting head 8 described below by pitch-feeding a carrier tape in which a pocket containing the component is formed.

  A Y-axis beam 6 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. Similarly, two X-axis beams 7 each having a linear drive mechanism are coupled to the Y-axis beam 6 so as to be movable in the Y direction. A mounting head 8 is mounted on each of the two X-axis beams 7 so as to be movable in the X direction. The mounting head 8 is a multiple-type head having a plurality of holding heads, and suction nozzles (not shown) capable of individually moving up and down by sucking and holding components are mounted on the lower ends of the respective holding heads. .

  By driving the Y-axis beam 6 and the X-axis beam 7, the mounting head 8 moves in the X direction and the Y direction. As a result, the two mounting heads 8 take out components from the component suction positions of the tape feeders 5 of the corresponding component supply units 4 by the suction nozzles, and place the components on the substrate 3 positioned at the mounting work position 2a of the substrate transport mechanism 2. Loading. The Y-axis beam 6 and the X-axis beam 7 constitute a head moving mechanism 9 that moves and mounts the component on the substrate 3 by moving the mounting head 8 that holds the component.

  A component recognition camera 10 is disposed between the component supply unit 4 and the substrate transport mechanism 2. When the mounting head 8 that has picked up a component from the component supply unit 4 moves above the component recognition camera 10, the component recognition camera 10 captures and recognizes the component held by the mounting head 8. Mounted on the mounting head 8 are substrate recognition cameras 11 that are located on the lower surface side of the X-axis beam 7 and move together with the mounting head 8. As the mounting head 8 moves, the substrate recognition camera 11 moves above the substrate 3 positioned at the mounting operation position 2a of the substrate transport mechanism 2, and images and recognizes the substrate 3. In the component mounting operation on the board 3 by the mounting head 8, the mounting position correction is performed in consideration of the component recognition result by the component recognition camera 10 and the board recognition result by the board recognition camera 11.

  Next, the configuration of the substrate transport mechanism 2 (substrate transport device) will be described with reference to FIGS. The substrate transport mechanism 2 includes a substrate transport unit 12, a substrate holding unit 13, and a position sensor unit 14. The board | substrate conveyance part 12 is arrange | positioned above the base 1a, and has the function to convey the board | substrate 3 to a X direction. The substrate transport unit 12 includes a pair of transport belts 16 arranged in the X direction inside a pair of plate-like members 15 extending in the X direction.

  The conveyor belt 16 is tuned to a pulley 17 disposed at one end of the plate-like member 15 and a drive pulley 18a driven by a conveyor motor 18 disposed at the other end. The transport belt 16 moves horizontally along the plate member 15 by synchronously driving the two transport motors 18 and transports the substrate 3 placed on the upper surface in the X direction.

  In FIG. 2A, a presser plate 19 that protrudes above the conveyor belt 16 is installed at the upper end of the plate-like member 15. The distance between the lower surface of the pressing plate 19 and the upper surface of the transport belt 16 is larger than the thickness of the substrate 3 transported by the transport belt 16. The pressing plate 19 has a function of holding the substrate 3 at the mounting work position 2a by pressing both edges of the substrate 3 lifted from the conveying belt 16 by the substrate holding unit 13 described later from above with the lower surface of the pressing plate 19. (See also FIG. 4 (a)).

  2A, the substrate holding unit 13 includes a lower receiving unit U and a lower receiving unit lifting / lowering driving unit 22 that lifts and lowers the lower receiving unit U. The lower receiving unit U includes a lower receiving pin 20 that lowers the substrate 3 from the lower surface side, and a lower receiving pin holding member 21 that holds a plurality of lower receiving pins 20 on the upper surface. The lower receiving pin 20 is disposed on the lower receiving pin holding member 21 so as not to contact the mounted component P when the substrate 3 on which the component P is mounted on the lower surface is held from below. The lower receiving unit raising / lowering drive unit 22 includes an air cylinder 23 having a piston rod 23a, and a lower receiving pin holding member 21 (lower receiving unit U) is attached to the tip of the piston rod 23a.

  The piston rod 23a is raised, lowered and stopped by switching the air supplied to the air cylinder 23 or exhausted from the air cylinder 23 by the electromagnetic valve 24 (see FIG. 7). That is, the air cylinder 23 controls the electromagnetic valve 24 to raise, lower, and stop the lower unit U (arrow A in FIG. 2A). The moving distance that the receiving unit U moves up and down is controlled by the air supply time or the exhaust time. For example, the movement distance by which the lower receiving unit U is lowered becomes longer when the lowering time TD is controlled to be longer, and the lower receiving unit U can be lowered to a lower position.

  In FIG. 2A, the position sensor unit 14 is disposed on the side of the lower unit lifting / lowering drive unit 22. The position sensor unit 14 has a function of detecting the receiving unit U located at the upper or lower height position.

  Next, a detailed configuration and function of the position sensor unit 14 will be described with reference to FIGS. In FIG. 3, the position sensor unit 14 includes an upper limit detection sensor 25, a lower limit detection sensor 26, and a light shielding dog 27. The upper limit detection sensor 25 and the lower limit detection sensor 26 are transmissive optical sensors each including a light emitting element that emits light and a light receiving element that receives irradiation light.

  The upper limit detection sensor 25 and the lower limit detection sensor 26 have a U shape having two arms extending from the body. In the upper limit detection sensor 25 and the lower limit detection sensor 26, the light emitting element is disposed on one arm portion, and the light receiving element is disposed to face the other arm portion, and a detection gap 25b and a gap between the two arm portions are arranged. A detection gap 26b is formed. The path of the irradiation light from the light emitting element to the light receiving element in the detection gap 25b and the detection gap 26b is a detection position 25c and a detection position 26c for detecting the presence or absence of the light shielding dog 27.

  In FIG. 3, the upper limit detection sensor 25 and the lower limit detection sensor 26 are respectively disposed at predetermined positions by a sensor fixing member 25a and a sensor fixing member 26a provided on the upper surface of the base 1a. The upper limit detection sensor 25 and the lower limit detection sensor 26 are arranged on the same line extending in the X direction so that the U-shaped opening of the upper limit detection sensor 25 and the U-shaped opening of the lower limit detection sensor 26 face each other. . Further, the lower limit detection sensor 26 is disposed at a height position below the upper limit detection sensor 25.

  In FIG. 3, the light shielding dog 27 has a flat plate shape and is attached to the side surface of the lower receiving pin holding member 21 (lower receiving unit U) so as to extend downward in parallel to the XZ plane. On the two side surfaces of the light shielding dog 27 in the X direction, an upper limit detection dog 27a extending outward is formed at the lower portion of one side surface, and a lower limit detection dog 27b extending outward at the opposite side is formed at the upper portion of the other side surface. Is formed. The upper limit detection dog 27a and the lower limit detection dog 27b move up and down integrally with the lower receiving unit U (arrow B), and enter the detection gap 25b of the upper limit detection sensor 25 and the detection gap 26b of the lower limit detection sensor 26, respectively.

  When the upper limit detection dog 27a rises together with the lower receiving unit U and the upper end 27c of the upper limit detection dog 27a enters the detection position 25c of the upper limit detection sensor 25, the irradiation light received by the light receiving element is blocked by the upper limit detection dog 27a. The When the irradiation light is shielded, the upper limit detection signal 25 is output by the upper limit detection sensor 25. When the lower limit detection dog 27b is lowered together with the lower receiving unit U and the lower end 27d of the lower limit detection dog 27b enters the detection position 26c of the lower limit detection sensor 26, the lower limit detection dog 27b blocks the irradiation light received by the light receiving element. The When the irradiation light is shielded, the lower limit detection sensor 26 outputs a lower limit detection signal SB.

  FIGS. 4A and 4B show a state in which the receiving unit U is raised to the upper limit position HU that is the rising limit. 4A is a side view of the substrate transport mechanism 2 viewed from the X direction, and FIG. 4B is a side view of the vicinity of the position sensor unit 14 viewed from the Y direction. In FIG. 4A, the substrate 3 carried into the mounting work position 2a by the conveyor belt 16 is lifted by receiving the lower surface 3a by the lower receiving pins 20 of the lower receiving unit U and lifting both the upper surfaces of the substrate 3 together. The edge is held in a state of being pressed from above by the lower surface of the presser plate 19. The component mounting apparatus 1 performs a component mounting operation for mounting the component P on the substrate 3 in a state where the substrate 3 is held by the receiving unit U.

  That is, the lower receiving unit U receives the board 3 carried into the mounting work position 2a on which the component P is mounted by the board transfer unit 12 from below. The upper limit position HU that is the upper limit of the lower receiving unit U is a lower receiving position HH that is a height position where the lower receiving unit U holds the substrate 3 as a lower receiving position. In the state in which the substrate 3 is held by the lower end, the upper limit detection dog 27a enters the detection position 25c of the detection gap 25b of the upper limit detection sensor 25 and shields the incident light to the light receiving element. A detection signal SU is output. That is, the upper limit detection dog 27a and the upper limit detection sensor 25 serve as a first position sensor that detects that the lower receiving unit U is at the lower receiving position HH.

  FIGS. 5A and 5B show a state where the receiving unit U is lowered to the lower limit position HB which is the lowering limit. 5A is a side view of the substrate transport mechanism 2 viewed from the X direction, and FIG. 5B is a side view of the vicinity of the position sensor unit 14 viewed from the Y direction. In FIG. 5A, a plurality of components P are mounted on the lower surface 3 a of the substrate 3. In a state where the lower receiving unit U is at the lower limit position HB, the upper surface of the component P * having the maximum component height (most protruded downward) mounted on the upper surface 20a of the lower receiving pin 20 and the lower surface 3a of the substrate 3. There is a margin between Pa * (the surface below the component P * in the state of being loaded into the mounting work position 2a) where the receiving pin 20 and the component P * do not interfere with each other.

  In a state where the lower receiving unit U is at the lower limit position HB, the lower limit detection dog 27b enters the detection position 26c of the detection gap 26b of the lower limit detection sensor 26 and shields the incident light to the light receiving element. Is outputting a lower limit detection signal SB. That is, the lower limit detection dog 27b and the lower limit detection sensor 26 serve as a second position sensor that detects that the receiving unit U is at the lower limit position HB (second position).

  FIG. 6 shows a state where the lower receiving unit U is stopped at a standby position HW located between the upper limit position HU (lower receiving position HH) and the lower limit position HB. The standby position HW is a position where the receiving unit U is lowered to stand by when the board 3 on which the component mounting operation has been completed is carried out of the board transfer mechanism 2. The upper surface 20a of the receiving pin 20 waiting at the standby position HW is the upper surface Pa * (mounting operation) of the component P * having the maximum component height H1 among the plurality of components P mounted on the lower surface 3a of the substrate 3. A margin H2 that does not interfere with the surface of the part P * in the state of being carried into the position 2a is vacant.

  That is, the standby position HW is a first position in which the receiving unit U is set to have a predetermined margin H2 with respect to an interference such as the lower surface 3a of the substrate 3 or a component P provided on the lower surface 3a. At the standby position HW, neither the upper limit detection signal SU from the upper limit detection sensor 25 nor the lower limit detection signal SB from the lower limit detection sensor 26 is output. Therefore, the control to stop the lower receiving unit U at the standby position HW is the length of the lowering time TD for lowering the lower receiving unit U from the lower receiving position HH or the rising time TU for raising the lower receiving unit U from the lower limit position HB. It is done by controlling.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 30 is an overall control device of the component mounting apparatus 1, and the control unit 30 executes a processing program stored in the storage unit 31 to execute the substrate transport mechanism 2, the component supply unit 4, the mounting head 8, and the head moving mechanism 9. The respective units of the display unit 32 are controlled. A component recognition camera 10 and a board recognition camera 11 are connected to the control unit 30. A transport motor 18, a solenoid valve 24, an upper limit detection sensor 25, and a lower limit detection sensor 26 are connected to the substrate transport mechanism 2. The display unit 32 is a liquid crystal display that displays various types of information.

  In the storage unit 31, in addition to various data used for component mounting work such as mounting data 31a, control of the substrate transport mechanism 2 (substrate transport device) such as standby position data 31b, measurement time data 31c, correction value data 31d, and the like. Various types of data used in the storage are stored. The mounting data 31a is data such as the component type, component height H1, and mounting position of the component P to be mounted, and is stored for each board type to be produced. The standby position data 31b is data including a standby position HW that is a height position where the receiving unit U is lowered and waits when the board 3 is loaded and unloaded. The standby position HW is set in consideration of the component height H1 of the component P mounted on the lower surface 3a of the substrate 3 received by the receiving unit U for each substrate type.

  In FIG. 7, the control unit 30 includes a mounting control unit 30a, a conveyance control unit 30b, a correction operation control unit 30c, a time measurement unit 30d, and a correction value acquisition unit 30e as internal processing functions. The mounting control unit 30 a controls the component supply unit 4, the mounting head 8, and the head moving mechanism 9 to control the components supply unit 4 with respect to the substrate 3 positioned and held at the mounting work position 2 a by the substrate transport mechanism 2. The component mounting operation of taking out the component P from the container and transferring and mounting it is executed. The mounting control unit 30a corrects the pick-up position and mounting position of the component P in consideration of the imaging results of the component recognition camera 10 and the board recognition camera 11 during component mounting work.

  The conveyance control unit 30b controls the substrate conveyance mechanism 2 (substrate conveyance device) to carry in, hold, and carry out the substrate 3 to the mounting work position 2a that is the work position. That is, the conveyance control unit 30b controls the conveyance motor 18 to carry the substrate 3 into the mounting work position 2a. Further, the conveyance control unit 30b controls the electromagnetic valve 24 to drive the air cylinder 23 included in the lower unit driving unit 22 to raise the lower unit U. Next, when receiving the upper limit detection signal SU from the upper limit detection sensor 25 at the lower receiving position HH, the transport control unit 30b stops the lower receiving unit U. Thus, the substrate 3 is held at the mounting work position 2a.

  Further, the conveyance control unit 30b corrects the descent time TD based on a correction value TC, which will be described later, and controls the solenoid valve 24 to drive the air cylinder 23 included in the lower unit elevating drive unit 22 for the corrected descent time TD. The lower receiving unit U is lowered to the standby position HW. Next, the conveyance control unit 30b controls the conveyance motor 18 to carry out the substrate 3 from the mounting work position 2a.

  In FIG. 7, the correction operation control unit 30 c performs overall control of the correction operation C for acquiring the correction value TC for correcting the descent time TD for lowering the lower receiving unit U from the lower receiving position HH to the standby position HW. That is, the correction operation control unit 30c determines whether or not it is the timing of the correction operation C when the substrate 3 is unloaded. Further, the correction operation control unit 30c controls the electromagnetic valve 24 in the correction operation C to drive the air cylinder 23 included in the lower unit lifting / lowering drive unit 22 to lower the lower receiving unit U at the lower receiving position HH. Next, when receiving the lower limit detection signal SB from the lower limit detection sensor 26 at the lower limit position HB, the correction operation control unit 30c stops the lower receiving unit U.

  The time measuring unit 30d receives signals from the upper limit detection sensor 25 and the lower limit detection sensor 26 in the correction operation C, and the lower unit U descends from the lower support position HH (upper limit position HU) to the lower limit position HB. The required measurement time TM is measured. That is, the time measuring unit 30d determines that the lower limit detection signal SB is turned on when the lower receiving unit U reaches the lower limit position HB after the lower receiving unit U is lowered from the lower receiving position HH and the upper limit detection signal SU is turned off. The time until is measured as a measurement time TM. In this way, the time measuring unit 30d measures the measurement time TM during which the lower receiving unit U descends from the lower receiving position HH to the lower limit position HB (second position). The measured measurement time TM is stored in the storage unit 31 as measurement time data 31c.

  In FIG. 7, the correction value acquisition unit 30 e calculates the measurement time TM measured by the time measurement unit 30 d in the correction operation C, and sets the descent time TD for lowering the receiving unit U from the lower receiving position HH to the standby position HW. A correction value TC for correction is acquired. For example, when the measurement time TM is shorter than a predetermined time, the correction value acquisition unit 30e determines that the lowering speed of the lower unit U driven by the air cylinder 23 included in the lower unit lifting / lowering driving unit 22 is faster than the predetermined time. The correction value TC is calculated so as to shorten the time TD.

  Further, when the measurement time TM is longer than the predetermined time, the correction value acquisition unit 30e determines that the lowering speed of the lower unit U driven by the air cylinder 23 included in the lower unit lifting / lowering driving unit 22 is lower than the predetermined time, The correction value TC is calculated so as to lengthen the falling time TD. That is, the correction value acquisition unit 30e acquires the correction value TC related to the lowering operation of the lower unit driving unit 22 for stopping the lower unit U at the standby position HW (first position). The acquired correction value TC is stored in the storage unit 31 as correction value data 31d. Note that the type of the physical value of the correction value TC may be any type as long as the conveyance control unit 30b is a basis for correcting the descent time TD, and may be time or speed, for example.

  Next, component mounting work (component mounting method) in the component mounting apparatus 1 will be described in accordance with the flow of FIGS. In FIG. 8, first, the conveyance control unit 30b controls the conveyance motor 18 to carry the substrate 3 into the mounting work position 2a (ST1: substrate loading step). Note that when the board 3 is carried in, the receiving unit U stands by at a standby position HW (lower limit position HB immediately after the correction operation C).

  Next, the transfer control unit 30b controls the electromagnetic valve 24 to raise the receiving unit U to the receiving position HH by the air cylinder 23 provided in the receiving unit lifting / lowering driving unit 22 to receive the substrate 3 (ST2: substrate). (Underlaying step) (see FIG. 4A). That is, the substrate 3 is received by raising the lower receiving unit U to the lower receiving position HH with respect to the lower surface 3a of the substrate 3 carried into the mounting work position 2a. Next, the mounting control unit 30a mounts the component P on the received substrate 3 (ST3: component mounting step). Next, the correction operation control unit 30c determines whether or not it is the timing of the correction operation C (ST4: determination step).

  If it is determined in the determination step (ST4) that it is not the timing of the correction operation C (No), the transport control unit 30b controls the solenoid valve 24 by correcting the descent time TD based on the stored correction value TC. The lower receiving unit U is lowered to the standby position HW by the air cylinder 23 provided in the lower receiving unit raising / lowering drive unit 22 (ST5: first lowering step) (see FIG. 6). Next, the conveyance control unit 30b controls the conveyance motor 18 to carry out the board 3 on which the component P is mounted from the mounting work position 2a (ST6: board carry-out process).

  That is, in the first lowering step (ST5) and the substrate unloading step (ST6), a predetermined margin H2 is provided for the interference unit provided on the lower surface 3a or the lower surface 3a of the substrate 3 from the lower receiving position HH. This is a process of lowering to a standby position HW (first position) set so as to be free and carrying out the board 3 on which the component P is mounted. In addition, the lower unit driving unit 22 drives the lower unit U up and down to raise the lower unit U to the lower receiving position HH with respect to the lower surface 3a of the loaded board 3 to mount the component. In unloading the substrate 3 that has been completed, the lower receiving unit U is lowered from the lower receiving position HH to the standby position HW.

  When it is determined in the determination step (ST4) that the timing of the correction operation C is determined (Yes), the correction operation control unit 30c executes the correction operation C for obtaining the correction value TC (ST7: correction operation step). Next, details of the correction operation step (ST7) will be described with reference to the flow of FIG. First, the correction operation control unit 30c lowers the lower receiving unit U from the lower receiving position HH to the lower limit position HB (second position) (ST11: second lowering step) (see FIG. 5A). At this time, the time measuring unit 30d measures the measurement time TM until the lower receiving unit U descends from the lower receiving position HH and reaches the lower limit position HB, and stores it as measured time data 31c (ST12: time measuring step). ).

  Next, the correction value acquisition unit 30e calculates the measured measurement time TM, and acquires a correction value TC for correcting the descent time TD for lowering the receiving unit U to the standby position HW when the board 3 is unloaded ( ST13: Correction value acquisition step). Next, the correction value acquisition unit 30e updates the stored correction value data 31d to the acquired correction value TC (ST14: correction value update process).

  That is, at the timing of the correction operation C (when the predetermined substrate 3 is unloaded), the lower receiving unit U is lowered to the lower limit position HB (second position) below the standby position HW (first position). A correction value TC relating to the descending operation of the receiving unit U is acquired. When the correction value TC is acquired, the measurement time TM when the receiving unit U descends from the receiving position HH to the lower limit position HB (second position) is measured, and the correction value is based on the measured measurement time TM. Get TC.

  When the correction value update process (ST14) is completed, the correction operation process (ST7) is completed and the process proceeds to the substrate unloading process (ST6). With the completion of the board unloading process (ST6), the component mounting work for one board 3 is completed, and the component mounting apparatus 1 starts the board loading process (ST1) for the board 3 to be subjected to the next component mounting work. In the subsequent component mounting work, the first descending step (ST5) in which the descending time TD is corrected based on the latest correction value TC updated in the correcting operation step (ST7) is performed. That is, in the step of unloading the substrate 3, the transfer control unit 30b corrects the operation of lowering the receiving unit U to the standby position HW (first position) based on the acquired correction value TC.

  Note that the substrate unloading process (ST6) does not need to wait until the correction operation process (ST7) is completed. For example, in the second descending process (ST11), the receiving unit U is lowered below the standby position HW. The substrate unloading step (ST6) may be started from the time when it is done. Thereby, the time required for the correction operation C can be shortened. Also, the lower receiving unit U that has been lowered to the lower limit position HB in the second lowering step (ST11) until the board carrying-in step (ST1) of the board 3 to be subjected to the next component mounting operation is completed to the standby position HW. You may raise and wait. As a result, the time required for the substrate receiving step (ST2) of the next component mounting operation after the correction operation C can be shortened.

  Next, with reference to FIG. 10, the technical significance and effect of the correction operation C executed when the predetermined substrate 3 is carried out will be described. FIG. 10 shows the mounting board to be produced as a result of the change over time in the height position (vertical axis) at which the receiving unit U, which is controlled with the standby position HW as the stop target in the first descending step (ST5), is actually stopped. This is schematically shown by the number of sheets produced (horizontal axis).

  The pressure of the air that is the driving source of the air cylinder 23 provided in the lower unit driving unit 22 for lowering the lower unit U is the operating status of the compressor that supplies the air, and other component mounting that shares the air source Sequential fluctuations occur depending on the operating status of the apparatus 1. When the pressure of the air supplied to the air cylinder 23 fluctuates, the lowering speed at which the air cylinder 23 lowers the receiving unit U fluctuates. On the other hand, in the component mounting apparatus 1, the control of lowering the lower receiving unit U from the lower receiving position HH and stopping at the standby position HW is controlled by the lowering time TD that is the driving time of the air cylinder 23 for lowering the lower receiving unit U. doing.

  Therefore, in the simple control in which the descent time TD is fixed, the stop position of the lower receiving unit U varies from the target standby position HW due to fluctuations in the pressure of the air supplied to the air cylinder 23. Since the upper surface 20a of the lower receiving pin 20 may interfere with the component P on the lower surface 3a of the substrate 3 when the lower receiving unit U is largely displaced upward from the target standby position HW, the allowable maximum standby for each substrate type. A position HWM is determined. Therefore, even if the stop position of the lower receiving unit U is shifted upward, the target standby position HW is determined for each substrate type so that the margin H2 is not increased above the allowable maximum standby position HWM.

  In FIG. 10, in the case of control in which the descent time TD without the correction operation C indicated by the broken line is fixed, the stop position of the receiving unit U varies greatly due to long-term fluctuations in the pressure of the air supplied to the air cylinder 23. Therefore, when there is no correction operation C, it is necessary to set the target standby position HW to the target standby position HW1 that is greatly shifted downward. On the other hand, in the case of control in which the correction operation C is periodically performed as indicated by the solid line to correct the descent time TD, fluctuations in the stop position of the receiving unit U can be suppressed. Therefore, the target standby position HW can be set to the target standby position HW2 shifted upward from the target standby position HW1.

  In the example of FIG. 10, the correction operation C (1) to the correction operation C (4) are periodically executed to update the correction value TC, and the stop position is corrected to the target standby position HW2 at each update. Yes. The higher the target standby position HW2 and the closer to the lower receiving position HH, the shorter the lowering distance of the lower receiving unit U and the lowering time TD can be shortened. In other words, the correction operation C is periodically executed to correct the descent time TD, thereby shortening the carry-out time of the board 3 and shortening the tact time of the component mounting work (working time of the mounting board per sheet). be able to.

  The timing of the correction operation C (interval of the correction operation C) is determined based on experiments and experience. In addition, the timing of the correction operation C does not need to be fixed at a fixed interval. For example, the interval is shortened immediately after the setup change in which the board type of the mounting board to be produced is changed, and the elapsed time after the setup change (the number of mounted board productions). ), The execution interval may be widened. Further, the correction operation C may be appropriately executed at a timing at which the pressure of the supplied air is likely to fluctuate, such as a timing at which the operation status of the component mounting apparatus 1 sharing the air supply source is changed.

  As described above, the component mounting apparatus 1 according to the present embodiment includes the substrate transport unit 12 that transports the substrate 3 and the substrate 3 that is transported to the mounting work position 2a on which the component P is mounted by the substrate transport unit 12. A lower receiving unit U (lower receiving pin 20 and lower receiving pin holding member 22) receiving from below, a lower receiving unit raising / lowering driving unit 22 for raising and lowering the lower receiving unit U, and a lower receiving unit U at a standby position HW ( And a correction value acquisition unit 30e for acquiring a correction value TC related to the lowering operation of the receiving unit elevating drive unit 22 for stopping at the first position. The lower receiving unit raising / lowering drive unit 22 raises the lower receiving unit U to the lower receiving position HH with respect to the lower surface 3a of the substrate 3 that has been loaded.

  In addition, when unloading the board 3 on which the component mounting operation has been completed, the lower receiving unit lifting / lowering drive unit 22 moves the lower receiving unit U from the lower receiving position HH to the lower surface 3a or the lower surface 3a of the substrate 3 (part P Etc.) is lowered to a standby position HW which is set so that a predetermined margin H2 is vacant. Then, at the timing of the correction operation C (when a predetermined substrate is unloaded), the lower receiving unit raising / lowering drive unit 22 lowers the lower receiving unit U to the lower limit position HB (second position) below the standby position HW to perform correction. The value acquisition unit 30e acquires a correction value TC related to the descending operation of the receiving unit U. Then, when carrying out the board 3 on which the component mounting work has been completed, the lowering unit elevating drive unit 22 is corrected for the lowering operation based on the acquired correction value TC, and lowers the lowering unit U to the standby position HW. .

  As a result, variations in the pressure of the air that drives the air cylinder 23 included in the lower support unit lifting / lowering drive unit 22 can be taken into consideration, and the standby position HW can be set to an appropriate position close to the lower support position HH. As a result, the descending distance from the receiving position HH to the standby position HW can be shortened, the descending time of the receiving unit U can be shortened, and the tact time of the component mounting work in the component mounting apparatus 1 can be further shortened. Can do.

  The above-described board transfer mechanism 2 (board transfer apparatus) is not limited to the component mounting apparatus 1 and is used for other apparatuses that transfer the board 3 and hold it at the work position to execute the work. Also good. For example, it may be used in a printing apparatus that prints cream solder on the substrate 3, a printing inspection apparatus that inspects the printing state of the cream solder on the substrate 3, a component mounting inspection apparatus that inspects the mounting state of the component P on the substrate 3. .

  That is, the substrate transport mechanism 2 (substrate transport apparatus) receives from below the substrate transport unit 12 that transports the substrate 3 and the substrate 3 that has been transported to a work position where the substrate transport unit 12 performs work on the substrate 3. Correction related to the lowering operation of the lower receiving unit U, the lower receiving unit lifting / lowering driving unit 22 that drives the lower receiving unit U to move up and down, and the air cylinder 23 for stopping the lower receiving unit U at the standby position HW (first position). And a correction value acquisition unit 30e that acquires the value TC. The lower receiving unit raising / lowering drive unit 22 raises the lower receiving unit U to the lower receiving position HH with respect to the lower surface 3a of the substrate 3 that has been loaded.

  Further, when unloading the substrate 3, the lower receiving unit lifting / lowering drive unit 22 moves the lower receiving unit U from the lower receiving position HH to a lower surface 3 a of the substrate 3 or an interference (such as a component P) provided on the lower surface 3 a. Is lowered to a standby position HW that is set so that the margin H2 is vacant. Then, at the timing of the correction operation C (when a predetermined substrate is unloaded), the air cylinder 23 lowers the receiving unit U to a lower limit position HB (second position) below the standby position HW, and a correction value acquisition unit. 30e acquires the correction value TC regarding the lowering operation of the lower receiving unit U. When the substrate 3 is unloaded, the air cylinder 23 corrects the lowering operation based on the acquired correction value TC and lowers the lower receiving unit U to the standby position HW.

  Thereby, the variation in the pressure of the air that drives the air cylinder 23 included in the lower unit lifting and lowering drive unit 22 is taken into consideration, and the standby position HW can be set to an appropriate position close to the lower position HH. As a result, the lowering distance from the lower receiving position HH to the standby position HW can be shortened, the lowering time of the lower receiving unit U can be shortened, and the tact time of the substrate transporting operation in the substrate transporting apparatus can be shortened. .

  In the above description, the lower receiving unit U that receives the substrate 3 by the lower receiving pins 20 has been described. However, the lower receiving unit U is not limited to this configuration. That is, the receiving unit U may be configured to be able to receive the lower surface 3a of the substrate 3 from below. For example, for the board 3 on which the component P is not mounted on the lower surface 3a, a box-shaped receiving unit U that receives the lower surface 3a of the board 3 by the surface may be used.

  The substrate carrying method, component mounting method, substrate carrying device, and component mounting device of the present invention have an effect that the tact time can be shortened, and are useful in the component mounting field in which components are mounted on a substrate.

1 Component mounting device 2 Substrate transport mechanism (substrate transport device)
2a Mounting work position 3 Substrate 3a Bottom surface (bottom surface of the substrate)
12 Substrate transport unit 22 Lower receiving unit lift drive unit 25 Upper limit detection sensor (first position sensor)
26 Lower limit detection sensor (second position sensor)
27a Upper limit detection dog (first position sensor)
27b Lower limit detection dog (second position sensor)
H2 margin HB Lower limit position (second position)
HH base position HW standby position (first position)
U Underlay unit

Claims (8)

Carrying the substrate into the working position;
A step of raising the lower receiving unit to the lower receiving position with respect to the lower surface of the loaded substrate,
A step of lowering the lower receiving unit from the lower receiving position to a first position set so as to leave a predetermined margin with respect to an interference provided on the lower surface or the lower surface of the substrate, and unloading the substrate; Including
When unloading a predetermined substrate, the lower receiving unit is lowered to a second position below the first position to obtain a correction value relating to the lowering operation of the lower receiving unit;
In the step of unloading the substrate, a substrate carrying method for correcting a lowering operation of lowering the receiving unit to the first position based on the acquired correction value.   2. When the correction value is acquired, the measurement time during which the lower receiving unit descends from the lower receiving position to the second position is measured, and the correction value is acquired based on the measured measurement time. The board | substrate conveyance method as described in. A step of carrying the substrate into the mounting work position;
A step of raising the lower receiving unit to the lower receiving position with respect to the lower surface of the loaded substrate,
Mounting a component on the received substrate;
The substrate on which the component is mounted by lowering the lower receiving unit from the lower receiving position to a first position set so as to leave a predetermined margin with respect to an interference provided on the lower surface or the lower surface of the substrate. A process of carrying out,
When unloading a predetermined substrate, the lower receiving unit is lowered to a second position below the first position to obtain a correction value relating to the lowering operation of the lower receiving unit;
A component mounting method for correcting an operation of lowering the receiving unit to the first position based on the acquired correction value in the step of carrying out the board.   4. When the correction value is acquired, the measurement time for the lower receiving unit to descend from the lower receiving position to the second position is measured, and the correction value is acquired based on the measured measurement time. The component mounting method described in 1. A substrate transport section for transporting the substrate;
A receiving unit for receiving a substrate carried from below at a work position where work on the substrate is performed by the substrate transport unit;
The lower receiving unit is driven to move up and down to raise the lower receiving unit to a lower receiving position with respect to the lower surface of the loaded substrate, and when receiving the substrate, the lower receiving unit is moved to the lower receiving position. A lower unit drive unit for lowering from a position to a first position set so as to leave a predetermined margin with respect to an interference provided on the lower surface or the lower surface of the substrate;
A correction value acquisition unit that acquires a correction value related to a lowering operation of the lower unit lifting and lowering drive unit for stopping the lower unit at the first position;
At the time of unloading a predetermined substrate, the lower support raising / lowering drive unit lowers the lower support unit to a second position below the first position, and the correction value acquisition unit lowers the lower support unit. Obtaining the correction value for
When carrying out the substrate, the substrate receiving unit lifting and lowering drive unit corrects the lowering operation based on the acquired correction value and lowers the receiving unit to the first position. A first position sensor for detecting that the lower receiving unit is in the lower receiving position;
A second position sensor for detecting that the receiving unit is in the second position;
A time measurement unit for measuring a measurement time for the lowering unit to descend from the lowering position to the second position;
The substrate transfer according to claim 5, wherein when acquiring the correction value, the time measurement unit measures the measurement time, and the correction value acquisition unit acquires the correction value based on the measured time. apparatus. A substrate transport section for transporting the substrate;
A receiving unit for receiving a substrate carried from below into a mounting work position where components are mounted by the substrate transport unit;
The lower receiving unit is driven up and down to raise the lower receiving unit to a lower receiving position with respect to the lower surface of the loaded board, and when the board on which the component mounting operation has been completed is carried out, A lower unit driving unit for lowering the receiving unit from the lower receiving position to a first position set to have a predetermined margin with respect to the interference provided on the lower surface or the lower surface of the substrate;
A correction value acquisition unit that acquires a correction value related to a lowering operation of the lower unit lifting and lowering drive unit for stopping the lower unit at the first position;
At the time of unloading a predetermined substrate, the lower support raising / lowering drive unit lowers the lower support unit to a second position below the first position, and the correction value acquisition unit lowers the lower support unit. Obtaining the correction value for
When unloading the board on which the component mounting operation has been completed, the lower receiving unit lifting drive unit corrects the lowering operation based on the acquired correction value, and lowers the lower receiving unit to the first position. Component mounting equipment. A first position sensor for detecting that the lower receiving unit is in the lower receiving position;
A second position sensor for detecting that the receiving unit is in the second position;
A time measurement unit for measuring a measurement time for the lowering unit to descend from the lowering position to the second position;
The component mounting apparatus according to claim 7, wherein when acquiring the correction value, the time measurement unit measures the measurement time, and the correction value acquisition unit acquires the correction value based on the measured time. .

Images