JP2000183508A - Collet for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a collet for mounting an electronic component, such as a bear chip and a chip part or the like in normalized height without inclination. SOLUTION: Plural protrusions 10 are formed at the top end of a collect main body 3 whose top end is used as an absorption face 3a of a bear chip 4, and a channel 11 for supplying cooling air or the like is formed inside the collet main body 3. Then, at the bringing of the bear chip 4 into contact with connecting materials (solder) 6 on a substrate 5 through pressurizing it, the protrusions 10 are butted against the substrate 5 so that the held height of the bear chip 4 can be made fixed, and the cooling air is injected through the channel 11 in this state so that fused solder can be quickly solidified. Thus, even if the collet 1 is separated from the bear chip 4 in a fast timing, the bear chip 4 will not be displaced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet for mounting an electronic component such as a bare chip or a chip component on a mounting object such as a substrate or a lead frame via a bonding material.

[0002]

2. Description of the Related Art As shown by a reference numeral 1 in FIG.
Is used as the suction surface 3a of the electronic component 4. This type of collet 1 is usually incorporated in a dedicated component mounting device (not shown) and moves between a component supply station and a mounting station. For example, a substrate (mounting target) positioned at the mounting station is used. The electronic component (in this case, a bare chip) 4 sucked and held on the suction surface 3a at the tip thereof is pressed against a bonding material 6 such as a solder or an adhesive formed in advance on the substrate 5 by approaching the upper surface 5 from above. Operate to make contact. In addition, as the collet 1, there is a pyramid collet having a concave tip in addition to a flat collet having a flat tip as shown in the figure.

[0003]

According to the above-described electronic component mounting process, the mounting height of the electronic component 4 on the substrate 5 is controlled by the height control of the component mounting apparatus for moving the collet 1. Therefore, depending on the thickness error of the substrate 5 and the bonding material 6, the control accuracy of the component mounting device, or the mounting error of the collet 1 with the component mounting device, the contact pressure of the electronic component 4 with the bonding material 6 is not sufficient. Equilibrium,
As shown in FIG. 4, the bonding material 6 is deformed unevenly,
In some cases, the electronic component 4 may be mounted obliquely.

In the electronic component mounting process, the substrate 5 is placed on the heater plate 7 and
Before the electronic component 4 is pressed into contact with the solder as the bonding material 6, the solder is melted by the heat of the heater plate 7, or the electronic component 4 is pressed into contact with an adhesive (usually a thermosetting resin) as the bonding material 6. Then, the adhesive may be heated and solidified by the heat of the heater plate 7 to complete the mounting in one process. In this case, in order to shorten the cycle time, after the electronic component 4 is pressed against the bonding material 6 on the substrate 5, the collet 1 is separated from the electronic component 4 without waiting for the bonding material 6 to be completely solidified. However, between the time when the collet 1 is separated from the electronic component 4 and the time when the bonding material 6 is completely solidified,
Due to the weight imbalance of the electronic component 4, the heavier one sinks more, and the electronic component 4 may be inclinedly mounted on the substrate 5 as described above.

[0005] For example, in Japanese Patent Application Laid-Open No. 8-335774, in a technical field of mounting an electronic component by reflow soldering, a spacer plate is interposed between the electronic component and a substrate so that the distance between the two is fixed. However, according to such a measure, extra space for installing the spacer plate must be secured, which makes high-density mounting difficult, and furthermore, the spacer is inserted and removed. Since a troublesome operation is required, a decrease in manufacturing efficiency is inevitable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide electronic components without tilting to a prescribed height without sacrificing high-density mounting and manufacturing efficiency. An object of the present invention is to provide a component mounting collet that can be mounted.

[0007]

According to a first aspect of the present invention, there is provided an electronic component having a collet body having a vacuum passage as a suction surface of an electronic component, the electronic component being held by suction on the suction surface. In a collet to be mounted on a mounting target via a bonding material, a plurality of projections are provided at the tip of the collet main body, the projections being in contact with the mounting target and holding the electronic component at a fixed height with respect to the mounting target. It is characterized by.

In the first aspect of the present invention, the projection provided at the tip of the collet body comes into contact with the object to be mounted, and the holding height of the electronic component is made mechanically constant. The thickness of the joining material is uniform regardless of the thickness error, the control accuracy of the component mounting device, the assembly error of the collet, and the like.

According to a second aspect of the present invention, the tip of a collet main body having a vacuum passage is used as a suction surface of an electronic component, and the electronic component which is sucked and held on the suction surface is mounted. A collet to be mounted on an object via a bonding material is characterized in that a collet main body is provided with a heat medium passage for ejecting a heat medium from its tip.

In the second aspect of the invention, after the electronic component is brought into contact with the bonding material, cold or warm air is supplied to the passage at an appropriate timing, whereby the bonding material is rapidly solidified, and the electronic component is hardened. Uneven settling is prevented.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 and FIG. 2 show an electronic component mounting collet as one embodiment of the present invention. In this embodiment, a bare chip (electronic component) 4 is attached to a substrate (mounting object) 5 in the same manner as shown in FIG.
Since the basic structure is the same as that shown in FIG. 3, the same parts are denoted by the same reference numerals. In the present embodiment, the collet main body 3 has a quadrangular prism shape, and a wall-shaped projection 10 having the same height protrudes from the tip of the collet main body 3 along four sides.
The projections 10 are arranged facing each other at a sufficient interval so as not to interfere with the bonding material (solder, adhesive, or the like) 6 formed on the substrate 5 in advance. The height of each projection 10 is set to be slightly smaller than the sum of the thickness of the bonding material 6 formed in advance on the substrate 5 and the thickness of the bare chip 4.

The collet body 3 is also provided with a plurality (here, four) of heat medium passages 11 arranged so as to surround the evacuation passage 2. In this heat medium passage 11,
Cool air or warm air is selectively supplied from a warm air source or a cold air source (not shown), and the cool air or warm air blows out around the electronic component 4 from the tip of the collet body 3. The protrusion 10 and the passage 1
The number, size, location, etc. of 1 are arbitrary.

The collet 1 is incorporated in a dedicated component mounting device (not shown) as described above, and moves between a component supply station and a mounting station. After receiving the bare chip 4 on the suction surface 3a at the tip of the collet main body 3 at the component supply station, move to the mounting station side, approach the substrate 5 from above, and
a the bonding material 6 on the substrate 5
To make pressure contact. At this time, the collet 1 moves down until the projection 10 provided at the tip of the collet main body 3 comes into contact with the substrate 5, whereby the electronic component 4 is positioned and held at a predetermined height without tilting.

When the bonding material 6 is made of solder, the solder is in a molten state by the heat of the heater plate 7 before the electronic component 4 is pressed against the bonding material (solder) 6. The bonding material 6 according to the pressing contact of the electronic component 4
Also has a specified thickness. On the other hand, the heating by the heater plate 7 is stopped simultaneously with the pressing contact of the electronic component 4, and at the same time, cool air is supplied to the heat medium passage 11 of the collet body 3 from a cool air source (not shown). Then, cool air is injected from the tip of the collet main body 3 around the electronic component 4 and the joining material 6, whereby the solder in the molten state is rapidly cooled and solidified (solidified), and the electronic component 4 is quickly immobilized. State. Therefore, after the electronic component 4 is brought into contact with the bonding material 6, the introduction of the negative pressure into the evacuation passage 2 of the collet main body 3 is stopped at a relatively early timing, and even if the collet 1 is separated from the electronic component 4, the electronic The position of the component 4 does not change, and the electronic component 4 is mounted at a specified height without inclination.

On the other hand, the bonding material 6 is made of an adhesive (thermosetting resin).
When the collet 1 is moved, the electronic component 4 is pressed into contact with the bonding material (adhesive) 6 and the heating by the heater plate 7 is started at the same time. The warm air is supplied from a warm air generating source. Then, warm air is injected from the tip of the collet body 3 around the electronic component 4 and the bonding material 6, whereby the adhesive is rapidly heated to the curing temperature and solidified, and the electronic component 4 quickly becomes immobile. Therefore, even when the electronic component 4 is pressed and contacted with the bonding material 6 in the same manner as when the solder is used as the bonding material 6, even if the collet 1 is separated from the electronic component 4 at a relatively early timing, the position of the electronic component 4 can be reduced. Does not change, and the electronic component 4 is mounted at a specified height without inclination.

In the above-described embodiment, the positioning projection 10 and the heat medium passage 11 are provided on the collet main body 3. However, the present invention is not limited to this.
Only one of them may be provided in the collet body 3. When only the positioning projections 10 are provided, regardless of the dimensional error of the substrate 5 and the bonding material 6, the control accuracy of the component mounting device, the mounting error of the collet 1 with respect to the component mounting device, and the like, On the other hand, the electronic component 4 can be positioned and held at a predetermined height without inclination. As a result, the tilt mounting of the electronic component 4 due to the deterioration of the positioning accuracy can be reliably prevented, and the mounting accuracy of the electronic component 4 is improved. In addition, such an effect of preventing the inclined mounting also occurs when the present invention is applied to a mounting process in which soldering is completed by reflow later. Becomes
On the other hand, when only the heat medium passage 11 is provided, the bonding material 6
The solid mounting of the electronic component 4 due to the solidification delay can be reliably prevented, and the mounting accuracy of the electronic component 4 is improved.

Further, in the above embodiment, the case where the bare chip 4 is applied to the mounting process of mounting the bare chip 4 on the substrate 5 has been described. However, the present invention is also applicable to mounting the bare chip 4 on a lead frame, or Needless to say, the present invention can be applied to various mounting processes for mounting chip components on a substrate.

[0019]

As described above, according to the collet for mounting electronic components according to the present invention, a simple measure of merely providing a projection at the tip of the collet main body or providing a heat medium passage in the collet main body is provided. Since the electronic component can be mounted at a predetermined height without inclination, there is a great value in its use without sacrificing high-density mounting and manufacturing efficiency.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a structure and a use mode of a collet as one embodiment of the present invention.

FIG. 2 is a plan view of the collet shown in FIG.

FIG. 3 is a cross-sectional view showing the structure and usage of a conventional collet.

FIG. 4 is a cross-sectional view illustrating an example of occurrence of a defect due to use of a conventional collet.

[Description of Signs] 1 Collet 2 Vacuum passage 3 Collet body 3a Suction surface 4 Bare chip (electronic component) 5 Substrate (object to be mounted) 10 Projection 11 Heat medium passage

Claims (2)

[Claims] 1. A collet in which an end of a collet main body having a vacuum passage is used as a suction surface of an electronic component, and the electronic component sucked and held on the suction surface is mounted on a mounting object via a bonding material. Characterized in that a plurality of projections are provided at the tip of the mounting member so as to abut on the mounting object and keep the electronic component at a fixed height with respect to the mounting object. 2. A collet, wherein a tip of a collet body having a vacuum passage is used as a suction surface of an electronic component, and the electronic component sucked and held on the suction surface is mounted on a mounting object via a bonding material. A collet for mounting an electronic component, wherein a heat medium passage for ejecting the heat medium from the tip is provided.