CN109155262A - Mounting device and installation method - Google Patents
Mounting device and installation method Download PDFInfo
- Publication number
- CN109155262A CN109155262A CN201780032721.2A CN201780032721A CN109155262A CN 109155262 A CN109155262 A CN 109155262A CN 201780032721 A CN201780032721 A CN 201780032721A CN 109155262 A CN109155262 A CN 109155262A
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- semiconductor chip
- mounting device
- substrate
- cooling unit
- thermally compressed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Mounting device and installation method are provided, when being thermally compressed to the semiconductor chip being temporarily fixed on the high substrate of the pyroconductivities such as silicon wafer using thermosetting resin, adverse effect will not be brought to the semiconductor chip other than thermo-compression bonding object.Specifically, mounting device and installation method are provided, the mounting device is temporarily fixed at multiple semiconductor chips on substrate and is thermally compressed to by thermosetting bonding agent, wherein, the mounting device includes crimp head, it is used as press surface, and the region comprising more than one semiconductor chip is pressed as pressurised zone；Crimping stations support the pressurised zone from the back side of the substrate；And cooling unit, the semiconductor chip adjacent with around the pressurised zone is cooled down.
Description
Technical field
The present invention relates to mounting devices and installation method.Specifically, it is related to temporarily solid by thermosetting resin
The multiple semiconductor chips being scheduled on substrate carry out mounting device and installation method of the thermo-compression bonding to be installed.
Background technique
In semiconductor installing area, due to the demand to densification, as chip method on the chip of three-dimensional installation
(being denoted as " COW method " below) attracts attention.COW method is the crystalline substance in the circuit block for being built-in with semiconductor chip to be divided into
On piece engagement semiconductor chip and the method installed, (chip top view is (a), its A-A section view of Figure 14 as shown in figure 14
Figure is (b) of Figure 14), a chip as substrate 3 and is installed into multiple semiconductor chips 2.
When in this way installing multiple semiconductor chips 2 on the substrate 3, (it is denoted as below " temporarily just using following technique
Formula division process "): semiconductor chip 2 is fixed temporarily by unhardened thermosetting bonding agent 4 as (a) of Figure 15
Heating crimping then is carried out on the substrate 3, the convex block 21 of semiconductor chip 2 is made to melt and engage with the electrode of substrate 3 31, and
Thermosetting resin 4 is set to harden ((b) of Figure 15).It, can be simultaneously to multiple semiconductor cores in the interim formal division process
Piece is thermally compressed.Therefore, with semiconductor chip is configured to phase the case where defined position is thermally compressed one by one
Than the whole production time can be shortened.
It is using thermosetting resin that institute's all semiconductor chips to be mounted are temporarily solid in the interim formal division process
It is scheduled on substrate and then is thermally compressed.Specifically, in thermo-compression bonding, it is same using having as shown in (a) of Figure 16, Figure 17
When the crimping tool 5 of press surface that multiple semiconductor chips are pressed be thermally compressed.(a) of Figure 17 is shown once to four
The case where a semiconductor chip 2 is thermally compressed on one side carries out semiconductor chip 2 using crimp head 5 when being thermally compressed
Heating is pressurizeed to 3 side of substrate on one side.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 11-274227 bulletin
Summary of the invention
Problems to be solved by the invention
As described above, institute's all semiconductor chips 2 to be mounted are temporarily fixed at base in interim formal division process
Heating crimping then is carried out using crimp head 5 on plate 3.Therefore, usually face around the semiconductor chip 2 of thermo-compression bonding object
When stationary state semiconductor chip 2 it is adjacent.But the thermo-compression bonding of the semiconductor chip 2 of these temporal hold states is not yet real
It applies, therefore the hardening for making thermosetting resin 4 is not intended to start.That is, if thermosetting resin 4 occurs before being thermally compressed
Hardening, even if then pressurizeing, the convex block 21 of the semiconductor chip 2 in (a) of Figure 15 will not contract at a distance from the electrode 3 of substrate 3
It is short, it is bad to sometimes result in engagement.
Therefore, it is necessary to prevent the semiconductor chip 2 adjacent to the semiconductor chip 2 being thermally compressed with crimp head 5 from facing
When fixed thermosetting resin 4 hardening start.
Therefore, the crimping stations 70 ((a) of Figure 18) for having used the entire surface to substrate 3 to be supported in the past, it is also proposed that
Structure (the figure of the crimping stations 7 supported as described in Patent Document 1 using the region being only thermally compressed to crimp head 5
18 (b)) and around the region being thermally compressed using cooling block 72 to substrate 3 carry out cooling structure (Figure 18's
(c))。
But in structure described in Patent Document 1, as substrate 3 with pyroconductivity be 0.3W/ (mK) left and right epoxy
Glass etc. is used as object, and in contrast, the pyroconductivity of silicon used in COW is very big, for the left and right 120W/ (mK).Therefore, i.e.,
So that the heat for being thermally compressed subject area in the structure of (b) of Figure 18 also can be heated to the semiconductor to periphery via substrate 3
The thermosetting resin 4 that chip 2 is fixed temporarily.In addition, using Figure 18 (c) structure in the case where, heat via
Substrate 3 escapes into cooling block 72, thus can not will thermo-compression bonding subject area be heated to as defined in temperature and becoming engage it is undesirable
Reason, therefore be undesirable.
The present application is to complete in view of the above problems, provides mounting device and installation method, when to hard using heat
When the property changed resin and the semiconductor chip that is temporarily fixed on the high substrate of the pyroconductivities such as silicon wafer are thermally compressed, it will not give
Semiconductor chip other than thermo-compression bonding object brings adverse effect.
Means for solving the problems
In order to solve above-mentioned problem, invention described in technical solution 1 is mounting device, is bonded to by thermosetting
Agent and be temporarily fixed at multiple semiconductor chips on substrate and be thermally compressed, wherein
The mounting device includes
Crimp head is used as press surface, carries out the region comprising more than one semiconductor chip as pressurised zone
Pressing；
Crimping stations support the pressurised zone from the back side of the substrate；And
Cooling unit cools down the semiconductor chip adjacent with around the pressurised zone.
The mounting device according to technical solution 1 of invention described in technical solution 2, wherein
The cooling unit cools down following region: the region the pressurised zone the outside being located next to and
The chip adjacent no more than with the pressurised zone.
The mounting device according to technical solution 1 or 2 of invention described in technical solution 3, wherein
Thermal insulation board is provided between the crimp head and the cooling unit.
The mounting device according to any one in technical solution 1~3 of invention described in technical solution 4, wherein
The cooling unit is air-cooled nozzle.
The mounting device according to any one in technical solution 1~4 of invention described in technical solution 5, wherein
Only to the semiconductor chip that thermo-compression bonding is not carried out in the semiconductor chip adjacent with around the pressurised zone
It is cooled down.
The mounting device according to technical solution 5 of invention described in technical solution 6, wherein
Cooling unit is provided on the outside of three sides of the pressurised zone.
The mounting device according to technical solution 6 of invention described in technical solution 7, wherein
Simultaneously the cooling unit of operating be only be arranged in three while outside cooling unit in vertical two while
The cooling unit in outside.
The mounting device according to any one in technical solution 1~7 of invention described in technical solution 8, wherein
The side for being fixed temporarily the chip is arranged in relative to the substrate for the cooling unit.
The mounting device according to any one in technical solution 1~8 of invention described in technical solution 9, wherein
The back side for being fixed temporarily the chip is arranged in relative to the substrate for the cooling unit.
Invention described in technical solution 10 is installation method, is temporarily fixed on substrate to by thermosetting bonding agent
Multiple semiconductor chips be successively thermally compressed according to each more than one mode, wherein
When being thermally compressed to semiconductor chip, only by the area supporting being thermally compressed of substrate in plane
On, only the semiconductor chip in the region being thermally compressed is pressurizeed and heated, on the other hand, in the heating
While a pair semiconductor chip adjacent with around the region being thermally compressed cool down.
The installation method according to technical solution 10 of invention described in technical solution 11, wherein
Use the material that pyroconductivity is 50W/mk or more as the material of the substrate.
Invention effect
Mounting device and installation method are provided, when to being temporarily fixed at the heat transfer such as silicon wafer using thermosetting resin
When semiconductor chip on the high substrate of rate is thermally compressed, it will not be brought to the semiconductor chip other than thermo-compression bonding object bad
It influences.
Detailed description of the invention
Fig. 1 is the figure for showing the structure of mounting device of embodiments of the present invention.
Fig. 2 is the figure for showing the hot pressing socket part of the mounting device of embodiments of the present invention.
(a) of Fig. 3 is substrate used in the mounting device of embodiments of the present invention viewed from above and substrate grasping
The figure of unit, (b) of Fig. 3 are substrate used in the mounting device of embodiments of the present invention and substrate grasping from side
The figure of unit.
(a) of Fig. 4 is the figure for showing the region being once thermally compressed in the mounting device of embodiments of the present invention,
It (b) is illustrated to the crimp head and cooling unit that are thermally compressed in the mounting device of embodiments of the present invention
Figure.
Fig. 5 is the figure being illustrated to the action example of the mounting device of embodiments of the present invention, wherein (a) is to adding
The figure that the state of crimp head decline before thermo-compression bonding is illustrated is (b) figure being illustrated to the state for carrying out heating crimping,
(c) it is the figure being illustrated to the state that crimp head rises and crimping stations have dropped after heating crimping, is carried out to substrate
The figure that mobile state is illustrated.
Fig. 6 is the figure being illustrated to another action example of the mounting device of embodiments of the present invention, wherein (a) is
It to the figure that the state of the crimp head decline before heating crimping is illustrated, is illustrated to the state for carrying out heating crimping
Figure, be (c) to the figure that crimp head rises and the state that has dropped of crimping stations is illustrated after heating crimping, be (d) to base
Plate carries out the figure that mobile state is illustrated.
Fig. 7 is the variation of embodiments of the present invention, wherein (a) is only to be fixed temporarily face phase with semiconductor chip
Anti- side is provided with the example of cooling unit, is (b) to be fixed temporarily surface side and its this pair of opposite side in semiconductor chip
Side is provided with the example of cooling unit.
Fig. 8 is the state for showing the variation multilayer using embodiments of the present invention while installing semiconductor chip
Figure.
Fig. 9 is the example for showing the sequence for the position that the mounting device of embodiment through the invention is installed,
In, it is (b) figure for showing the direction successively installed that (a), which is the figure for showing the position initially installed,.
Figure 10 is the figure using the example of the mounting device of embodiments of the present invention, wherein (a) is shown according to installation
Sequence omits the figure of the example of cooling unit, is (b) figure for showing the example for also omitting thermal insulation board.
Figure 11 is the case where determining the use of the sequence for the position that the mounting devices of embodiments of the present invention is installed
Figure, wherein (a) is the figure for showing thermo-compression bonding region, is (b) to show to carry out the cooling unit around crimp head as unit of side
The figure of the state of control.
Figure 12 is the case where determining the use of the sequence for the position that the mounting devices of embodiments of the present invention is installed
Figure, wherein (a) is the figure for showing thermo-compression bonding region, is (b) to show to carry out the cooling unit around crimp head as unit of side
The figure of the state of control.
(a) of Figure 13 is to show the sequence installed using the mounting device of embodiments of the present invention being limited to one
The figure of the example in a direction is (b) to show the example that cooling unit is omitted in the case where the sequence installed is a direction
The figure of son.
(a) of Figure 14 is the top view for showing the state that multiple semiconductor chips are fixed temporarily on silicon wafer substrate,
It (b) is the figure for showing cross-sectional view.
(a) of Figure 15 is the section view for the state being temporarily fixed at semiconductor chip using thermosetting bonding agent on substrate
Figure, is (b) figure for showing the state after being thermally compressed in this state to semiconductor chip.
Figure 16 is to show to be thermally compressed the semiconductor chip being temporarily fixed on silicon wafer substrate as unit of multiple
Example figure.
Figure 17 is the figure being thermally compressed as unit of multiple to the semiconductor chip being temporarily fixed on substrate, wherein
(a) it is the figure for showing the press surface of crimp head, is (b) figure for showing the cross-sectional view of press surface of crimp head.
Figure 18 is figure when being thermally compressed to the semiconductor chip being temporarily fixed on substrate, wherein (a) be show it is logical
The figure of normal crimping stations is (b) to show the figure of crimping stations only supported to heating crimp region, is shown only to adding
It is thermally compressed the crimping stations and the figure that cooling block is carried out to periphery chip that region is supported.
Specific embodiment
It is illustrated using an example of attached drawing to embodiments of the present invention.
Fig. 1 is the figure for showing mounting device 1 of the invention.Mounting device 1 is to the semiconductor core being fixed temporarily on the substrate 3
Piece 2 is thermally compressed.As shown in (a) of Figure 15, semiconductor chip 2 is fixed temporarily on the substrate 3 by bonding agent 4.
In Fig. 1, using left and right directions as X-direction, using depth direction as Y direction, using up and down direction as Z axis
Direction is illustrated.The mounting device 1 of Fig. 1 has the week of crimp head 5, substrate grasping unit 6, crimping stations 7 and crimp head 5
The cooling unit 51 enclosed, each section are controlled by control unit 8.Alternatively, it is also possible to as shown in Figure 2 in crimp head 5 and cooling
Thermal insulation board 52 is set between unit 51.
Semiconductor chip 2 has convex block as shown in (a) of Figure 15, as bump material, usually using solder.Separately
Outside, as substrate 3, it is contemplated that be the silicon wafer as showing the figure of overlook view in Fig. 3 (a), but it is not limited to this, can also
To be applied to the substrate being made of other materials, but in order to sufficiently use feature of the invention, it is expected that being using pyroconductivity
The material of 50W/ (mK) or more is as substrate.
As the thermosetting bonding agent 4 that semiconductor chip 2 is fixed on to substrate 3, it is desired for non-conductive film (following note
For " NCF "), but it is not limited to this, or non-conductive thickener (being denoted as " NCP " below).
Crimp head 5 has the function of as follows: moving in (Z-direction) in above-below direction and to being fixed temporarily on the substrate 3
Semiconductor chip 2 pressurize, and semiconductor chip 2 is heated using internal heater.As shown in (a) of Fig. 4,
There is the press surface to pressurize together to four semiconductor chips 2 in mounting device 1, but it is not limited to this, press surface
Area can be smaller than above-mentioned press surface or bigger than above-mentioned press surface.But press surface needs to have not and in addition to pressing pair
The shape that semiconductor chip 2 other than the semiconductor chip 2 of elephant contacts.That is, the pressing of the crimp head 5 in (a) by Fig. 4
In the pressurised zone that face is pressed, four semiconductor chips are pressed together, on the other hand will not to pressurised zone
Adjacent semiconductor chip 2 is pressed.
In addition, the shape of usually semiconductor chip 2 is rectangle, it is therefore desirable for the pressing of the crimp head 5 in mounting device 1
The shape in face is also rectangle, and rectangular each side is arranged in cooling unit 51 as shown in (b) of Fig. 4.Cooling unit 51
To being cooled down around pressurised zone, in the present embodiment, to the outside of pressurised zone being located next to and be no more than with
The region of the adjacent chip of pressurised zone is cooled down.As specific region cooling unit 51, preferably air-cooled nozzle has
Following function: it directs cool air over to the upper surface of the semiconductor chip 2 adjacent with pressurised zone and (is not faced with substrate 3
That side) and prevent the temperature for the bonding agent 4 being fixed temporarily to the semiconductor chip 2 adjacent with pressurised zone from rising.
In addition, in (b) of Fig. 4, according to the direction on the side of setting cooling unit 51, using the upside in figure as cooling unit 51C, under
Side is as cooling unit 51U, left side as cooling unit 51L, right side as cooling unit 51R.
Thermal insulation board 52 can also be set between crimp head 5 and cooling unit 51, can prevent from crimping by thermal insulation board 52
It is thermally conductive between first 5 and cooling unit 51.Crimp head 5 press surface shape be rectangular situation under, with cooling unit
51 similarly, and thermal insulation board 52 is also provided with each of rectangularity.That is, in (b) of Fig. 4, according to the side for being provided with thermal insulation board 52
Direction, using the upside in figure as thermal insulation board 52C, downside as thermal insulation board 52U, left side as thermal insulation board 52L, right side as
Thermal insulation board 52R.
As shown in figure 3, substrate grasping unit 6 around substrate 3 to holding, however, you can also not as (a) of Fig. 3
Whole circumference is held, and several positions of surrounding are held.Substrate grasping unit, which has, passes through drive (not shown)
Moving cell makes substrate 3 in X-direction, Y direction and function to move on the direction θ of Z-direction rotary shaft, can also have
There is the function of moving in the Z-axis direction.
Crimping stations 7 are carried out the pressurised zone of heating crimping from the following table surface bearing of substrate 3 by crimp head 5, and crimping stations 7 can be with
With the function of carrying out absorption holding to substrate.Crimping stations 7 can according to need and built-in having heaters, in pressurised zone from
It is heated 3 side of substrate.In addition, crimping stations 7 are also in the same manner as crimp head 5 only to the semiconductor core for being fixed temporarily pressing object
The region of piece 2 is supported.
Control unit 8 is specifically as follows the structure using data/address bus connection CPU, ROM, RAM, HDD etc., or may be
The structure being made of single-chip LSI etc..Preserved in control unit 8 for the various constituent elements being connect with control unit 8 into
The various programs and data of row control.
Control unit 8 is connect with crimp head 5, is capable of movement and the plus-pressure of up and down direction (Z-direction) to crimp head 5
It is controlled, and heating temperature can be controlled.
Control unit 8 is connect with cooling unit 51, can be controlled refrigerating function.Here, in cooling unit 51 such as Fig. 4
(b) shown in multiple sides are set like that in the case where, control unit 8, which can be, to be controlled refrigerating function as unit of side
The structure of system.
Control unit 8 is connect with substrate grasping unit 6, be capable of the movement in the direction XY and the direction θ to substrate grasping unit 6 into
Row control, also can the movement as needed to up and down direction (Z-direction) control.
Control unit 8 is connect with crimping stations 7, and the movement for capableing of up and down direction (Z-direction) to crimping stations 7 controls.
In addition, control unit 8 can have the function of being controlled the heating temperature of crimping stations 7, it is possible to have make the absorption of substrate 3
The function of keeping function to switch on and off.
Hereinafter, the movement to using mounting device 1 to be thermally compressed the semiconductor chip 2 being fixed temporarily on the substrate 3
It is illustrated.
Firstly, (a) of Fig. 5 is made under crimp head in the state that pressurised zone of the crimping stations 7 to substrate 3 is kept
The state of drop, (b) of Fig. 5 are the state that crimp head 5 carries out heating crimping to the semiconductor chip 5 of pressurised zone, heating crimping
After, the crimp head 5 as shown in (c) of Fig. 5 rises and crimping stations 7 decline, then according to making then to be heated
The semiconductor chip 2 of crimping enters the mode between crimp head 5 and crimping stations, and (utilizing substrate grasping unit 6) keeps substrate 3 horizontal
Mobile ((d) of Fig. 5), then crimping stations 7 rise and become with (a) of Fig. 5 identical state.In addition, (c), Fig. 5 in Fig. 5
(d) in crimping stations 7 decline, but can also be using the structure that increase the position of substrate 3 using substrate grasping unit 6.
During above, at least in the stage of (b) of Fig. 5, the operating of cooling unit 51 and to carry out heating and crimp
The adjacent semiconductor chip 2 in periphery of semiconductor chip 2 cooled down.In the case where cooling unit 51 is air-cooled nozzle,
It is cooled down using upper surface (with face that side of substrate opposite face) of the cooling air to semiconductor chip 2.Though as a result,
So there is the heat transmitted from 3 side of substrate, still is able to inhibit the heat for being fixed temporarily cooling semiconductor chip 2 hard
The property changed bonding agent 4 occurs temperature and rises, and can prevent hardening from starting.Here, cooling unit 51 needs to prevent to cooling object
The hardening for the thermosetting bonding agent 4 that semiconductor chip 2 is fixed temporarily starts, on the other hand, if being cooled to crimp head 5
When pressurised zone in press surface, the hardening of the melt solder and thermosetting resin 4 that will lead to convex block is incomplete, gives mounted article
Matter brings adverse effect, therefore preferably its cooling capacity is not too strong.Therefore, cooling capacity is needed according to mounting condition (semiconductor
Chip 2, substrate 3, the physical property of thermosetting bonding agent 4, shape and thermo-compression bonding technique etc.) and set condition appropriate.Such as
Use air-cooled nozzle as in the case where cooling unit 51, it can be with the temperature of pre-optimized cooling air, flow, outflow direction
Deng.
In addition, cooling unit 51 functions when can also not only be thermally compressed state shown in (b) of Fig. 5, Fig. 5's
(a) the crimp head ascent stage of (c) of the decline stage and Fig. 5 of crimp head 5 also functions, can also be in crimp head 5
Press surface functions when reaching in the range of regulation at a distance from (pressurization object) semiconductor chip 2.
In addition, in (d) of (a) to Fig. 5 of Fig. 5, show cooling unit 51 and crimp head 5 synchronize the example that is acted
Son, but can also using as shown in (a) of Fig. 6 (d) to Fig. 6, cooling unit 51 do not move in the up-down direction and makes
Crimp head 5 carries out upper and lower structure.
In explanation so far, as cooling unit, be arranged in around crimp head 5 example, i.e. from interim
Be fixed with semiconductor chip 2 that side carry out cooling cooling unit 51 premised on, but can also using setting never face
When fixed semiconductor chip 2 that side in face of substrate carry out cooling cooling unit 71 structure ((a) of Fig. 7, Fig. 7's
(b)).The substrate that faces by being never fixed temporarily that side of semiconductor chip 2 is cooled down, thus for example for together
Adjacent semiconductor core when being thermally compressed to the semiconductor chip 2 for being fixed temporarily stacking according to multilayer as shown in Figure 8
The cooling of piece 2 is effective.
In addition, being provided on all directions on four sides of the press surface of rectangular crimp head 5 cold in (b) of Fig. 4
But unit 51, but most cases are not necessarily to while operating the directive cooling unit of institute.For example, if being in and pressure in (a) of Fig. 4
The state that the adjacent semiconductor chip 2 in all directions of connector 5 is fixed temporarily by unhardened thermosetting bonding agent 4, then need
Operate the directive cooling unit 51 of institute on four sides, but such situation is extremely rare in reality.
That is, there is no viscous using unhardened thermosetting on certain direction on four sides of rectangular crimp head 5 sometimes
Connect (temporal hold state) semiconductor chip 2 that agent 4 is fixed temporarily.Here, there is no the semiconductor cores of temporal hold state
Piece 2 refers to the state being had been carried out after heating crimping there is no semiconductor chip 2 or semiconductor chip 2.In this way, working as
There is no in the case where the semiconductor chip 2 of temporal hold state on the direction on the specific side of crimp head 5, do not need to the side
Direction cooled down.Therefore, positioned at there is no the cooling units 51 on the side in the direction of the semiconductor chip 2 of temporal hold state
It can be inoperative.
It is shown below with specific example, makes arrow of the crimp head 5 from the position of (a) of Fig. 9 according to (b) of Fig. 9
Sequence implement heating crimping in the case where, the top in figure is upward, belong to there is no semiconductor chip 2 or exist heating
Certain situation of semiconductor chip 2 after crimping implementation, there is no the semiconductor chips 2 of temporal hold state.Therefore, scheming
In cooling unit 51 shown in 4 (b), without operating cooling unit 51C.Accordingly it is also possible to using as shown in (a) of Figure 10
The structure of the cooling unit 51C in (b) of Fig. 4 is omitted, also can be omitted the thermal insulation board 52C in (b) of Fig. 4.I.e., it is possible to only
Cooling unit 51 is set when the press surface of crimp head 5 is formed by rectangular four three in.By using such knot
Structure, being capable of cutting device cost.
In addition, adding in the case where the sequence of the arrow of (b) according to Fig. 9 carries out heating crimping when mobile from right to left
It is thermally compressed position and carries out being present in the semiconductor chip 2 on the right side of crimp head 5 when heating crimping (such as (a) of Figure 11)
It is to heat the semiconductor chip after crimping is implemented, in the cooling unit 51 shown in (b) of Figure 11, cooling unit 51R can not
Operating.In turn, when moving from left to right heating crimping position and carry out heating crimping (such as (a) of Figure 12), it is present in
The semiconductor chip 2 in the left side of crimp head 5 is also the semiconductor chip after heating crimping is implemented, cold shown in (b) of Figure 12
But in unit 51, cooling unit 51L can be inoperative.That is, the sequence in the arrow of (b) according to Fig. 9 carries out heating crimping
In the case of, cooling unit only is set when the press surface of crimp head 5 is formed by rectangular four three in, and at the same time fortune
The cooling unit turned can be only the vertical both sides in three sides.Function in this way is capable of the operating cost of cutting device.
In addition, as special example, shown in (a) of such as Figure 13, the movement at heating crimping position be only a direction
In the case where, it can not the upper direction in figure and the side setting cooling unit towards that side opposite with moving direction
51.The example is shown in (b) of Figure 13.
As described above, through the invention, to being temporarily fixed at the pyroconductivities such as silicon wafer using thermosetting resin
When semiconductor chip on high substrate is thermally compressed, the semiconductor chip other than thermo-compression bonding object will not be brought bad
It influences and is thermally compressed.Also, dysgenic range can be brought to be limited to minimal apparatus structure by being included in
And function, inhibit installation cost, operating cost and realize the present invention.
Label declaration
1: mounting device；2: semiconductor chip；3: substrate；4: thermosetting bonding agent；5: crimp head；6: substrate grasping list
Member；7: crimping stations；8: control unit；51: cooling unit；52: thermal insulation board；71: cooling unit.
Claims (11)
1. a kind of mounting device, to be temporarily fixed at by thermosetting bonding agent multiple semiconductor chips on substrate into
Row thermo-compression bonding, wherein
The mounting device includes
Crimp head is used as press surface, the region comprising more than one semiconductor chip is pressed as pressurised zone；
Crimping stations support the pressurised zone from the back side of the substrate；And
Cooling unit cools down the semiconductor chip adjacent with around the pressurised zone.
2. mounting device according to claim 1, wherein
The cooling unit cools down following region: the region the pressurised zone the outside being located next to and do not surpass
Cross the chip adjacent with the pressurised zone.
3. mounting device according to claim 1 or 2, wherein
Thermal insulation board is provided between the crimp head and the cooling unit.
4. mounting device according to any one of claims 1 to 3, wherein
The cooling unit is air-cooled nozzle.
5. mounting device described in any one according to claim 1~4, wherein
Only the semiconductor chip that thermo-compression bonding is not carried out in the semiconductor chip adjacent with around the pressurised zone is carried out
It is cooling.
6. mounting device according to claim 5, wherein
Cooling unit is provided on the outside of three sides of the pressurised zone.
7. mounting device according to claim 6, wherein
Simultaneously the cooling unit of operating be only be arranged in three while outside cooling unit in vertical two while outside
Cooling unit.
8. mounting device according to any one of claims 1 to 7, wherein
The side for being fixed temporarily the chip is arranged in relative to the substrate for the cooling unit.
9. mounting device according to any one of claims 1 to 8, wherein
The back side for being fixed temporarily the chip is arranged in relative to the substrate for the cooling unit.
10. a kind of installation method, to be temporarily fixed at by thermosetting bonding agent multiple semiconductor chips on substrate by
It is successively thermally compressed according to each more than one mode, wherein
When being thermally compressed to semiconductor chip,
Only in the plane by the area supporting being thermally compressed of substrate,
Only the semiconductor chip in the region being thermally compressed is pressurizeed and is heated,
On the other hand, while the heating pair semiconductor chip adjacent with around the region being thermally compressed into
Row cooling.
11. installation method according to claim 10, wherein
Use the material that pyroconductivity is 50W/mk or more as the material of the substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-067990 | 2016-03-30 | ||
| JP2016067990A JP6679378B2 (en) | 2016-03-30 | 2016-03-30 | Mounting device and mounting method |
| PCT/JP2017/011081 WO2017169942A1 (en) | 2016-03-30 | 2017-03-21 | Mounting device and mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109155262A true CN109155262A (en) | 2019-01-04 |
Family
ID=59965217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780032721.2A Pending CN109155262A (en) | 2016-03-30 | 2017-03-21 | Mounting device and installation method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6679378B2 (en) |
| KR (1) | KR102257782B1 (en) |
| CN (1) | CN109155262A (en) |
| TW (1) | TWI728086B (en) |
| WO (1) | WO2017169942A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111696871A (en) * | 2020-02-28 | 2020-09-22 | 浙江铖昌科技有限公司 | Chip mounting method |
| CN112218516A (en) * | 2019-07-09 | 2021-01-12 | 芝浦机械电子装置株式会社 | Mounting device |
| CN113539883A (en) * | 2020-04-13 | 2021-10-22 | Jmj韩国株式会社 | Semiconductor device mounting apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6484370B1 (en) * | 2018-05-31 | 2019-03-13 | アサヒ・エンジニアリング株式会社 | Electronic component mounting equipment |
| KR20200054747A (en) | 2018-11-12 | 2020-05-20 | 삼성전자주식회사 | Display module, display apparatus including the same and method of manufacturing display module |
| KR102252734B1 (en) * | 2019-07-18 | 2021-05-17 | 세메스 주식회사 | Die bonder |
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| JPH11274227A (en) * | 1998-03-20 | 1999-10-08 | Hitachi Ltd | Method and device for mounting semiconductor chip |
| CN1606142A (en) * | 2003-10-10 | 2005-04-13 | 松下电器产业株式会社 | Electronic circuit device and its manufacturing method and device |
| TW201004522A (en) * | 2008-07-01 | 2010-01-16 | Au Optronics Corp | Thermal compression bonding assembly |
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| JP5093241B2 (en) * | 2007-09-03 | 2012-12-12 | 富士通株式会社 | Soldering equipment |
| JP5039918B2 (en) * | 2007-09-19 | 2012-10-03 | 芝浦メカトロニクス株式会社 | Electronic component mounting apparatus and mounting method |
| KR101458710B1 (en) * | 2013-06-19 | 2014-11-06 | 하이디스 테크놀로지 주식회사 | Ic chip bonding apparatus and method |
-
2016
- 2016-03-30 JP JP2016067990A patent/JP6679378B2/en active Active
-
2017
- 2017-03-21 WO PCT/JP2017/011081 patent/WO2017169942A1/en active Application Filing
- 2017-03-21 KR KR1020187027593A patent/KR102257782B1/en active IP Right Grant
- 2017-03-21 CN CN201780032721.2A patent/CN109155262A/en active Pending
- 2017-03-30 TW TW106110712A patent/TWI728086B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274227A (en) * | 1998-03-20 | 1999-10-08 | Hitachi Ltd | Method and device for mounting semiconductor chip |
| CN1606142A (en) * | 2003-10-10 | 2005-04-13 | 松下电器产业株式会社 | Electronic circuit device and its manufacturing method and device |
| TW201004522A (en) * | 2008-07-01 | 2010-01-16 | Au Optronics Corp | Thermal compression bonding assembly |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112218516A (en) * | 2019-07-09 | 2021-01-12 | 芝浦机械电子装置株式会社 | Mounting device |
| CN112218516B (en) * | 2019-07-09 | 2021-08-20 | 芝浦机械电子装置株式会社 | Mounting device |
| CN111696871A (en) * | 2020-02-28 | 2020-09-22 | 浙江铖昌科技有限公司 | Chip mounting method |
| CN113539883A (en) * | 2020-04-13 | 2021-10-22 | Jmj韩国株式会社 | Semiconductor device mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102257782B1 (en) | 2021-05-27 |
| JP2017183481A (en) | 2017-10-05 |
| WO2017169942A1 (en) | 2017-10-05 |
| JP6679378B2 (en) | 2020-04-15 |
| TWI728086B (en) | 2021-05-21 |
| TW201802975A (en) | 2018-01-16 |
| KR20180129787A (en) | 2018-12-05 |
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